Hydraulic mechanism of semiconductor injection mold

Abstract

The utility model discloses a hydraulic mechanism for a semiconductor injection mold, which relates to the technical field of injection molds and comprises a fixed bottom plate and a hydraulic component, the fixed bottom plate is of an integrated structure, and the hydraulic component is arranged on the surface of the fixed bottom plate. And the hydraulic assembly comprises a hydraulic cylinder, a movable plate, movable rings, a fixed table, a supporting vertical rod, a buffer spring, a fixed plate, a limiting vertical rod, a limiting plate and a hydraulic controller, the hydraulic cylinder is arranged on the upper surface of the fixed bottom plate, the movable plate is installed at the top of the hydraulic cylinder, the movable rings are arranged on the two sides of the movable plate, and the fixed table is installed at the upper end of the outer side of the hydraulic cylinder. According to the hydraulic mechanism of the semiconductor injection mold, the hydraulic mechanism can be stably limited through the hydraulic assembly, meanwhile, buffering protection can be conducted in the hydraulic process, the hydraulic mechanism is prevented from being damaged, the service life of the hydraulic mechanism is prolonged, and the mold on the hydraulic mechanism can be rapidly disassembled and assembled through the disassembling and assembling assembly.

Description

Technical Field

[0001] This utility model relates to the field of injection mold technology, specifically to a hydraulic mechanism for semiconductor injection molds. Background Technology

[0002] Injection molds play a crucial role in semiconductor manufacturing, not only improving production efficiency and product quality but also further driving industry development through technological innovation. The hydraulic mechanism of an injection mold refers to the mechanism that uses hydraulic pressure provided by a hydraulic system to drive the mold's opening and closing movements and eject the product. The hydraulic mechanism plays a vital role in injection molding machines, mainly including the mold clamping mechanism and the ejection mechanism. However, current hydraulic mechanisms still have the following shortcomings:

[0003] For example, patent document CN221872817U discloses a hydraulic ejection mechanism for plastic molds. This hydraulic ejection mechanism can adaptively adjust the position and number of ejector pins according to the shape and size of the actual plastic mold, making it widely applicable. It eliminates the need for multiple ejection mechanisms of different specifications, avoiding significant cost investment, and is easy to operate and adjust. However, it is not easy to maintain the stability of the hydraulic process, and prolonged hydraulic operation can easily damage the device, thus shortening its service life.

[0004] Therefore, in view of this, we have studied and improved the existing structure to address its shortcomings, and proposed a hydraulic mechanism for semiconductor injection molds. Utility Model Content

[0005] The purpose of this invention is to provide a hydraulic mechanism for semiconductor injection molds to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a hydraulic mechanism for a semiconductor injection mold, comprising a fixed base plate and a hydraulic assembly. The fixed base plate is an integrated structure. The hydraulic assembly is disposed on the surface of the fixed base plate and includes a hydraulic cylinder, a movable plate, a movable ring, a fixed platform, a support rod, a buffer spring, a fixed plate, a limit rod, a limit plate, and a hydraulic controller. The hydraulic cylinder is disposed on the upper surface of the fixed base plate, and a movable plate is installed on the top of the hydraulic cylinder. Movable rings are disposed on both sides of the movable plate. A fixed platform is installed on the upper outer side of the hydraulic cylinder, and support rods are disposed at both ends of the inner side of the fixed platform. A buffer spring is disposed on the lower outer side of the support rod, and the lower side of the buffer spring is connected to the upper surface of the fixed platform.

[0007] Furthermore, the buffer springs are provided in four sets, and the upper side of the buffer springs is connected to the lower surface of the movable ring.

[0008] Furthermore, a fixing plate is installed at the lower end of the rear surface of the fixing platform, and a limit post is provided on the upper surface of the fixing plate.

[0009] Furthermore, a limiting plate is slidably connected to the outer surface of the limiting pole, and the front surface of the limiting plate is connected to the rear surface of the movable plate. A hydraulic controller is installed on the right side of the fixed platform.

[0010] Furthermore, a support platform is provided at the upper end of the support pole, and connecting plates are installed on the lower surface of the support platform and the upper surface of the movable plate.

[0011] Furthermore, a mounting base is installed on the surface of the connecting plate, and the surface of the mounting base is provided with disassembly and assembly components for easy replacement.

[0012] Furthermore, the assembly and disassembly assembly includes an installation slide, a shaped mounting component, a detachable mold, and a rotating plate. The installation slide is formed on the upper surface of the mounting base. The shaped mounting component is slidably connected to the inner side of the installation slide, and the detachable mold is installed on the upper surface of the shaped mounting component. The rotating plates are provided at the lower ends of both sides of the detachable mold.

[0013] Furthermore, the assembly and disassembly assembly also includes mounting holes, fixing posts, and auxiliary plates. The mounting holes are formed on the surface of the mounting plate and the two side surfaces of the mounting base. The fixing posts are engaged with the inner side of the mounting holes, and the auxiliary plates are provided on the outer surface of the fixing posts.

[0014] This utility model provides a hydraulic mechanism for semiconductor injection molds, which has the following advantages:

[0015] 1. This utility model incorporates a hydraulic assembly, which includes a hydraulic cylinder, a movable plate, a movable ring, a fixed platform, a support column, a buffer spring, a fixed plate, a limiting column, a limiting plate, and a hydraulic controller. In use, the hydraulic controller controls the hydraulic cylinder, which in turn moves the movable plate up and down along the surface of the support column via the movable ring. The limiting plate, through its sliding connection with the limiting column surface, limits the movement of the movable plate. When the movable plate descends via the movable ring, the movable ring compresses the buffer spring downwards, thus buffering the downward pressure on the movable ring. This allows the device to stably limit the movement of the hydraulic mechanism and provides buffering protection during hydraulic operation, preventing damage and extending its service life.

[0016] 2. This utility model, by setting up a disassembly and assembly component, includes an installation slide, a special-shaped installation component, a detachable mold, and a rotating plate. The disassembly and assembly component also includes installation holes, fixing posts, and auxiliary plates. In use, the detachable mold is fixed on the mounting base by sliding the special-shaped installation component with the inner side of the installation slide. At this time, the installation holes on the surface of the rotating plate correspond to the installation holes on the surface of the mounting base. The rotating plate and the mounting base are stably fixed by the locking connection between the fixing post and the inner side of the installation hole, so as to achieve stable installation of the detachable mold. Thus, the device can realize the rapid disassembly and assembly of the mold on the hydraulic mechanism. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a hydraulic mechanism for a semiconductor injection mold according to the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the disassembly and assembly components of a hydraulic mechanism for a semiconductor injection mold according to the present invention;

[0019] Figure 3 This is a rear-view three-dimensional structural diagram of a hydraulic mechanism for a semiconductor injection mold according to the present invention.

[0020] In the diagram: 1. Fixed base plate; 2. Hydraulic components; 201. Hydraulic cylinder; 202. Movable plate; 203. Movable ring; 204. Fixed platform; 205. Supporting upright; 206. Buffer spring; 207. Fixed plate; 208. Limiting upright; 209. Limiting plate; 210. Hydraulic controller; 3. Support platform; 4. Connecting plate; 5. Mounting base; 6. Disassembly and assembly components; 601. Mounting slide; 602. Irregularly shaped mounting part; 603. Demountable mold; 604. Mounting plate; 605. Mounting hole; 606. Fixed column; 607. Auxiliary plate. Detailed Implementation

[0021] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0022] like Figures 1 to 3As shown, a hydraulic mechanism for a semiconductor injection mold includes a fixed base plate 1 and a hydraulic assembly 2. The fixed base plate 1 is an integral structure. The hydraulic assembly 2 is disposed on the surface of the fixed base plate 1 and includes a hydraulic cylinder 201, a movable plate 202, a movable ring 203, a fixed platform 204, a support rod 205, a buffer spring 206, a fixed plate 207, a limiting rod 208, a limiting plate 209, and a hydraulic controller 210. The hydraulic cylinder 201 is disposed on the upper surface of the fixed base plate 1, and the movable plate 202 is installed on the top of the hydraulic cylinder 201. Movable rings 203 are disposed on both sides of the movable plate 202. The fixed platform 204 is installed on the upper outer side of the hydraulic cylinder 201, and the support rods 205 are disposed at both ends of the inner side of the fixed platform 204. The buffer spring 206 is disposed on the lower outer side of the support rod 205, and the lower side of the buffer spring 206 is connected to the upper surface of the fixed platform 204.

[0023] The specific operation is as follows: During use, the hydraulic cylinder 201 is controlled by the hydraulic controller 210. The hydraulic cylinder 201 drives the movable plate 202 to rise and fall along the surface of the support rod 205 through the movable ring 203. The movement of the movable plate 202 is limited by the sliding connection between the limiting plate 209 and the surface of the limiting rod 208. When the movable plate 202 descends through the movable ring 203, the movable ring 203 will press down on the buffer spring 206. The buffer spring 206 buffers the downward pressure of the movable ring 203.

[0024] Please refer to Figures 1 to 2 Four sets of buffer springs 206 are provided, and the upper side of the buffer springs 206 is connected to the lower surface of the movable ring 203. A fixing plate 207 is installed at the lower end of the rear surface of the fixing platform 204, and a limit rod 208 is provided on the upper surface of the fixing plate 207. A limit plate 209 is slidably connected to the outer surface of the limit rod 208, and the front surface of the limit plate 209 is connected to the rear surface of the movable plate 202. A hydraulic controller 210 is installed on the right side of the fixing platform 204. A support platform 3 is provided at the upper end of the support rod 205, and a connecting plate 4 is installed on the lower surface of the support platform 3 and the upper surface of the movable plate 202. A mounting seat 5 is installed on the surface of the connecting plate 4, and a disassembly and assembly component 6 for easy replacement is provided on the surface of the mounting seat 5. The disassembly and assembly component 6 includes an installation slide 601, a special-shaped mounting part 602, a detachable mold 603, and a mounting plate 604. The installation slide 601 is opened on the upper surface of the mounting base 5. The special-shaped mounting part 602 is slidably connected to the inner side of the installation slide 601. The detachable mold 603 is installed on the upper surface of the special-shaped mounting part 602. The mounting plate 604 is provided at the lower ends of both sides of the detachable mold 603. The disassembly and assembly component 6 also includes an installation hole 605, a fixing post 606, and an auxiliary plate 607. The mounting hole 605 is opened on the surface of the mounting plate 604 and the two sides of the mounting base 5. The fixing post 606 is engaged and connected to the inner side of the installation hole 605. The auxiliary plate 607 is provided on the outer surface of the fixing post 606.

[0025] The specific operation is as follows: During use, the detachable mold 603 is fixed on the mounting base 5 by sliding the irregular mounting part 602 and the inner side of the mounting groove 601. At this time, the mounting hole 605 on the surface of the rotating plate 604 corresponds to the mounting hole 605 on the surface of the mounting base 5. The rotating plate 604 and the mounting base 5 are stably fixed by the engaging connection between the fixing post 606 and the inner side of the mounting hole 605, so as to achieve stable installation of the detachable mold 603.

[0026] In summary, as Figures 1 to 3 As shown, in use, the hydraulic mechanism of this semiconductor injection mold first fixes the detachable mold 603 onto the mounting base 5 by sliding the irregularly shaped mounting part 602 onto the inner side of the mounting groove 601. At this time, the mounting holes 605 on the surface of the rotating plate 604 correspond to the mounting holes 605 on the surface of the mounting base 5. The rotating plate 604 and the mounting base 5 are stably fixed by the engaging connection between the fixing post 606 and the inner side of the mounting hole 605, so as to achieve stable installation of the detachable mold 603. The hydraulic cylinder 201 is controlled by the hydraulic controller 210. The hydraulic cylinder 201 drives the movable plate 202 to rise and fall along the surface of the support rod 205 via the movable ring 203. The movement of the movable plate 202 is limited by the sliding connection between the limiting plate 209 and the surface of the limiting rod 208. When the movable plate 202 descends via the movable ring 203, the movable ring 203 will press down on the buffer spring 206, and the buffer spring 206 will buffer the downward pressure of the movable ring 203.

[0027] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A hydraulic mechanism for a semiconductor injection mold, comprising a fixed base plate (1) and a hydraulic assembly (2), characterized in that: The fixed base plate (1) is an integrated structure. The hydraulic assembly (2) is disposed on the surface of the fixed base plate (1). The hydraulic assembly (2) includes a hydraulic cylinder (201), a movable plate (202), a movable ring (203), a fixed platform (204), a support rod (205), a buffer spring (206), a fixed plate (207), a limiting rod (208), a limiting plate (209), and a hydraulic controller (210). The hydraulic cylinder (201) is disposed on the fixed base plate (1). 1) The upper surface, and the top of the hydraulic cylinder (201) is equipped with a movable plate (202), and the movable plate (202) is provided on both sides of the movable ring (203). The upper outer side of the hydraulic cylinder (201) is equipped with a fixed platform (204), and the two inner ends of the fixed platform (204) are provided with support rods (205). The lower outer side of the support rod (205) is provided with a buffer spring (206), and the lower side of the buffer spring (206) is connected to the upper surface of the fixed platform (204).

2. The hydraulic mechanism for a semiconductor injection mold according to claim 1, characterized in that, The buffer spring (206) is provided in four sets, and the upper side of the buffer spring (206) is connected to the lower surface of the movable ring (203).

3. The hydraulic mechanism for a semiconductor injection mold according to claim 1, characterized in that, A fixing plate (207) is installed at the lower end of the rear surface of the fixing platform (204), and a limit pole (208) is provided on the upper surface of the fixing plate (207).

4. The hydraulic mechanism for a semiconductor injection mold according to claim 1, characterized in that, The outer surface of the limiting pole (208) is slidably connected to the limiting plate (209), and the front surface of the limiting plate (209) is connected to the rear surface of the movable plate (202). A hydraulic controller (210) is installed on the right side of the fixed platform (204).

5. The hydraulic mechanism for a semiconductor injection mold according to claim 1, characterized in that, The upper end of the support pole (205) is provided with a support platform (3), and a connecting plate (4) is installed on the lower surface of the support platform (3) and the upper surface of the movable plate (202).

6. The hydraulic mechanism for a semiconductor injection mold according to claim 5, characterized in that, The connecting plate (4) is equipped with a mounting base (5), and the mounting base (5) is provided with a disassembly and assembly component (6) for easy replacement.

7. A semiconductor injection mold hydraulic mechanism according to claim 6, characterized in that, The assembly / disassembly component (6) includes an installation slide (601), a shaped mounting component (602), a detachable mold (603), and a mounting plate (604). The installation slide (601) is opened on the upper surface of the mounting base (5). The shaped mounting component (602) is slidably connected to the inner side of the installation slide (601). The detachable mold (603) is installed on the upper surface of the shaped mounting component (602). Mounting plates (604) are provided at the lower ends of both sides of the detachable mold (603).

8. A semiconductor injection mold hydraulic mechanism according to claim 6, characterized in that, The assembly / disassembly assembly (6) also includes a mounting hole (605), a fixing post (606), and an auxiliary plate (607). The mounting plate (604) and the two sides of the mounting base (5) are provided with the mounting hole (605). The fixing post (606) is engaged with the inner side of the mounting hole (605), and the auxiliary plate (607) is provided on the outer side of the fixing post (606).

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