Feeding and discharging mechanism of silicon rod cutting equipment

Abstract

The utility model discloses a feeding and discharging mechanism of silicon rod cut-off equipment, which comprises a plurality of bearing assemblies arranged on a processing platform and used for bearing horizontally placed to-be-cut silicon rods during feeding and bearing cut-off silicon rod sections after cut-off operation during discharging, and comprises a bearing frame used for bearing the silicon rods or the cut-off silicon rod sections, the bearing frame shifting mechanism is used for driving the bearing frame to drive the silicon rod or the silicon rod cut section to move in the first direction, and the silicon rod transferring mechanism is used for driving the silicon rod or the silicon rod cut section to move relative to the bearing frame in the first direction. The control device is connected with the plurality of wire cutting devices for cutting operation and the plurality of bearing assemblies, and is used for controlling the plurality of bearing assemblies to sequentially move towards the discharging end of the machining platform under a first instruction so as to carry out feeding operation; and the multiple wire cutting devices and the multiple bearing assemblies are controlled to sequentially move towards the discharging end under a second instruction so as to conduct discharging operation.

Description

Technical Field

[0001] This application relates to the field of silicon processing technology, and in particular to a loading and unloading mechanism for a silicon rod cutting device. Background Technology

[0002] Currently, with increasing societal emphasis on and openness to the use of green and renewable energy, the photovoltaic solar power generation field is receiving more and more attention and development. In the photovoltaic power generation field, typical crystalline silicon solar cells are manufactured on high-quality silicon wafers, which are cut from pulled or cast silicon ingots using a multi-wire saw and subsequent processing.

[0003] The existing silicon wafer manufacturing process, taking monocrystalline silicon wafers as an example, generally includes the following steps: First, a long, cylindrical silicon rod is cut into multiple short silicon rods using a silicon rod cutting machine; after cutting, the short silicon rods are squared using a silicon rod squaring machine to form square silicon rods with a rectangular cross-section; then, the squared silicon rods are ground, rounded, or chamfered to achieve the required flatness and dimensional tolerances on the surface; finally, the square silicon rods are sliced ​​to obtain silicon wafers.

[0004] Generally, when loading silicon ingots, most manufacturers use robots or robotic arms to transport them to the processing area for cutting into multiple segments. However, this loading method is labor-intensive, and the silicon ingots may fall or be damaged during transport. Furthermore, after the cutting process, when unloading the resulting silicon ingot segments, the cutting wire needs to be quickly removed for the next cut. During this process, contact between the cutting wire and the silicon ingot segments must be avoided to prevent surface damage and ensure product quality. Therefore, how to ensure labor-saving and stable transport of silicon ingots to the processing area during loading, and how to quickly remove the cutting wire and unload the ingots during unloading, are technical problems that urgently need to be solved by those skilled in the art. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a loading and unloading mechanism for a silicon rod cutting device, which solves the technical problems of the laborious and unstable loading method using robots or robotic arms, and the damage to the surface of the silicon rod segment caused by the contact between the cutting line and the silicon rod segment during unloading.

[0006] To achieve the above and other related objectives, this application provides a loading and unloading mechanism for a silicon rod cutting device, comprising: multiple support components disposed on a processing platform for supporting horizontally placed silicon rods to be cut during loading and supporting silicon rod segments after cutting during unloading, including a support frame for carrying the silicon rod or the silicon rod segment, a support frame shifting mechanism for driving the support frame to move the silicon rod or the silicon rod segment along a first direction, and a silicon rod conveying mechanism for driving the silicon rod or the silicon rod segment relative to the support frame along the first direction; and a control device connected to multiple wire cutting devices performing the cutting operation and the multiple support components, for controlling the multiple support components to move sequentially toward the unloading end of the processing platform under a first command to perform the loading operation, and controlling the multiple wire cutting devices and the multiple support components to move sequentially toward the unloading end under a second command to perform the unloading operation.

[0007] In summary, the loading and unloading mechanism provided in this application, by setting multiple support components on the processing platform, can support the silicon rod to be cut during loading and the silicon rod segments formed during unloading. By setting a control device connecting the support components and the wire cutting device, the loading and unloading operations can be automated, improving processing efficiency. By setting a support frame, a support frame shifting mechanism, and a silicon rod conveying mechanism on each support component, each support component can support the silicon rod or silicon rod segment and move independently on the processing platform, making the loading process more labor-saving. During unloading, the support components can move separately to leave space for wire retraction, thereby avoiding contact between the cutting wire and the silicon rod segment, thus ensuring product quality. Throughout the entire processing, the support components stably support the silicon rod or silicon rod segment, improving the stability of loading and unloading. Attached Figure Description

[0008] The specific features involved in this application are shown in the appended claims. The features and advantages of the invention can be better understood by referring to the exemplary embodiments and accompanying drawings described in detail below. A brief description of the drawings is as follows:

[0009] Figure 1 The diagram shown is a structural schematic of a dual-station silicon rod cutting machine in one embodiment of this application.

[0010] Figure 2 The diagram shown is a structural schematic of the first support component in one embodiment of this application.

[0011] Figure 3 and Figure 4 The following are schematic diagrams of the wire cutting device in one embodiment of this application.

[0012] Figure 5The diagram shown is a flowchart illustrating how, in one embodiment of this application, a control device controls multiple support components to perform a feeding operation under a first command.

[0013] Figure 6 The diagram shown is a schematic representation of a plurality of first support components converging at the feeding end in one embodiment of this application.

[0014] Figure 7 This is a schematic diagram showing the state of the first support component performing a cut-off operation in one embodiment of this application.

[0015] Figure 8 The diagram shows a flow chart in one embodiment of this application, in which a control device controls multiple support components and multiple wire cutting devices to perform material cutting operations under a second command.

[0016] Figure 9 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine after performing step S210 in one embodiment of this application.

[0017] Figure 10 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine after step S220 is performed in one embodiment of this application.

[0018] Figure 11 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine after step S230 is executed in one embodiment of this application.

[0019] Figure 12 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine performing step S250 in one embodiment of this application. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand the advantages and technical effects of this application from the content disclosed in this specification. In the following description, some embodiments may be referenced to the accompanying drawings. It should be understood that other embodiments not shown in the drawings may also be used, and changes in specific structures, parts or mechanisms, components, and operations may be made without departing from the spirit and scope of this application. The following detailed description should not be considered limiting, and the scope of the embodiments of this application is limited only by the claims published in this application. The terminology used herein is for describing particular embodiments only and is not intended to limit this application.

[0021] It should be understood that although the terms first, second, or third, etc., may be used herein to describe various elements or parameters in some embodiments, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another, and not to define the order, priority, or importance of multiple elements. For example, a first instruction may be referred to as a second instruction, and similarly, a second instruction may be referred to as a first instruction, without departing from the scope of the various described embodiments. Both the first instruction and the second instruction describe a particular instruction, but they are not the same instruction unless the context otherwise explicitly indicates otherwise.

[0022] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” and “including” indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. For example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices. Additionally, the term “and / or,” which may be used hereinafter, describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Furthermore, the character “ / ”, unless otherwise specified, generally indicates that the preceding and following related objects have an “and / or” relationship. Additionally, in the description of embodiments of this application, “multiple” refers to two or more. Furthermore, the terms “or” and “and / or” as used herein are interpreted as inclusive, or mean either one or any combination thereof. Exceptions to this definition only arise when a combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0023] It should also be understood that when an element, such as a layer, region, or substrate, is referred to as being "on" another element or extending "on" another element, the element may be directly on or directly extending onto the other element, or intermediate elements may be present. Conversely, when an element is referred to as being "directly on" another element or "directly extending onto" another element, no intermediate elements are present. It will also be understood that when an element is referred to as being "connected" or "attached" to another element, it may be directly connected or coupled to the other element, or intermediate elements may be present. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, no intermediate elements are present. Furthermore, the term "coupled" generally means physical, mechanical, magnetic, and / or electrical coupling or connection, and in the absence of specific contrasting language, the presence of intermediate elements between coupled or associated items is not excluded.

[0024] Relative terms such as “below,” “above,” “upper,” “lower,” “horizontal,” or “vertical” may be used herein to describe the relationship between one element, layer, or region and another element, layer, or region illustrated in the figures. It will be understood that these terms are intended to cover different device orientations other than those depicted in the figures. In this application, “vertical,” “horizontal,” and “parallel” are defined as including cases within ±10% of the standard definition. For example, vertical typically refers to an angle of 90° relative to a reference line, but in this application, vertical refers to cases including those within 80° to 100°. Unless otherwise expressly stated, comparative quantitative terms (such as “above” and “below”) are intended to cover the concept of equality. As an example, “above” can mean not only “greater than” in a mathematical sense but also “equal to.”

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. When used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that, when used herein, the terms “comprising,” “including,” “containing,” and / or “comprising” designate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0026] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It will also be understood that terms used herein shall be interpreted as having the meaning consistent with their meaning in the context of this specification and the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0027] In view of the technical problems mentioned in the background art, this application provides a loading and unloading mechanism for use in a silicon rod dual-station cutting machine. The loading and unloading mechanism provided by this application, by setting multiple support components on the processing platform, can support the silicon rod to be cut during loading and support the cut silicon rod segments during unloading. By setting a control device connecting the support components and the wire cutting device, the loading and unloading operations can be automated, improving processing efficiency. By setting a support frame, a support frame shifting mechanism, and a silicon rod conveying mechanism on each support component, each support component can independently move while supporting the silicon rod or silicon rod segment on the processing platform, making the loading process more labor-saving. During unloading, the support components can move separately to leave space for wire retraction, thereby avoiding contact between the cutting wire and the silicon rod segment, thus ensuring product quality. Throughout the entire processing, the support components stably support the silicon rod or silicon rod segment, improving the stability of loading and unloading.

[0028] To clarify the definition of directions and the operation between different structures, the embodiments disclosed in this application define a three-dimensional space defined by a first direction, a second direction, and a third direction. The first direction, the second direction, and the third direction are all straight lines and are mutually perpendicular. For example, the length extension direction of the bottom of the base is defined as the first direction (i.e., the left-right direction or the transfer direction), the width extension direction of the bottom of the base is defined as the second direction (i.e., the front-back direction or the repositioning direction), and the vertical direction is defined as the third direction (i.e., the vertical direction, the perpendicular direction, the up-down direction, or the lifting direction).

[0029] This application provides a dual-station silicon rod cutting machine in some embodiments for cutting silicon rods, that is, performing a cutting operation on an original long silicon rod to form multiple short silicon rod segments (i.e., silicon rod segments conforming to workpiece specifications after cutting). In the following description, for ease of description, the original long silicon rod is referred to as the silicon rod, and the short silicon rods formed after the cutting operation are referred to as silicon rod segments. The silicon rod is, for example, a single-crystal silicon rod, i.e., a crystal rod grown from a melt using, for example, the Czochralski method, such as a single-crystal silicon rod with a length of approximately 5000 mm to 8000 mm commonly seen in silicon rod processing, and the length of the silicon rod segments formed after cutting can be, for example, 300 mm to 1000 mm.

[0030] The following combination Figures 1 to 12This application provides a detailed description of the silicon rod dual-station cutting machine.

[0031] Please see Figure 1 The image shown is a schematic diagram of the structure of a dual-station silicon rod cutting machine in one embodiment of this application. Figure 1 As shown, the silicon rod dual-station cutting machine includes a base, multiple support components, and multiple wire cutting devices.

[0032] In one embodiment, the machine base 1 is provided with a processing platform, which includes a first station and a second station arranged parallel to each other along a first direction. Further, the processing platform may be equipped with a wire cutting device 4 for performing processing on the silicon rod to be cut, such as a severing operation, by the wire cutting device 4 performing the severing operation on the silicon rod. The shape of the processing platform can be determined based on the machine base 1, or it can be determined jointly based on the processing needs of the machine base 1 and the wire cutting device 4. Figure 1 As shown, the base 1 is generally rectangular, with a processing platform on its top. The processing platform of the base 1 can be, for example, rectangular, and its length matches the length of the silicon rod to be cut. Here, the end of the base 1 used for loading is called the loading end, and the end of the base 1 used for unloading is called the unloading end. Figure 1 In the example shown, the first workstation and the second workstation are symmetrically arranged on the left and right sides of the machine base 1.

[0033] In one embodiment, the plurality of supporting components includes a plurality of first supporting components 2 and a plurality of second supporting components 3. The plurality of first supporting components 2 are movably disposed at the first workstation for supporting the horizontally placed first silicon ingot 10 and performing loading or unloading operations. The plurality of second supporting components 3 are movably disposed at the second workstation for supporting the horizontally placed second silicon ingot and performing loading or unloading operations.

[0034] In one embodiment, a plurality of first support components 2 are disposed on a first guide rail, and a plurality of second support components 3 are disposed on a second guide rail. The first guide rail and the second guide rail are parallel to each other. In other words, when the first silicon rod 10 or the second silicon rod is placed horizontally on the plurality of first support components 2 or the plurality of second support components 3, the axis of the first silicon rod 10 or the second silicon rod is approximately parallel to the first direction. It should be noted that the structure and working principle of the first support components 2 and the second support components 3 are the same. Therefore, in subsequent embodiments, the structure and working principle of the first support components will be described in detail using the first support component 2 supporting the first silicon rod 10 as an example.

[0035] In one embodiment, a plurality of first supporting components 2 are movably disposed at the first workstation for supporting the horizontally placed first silicon rod 10. Further, the plurality of first supporting components 2 are spaced apart at the first workstation to support multiple silicon rod segments formed after the first silicon rod 10 has undergone a cutting operation. Each silicon rod segment can be supported by at least one first supporting component 2. For example, in some examples, a silicon rod segment can be supported by one first supporting component 2, corresponding to the central region of the silicon rod segment. In other examples, a silicon rod segment can be supported by two or more first supporting components 2.

[0036] Please see Figure 2 The image shown is a structural schematic diagram of the first support component in one embodiment of this application. Figure 2 As shown, the first support assembly 2 includes a support frame 21, a support frame shifting mechanism 22, and a silicon rod transfer mechanism 23. The support frame 21 is disposed on the first guide rail and is used to support the first silicon rod 10 for loading and cutting operations, as well as to support the silicon rod segments after cutting for unloading operations. The support frame shifting mechanism 22 is used to drive the support frame 21 to move the first silicon rod 10 or the silicon rod segments along a first direction. The silicon rod transfer mechanism 23 is used to drive the first silicon rod 10 or the silicon rod segments to move relative to the support frame 21 along the first direction.

[0037] exist Figure 2 In the illustrated embodiment, the support frame 21 is the main structure of the first support assembly 2, the support frame shifting mechanism 22 is located at the bottom of the support frame 21, and the silicon rod transfer mechanism 23 is located at the top of the support frame 21. It should be understood that the movement of the first silicon rod 10 along the first direction can be achieved not only by driving the support frame 21 to move through the support frame shifting mechanism 22, but also by directly driving the first silicon rod 10 through the silicon rod transfer mechanism 23.

[0038] In one embodiment, the support frame shifting mechanism 22 includes a slider and a moving drive unit. The slider is located at the bottom of the support frame 21 and is mounted on the first guide rail. Correspondingly, a rack parallel to the first guide rail is provided on the processing platform of the machine base 1. The moving drive unit may include a drive gear and a gear drive motor associated with the drive gear. The drive gear meshes with the rack, and the gear drive motor drives the connected drive gear to rotate. Through the meshing of the drive gear and the rack, the first support assembly 2 is driven to move along the first guide rail in a first direction on the processing platform. Specifically, when the first silicon rod is placed horizontally on each of the first support assemblies 2, the support frame shifting mechanism 22 in each of the first support assemblies 2 drives the respective support assembly to move along the first direction, thereby causing the first silicon rod supported by each of the first support assemblies 2 to move along the first direction.

[0039] Of course, the support frame shifting mechanism 22 can still be modified in other ways. For example, in other embodiments, the support frame shifting mechanism includes a chain conveyor mechanism or a conveyor belt mechanism.

[0040] In one embodiment, the silicon rod transfer mechanism 23 includes a roller assembly and a roller assembly drive unit. The roller assembly is arranged in two parallel rows along a second direction, and the roller assembly drive unit is used to drive the roller assembly to rotate so as to move the first silicon rod or the silicon rod segment along the first direction.

[0041] In one embodiment, each of the two roller groups includes a plurality of rollers arranged along a first direction. Figure 2 In the example shown, each row of rollers may include three rollers arranged along a first direction. Figure 2 This is merely an illustrative example; the actual length of the entire first silicon rod or silicon rod segment to be supported may vary. For instance, if the silicon rod segment to be supported is long, the number of rollers in each row of rollers may be more than three (e.g., four, five, or more) to provide support over a greater length range and greater rolling friction when moving the silicon rod segment. If the silicon rod segment to be supported is short, the number of rollers in each row of rollers may be less than three (e.g., two). Furthermore, the number of rollers in the two rows of rollers may differ. For example, in some examples, one row of rollers may include two rollers while the other includes three rollers, or one row of rollers may include three rollers while the other includes four rollers, or one row of rollers may include four rollers while the other includes five rollers. It should be noted that the above examples are not exhaustive and can be adjusted according to actual production needs. Furthermore, in some examples, the rollers in the two rows of rollers are aligned with each other, but this is not a limitation. For example, in some examples, the rollers in the two rows of rollers may also be staggered by half a roller's distance.

[0042] In one embodiment, each of the plurality of rollers has an inward tilt angle, so that the roller surface of the roller contacts the circumferential surface of the silicon rod, increasing the contact area and making it more conducive to moving the silicon rod.

[0043] In one embodiment, the roller group drive unit is used to drive the rollers in the corresponding roller group to rotate, thereby moving the first silicon rods on the two rows of roller groups along a first direction. In one example, the two rows of roller groups share a single roller group drive unit, which simultaneously drives the rollers in both rows of roller groups to rotate. In another example, each row of roller groups in the two roller groups corresponds to a roller group drive unit, and each roller group drive unit is used to drive the rollers in its corresponding row of roller groups to rotate. The roller group drive unit may, for example, include a roller drive motor.

[0044] Specifically, in practical applications, when the first silicon rod is placed horizontally on each of the first support components 2, the rollers in the roller group of each first support component contact the first silicon rod, and the rollers in their respective roller groups are driven by the roller group drive unit in each first support component, and the first silicon rod is moved relative to the support component along the first direction by means of the friction between the rollers and the first silicon rod.

[0045] Of course, the silicon rod transfer mechanism can still be modified in other ways. For example, in other embodiments, the silicon rod transfer mechanism includes a roller conveyor mechanism, a chain conveyor mechanism, or a conveyor belt mechanism.

[0046] In one embodiment, the silicon rod transfer mechanism 23 includes a roller assembly folding unit, which is used to fold the roller assembly downwards away from the first silicon rod or silicon rod segment. In one implementation, the roller assembly folding unit may be configured as a cylinder or hydraulic cylinder with a telescopic rod, and disposed between the roller assembly and the support frame 21. Each roller in the roller assembly is mounted on a base, which may be, for example, a bottom frame or base plate. The proximal end of the base is axially connected to the support frame 21 via a shaft connection. The cylinder or hydraulic cylinder drives the telescopic rod to extend and retract, thereby causing the base and each roller in the roller assembly on it to fold upwards or downwards. In some other implementations, the roller assembly folding unit may be configured as a motor with a screw.

[0047] In one embodiment, such as Figure 2 As shown, the first support assembly 2 also includes a top pressing mechanism 24 and a bottom lifting mechanism 25. The top pressing mechanism 24 is disposed on the support frame 21 and is used to press the top of the first silicon rod 10. The bottom lifting mechanism 25 is disposed on the support frame 21 and adjacent to the silicon rod moving mechanism 23, and is used to support the bottom of the first silicon rod 10 during the cutting operation.

[0048] In one embodiment, the top clamping mechanism 24 includes a clamping member 241 and a clamping drive unit 243, the clamping drive unit 243 being used to drive the clamping member 241 to clamp or release the first silicon rod 10.

[0049] In one embodiment, the clamping member 241 has a shaft connection portion, a clamping portion, and a force-receiving portion. The shaft connection portion is shaft-connected to the support frame 21, the clamping portion is used to clamp the first silicon rod 10, and the force-receiving portion controls the clamping member 241 under the control of the clamping drive unit 243. In one example, the position where the clamping portion contacts the first silicon rod 10 has a certain downward curvature, which can match the curvature of the circumferential surface of the first silicon rod 10 to expand the force-receiving range of the first silicon rod 10. In some other examples, an elastic element is also added to the clamping portion. The elastic element can be in contact with the circumferential surface of the first silicon rod 10, and while clamping the first silicon rod 10, it provides a buffering effect to prevent damage to the first silicon rod 10.

[0050] In one embodiment, a certain force can be applied to the force-receiving part by the clamping drive unit 243, causing the clamping member 241 to move downward around the shaft joint through a lever principle, or to release the top of the first silicon rod 10. The clamping drive unit 243 includes, but is not limited to, a cylinder with a telescopic rod, which can drive the telescopic rod to extend or retract, thereby causing the telescopic rod to actuate the clamping member 241. Specifically, when the cylinder drives the telescopic rod to retract, the retracted telescopic rod pulls the clamping member 241, causing the clamping part of the clamping member 241 to move towards the supported first silicon rod 10 based on the shaft joint and press against the first silicon rod 10. When the cylinder drives the telescopic rod to extend, the extended telescopic rod pushes the clamping member 241, causing the clamping part of the clamping member 241 to move away from the supported first silicon rod 10 based on the shaft joint.

[0051] In one embodiment, the bottom lifting mechanism 25 includes lifting columns 251 and a lifting drive unit 253, the lifting drive unit 253 being used to drive the lifting columns 251 to move upward to support the first silicon rod 10. In this embodiment, the lifting columns 251 are arranged in two parallel rows along a second direction, each row including a plurality of lifting columns 251 arranged along a first direction. Figure 2 In the example shown, the lifting column 251 has an inward tilt angle, so that when the lifting column 251 contacts the first silicon rod 10, it provides a stable support surface for the first silicon rod 10. In one example, a support pad, such as a rubber pad, is provided on the support surface to avoid direct contact between the lifting column 251 and the first silicon rod 10, thereby preventing mechanical damage to the first silicon rod 10.

[0052] In one embodiment, the lifting drive unit 253 can control the lifting column 251 to actuate or lock at a corresponding position. It should be understood that silicon rods are typically formed by melting polycrystalline silicon and then growing monocrystalline silicon using the Czochralski method; therefore, the diameter of the silicon rod may be gradually varying. In view of this, to provide stable support for the silicon rod during the cutting operation, the lifting column 251 needs to be independently controlled to allow it to rise to different heights until it touches the circumferential surface of the silicon rod. In this embodiment, each lifting column 251 is equipped with a lifting drive unit 253, so that each lifting column can be independently controlled and can rise to different heights under the drive of the lifting drive unit 253 to touch the circumferential surface of the first silicon rod 10.

[0053] In one embodiment, the bottom lifting mechanism 25 is configured as two rows of cylinders arranged in parallel along a second direction. In one example, each row of the bottom lifting mechanism 25 is configured with at least one cylinder; for example, each row of the bottom lifting mechanism 25 includes two cylinders arranged along a first direction. Of course, the number of bottom lifting mechanisms 25 can be any number, as long as the formed support surface can stably support the first silicon rod, and the number and layout of each bottom support mechanism are not limited. For example, the number of bottom lifting mechanisms in each row can be more than two, such as three, four, five, or more, to provide support over a greater length range. In addition, the number of bottom lifting mechanisms included in the two rows of bottom lifting mechanisms can also be inconsistent. For example, in some embodiments, one row of bottom lifting mechanisms includes two bottom lifting mechanisms and the other row includes three bottom lifting mechanisms, or one row of bottom lifting mechanisms includes three bottom lifting mechanisms and the other row includes four bottom lifting mechanisms, or one row of bottom lifting mechanisms includes two bottom lifting mechanisms and the other row includes only one bottom lifting mechanism. It should be noted that the examples above are not exhaustive and can be adjusted according to actual production needs.

[0054] In one embodiment, such as Figure 1 As shown, ten first support components 2 and ten second support components 3 are configured, and each support component can be controlled independently. Specifically, ten first support components 2 are provided on the first guide rail of the first station, and ten second support components 3 are provided on the second guide rail of the second station. The structure of each support component can be the same, and each has an independent support frame shifting mechanism, so that each support component can move arbitrarily on its own guide rail until it moves to its own support position, and transfers the first silicon rod 10 or the second silicon rod to the cutting position on the processing platform for subsequent cutting operations.

[0055] In one embodiment, the support component at the loading end of the processing platform is fixedly installed, while the remaining nine first support components 2 or nine second support components 3 can move along the first guide rail and the second guide rail, respectively. In one implementation, a locking structure can be provided on the support frame shifting mechanism to lock the support frame shifting mechanism, thereby fixing the first support components 2 and the second support components 3 at the loading end. In another embodiment, the support component at the unloading end of the processing platform can be fixedly installed, while the remaining nine first support components 2 or nine second support components 3 can move along the first guide rail and the second guide rail, respectively. Of course, the number of fixed support components at the loading or unloading end can also be multiple, depending on actual production needs. For example, when the length of the silicon rod to be cut is short, not all support components need to participate in supporting the silicon rod or silicon rod segment; in this case, the excess support components can be fixedly installed at the loading or unloading end to avoid hindering the cutting operation.

[0056] In one embodiment, the nine first support components 2 or the nine second support components 3 move sequentially toward the unloading end of the processing platform, with the moving distance decreasing sequentially. Specifically, taking the transfer of the first silicon rod 10 to the cutting position as an example, all the first support components 2 can first converge at the loading end of the first station, wherein the first support component 2 near the loading end is fixed. Subsequently, starting from the first support component 2 near the unloading end, the support frame shifting mechanism of the nine first support components 2 is driven sequentially to move toward the unloading end along the first direction, with the moving distance of the nine first support components 2 decreasing sequentially until the first silicon rod 10 is transferred to the cutting position. In one example, the moving distance of each of the nine first support components 2 or the nine second support components 3 is an arithmetic sequence. It should be noted that the specific movement method of each support component during the loading or unloading process of the silicon rod dual-station cutting machine described in this application can be referred to the description in the subsequent embodiments, and will not be repeated here.

[0057] Furthermore, after the first silicon rod 10 is transferred to the cutting position of the processing platform and each of the first supporting components 2 is moved to its respective supporting position, the clamping member 241 in the top clamping mechanism 24 is actuated by the clamping drive unit 243 and clamps the first silicon rod 10 supported by each of the first supporting components 2. Through the cooperation of the clamping member 241 and the roller group in the silicon rod transfer mechanism 23, the first silicon rod 10 is positioned. Subsequently, the lifting column 251 in the bottom lifting mechanism 25 is raised and moved by the lifting drive unit 253 until it touches the bottom of the first silicon rod 10. Next, the clamping member 241 in the top clamping mechanism 24 is controlled by the clamping drive unit 243 to move away from the first silicon rod 10. The roller group in the silicon rod transfer mechanism 23 is controlled by the roller group flipping unit to flip downward and separate from the first silicon rod 10. This makes both the silicon rod transfer mechanism 23 and the top clamping mechanism 24 move away from the first silicon rod 10, so that the first silicon rod 10 is cut under the support of the lifting column 251 in the bottom lifting mechanism 25 and the action of the wire cutting device, forming multiple silicon rod segments.

[0058] Please see Figure 3 and Figure 4 The figures shown are schematic diagrams of the wire cutting device in one embodiment of this application. Figure 3 and Figure 4 As shown, each of the plurality of wire cutting devices 4 includes a cutting base 41, a cutting mounting structure 42, and a station switching mechanism 45. The cutting base 41 is disposed between the first station and the second station along a first direction. The cutting mounting structure 42 is disposed on the cutting base 41 and is provided with a first wire saw 435a and a second wire saw 435b. The station switching mechanism 45 can drive the cutting mounting structure 42 to swing between the first station and the second station, so that when the first silicon rod 10 is loaded at the first station, the second wire saw 435b swings to the second station to cut the second silicon rod to form multiple silicon rod segments, and when the second silicon rod is unloaded after the cutting operation, the first wire saw 435a swings to the first station to cut the first silicon rod 10.

[0059] In one embodiment, such as Figure 3 and Figure 4As shown, the first wire saw 435a and the second wire saw 435b can be disposed on the wire cutting unit 43. The wire cutting unit 43 can be configured to include multiple cutting wheels and transition wheels, and is disposed on the cutting mounting structure 42. In some examples, the multiple cutting wheels and transition wheels can be directly mounted on the cutting mounting structure 42. In other examples, the multiple cutting wheels and transition wheels can be disposed on the cutting mounting structure 42 through a bracket, connecting plate, or mounting frame. The cutting mounting structure 42 serves as a carrier that associates the multiple cutting wheels and transition wheels in the wire cutting unit 43 with the cutting seat 41. Its specific form can be, for example, a beam, a plate frame, a bracket, etc., and this application does not limit this.

[0060] In one embodiment, the first wire saw 435a and the second wire saw 435b are configured as parallel double-wire wire saws. In one example, the double-wire wire saw is formed by two closed-loop cutting wires respectively wound around the cutting wheel and the transition wheel of the wire cutting unit 43. Specifically, as Figure 3 As shown, the wire cutting unit 43 includes a first cutting wheel 431a, a second cutting wheel 431b, a third cutting wheel 431c, a first transition wheel 433a, a second transition wheel 433b, a first cutting line 435, and a second cutting line 436. The second cutting wheel 431b is located between the first cutting wheel 431a and the third cutting wheel 431c. The first cutting line 435 is sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a to form a first wire saw 435a between the first cutting wheel 431a and the second cutting wheel 431b. The second cutting line 436 is sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the second transition wheel 433b to form a second wire saw 435b between the third cutting wheel 431c and the second cutting wheel 431b.

[0061] In the above embodiment, both the first cutting wire 435 and the second cutting wire 436 are wound in a loop between the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the transition wheel to form a closed-loop cutting wire. In this example, the wire cutting device 4 can eliminate components such as the take-up spool and the pay-off spool, thereby effectively reducing the total length of the cutting wire required by the wire cutting unit and lowering production costs. At the same time, after being driven, the first cutting wire 435 and the second cutting wire 436 can run at high speed in the same direction of operation, avoiding problems such as wavy cut surfaces caused by the reversal of the cutting wire during the cutting process, and achieving high-precision cutting operations.

[0062] In one embodiment, each cutting wire can be independently tensioned. In one implementation, the wire cutting device 4 further includes a first tension adjusting mechanism 437 corresponding to the first cutting wire 435 and a second tension adjusting mechanism 438 corresponding to the second cutting wire 436. The first tension adjusting mechanism 437 is associated with a first transition wheel 433a, and the second tension adjusting mechanism 438 is associated with a second transition wheel 433b. The first transition wheel 433a, when guiding and pulling the first cutting wire 435, also serves as a tensioning wheel for adjusting the tension of the first cutting wire 435. The second transition wheel 433b, when guiding and pulling the second cutting wire 436, also serves as a tensioning wheel for adjusting the tension of the second cutting wire 436.

[0063] Taking the first tension adjustment mechanism 437 as an example, in some embodiments, the first tension adjustment mechanism 437 may be configured to include a tension sensor, a servo motor, and a lead screw. The tension sensor is disposed on the first transition wheel 433a, continuously sensing the tension value of the first cutting line 435 on the first transition wheel 433a, and issuing a drive signal when the tension value is less than a preset value. The servo motor is electrically connected to the tension sensor and starts working after receiving the drive signal issued by the tension sensor. One end of the lead screw is connected to the first transition wheel 433a, and the other end is connected to the servo motor. When the servo motor is working, it pulls the first transition wheel 433a to perform unidirectional displacement to adjust the tension of the first cutting line 435.

[0064] In some embodiments, the first tension adjustment mechanism 437 may be configured to include a linkage assembly and a tension drive unit. The linkage assembly is associated with a first transition wheel 433a, which serves as a tensioning wheel, and is controlled by the tension drive unit. That is, the tension drive unit drives the linkage assembly to actuate, thereby causing a positional change in the first transition wheel 433a to adjust the tension of the first cutting line 435.

[0065] In some implementations, the tension drive unit may include a counterweight, which may be associated with a linkage assembly. For example, when increasing the tension of the first cutting line 435, the counterweight is released, causing it to descend. Under the weight of the counterweight, the linkage assembly moves the associated tensioning wheel, thereby expanding the perimeter of the pattern formed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus increasing the tension of the first cutting line 435. When decreasing the tension of the first cutting line 435, the counterweight is raised. Under the weight of the counterweight, the linkage assembly moves the associated tensioning wheel in the opposite direction, thereby reducing the perimeter of the pattern formed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus decreasing the tension of the first cutting line 435. The counterweight may include counterweight blocks, wherein the number of counterweight blocks may vary according to the tension adjustment requirements of the first cutting line 435. For example, when increasing the tension of the first cutting line 435, the number of counterweight blocks may be increased, and when decreasing the tension of the first cutting line 435, the number of counterweight blocks may be decreased.

[0066] In some examples, the counterweight may include a locking mechanism for locking the counterweight so that it is stationary relative to the cutting mounting structure 42, thereby switching the counterweight and the cutting mounting structure 42 from an active state to a locked state. In some examples, the locking mechanism may be, for example, a pin, and the tension drive unit may include, for example, a tension cylinder associated with a movable tension wheel. The tension cylinder drives the associated tension wheel, and the tension of the first cutting line 435 is adjusted by changing the position of the tension wheel.

[0067] In some embodiments, the first tension adjusting mechanism 437 may be configured to include a torsion motor and a torsion shaft, the torsion motor being mounted on the cutting mounting structure 42, and the torsion shaft being associated with the torsion motor and the first transition wheel 433a. When the tension of the first cutting line 435 is to be increased, the torsion motor is driven to rotate in a first direction to drive the first transition wheel 433a to make a first movement via the torsion shaft, thereby expanding the perimeter of the pattern enclosed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus increasing the tension of the first cutting line 435. When the tension of the first cutting line 435 is to be decreased, the torsion motor is driven to rotate in a second direction to drive the first transition wheel 433a to make a second movement via the torsion shaft, thereby reducing the perimeter of the pattern enclosed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus decreasing the tension of the first cutting line 435.

[0068] The second tension adjustment mechanism 438 can have the same configuration as the first tension adjustment mechanism 437, and its specific structure and implementation will not be described in detail.

[0069] In one embodiment, the first cutting wheel 431a, the second cutting wheel 431b, and the third cutting wheel 431c have at least two cutting grooves, which are parallel to each other, so that the first cutting line 435 and the second cutting line 436 can be respectively arranged on different cutting grooves to form a parallel double-wire cutting saw. It should be understood that in the silicon rod cutting operation, it is necessary to perform a slicing and sampling operation on the silicon rod to test the material properties of the silicon rod to be cut. The double-wire cutting saw can simultaneously perform cutting and slicing operations on the silicon rod, wherein the thickness of the sample obtained from the slicing and sampling operation is the line spacing between the first cutting line 435 and the second cutting line 436 in the double-wire cutting saw.

[0070] In one embodiment, the wire cutting device 4 further includes a spacing adjustment mechanism for adjusting the switching between the first cutting line 435 and the second cutting line 436 in the cutting groove, thereby adjusting the thickness of the sample obtained from the slicing sampling operation. In some implementations, the spacing adjustment mechanism includes a lead screw and a lead screw drive source. The lead screw is arranged in a direction perpendicular to the surface of the cutting wheel and is threadedly connected to the wire cutting unit. The lead screw drive source is used to drive the lead screw to rotate. In other implementations, the spacing adjustment mechanism includes a telescopic member and a telescopic member drive source. The telescopic member is arranged in a direction perpendicular to the surface of the cutting wheel and is associated with the wire cutting unit. The telescopic member drive source is used to drive the telescopic member to extend or retract in a direction perpendicular to the surface of the cutting wheel. In still other implementations, the spacing adjustment mechanism includes a rack, a transmission gear, and a gear drive source. The rack is arranged in a direction perpendicular to the surface of the cutting wheel, the transmission gear meshes with the rack, and the gear drive source is used to drive the transmission gear to rotate.

[0071] In one embodiment, both the first cutting wire 435 and the second cutting wire 436 include a cutting wire driving device for driving the first cutting wire 435 or the second cutting wire 436 to run at high speed to cut the first silicon rod 10 or the second silicon rod. In one implementation, the cutting wire driving device is configured as a servo motor, which has a power output shaft connected to the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, or a related transition wheel. Thus, the first cutting wire 435 and the second cutting wire 436 can pass through the wound cutting wheel and transition wheel respectively and run along the winding direction. Of course, the cutting wire driving device can also be other drive sources such as a hydraulic motor, as long as it drives the corresponding cutting wire; this application does not impose any limitations.

[0072] In another embodiment, the first wire saw 435a and the second wire saw 435b are configured as single-wire wire saws. In one example, the single-wire wire saw consists of a single cutting wire wound in a loop between the cutting wheel and the transition wheel. Specifically, as... Figure 4 As shown, a first cutting line 435 is sequentially wound around a first cutting wheel 431a, a second cutting wheel 431b, a third cutting wheel 431c, and a first transition wheel 433a to form a first cutting wire saw 435a between the first cutting wheel 431a and the second cutting wheel 431b, and a second cutting wire saw 435b is formed between the third cutting wheel 431c and the second cutting wheel 431b. Alternatively, in some other examples, the single-wire cutting wire saw may be formed by a second cutting line 436 sequentially wound around a first cutting wheel 431a, a second cutting wheel 431b, a third cutting wheel 431c, and a second transition wheel 433b, forming a first cutting wire saw between the first cutting wheel 431a and the second cutting wheel 431b, and a second cutting wire saw between the third cutting wheel 431c and the second cutting wheel 431b.

[0073] In the above embodiments, the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and a certain transition wheel form a quadrilateral arrangement. In some other embodiments, the cutting wire may be sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, the first transition wheel 433a, and the second transition wheel 433b to form a pentagonal arrangement. In this case, a first cutting wire saw is formed between the first cutting wheel 431a and the second cutting wheel 431b, and a second cutting wire saw is formed between the third cutting wheel 431c and the second cutting wheel 431b.

[0074] In some embodiments, the single-wire cutting saw is equipped with a cutting wire drive device and a tension adjustment mechanism, as described in the foregoing embodiments, and will not be repeated here.

[0075] exist Figure 3 and Figure 4 In the embodiments described, the first wire saw 435a and the second wire saw 435b share three cutting wheels: the first cutting wheel 431a, the second cutting wheel 431b, and the third cutting wheel 431c. This arrangement reduces the number of cutting wheels in the wire cutting unit, thereby improving the structural compactness of the wire cutting device 4. The above embodiments are preferred implementations and should not be construed as limiting the present application. Those skilled in the art can adjust the specific structure of the wire cutting device based on the guidance of the present application.

[0076] In one embodiment, the cutting seat 41 is disposed on a third guide rail, and the third guide rail is parallel to the aforementioned first and second guide rails. Further, the third guide rail is located between the first and second guide rails, and the first wire saw 435a and the second wire saw 435b are perpendicular to the first silicon rod 10 and the second silicon rod, respectively, and, driven by the workstation switching mechanism, respectively perform cutting operations on the first silicon rod 10 or the second silicon rod.

[0077] In one embodiment, the plurality of wire cutting devices 4 are arranged along a first direction on a third guide rail, and can be simultaneously switched to the first station or the second station under the drive of the station switching mechanism 45. In one implementation, the station switching mechanism 45 includes a swing driver and a passive rotating shaft. The swing driver is located at the top of the cutting mounting structure 42, and the passive rotating shaft is located at the bottom of the cutting mounting structure 42. The swing driver drives the cutting mounting structure 42 to swing around the passive rotating shaft, so that the cutting mounting structure 42 can switch between the first station and the second station.

[0078] In one embodiment, the oscillating actuator may be configured to include an arc-shaped guide rail disposed on the top of the cutting mounting structure 42 and an oscillating drive source. The oscillating drive source can drive the cutting mounting structure 42 to move on the arc-shaped guide rail to realize the oscillation of the wire cutting device 4 around the passive rotation axis, thereby realizing the switching of the wire cutting device 4 between the first station and the second station, thereby selectively performing severing operations on the first silicon rod 10 or the second silicon rod. Compared to placing the oscillating actuator at the bottom of the cutting mounting structure 42, this embodiment makes the oscillation of the cutting mounting structure 42 around the passive rotation axis less strenuous. In some examples, the oscillating drive source may be configured as a cylinder, a servo motor, or a hydraulic motor, etc.

[0079] In one embodiment, the wire cutting device 4 swings between the first station and the second station at an angle of 85°-95°, for example, approximately 85°, 85.5°, 86°, 86.5°, 87°, 87.5°, 88°, 88.5°, 89°, 89.5°, 90°, 90.5°, 91°, 91.5°, 92°, 92.5°, 93°, 93.5°, 94°, 94.5°, or 95°. Preferably, the wire cutting device 4 swings between the first station and the second station at an angle of 91.5°. In one implementation, based on the mathematical relationship between the arc length and the corresponding angle, the swing angle of the wire cutting device 4 between the first station and the second station can be controlled by controlling the length of the arc-shaped guide rail.

[0080] In one embodiment, such as Figure 3 and Figure 4As shown, the wire cutting device 4 also includes a cutting shifting mechanism 44, which drives at least one wire cutting device 4 to move along the third guide rail to adjust the cutting position or the wire retraction position. It should be understood that during the cutting process, the silicon rod needs to be cut at a specific cutting position to obtain a silicon rod segment of a specific length according to actual processing requirements. After cutting, the wire cutting device 4 needs to move a certain distance to a suitable wire retraction position to avoid interference between the silicon rod segment and the wire saw, thereby avoiding damage to the silicon rod segment and ensuring the quality of the cutting operation. Therefore, the wire cutting device 4 needs to move along the first direction on the third guide rail to adjust the cutting position or the wire retraction position of the wire saw.

[0081] In one embodiment, the cutting and shifting mechanism 44 includes a shifting guide rail 441, a slider 442, and a shifting drive unit. Two shifting guide rails 441 are configured and arranged parallel to each other along a first direction on the processing platform of the machine base 1. The length of the two shifting guide rails 441 can extend through the entire processing platform. The slider 442 cooperates with the shifting guide rails 441 and is located at the bottom of the cutting seat 41. In one example, the shifting drive unit includes a shifting rack 443, a drive gear (not shown), and a gear drive motor 445. The shifting rack 443 can be arranged parallel to the two shifting guide rails 441. The drive gear meshes with the shifting rack 443. The gear drive motor 445 is associated with the drive gear and is located on the cutting seat 41 of the corresponding wire cutting device 4. Specifically, the gear drive motor 445 drives the connected drive gear to rotate, and through the meshing of the drive gear with the shift rack 443, drives the wire cutting device 4 to move along the shift guide rail 441 in a first direction on the processing platform. In some other examples, the moving drive unit may include a moving lead screw and a drive motor, wherein the moving lead screw is arranged along the first direction and associated with the cutting seat in the at least one wire cutting device, and the drive motor is used to drive the moving lead screw to rotate so that the associated at least one wire cutting device moves along the shift guide rail in the first direction.

[0082] Of course, the cutting and shifting mechanism 44 can still be modified in other ways. For example, in other embodiments, the cutting and shifting mechanism can be configured to include a chain conveying mechanism or a conveyor belt mechanism, etc. Those skilled in the art can set the specific structure of the cutting and shifting mechanism under the guidance of this application.

[0083] In one embodiment, such as Figure 1As shown, the wire cutting device 4 is configured with nine units, of which the wire cutting device located at the loading end of the processing platform is fixedly installed, and the remaining eight wire cutting devices can move along the third guide rail. Specifically, nine wire cutting devices are installed on the third guide rail. Each wire cutting device can have the same structure and each has an independent cutting and shifting mechanism. In one example, the cutting and shifting mechanism is equipped with a locking structure, which can lock the wire cutting device at the loading end, thus fixing the wire cutting device, while the remaining eight wire cutting devices can move on the third guide rail. In another embodiment, the wire cutting device located at the unloading end of the processing platform can be fixedly installed, while the remaining eight wire cutting devices can move along the third guide rail. Of course, the number of wire cutting devices fixedly installed at the loading or unloading end can also be multiple, depending on the actual production needs. For example, when the length of the silicon rod to be cut is short, not all wire cutting devices need to participate in the silicon rod cutting operation. In this case, the excess wire cutting devices can be fixedly installed at the loading or unloading end to avoid hindering the cutting operation.

[0084] In one embodiment, the eight wire cutting devices move sequentially toward the unloading end of the processing platform, with the moving distance decreasing sequentially. Specifically, before the cutting operation, all the wire cutting devices can be gathered at the loading end of the processing platform, with the wire cutting device near the loading end fixed. Then, starting with the wire cutting device near the unloading end, the cutting displacement mechanism of the eight wire cutting devices is driven sequentially toward the unloading end along a first direction, with the moving distance of the eight wire cutting devices decreasing sequentially until each wire cutting device reaches the cutting position. In one example, the moving distance of each of the eight wire cutting devices is an arithmetic sequence. It should be noted that the specific movement method of each wire cutting device during the loading or unloading process of the silicon rod dual-station cutting machine described in this application can be referred to the description in the subsequent embodiments, and will not be repeated here.

[0085] In one embodiment, the first wire saw 435a and the second wire saw 435b of the wire cutting device 4 located at the loading end or the unloading end can be configured as parallel double-wire wire saws for tail-end slicing or head-end slicing sampling. Specifically, the station switching mechanism 45, driven by the swing driver, causes the wire cutting device 4 to swing around the passive rotation axis, causing the first wire saw 435a to swing to the first station to perform tail-end slicing or head-end slicing sampling on the first silicon rod 10; or, driven by the swing driver, the wire cutting device 4 to swing around the passive rotation axis, causing the second wire saw 435b to swing to the second station to perform tail-end slicing or head-end slicing sampling on the second silicon rod.

[0086] As mentioned earlier, in the silicon rod cutting operation, it is necessary to perform a slicing and sampling operation on the silicon rod to obtain silicon wafer samples for testing the material properties of the silicon rod to be cut. The specific configuration of the dual-wire cutting saw can be found in the description of the preceding embodiments. In one example, the first and second cutting wire saws of the wire cutting device located at the feeding end are configured as dual-wire cutting wire saws, which can simultaneously perform cutting and slicing sampling operations on the tail of the silicon rod. In another example, the first and second cutting wire saws of the wire cutting device located at the unloading end are configured as dual-wire cutting wire saws, which can simultaneously perform cutting and slicing sampling operations on the head of the silicon rod. Of course, the dual-wire cutting wire saw can be set on the wire cutting device at any position to sample at any location on the silicon rod, specifically determined according to actual production needs.

[0087] In one embodiment, the first wire saw 435a and the second wire saw 435b of the wire cutting device 4, located in the middle position, are configured as single-wire cutting saws to cut the first silicon rod 10 and the second silicon rod, respectively. Specifically, the station switching mechanism 45, driven by the swing drive, causes the wire cutting device 4 to swing around the passive rotation axis, so that the first wire saw 435a swings to the first station to cut the first silicon rod 10; or, driven by the swing drive, the wire cutting device 4 swings around the passive rotation axis, so that the second wire saw 435b swings to the second station to cut the second silicon rod. The specific configuration of the single-wire cutting saws can be found in the previous description and will not be repeated here.

[0088] As mentioned earlier, most manufacturers use robots or robotic arms to transport silicon ingots to the processing area for cutting into multiple segments during loading. However, this loading method is labor-intensive and may cause the silicon ingots to fall or be damaged during transport. Furthermore, when unloading the resulting silicon ingot segments after cutting, the cutting wire needs to be quickly removed for the next cut. During this process, contact between the cutting wire and the silicon ingot segments must be avoided to prevent surface damage and ensure product quality.

[0089] In view of this, the loading and unloading mechanism of the silicon rod cutting equipment provided in this application includes multiple support components and a control device. The multiple support components are disposed on a processing platform and are used to support the horizontally placed silicon rod to be cut during loading and to support the silicon rod segments after cutting during unloading. They include a support frame for carrying the silicon rod or the silicon rod segments, a support frame shifting mechanism for driving the support frame to move the silicon rod or the silicon rod segments along a first direction, and a silicon rod conveying mechanism for driving the silicon rod or the silicon rod segments relative to the support frame along the first direction. The control device is connected to multiple wire cutting devices performing the cutting operation and the multiple support components, and is used to control the multiple support components to move sequentially toward the unloading end of the processing platform under a first command for loading, and to control the multiple wire cutting devices and the multiple support components to move sequentially toward the unloading end under a second command for unloading.

[0090] In this application, the supporting component is for Figure 1-2 The support component in the illustrated embodiment, wherein the wire cutting device is for... Figure 1-4 The wire cutting device in the illustrated embodiment can be referred to the foregoing description in the following description, and will not be repeated here.

[0091] In one embodiment, the control device includes a processing unit, a storage unit, and multiple interface units. Each interface unit is an independently packaged device, component, or mechanism within the dual-station silicon rod cutting machine, including multiple wire cutting devices and multiple support components, and transmits data via an interface. The control device also includes at least one of the following: a prompting device, a human-machine interface device, etc. The interface unit determines its interface type according to the connected device, component, or mechanism, including but not limited to: a universal serial interface, a video interface, an industrial control interface, a wireless communication port, etc. The storage unit stores the printing program, and the processing unit is connected to the storage unit to coordinate the various components or structures in the dual-station silicon rod cutting machine to perform the cutting operation on the first or second silicon rod when executing the cutting operation.

[0092] The following describes in detail the specific process by which the control device controls the multiple support components and the multiple wire cutting devices to perform loading or unloading operations using the loading and unloading mechanism provided in this application. For ease of description, the loading and unloading operations of multiple first support components at the first station will be used as an example in the subsequent embodiments.

[0093] Please see Figure 5 The diagram shows a flow chart of a control device controlling multiple support components to perform a loading operation under a first command in one embodiment of this application. Figure 5As shown, the loading operation process includes steps S110, S120, and S130. The following description uses the loading operation process executed by a control device as an example to illustrate various embodiments.

[0094] In step S110, the control device drives the support frame shifting mechanism to bring all the support components together at the loading end of the processing platform.

[0095] It should be understood that the convergence refers to the arrangement of the various first support components close together at the loading end of the processing platform, or arranged sequentially at a certain interval. Taking the loading operation of multiple first support components 2 as an example, in one embodiment, the support frame shifting mechanism 22 corresponding to all the first support components 2 is driven to move all the first support components towards the loading end along a first direction, so that all the first support components converge at the loading end to form a complete loading and conveying group. In this embodiment, all ten first support components at the first station are movable.

[0096] In another embodiment, the support frame shifting mechanism 22 corresponding to the first support component 2 of the drive section causes the movable first support component to move along a first direction toward the loading end until it converges at the loading end to form an integral loading conveyor group. In one example, one first support component located at the unloading end of the processing platform is fixedly installed, while the remaining nine first support components can move along the first guide rail. Please refer to [link to relevant documentation]. Figure 6 The image shows a schematic diagram of multiple first support components converging at the loading end in one embodiment of this application. Figure 6 In the example shown, the nine movable first support components 2 move along the first guide rail toward the loading end under the drive of their respective support frame shifting mechanisms 22, until they all converge at the loading end and present an arrangement as shown. Figure 6 The state shown. It should be noted that... Figure 6 This is merely an illustrative illustration and should not be construed as a limitation of this application. For example, one first support component located at the loading end of the processing platform may be fixedly installed, while the other nine first support components may be movable along the first guide rail; or the first support components located at the loading end and unloading end of the processing platform may be fixedly installed respectively, while the other eight first support components may be movable along the first guide rail.

[0097] Please continue reading. Figure 5 In step S120, the control device drives the silicon rod transfer mechanism to transfer the silicon rod to be cut onto the support assembly, and drives the support frame shifting mechanism to move multiple movable support assemblies toward the unloading end along the first direction until the silicon rod to be cut reaches the cutting area and each support assembly reaches its respective support position.

[0098] In one embodiment, such as Figure 1As shown, the silicon rod dual-station cutting machine described in this application further includes a feeding conveyor 7 connected to the feeding end. Specifically, it may include a first feeding conveyor 7 connected to the feeding end of the first station and a second feeding conveyor 7 connected to the feeding end of the second station. Taking the first feeding conveyor 7 as an example, in... Figure 1 In the example shown, the first or second feeding conveyor 7 may include a support frame, with a support platform at the top. Two rows of rollers are arranged on opposite sides of the support platform. Each roller group includes multiple rollers arranged sequentially along the length of the support frame. Each roller is connected to the support platform via a bearing seat and protrudes from the support platform. The rollers in the two rows of rollers form a support surface for supporting the silicon rod. After the silicon rod is horizontally placed on the two rows of rollers on the support platform, the silicon rod can be directly pushed by the two rows of rollers to transport the silicon rod and complete the silicon rod feeding operation. In some embodiments, the first feeding conveyor 7 includes a silicon rod pushing mechanism. Using the silicon rod pushing mechanism, the first silicon rod 10 can be pushed independently or in conjunction with manual force to move on the two rows of rollers. In some embodiments, the silicon rod pushing mechanism may be, for example, a chain drive mechanism, including a ring chain, a pusher on the ring chain, and a chain drive unit for moving the ring chain. The pusher may include a push block or a push rod, and the chain drive unit may include a drive gear meshing with the ring chain and a drive motor associated with the drive gear. In practical applications, the drive motor drives the drive gear to rotate, which in turn drives the ring chain and the pusher block or push rod on it. The moving pusher block or push rod pushes the first silicon rod 10 to move along the ring chain.

[0099] In some embodiments, in the second direction, the rollers in the first roller group and the rollers in the second roller group are paired up to form a roller pair. The two rollers in a roller pair can be connected by a rotating shaft. The silicon rod pushing mechanism includes a cascaded chain drive mechanism, which includes multiple cascaded chains and a drive motor. Specifically, the silicon rod pushing mechanism is arranged on one side of the two roller groups as the drive side, and the roller on the drive side of each roller pair is equipped with a double drive gear. The cascading of all rollers in the two roller groups is achieved by connecting two adjacent rollers along the first direction through a cascaded chain (e.g., a short annular chain) to the corresponding drive gear. The drive motor is also connected to the two roller groups through the short annular chain and the drive gear. In practical applications, the drive motor drives the drive gear to rotate, which drives all the rollers in the two roller groups to roll through the cascaded chain. The friction between the rollers and the first silicon rod 10 drives the first silicon rod 10 to move. Compared to ordinary chain drive mechanisms, cascaded chain drive mechanisms can generate greater power, and all rollers rotate synchronously, which can ensure that the first silicon rod 10 moves more smoothly and steadily.

[0100] For ease of description and explanation, the first support component closest to the unloading end (i.e., the rightmost end) among the ten first support components is called the first support component. The support components are numbered sequentially from the unloading end to the loading end as the second, third, fourth, fifth, sixth, seventh, eighth, and ninth support components, and so on. The first support component closest to the loading end (i.e., the leftmost end) is called the tenth support component.

[0101] Specifically, in step S120, the roller group drive unit in the silicon rod transfer mechanism 23 of all the first support components 2 gathered at the feeding end is first driven to rotate the rollers. Then, the first feeding conveyor 7 is used to transport the horizontally placed first silicon rod 10 and transfer its head to the roller group of the silicon rod transfer mechanism 23 in the tenth support component. After that, with the help of the rotational friction of the first feeding conveyor 7 and the roller groups in the silicon rod transfer mechanisms 23 of each gathered first support component, the first silicon rod 10 to be cut can be sequentially transported to each gathered first support component. Next, as the roller assembly in the silicon rod transfer mechanism 23 of each of the gathered first support components rotates, the corresponding support component is driven by the support frame shifting mechanism 22 to move along the first guide rail toward the unloading end. In this way, while the first silicon rod 10 is being conveyed toward the unloading end, each of the first support components gathered at the loading end also moves toward the unloading end and gradually disperses from each other. Finally, each of the first support components moves to its respective support position under the drive of the support frame shifting mechanism, and moves the first silicon rod 10 to the corresponding cutting area.

[0102] In one embodiment, in step S120, the moving distances of the plurality of movable support components are maintained to decrease sequentially. In an example where all ten first support components converge at the loading end, the first support component is first driven to move a first distance along the first guide rail toward the unloading end. After a preset time interval, the second support component is then driven to move a second distance along the first guide rail toward the unloading end. Subsequently, the third support component is driven to move a third distance along the first guide rail toward the unloading end, the fourth support component is driven to move a fourth distance along the first guide rail toward the unloading end, the fifth support component is driven to move a fifth distance along the first guide rail toward the unloading end, the sixth support component is driven to move a sixth distance along the first guide rail toward the unloading end, the seventh support component is driven to move a seventh distance along the first guide rail toward the unloading end, the eighth support component is driven to move an eighth distance along the first guide rail toward the unloading end, the ninth support component is driven to move a ninth distance along the first guide rail toward the unloading end, and the tenth support component is driven to move a tenth distance along the first guide rail toward the unloading end. Among them, the first distance, the second distance, the third distance, the fourth distance, the fifth distance, the sixth distance, the seventh distance, the eighth distance, the ninth distance, and the tenth distance decrease in sequence.

[0103] In one embodiment, the distances moved by each of the plurality of movable support components are an arithmetic sequence. That is, in the above embodiment, the first distance, the second distance, the third distance, the fourth distance, the fifth distance, the sixth distance, the seventh distance, the eighth distance, the ninth distance, and the tenth distance are an arithmetic sequence.

[0104] Furthermore, the cutting and shifting mechanism is driven to operate, thereby driving the nine wire cutting devices 4 to move to their respective cutting positions. For ease of description and explanation, the wire cutting device closest to the unloading end (i.e., the rightmost end) among the nine wire cutting devices is referred to as the first wire cutting device. From the unloading end towards the loading end, they are sequentially named the second, third, fourth, fifth, sixth, seventh, eighth, and ninth wire cutting devices, and so on. The wire cutting device closest to the loading end (i.e., the leftmost end) is referred to as the tenth wire cutting device. This will not be repeated in subsequent embodiments.

[0105] Please continue reading. Figure 5 In step S130, the control device drives the top clamping mechanism to clamp the top of the silicon rod to be cut, drives the bottom lifting mechanism to rise and touch the bottom of the silicon rod to be cut, and then removes the top clamping mechanism and the silicon rod transfer mechanism, so that the silicon rod to be cut is cut under the support of the bottom lifting mechanism to form multiple silicon rod segments.

[0106] Specifically, please refer to Figure 7 This is a schematic diagram showing the state of the first supporting component performing a truncation operation in one embodiment of this application. Figure 7 As shown in diagram a, after each first support assembly 2 moves to its corresponding support position and the first silicon rod 10 moves to its corresponding cutting position, the top clamping mechanism in each first support assembly 2 is activated, causing the clamping drive unit 243 to drive the clamping member 241 to move toward the first silicon rod 10 until it clamps the top of the first silicon rod 10. The top clamping mechanism, in cooperation with the silicon rod transfer mechanism 23, positions the first silicon rod 10. Then, as... Figure 7 As shown in b, the lifting drive unit 253 in the bottom lifting mechanism of each first support component 2 drives the lifting column 251 to rise and touch the bottom of the first silicon rod 10.

[0107] Subsequently, as Figure 7 As shown in Figure c, the roller assembly folding unit in each of the first support components 2 is driven to fold the roller assembly downwards and away from the bottom of the first silicon rod 10. Thereafter, as... Figure 7As shown in diagram d, the clamping drive unit 243 drives the top clamping mechanism in each of the first support components 2, causing the clamping member 241 to lift and move away from the first silicon rod 10. In this way, the first silicon rod 10 is cut off only under the support of the lifting column 251 of the bottom lifting mechanism.

[0108] Then, as Figure 7 As shown in Figure e, the station switching mechanism, driven by the oscillating driver, causes the nine wire cutting devices 4 to oscillate around the passive rotation axis, causing the first cutting wire saw 435a to oscillate to the first station and perform a cutting or slicing operation on the first silicon rod 10, forming eight silicon rod segments 20. At this time, the lifting columns 251 in each of the first support components 2 can form a support surface that fits against the bottom circumferential surface of the first silicon rod 10. When the first silicon rod 10 is cut, it will not be interfered with by the rollers in the first support component or any other possible contact components, which can effectively prevent edge chipping during the cutting process, ensure the flatness of the cut surface, and thus improve the quality of silicon rod cutting.

[0109] Meanwhile, during the first silicon rod 10 cutting operation at the first station, the second silicon rod can be loaded at the second station. Specifically, multiple second support components 3 located at the second station execute steps S110 to S130, causing the second silicon rod to move to the corresponding cutting area. Only under the support of the bottom lifting mechanism of the second support component, the second cutting wire saw 435b is driven by the station switching mechanism to swing to the second station to perform the cutting operation or slice sampling operation on the second silicon rod.

[0110] After the cutting operation is completed, the control device controls multiple wire cutting devices and multiple support components to move sequentially toward the unloading end under the second command to perform the unloading operation.

[0111] Please see Figure 8 The diagram illustrates a process in one embodiment of this application where a control device controls multiple support components and multiple wire cutting devices to perform a material feeding operation under a second command. Figure 8 As shown, the material feeding operation includes steps S210, S220, S230, S240, and S250. The following description uses the example of the material feeding operation being executed by a control device to illustrate various embodiments.

[0112] In step S210, the control device drives the top clamping mechanism to press the top surface of the silicon rod segment, so that the silicon rod segment can be fixed by both the top clamping mechanism and the bottom lifting mechanism at the same time.

[0113] Specifically, such as Figure 7As shown in f, after the first silicon rod 10 is cut into eight silicon rod segments 20 by the first wire saw 435a, the top clamping mechanism of each first support component 2 (for example, the second to the ninth support component) corresponding to the eight silicon rod segments 20 is activated, causing the clamping drive unit 243 to drive the clamping member 241 to move toward the silicon rod segment 20 and clamp the top of the silicon rod segment 20. The top clamping mechanism and the bottom lifting mechanism cooperate to fix the silicon rod segment 20. At this time, the silicon rod dual-station cutting machine presents the following state: Figure 9 The state shown, in which, Figure 9 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine after performing step S210 in one embodiment of this application.

[0114] Please continue reading. Figure 8 In step S220, the control device drives the support frame shifting mechanism so that each support component moves the silicon rod segment it carries toward the unloading end of the processing platform. At the same time, it drives the wire cutting device to move toward the unloading end to adjust the spacing and leave space for the wire saw to retract.

[0115] In the embodiments described in this application, nine wire cutting devices 4 and eight first support components 2 (i.e., the second to the ninth support components) supporting eight silicon rod segments 20 are moved along the first guide rail toward the unloading end for spacing adjustment.

[0116] In one embodiment, step S220 further includes simultaneously activating the wire cutting device and the support assembly, starting from the unloading end of the processing platform, and sequentially stopping the wire cutting device and the support assembly, such that the respective moving distances of the wire cutting device and the support assembly decrease sequentially. Please refer to [link to previous text]. Figure 10 The image shows a schematic diagram of the state of the silicon rod dual-station cutting machine after step S220 is executed in one embodiment of this application.

[0117] Specifically, starting from the unloading end, the first wire cutting device is driven to move a first cutting distance along a first direction toward the unloading end. The second supporting assembly and the first silicon rod segment 20 it supports are then driven to move a first supporting distance along the first direction toward the unloading end. At this point, the first cutting distance is greater than the first supporting distance, thus providing a first retraction space for the first wire saw of the first wire cutting device. The second wire cutting device is then driven to move a second cutting distance along the first direction toward the unloading end. The third supporting assembly and the second silicon rod segment 20 it supports are then driven to move a second supporting distance along the first direction toward the unloading end. At this point, the first supporting distance is greater than the second cutting distance, and the second cutting distance is greater than the second supporting distance, thus providing a second retraction space for the first wire saw of the second wire cutting device. The third wire cutting device is driven to move a third cutting distance along the first direction toward the unloading end, and the fourth support assembly and the third silicon rod segment 20 it supports are driven to move a third support distance along the first direction toward the unloading end. At this time, the second support distance is greater than the third cutting distance, and the third cutting distance is greater than the third support distance, thus leaving a third wire retraction space for the first cutting wire saw of the third wire cutting device. The fourth wire cutting device is driven to move a fourth cutting distance along the first direction toward the unloading end, and the fifth support assembly and the fourth silicon rod segment 20 it supports are driven to move a fourth support distance along the first direction toward the unloading end. At this time, the third support distance is greater than the fourth cutting distance, and the fourth cutting distance is greater than the fourth support distance, thus leaving a fourth wire retraction space for the first cutting wire saw of the fourth wire cutting device. The fifth wire cutting device is driven to move a fifth cutting distance along the first direction toward the unloading end, and the sixth support assembly and the fifth silicon rod segment 20 it supports are driven to move a fifth support distance along the first direction toward the unloading end. At this time, the fourth support distance is greater than the fifth cutting distance, and the fifth cutting distance is greater than the fifth support distance, thus leaving a fifth wire retraction space for the first cutting wire saw of the fifth wire cutting device. The sixth wire cutting device is driven to move a sixth cutting distance along the first direction toward the unloading end, and the seventh support assembly and the sixth silicon rod segment 20 it supports are driven to move a sixth support distance along the first direction toward the unloading end. At this time, the fifth support distance is greater than the sixth cutting distance, and the sixth cutting distance is greater than the sixth support distance, thus leaving a sixth wire retraction space for the first cutting wire saw of the sixth wire cutting device. The seventh wire cutting device is driven to move a seventh cutting distance towards the unloading end along the first direction, and the eighth support component and the seventh silicon rod segment 20 it supports are driven to move a seventh support distance towards the unloading end along the first direction. At this time, the sixth support distance is greater than the seventh cutting distance, and the seventh cutting distance is greater than the seventh support distance, thereby leaving a seventh wire retraction space for the cutting wire saw of the seventh wire cutting device.The eighth wire cutting device is driven to move an eighth cutting distance along the first direction toward the unloading end, and the ninth support assembly and the eighth silicon rod segment 20 it supports are driven to move an eighth support distance along the first direction toward the unloading end. At this time, the seventh support distance is greater than the eighth cutting distance, and the eighth cutting distance is greater than the eighth support distance, thus leaving an eighth retraction space for the first cutting wire saw of the eighth wire cutting device. The ninth wire cutting device is driven to move a ninth cutting distance along the first direction toward the unloading end, and at this time, the eighth support distance is greater than the ninth cutting distance, thus leaving a ninth retraction space for the first cutting wire saw of the ninth wire cutting device. At this time, the nine wire cutting devices 4 and each first support assembly 2 are positioned as shown. Figure 10 The state shown.

[0118] In one embodiment, the moving distances of the wire cutting device and the supporting component are respectively arithmetic progressions. That is, the first cutting distance, first supporting distance, second cutting distance, second supporting distance, third cutting distance, third supporting distance, fourth cutting distance, fourth supporting distance, fifth cutting distance, fifth supporting distance, sixth cutting distance, sixth supporting distance, seventh cutting distance, seventh supporting distance, eighth cutting distance, eighth supporting distance, and ninth cutting distance described in the above embodiment form a decreasing arithmetic progression.

[0119] Please continue reading. Figure 8 In step S230, the control device drives the station switching mechanism to make the wire cutting device swing so that the wire saw can complete the wire retraction through the wire retraction space.

[0120] Specifically, please refer to Figure 11 The image shows a schematic diagram of the state after step S230 is performed by the silicon rod dual-station cutting machine in one embodiment of this application. Figure 11 In the example shown, the station switching mechanism, driven by the oscillating actuator, causes the nine wire cutting devices 4 to oscillate around the passive rotation axis to move away from the first station, allowing the first wire saw in each wire cutting device to retract its wire unimpeded through the corresponding retraction space. In another example, the station switching mechanism can cause the nine wire cutting devices 4 to oscillate directly to the second station, allowing the first wire saw to retract its wire while the second wire saw performs a cutting operation or slice sampling operation on the second silicon rod.

[0121] Please continue reading. Figure 8 In step S240, the control device removes the top clamping mechanism to move away from the silicon rod segment, drives the roller group folding unit to make the silicon rod transfer mechanism support the silicon rod segment, and removes the bottom lifting mechanism so that the silicon rod segment is unloaded only under the support of the silicon rod transfer mechanism.

[0122] As mentioned above, during the process of adjusting the spacing to achieve the retraction of each first cutting line saw, the top pressing mechanism in the corresponding first support component presses the top of each silicon rod segment 20 and cooperates with the bottom lifting mechanism to position the silicon rod segment 20. Therefore, before unloading each silicon rod segment 20, the top pressing mechanism of each first support component 2 needs to be removed, the silicon rod transfer mechanism needs to be returned to its original position to support the silicon rod segment 20 again, and the bottom lifting mechanism needs to be removed at the same time.

[0123] Specifically, the top clamping mechanism of the second to ninth support components 2 is activated, causing the clamping drive unit 243 to drive the clamping member 241 away from each silicon rod segment 20, the roller group flipping unit in the silicon rod transfer mechanism 23 is activated to flip the roller group upward to support each silicon rod segment 20 again, and the lifting drive unit 253 in the bottom lifting mechanism is activated to lower the lifting column 251 away from each silicon rod segment 20.

[0124] Please continue reading. Figure 8 In step S250, the control device drives the support frame shifting mechanism to sequentially gather all movable support components to the unloading end of the processing platform. The silicon rod transfer mechanism near the unloading end continues to work until all silicon rod segments have completed the unloading operation.

[0125] In one embodiment, such as Figure 1 As shown, the silicon rod dual-station cutting machine described in this application further includes a feeding conveying device 8 connected to the feeding end. Specifically, it may include a first feeding conveying device 8 connected to the feeding end of the first station and a second feeding conveying device 8 connected to the feeding end of the second station. The feeding conveying device 8 and the feeding conveying device 7 may have the same configuration, and their specific structure can be found in the description of the foregoing embodiments, which will not be repeated here.

[0126] Specifically, please refer to Figure 12 The image shows a schematic diagram illustrating the state of the silicon rod dual-station cutting machine during step S250 in one embodiment of this application. Figure 12 As shown, the roller assembly in the silicon rod transfer mechanism of each first support component 2 rotates continuously, pushing each silicon rod segment 20 to the first unloading conveyor 8 in sequence, whereby the first unloading conveyor 8 unloads the material in sequence.

[0127] In one embodiment, the time for cutting the first silicon rod 10 or the second silicon rod is equal to the time for loading or unloading. That is, while cutting the first silicon rod 10, the second silicon rod can be loaded; after the second silicon rod reaches the cutting position, the first silicon rod 10 is cut into multiple silicon rod segments 20, and the unloading operation can continue; while the silicon rod segments 20 are being unloaded, each wire cutting device 4 can swing to the second station to cut the second silicon rod. In this way, the first and second stations of the silicon rod dual-station cutting machine continuously perform loading, cutting, and unloading operations on the silicon rods, thereby greatly improving the cutting efficiency of the silicon rods.

[0128] The following description, in conjunction with the accompanying drawings, illustrates the execution process of the silicon rod dual-station cutting machine in the aforementioned embodiments.

[0129] First, the control device controls multiple first support components 2 to execute steps S110 to S130 under a first command to feed the first silicon rod 10 on the first station, so that the first silicon rod 10 to be cut reaches the cutting area and is ready for cutting under the support of the bottom lifting mechanism. Then, multiple wire cutting devices 4 reach the cutting position under the drive of the cutting shifting mechanism, and the first cutting wire saw 435a swings to the first station under the drive of the swing driver, and performs cutting or slicing sampling on the first silicon rod 10 to form multiple silicon rod segments 20. While cutting the first silicon rod 10, the control device controls multiple second support components 3 to repeat steps S110 to S130 under a first command to feed the second silicon rod on the second station, so that the second silicon rod to be cut reaches the cutting area and is ready for cutting under the support of the bottom lifting mechanism. Subsequently, the control device controls multiple first support components 2 and multiple wire cutting devices 4 to execute steps S210 to S250 under a second command, performing unloading operations on the multiple silicon rod segments 20 obtained from cutting the first silicon rod 10. Simultaneously with the unloading of the silicon rod segments 20, the multiple wire cutting devices 4, driven by a swing driver, swing the second cutting wire saw 435b to the second station, performing cutting or slicing operations on the second silicon rod to form multiple silicon rod segments. Then, the control device controls multiple second support components 3 and multiple wire cutting devices 4 to repeat steps S210 to S250 under a second command, performing unloading operations on the multiple silicon rod segments obtained from cutting the second silicon rod. By cyclically executing the above steps, the control device enables the dual-station silicon rod cutting machine to achieve uninterrupted feeding, cutting, and unloading operations on silicon rods at two stations.

[0130] In summary, to overcome the technical problems of laborious and unstable loading methods using robots or robotic arms, and surface damage to silicon rod segments caused by contact between the cutting wire and the silicon rod segment during unloading, the loading and unloading mechanism provided in this application, by setting multiple support components on the processing platform, can support the silicon rod to be cut during loading and the resulting silicon rod segment during unloading. By setting a control device connecting the support components and the wire cutting device, the loading and unloading operations can be automated, improving processing efficiency. By setting a support frame, a support frame shifting mechanism, and a silicon rod conveying mechanism on each support component, each support component can independently move while supporting the silicon rod or silicon rod segment on the processing platform, making the loading process more labor-saving. During unloading, the support components can move separately to leave space for wire retraction, thereby avoiding contact between the cutting wire and the silicon rod segment, ensuring product quality. Throughout the entire processing, the support components stably support the silicon rod or silicon rod segment, improving the stability of loading and unloading.

[0131] Furthermore, by incorporating a bottom lifting mechanism within the support assembly, support for the silicon ingot during the cutting process is achieved. By setting multiple independently controllable lifting columns within the bottom lifting mechanism, each column can rise to a different height to adaptively contact the circumference of the silicon ingot, thus ensuring full contact and stable support. This prevents displacement of the silicon ingot during cutting, avoiding edge chipping and improving the quality of silicon ingot processing.

[0132] Furthermore, the silicon rod dual-station cutting machine provided in this application, by setting a first station and a second station parallel to each other on the processing platform, can simultaneously support two silicon rods. By setting a first wire saw and a second wire saw on the cutting mounting structure of the wire cutting device to cut the two silicon rods separately, the cutting operation of the two silicon rods can be realized simultaneously. By setting a station switching mechanism that can drive the cutting mounting structure to swing between the first station and the second station, the switching between the first and second wire saws on the two stations is realized, thereby enabling the cutting operation of silicon rods on both stations using the same set of wire cutting devices. This ensures processing efficiency, improves the utilization rate of the wire cutting device, optimizes the equipment layout, and reduces production costs.

[0133] The above embodiments are merely illustrative of the inventive essence and beneficial effects of this application, and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the principles and scope of this application. Therefore, all equivalent modifications or alterations achieved by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A loading and unloading mechanism for a silicon rod cutting device, characterized in that, include: Multiple support components are disposed on a processing platform for supporting horizontally placed silicon rods to be cut during loading and supporting silicon rod segments after cutting during unloading. The components include a support frame for carrying the silicon rod or the silicon rod segment, a support frame shifting mechanism for driving the support frame to move the silicon rod or the silicon rod segment along a first direction, and a silicon rod conveying mechanism for driving the silicon rod or the silicon rod segment to move relative to the support frame along the first direction. A control device is connected to multiple wire cutting devices for cutting operations and multiple support components, for controlling the multiple support components to move sequentially toward the unloading end of the processing platform for loading operations under a first command, and for controlling the multiple wire cutting devices and multiple support components to move sequentially toward the unloading end for unloading operations under a second command.

2. The loading and unloading mechanism according to claim 1, characterized in that, The silicon rod transfer mechanism includes two rows of rollers arranged in parallel along a second direction, and a roller drive unit for driving the rollers to rotate so as to move the silicon rod or the silicon rod segment along a first direction.

3. The loading and unloading mechanism according to claim 2, characterized in that, The silicon rod transfer mechanism includes a roller assembly folding unit for folding the roller assembly downwards away from the silicon rod or the silicon rod segment.

4. The loading and unloading mechanism according to claim 1, characterized in that, The support component also includes: A top clamping mechanism, disposed on the support frame, is used to clamp the top of the silicon rod; A bottom lifting mechanism, disposed on the support frame and adjacent to the silicon rod transfer mechanism, is used to support the bottom of the silicon rod during the cutting operation.

5. The loading and unloading mechanism according to claim 1, characterized in that, The support components are configured in ten parts, and each support component can be controlled independently.

6. The loading and unloading mechanism according to claim 5, characterized in that, The support component located at the loading end of the processing platform is fixedly installed, while the remaining 9 support components can all move along the first direction.

7. The loading and unloading mechanism according to claim 1, characterized in that, The wire cutting device includes a cutting seat mounted on the processing platform, a cutting mounting structure mounted on the cutting seat and having a wire saw, and a station switching mechanism that can drive the cutting mounting structure to swing to achieve cutting or wire retraction.

8. The loading and unloading mechanism according to claim 7, characterized in that, The workstation switching mechanism includes a swing driver located at the top of the cutting installation structure and a passive rotating shaft located at the bottom of the cutting installation structure. The swing driver can drive the cutting installation structure to swing around the passive rotating shaft.

9. The loading and unloading mechanism according to claim 7, characterized in that, The wire cutting device also includes a cutting shifting mechanism for driving the cutting seat to move so as to adjust the cutting position or the wire retraction position.

10. The loading and unloading mechanism according to claim 9, characterized in that, The wire cutting device is configured with 9 units, of which the wire cutting device located at the loading end of the processing platform is fixed, and the remaining 8 wire cutting devices can all move along the first direction.

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