High-temperature-resistant water vapor packaging adhesive film and photovoltaic module

Abstract

The utility model relates to a high-temperature-resistant water vapor packaging adhesive film and a photovoltaic module, the adhesive film is used for packaging the photovoltaic module, the adhesive film adopts a multi-layer structure design and comprises a first adhesive film layer, a water blocking layer and a second adhesive film layer, and high-temperature water vapor is effectively blocked. The waterproof layer comprises a base material layer and a barrier layer; the thickness of the barrier layer is less than 5 [mu] m; the thickness of the second adhesive film layer is 1-5 times that of the first adhesive film layer; under the test conditions of 85 DEG C and 90% humidity, the water vapor transmission rate of the high-temperature-resistant water vapor adhesive film with the thickness of 300-900 microns is lower than 1g / m < 2 > / day. The high-temperature-resistant water vapor adhesive film can slow down corrosion of water vapor to a photovoltaic module in a high-temperature environment, prolongs the service life of the module, and improves the service life and performance of the photovoltaic module.

Description

Technical Field

[0001] This application belongs to the field of photovoltaic module technology, and in particular relates to a high-temperature resistant moisture-absorbing encapsulating film and a photovoltaic module. Background Technology

[0002] With the development of solar cell technology, new types of solar cells such as HJT, IBC, and TOPCON have significant advantages in light conversion efficiency compared to traditional photovoltaic cells. However, these new cells are quite sensitive to moisture. Traditional encapsulation methods use materials such as glass, backsheets, EVA, or POE to encapsulate the solar cells. Since the modules themselves generate heat during operation, coupled with poor heat dissipation, the module operating temperature can reach 90℃. Increased temperature leads to increased permeability of polymer materials and decreased barrier properties, resulting in a significant reduction in the moisture barrier properties of the backsheet and encapsulant film during module operation, potentially reaching 100 g / m³. 2 • More than 24 hours, and the moisture at high temperatures further exacerbates the aging and degradation of the adhesive film inside the component.

[0003] To address the aforementioned technical issues, improvements to the film material and structure are needed to enhance the overall performance of the components. Utility Model Content

[0004] The purpose of this application is to provide a high-temperature resistant moisture-absorbing film with high high-temperature moisture barrier performance, which can provide better protection for battery modules. This application provides a high-temperature resistant moisture-absorbing encapsulation film for photovoltaic module encapsulation, characterized by comprising a first film layer, a water-blocking layer, and a second film layer.

[0005] The water-blocking layer includes a substrate layer and a barrier layer;

[0006] The thickness of the barrier layer is less than 5 μm;

[0007] The thickness of the second adhesive film layer is 1-5 times the thickness of the first adhesive film layer;

[0008] The thickness of the second adhesive film layer is greater than the total thickness of the water-blocking layer.

[0009] In one embodiment, the first film layer is a UV-blocking film; the first film layer has a UV light blocking rate of more than 98% in the 180-400nm range.

[0010] In one embodiment, the thickness of the first adhesive film layer is 50-200 μm; the thickness of the second adhesive film layer is 200-600 μm; and the thickness of the high-temperature resistant moisture-proof adhesive film is 300-900 μm.

[0011] In one embodiment, the barrier layer is disposed on at least one side of the substrate layer; the substrate layer has a thickness of 10-50 μm; and the water-blocking layer has a thickness of 11-55 μm.

[0012] In one embodiment, the barrier layer is a coating; the coating is one of oxides, nitrides, oxynitrides, and oxyborides; the coating is a single-layer structure or a multilayer structure.

[0013] In one embodiment, the barrier layer is a water-blocking coating; the thickness of the water-blocking coating is 1-5 μm.

[0014] In one embodiment, after high-temperature lamination, the 180° peel strength between the barrier layer and the adhesive film layer is 40 N / cm to 150 N / cm.

[0015] In one embodiment, the first adhesive layer and the second adhesive layer are each independently selected from one of the following: EVA layer, POE layer, PVB layer or TPU layer;

[0016] The substrate layer is selected from one of PET, PP, PE, PC, PEN, PI, nylon, and ethylene-vinyl alcohol.

[0017] In addition, this application also provides a photovoltaic module containing the aforementioned encapsulating film, wherein the second encapsulating film layer is disposed in contact with the solar cells in the photovoltaic module.

[0018] In one embodiment, the high-temperature resistant moisture-absorbing encapsulating film has a UV light blocking rate greater than 98% in the 180-400nm range; the high-temperature resistant moisture-absorbing encapsulating film has a visible light transmittance greater than 85% in the 400-700nm range; and under test conditions of 85℃ and 90% humidity, the moisture transmittance of the 300-900μm thick film is less than 1g / m³. 2 / day.

[0019] Therefore, the photovoltaic module in this application has at least the following beneficial effects:

[0020] ①This application uses a transparent material with good water vapor barrier properties in the encapsulation film structure as a barrier layer, which not only makes up for the defect of the decline in water vapor barrier performance of ordinary encapsulation films in high temperature environments, but also ensures the overall light transmittance of the encapsulation film.

[0021] ② By selecting the thickness range of the second adhesive layer, this application not only avoids the risk of battery cell breakage due to the relatively hard material of the water-blocking layer, but also ensures the adhesion to both the water-blocking layer side and the battery cell side.

[0022] ③The substrate layer in this application can also serve as a physical support layer for the encapsulating film as a whole, which can alleviate the shrinkage phenomenon of the encapsulating film during the hot pressing process of the module, thereby ensuring the yield of the photovoltaic module.

[0023] ④ In this application, the first adhesive film layer is an ultraviolet-blocking adhesive film, which reduces the damage to the polymer materials and solar cell array layers caused by ultraviolet rays. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the high-temperature resistant water vapor membrane in Embodiment 1 of this application;

[0025] Figure 2 This is a schematic diagram of the structure of the high-temperature resistant water vapor membrane in Embodiment 2 of this application;

[0026] Figure 3 This is a schematic diagram of the structure of the high-temperature resistant water vapor membrane in Embodiment 3 of this application.

[0027] Explanation of reference numerals in the attached drawings: 110, first adhesive film layer; 120, second adhesive film layer; 200, water-blocking layer; 210, substrate layer; 220, barrier layer; 221, first barrier layer; 222, second barrier layer. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0029] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] Photovoltaic modules need to operate stably in various environments. A typical module includes a front panel, front encapsulant film, cell strings, back adhesive film, and rear panel. As a critical component of photovoltaic modules, the encapsulant film requires optimized materials to prevent moisture penetration into the cell panels, protecting the modules from moisture damage. The industry has proven that good moisture barrier performance is essential for ensuring the long-term stable operation of the modules. This application focuses on the improvement and optimization of the encapsulant film structure. Please refer to [link / reference]. Figures 1 to 3 As shown, the high-temperature resistant water vapor barrier film in the preferred embodiment of this application has high water vapor barrier performance and can provide better protection for the battery assembly. Specifically, it includes a first film layer 110, a water-blocking layer 200, and a second film layer 120. The water-blocking layer 200 includes a substrate layer 210 and a barrier layer 220. The thickness of the barrier layer 220 is less than 5 μm. The thickness of the second film layer 120 is 1-5 times the thickness of the first film layer 110. The thickness of the second film layer 120 is greater than the total thickness of the water-blocking layer 200.

[0032] The substrate layer 210 is made of a polymer material, which has a certain mechanical strength and flexibility and can act as a physical support layer for the entire encapsulation film. It can alleviate the shrinkage of the encapsulation film during the hot pressing process of the module, thereby ensuring the yield of the photovoltaic module. Specifically, it can be selected from PET, PP, PE, PC, PEN, PI, nylon, and ethylene-vinyl alcohol.

[0033] The first adhesive film layer 110 and the second adhesive film layer 120 serve as the material layers for the upper and lower surfaces of the high-temperature moisture-resistant adhesive film, respectively. These two adhesive films not only tightly bond the battery cells to the front or rear panel, but also form good contact with the substrate layer 210 or the barrier layer 220. Furthermore, the first adhesive film layer 110 blocks ultraviolet radiation, reducing damage to the battery module from UV rays.

[0034] Specifically, the first encapsulant layer 110 is a UV-blocking encapsulant layer; the first encapsulant layer 110 has a UV light blocking rate of more than 98% in the 180-400nm range. A UV light blocking rate of more than 98% means that the vast majority of harmful ultraviolet rays are effectively blocked outside the photovoltaic module, thereby significantly reducing the direct irradiation and damage of ultraviolet rays to the cells, wires and other sensitive components, protecting the internal structure of the photovoltaic module from the adverse effects of UV-induced aging and degradation. Long-term exposure to ultraviolet rays will accelerate the degradation and failure of photovoltaic modules. The high-efficiency UV protection capability of the first encapsulant layer 110 helps to slow down this process, thereby extending the overall service life of the photovoltaic module.

[0035] Specifically, the thickness of the first adhesive film layer 110 is 50-200 μm; the thickness of the second adhesive film layer 120 is 200-600 μm; and the thickness of the high-temperature resistant moisture-proof adhesive film is 300-900 μm. This reasonable layer thickness design not only ensures the adhesion between the adhesive film layer and the solar cell and the front or rear panel, but also effectively controls costs and improves the market competitiveness of the photovoltaic module. Furthermore, increasing the thickness of the second adhesive film layer 120 effectively avoids the risk of solar cell breakage due to the relatively hard material of the water-blocking layer 200, and better adapts to the deformation of the solar cell under thermal or mechanical stress, thereby ensuring the yield of the photovoltaic module.

[0036] Specifically, the barrier layer 220 is disposed on at least one side of the substrate layer 210; the substrate layer 210 has a thickness of 10-50 μm; and the water-blocking layer 200 has a thickness of 11-55 μm. The 10-50 μm thickness of the substrate layer 210 ensures sufficient mechanical support strength while avoiding negative impacts such as reduced light transmittance and hardness caused by excessive thickness. This helps maintain the thin and lightweight characteristics of the high-temperature resistant water vapor barrier film, improving the overall efficiency of the photovoltaic module. By precisely controlling the total thickness of the water-blocking layer 200 within the range of 11-55 μm, an optimal balance between water vapor barrier performance and material cost is achieved.

[0037] Specifically, the barrier layer 220 is a coating; the coating is one of oxides, nitrides, oxynitrides, and oxyborides; the coating is a single-layer structure or a multilayer structure. The coating can exist in the form of a single-layer structure, deposited on the surface of the substrate layer 210 by physical deposition or chemical deposition to form a robust water vapor barrier. In addition, to further improve the barrier effect, the coating can also adopt a multilayer structure, that is, multiple coatings of different materials are stacked together in a certain order and thickness to form a multilayer composite barrier layer 220. The multilayer structure can not only effectively resist the penetration of water vapor from different sources and forms, but also improve the overall mechanical properties and stability through the interaction between the layers. By selecting appropriate coating materials and designing a reasonable coating structure, the optimal utilization of materials can be achieved while ensuring excellent performance.

[0038] Specifically, the barrier layer 220 is a water-blocking coating; the thickness of the water-blocking coating is 1-5 μm. With its extremely thin thickness and excellent barrier performance, the water-blocking coating can effectively block the penetration of water vapor without significantly increasing the overall weight and cost. The water-blocking coating usually has good adhesion and can adhere tightly to the surface of the substrate layer 210 to form a continuous, defect-free barrier layer 220.

[0039] Specifically, after high-temperature lamination, the 180° peel strength between the barrier layer 220 and the adhesive film layer is 40 N / cm to 150 N / cm. This strong peel strength, achieved through high-temperature lamination, ensures a tight bond between the barrier layer 220 and the adhesive film layer, thereby enhancing the stability of the entire adhesive film structure. This stability is crucial for resisting the effects of external environmental factors (such as temperature changes and humidity fluctuations) on the adhesive film performance, and helps maintain the long-term stable operation of the photovoltaic module.

[0040] Specifically, the first adhesive film layer 110 and the second adhesive film layer 120 are each independently selected from one of EVA layer, POE layer, PVB layer or TPU layer; the substrate layer 210 is selected from one of PET, PP, PE, PC, PEN, PI, nylon, ethylene-vinyl alcohol.

[0041] To further improve barrier performance, the barrier layer 220 provided in this application may include multiple layers. To avoid affecting the bonding strength of the adhesive film, the position of the barrier layer 220 is defined. The barrier layer 220 includes a first barrier layer 221 and a second barrier layer 222, which are respectively formed on both sides of the substrate layer 210. By placing the barrier layers 220 on both sides of the substrate layer 210, the problem of reduced adhesive film bonding strength due to excessive thickness of the barrier layer 220 is avoided. This design ensures a tight fit between the adhesive film and the battery assembly, thereby guaranteeing the stability and safety of the battery assembly. By placing the first barrier layer 221 and the second barrier layer 222 on both sides of the substrate layer 210, bidirectional barrier against moisture can be achieved, allowing for more precise control of the thickness of the barrier layer 220 (including the first barrier layer 221 and the second barrier layer 222). The manufacturing process is simpler and more direct, thereby achieving efficient material utilization.

[0042] Based on the above scheme, the two adhesive film layers will respectively contact the battery string, front panel, or back panel. Since the mechanical properties of the battery string and the front panel or back panel are inconsistent, this application further optimizes the structure of the two adhesive film layers. The second adhesive film layer 120 is the material layer in contact with the battery cell. The thickness of the second adhesive film layer 120 is 1-5 times the thickness of the first adhesive film layer 110. In the preferred technical solution, the thickness of the second adhesive film layer 120 is 1.5-4 times the thickness of the first adhesive film layer 110. A thicker second adhesive film layer 120 can provide a larger contact capacity, thereby effectively reducing the risk of battery efficiency decline due to interface defects or contamination. The thicker second adhesive film layer 120 can also better adapt to the deformation of the battery cell under thermal or mechanical stress. Although increasing the thickness of the second adhesive film layer 120 can enhance the contact effect with the battery cell, an excessively thick adhesive film layer will also increase material costs and processing difficulty. Therefore, the thickness of the second adhesive film layer 120 is set to 1-5 times the thickness of the first adhesive film layer 110. This setting takes into account both the overall material performance and processing efficiency.

[0043] The first adhesive film layer 110 blocks ultraviolet light. Ultraviolet light is one of the main factors that cause aging, fading and performance degradation of many materials. The blocking of ultraviolet light by the first adhesive film layer 110 means that it can effectively block ultraviolet light from damaging the underlying material, providing effective protection for the inner structure and ensuring that it is not damaged by ultraviolet light, thereby significantly extending the service life of the material and maintaining its stable performance.

[0044] In addition, the refractive index of the first adhesive film layer 110, the first barrier layer 221, the substrate layer 210, the second barrier layer 222, and the second adhesive film layer 120 gradually increases. By adjusting the refractive index, the light inside the battery module can be prevented from escaping outward as much as possible, thereby improving the light utilization rate.

[0045] Specifically, the thickness of the second adhesive film layer 120 is greater than the total thickness of the substrate layer 210 and the barrier layer 220. The technical solution of this application precisely controls the thickness and structural design of the adhesive film layer. Although the thickness of the second adhesive film layer 120 increases, the total thickness of the substrate layer 210 and the barrier layer 220 is still kept within an appropriate range, ensuring that the adhesive film still has excellent water vapor barrier performance and ultraviolet protection function.

[0046] To improve structural stability, this application further optimizes the structure of the substrate layer 210 and the barrier layer 220. The substrate layer 210 includes an array of through holes. The first barrier layer 221 and the second barrier layer 222 have portions extending into the array of through holes and are connected through the portions extending into the array of through holes. The barrier layers 220 on both sides of the substrate layer 210 are connected together through the through holes in the substrate layer 210. In this way, the two barrier layers 220 are formed into a whole. During the lamination process, the barrier layers 220 are more likely to remain in their original designed positions and the displacement is smaller, thereby further stabilizing the structure.

[0047] Furthermore, this application also mitigates bonding and stress problems that may arise from material variations between the barrier layer 220 and the adhesive film layer by providing a buffer layer between them. The high-temperature water vapor resistant adhesive film also includes a buffer layer disposed between the barrier layer 220 and the adhesive film layer. The buffer layer is formed by alternating stacks of inorganic material sublayers identical to those in the barrier layer 220 and organic material sublayers identical to those in the adhesive film layer. In this way, the material variation in the thickness direction is more gradual, thereby improving the bonding strength. In addition, the thickness of the inorganic material sublayers in the buffer layer gradually decreases from the barrier layer 220 towards the adhesive film layer, while the thickness of the organic material sublayers in the buffer layer gradually increases from the barrier layer 220 towards the adhesive film layer. This method achieves superior bonding strength between the layers within the adhesive film.

[0048] In addition, this application also provides a photovoltaic module containing the aforementioned encapsulating film, wherein the second encapsulating film layer 120 of the encapsulating film is disposed in contact with the solar cells in the photovoltaic module.

[0049] Specifically, the high-temperature resistant moisture-absorbing encapsulating film has a UV light blocking rate greater than 98% in the 180-400nm range; the high-temperature resistant moisture-absorbing encapsulating film has a visible light transmittance greater than 85% in the 400-700nm range; and under test conditions of 85℃ and 90% humidity, the moisture transmittance of the 300-900μm thick film is less than 1g / m³. 2 / day.

[0050] The technical solution of this application will be further described in detail below with some specific implementation schemes.

[0051] Example 1

[0052] Please see Figure 1 , Figure 1This is a schematic diagram of the high-temperature resistant moisture-absorbing film in Embodiment 1 of this application. The high-temperature resistant moisture-absorbing film in this embodiment includes a first film layer 110, a first barrier layer 221, a substrate layer 210, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the first barrier layer 221 is made of alumina, and the substrate layer 210 is made of PET. The thickness of the first barrier layer 221 is 0.8 μm, the thickness of the first film layer 110 is 100 μm, the thickness of the substrate layer 210 is 50 μm, and the thickness of the second film layer 120 is 200 μm, ultimately forming a film with a thickness of approximately 350.8 μm.

[0053] Example 2

[0054] Please see Figure 2 , Figure 2 This is a schematic diagram of the high-temperature resistant moisture-absorbing film in Embodiment 2 of this application. The high-temperature resistant moisture-absorbing film in this embodiment includes a first film layer 110, a first barrier layer 221, a substrate layer 210, a second barrier layer 222, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the first barrier layer 221 and the second barrier layer 222 are made of alumina, and the substrate layer 210 is made of PET. The thickness of the first barrier layer 221 is 0.8 μm, the thickness of the second barrier layer 222 is 0.8 μm, the thickness of the first film layer 110 is 100 μm, the thickness of the substrate layer 210 is 50 μm, and the thickness of the second film layer 120 is 200 μm, ultimately forming a film with a thickness of approximately 351.6 μm.

[0055] Example 3

[0056] Please see Figure 3 , Figure 3 This is a schematic diagram of the high-temperature resistant moisture-absorbing film in Embodiment 3 of this application. The high-temperature resistant moisture-absorbing film in this embodiment includes a first film layer 110, a substrate layer 210, a second barrier layer 222, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the second barrier layer 222 is made of alumina, the substrate layer 210 is made of PET, the thickness of the second barrier layer 222 is 0.8 μm, the thickness of the first film layer 110 is 100 μm, the thickness of the substrate layer 210 is 50 μm, and the thickness of the second film layer 120 is 200 μm, ultimately forming a film with a thickness of approximately 350.8 μm.

[0057] Example 4

[0058] and Figure 1The structure shown is the same. In this embodiment, the high-temperature resistant moisture-absorbing film includes a first film layer 110, a first barrier layer 221, a substrate layer 210, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of POE, the first barrier layer 221 is made of alumina, and the substrate layer 210 is made of PP. The thickness of the first barrier layer 221 is 0.8 μm, the thickness of the first film layer 110 is 100 μm, the thickness of the substrate layer 210 is 50 μm, and the thickness of the second film layer 120 is 200 μm, ultimately forming a film with a thickness of approximately 350.8 μm.

[0059] Example 5

[0060] and Figure 2 The structure shown is the same. In this embodiment, the high-temperature resistant moisture-proof film includes a first film layer 110, a first barrier layer 221, a substrate layer 210, a second barrier layer 222, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of POE, the first barrier layer 221 and the second barrier layer 222 are made of alumina, and the substrate layer 210 is made of PP. The thickness of the first barrier layer 221 is 0.8 μm, the thickness of the second barrier layer 222 is 0.8 μm, the thickness of the first film layer 110 is 100 μm, the thickness of the substrate layer 210 is 50 μm, and the thickness of the second film layer 120 is 200 μm, ultimately forming a film with a thickness of approximately 351.6 μm.

[0061] Example 6

[0062] and Figure 3 The structure shown is the same. In this embodiment, the high-temperature resistant moisture-absorbing film includes a first film layer 110, a substrate layer 210, a second barrier layer 222, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the second barrier layer 222 is made of alumina, the substrate layer 210 is made of PET, the thickness of the second barrier layer 222 is 0.8 μm, the thickness of the first film layer 110 is 100 μm, the thickness of the substrate layer 210 is 50 μm, and the thickness of the second film layer 120 is 200 μm, ultimately forming a film with a thickness of approximately 350.8 μm.

[0063] Example 7

[0064] and Figure 1The structure shown is the same. In this embodiment, the high-temperature resistant moisture-absorbing film includes a first film layer 110, a first barrier layer 221, a substrate layer 210, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the first barrier layer 221 is made of alumina, and the substrate layer 210 is made of PET. The thickness of the first barrier layer 221 is 5 μm, the thickness of the first film layer 110 is 200 μm, the thickness of the substrate layer 210 is 30 μm, and the thickness of the second film layer 120 is 600 μm, ultimately forming a film with a thickness of approximately 835 μm.

[0065] Example 8

[0066] and Figure 2 The structure shown is the same. In this embodiment, the high-temperature resistant moisture-absorbing film includes a first film layer 110, a first barrier layer 221, a substrate layer 210, a second barrier layer 222, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the first barrier layer 221 and the second barrier layer 222 are made of alumina, and the substrate layer 210 is made of PET. The thickness of the first barrier layer 221 is 5 μm, the thickness of the second barrier layer 222 is 5 μm, the thickness of the first film layer 110 is 200 μm, the thickness of the substrate layer 210 is 30 μm, and the thickness of the second film layer 120 is 600 μm, ultimately forming a film with a thickness of approximately 840 μm.

[0067] Example 9

[0068] and Figure 3 The structure shown is the same. In this embodiment, the high-temperature resistant moisture-absorbing film includes a first film layer 110, a substrate layer 210, a second barrier layer 222, and a second film layer 120 formed sequentially. The first film layer 110 and the second film layer 120 are made of EVA, the second barrier layer 222 is made of alumina, the substrate layer 210 is made of PET, the thickness of the second barrier layer 222 is 5 μm, the thickness of the first film layer 110 is 200 μm, the thickness of the substrate layer 210 is 30 μm, and the thickness of the second film layer 120 is 600 μm, ultimately forming a film with a thickness of approximately 835 μm.

[0069] Comparative Example 1

[0070] For ordinary EVA film, a thickness of 350μm is selected.

[0071] Comparative Example 1

[0072] For ordinary EVA film, a thickness of 840μm is selected.

[0073] Performance tests were conducted on the encapsulant films formed in Examples 1-9 and Comparative Examples 1-2, including the water permeability and light transmittance of the encapsulant films. Furthermore, the encapsulant films from Examples 1-9 and Comparative Examples 1-2 were used as the front and rear encapsulant films for photovoltaic modules, respectively, to form photovoltaic modules. Other conditions remained the same, and efficiency and power degradation tests were performed on the formed modules. The tests included the power loss of the module after 200 kWh of ultraviolet light and the power loss of the module after 2000 hours of damp heat testing. The test results showed that the water permeability of the encapsulant films in the embodiments of this application decreased significantly. When applied to solar cell modules, the performance of solar cell modules formed with pure EVA encapsulant films was inferior to that of the encapsulant films in the technical solution of this application in various degradation tests.

[0074] As described above, the high-temperature resistant moisture-absorbing film provided in this application can solve the problem of performance degradation in photovoltaic modules caused by decreased moisture barrier performance in high-temperature environments. Through careful design of the film structure and rational selection of materials, this application achieves excellent moisture barrier performance and good UV protection. The multi-layer structure design, including a substrate layer, a barrier layer, and a film layer, effectively prevents the penetration of high-temperature moisture. The high-temperature resistant moisture-absorbing film provided in this application has superior performance and stability, effectively protecting photovoltaic modules from the damage of high-temperature and high-humidity environments, and improving the service life and performance of photovoltaic modules.

[0075] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A high-temperature resistant moisture-absorbing encapsulating film for encapsulating photovoltaic modules, characterized in that, It includes a first adhesive film layer, a water-resistant layer, and a second adhesive film layer. The water-blocking layer includes a substrate layer and a barrier layer; The thickness of the barrier layer is less than 5 μm; The thickness of the second adhesive film layer is 1-5 times the thickness of the first adhesive film layer; The thickness of the second adhesive film layer is greater than the total thickness of the water-blocking layer.

2. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, The first adhesive film layer is a UV-blocking adhesive film; the first adhesive film layer has a UV light blocking rate of more than 98% in the 180-400nm range.

3. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, The thickness of the first adhesive film layer is 50-200 μm; The thickness of the second adhesive film layer is 200-600 μm; The thickness of the high-temperature resistant moisture-absorbing encapsulating film is 300-900μm.

4. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, The barrier layer is disposed on at least one side of the substrate layer; The thickness of the substrate layer is 10-50 μm; The thickness of the water-blocking layer is 11-55 μm.

5. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, The barrier layer is a coating; the coating is one of oxides, nitrides, oxynitrides, and oxyborides. The coating can be a single-layer structure or a multi-layer structure.

6. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, The barrier layer is a water-blocking coating; the thickness of the water-blocking coating is 1-5 μm.

7. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, After high-temperature lamination, the 180° peel strength between the barrier layer and the adhesive film layer is 40 N / cm to 150 N / cm.

8. The high-temperature resistant moisture-absorbing encapsulating film according to claim 1, characterized in that, The first adhesive film layer and the second adhesive film layer are each independently selected from one of the following: EVA layer, POE layer, PVB layer or TPU layer; The substrate layer is selected from one of PET, PP, PE, PC, PEN, PI, nylon, and ethylene-vinyl alcohol.

9. A photovoltaic module, characterized in that, The photovoltaic module contains an encapsulating film according to any one of claims 1 to 8, wherein the second encapsulating film layer is disposed in contact with the solar cells in the photovoltaic module.

10. The photovoltaic module according to claim 9, characterized in that, The high-temperature resistant moisture-absorbing encapsulating film has a UV light blocking rate of greater than 98% in the 180-400nm range; The high-temperature resistant water vapor encapsulation film has a visible light transmittance of greater than 85% in the 400-700nm range; Under test conditions of 85℃ and 90% humidity, the water vapor transmission rate of the high-temperature resistant water vapor membrane with a thickness of 300-900μm is less than 1g / m². 2 / day.

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