LED lamp bead quick-release structure

Abstract

The utility model discloses an LED lamp bead quick release structure which comprises a base plate, the lower surface of the base plate is fixedly connected with an external thread ring, the outer surface of the external thread ring is in threaded connection with an internal thread ring, the lower surface of the internal thread ring is fixedly connected with a lens, the upper surface of the base plate is fixedly connected with a top cover, and the top cover is fixedly connected with an LED lamp bead. The upper surface of the base plate is fixedly connected with a clamping block, the front face and the back face of each top cover are both fixedly connected with a clamping frame, and the lower surface of the base plate is provided with an LED chip. According to the LED lamp bead quick disassembling structure, the clamping block and the clamping frames are separated, the two top covers are taken down, then the lens is rotated, the internal thread ring is made to leave the external thread ring, and the lens can be taken down; when the LED lamp bead is disassembled, only the substrate and the LED chip are left, then the screws on the positive electrode pin and the negative electrode pin are screwed off, the clamping pin and the clamping seat are separated, the plug pin is taken out of the socket, and then the LED chip can be taken down from the substrate, so that the LED lamp bead is disassembled.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and in particular to a quick-release structure for LED lamp beads. Background Technology

[0002] LED lamp beads are the abbreviation for Light Emitting Diode, a common name. Compared with traditional light sources, the visible light emitted by LED light-emitting diodes is energy-saving, has high luminous flux, long lifespan (average lifespan can reach 100,000 hours), is pollution-free, and emits no ultraviolet light. With the deepening research on light-emitting diodes as a visible light source, replacing traditional incandescent lamps and energy-saving fluorescent lamps with LED lights has become a technology that countries are striving to develop.

[0003] Existing LED beads generally consist of an LED chip, a substrate, and a focusing lens. The LED chip and the laser lens are directly bonded or soldered onto the substrate. However, when disassembling the LED beads, a soldering station and a desoldering pump are required, making the disassembly process cumbersome and slow, and preventing the LED beads from being quickly disassembled to replace the internal LED chip. Utility Model Content

[0004] The main objective of this invention is to provide a quick-release structure for LED beads, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A quick-release structure for LED beads includes a substrate. An external threaded ring is fixedly connected to the lower surface of the substrate. An internal threaded ring is threadedly connected to the outer surface of the external threaded ring. A lens is fixedly connected to the lower surface of the internal threaded ring. A top cover is fixedly connected to the upper surface of the substrate. A locking block is fixedly connected to the upper surface of the substrate. Locking frames are fixedly connected to both the front and back of the top cover. An LED chip is disposed on the lower surface of the substrate. A pin is fixedly connected to one side of the LED chip, and a locking pin is fixedly connected to the other side of the LED chip. A socket and a locking base are fixedly connected to the lower surface of the substrate.

[0007] In order to achieve the effect of connecting the positive electrode to the circuit, as a quick-release structure for LED beads of this utility model, the upper surface of the LED chip is fixedly connected with a positive electrode pin, and the upper surface of the positive electrode pin is provided with a positive electrode connection groove.

[0008] In order to achieve the effect of connecting the negative terminal to the circuit, as a quick-release structure for LED beads of this utility model, the upper surface of the LED chip is fixedly connected with a negative terminal pin, and the upper surface of the negative terminal pin is provided with a negative terminal connection groove.

[0009] In order to facilitate heat dissipation above the LED chip, as a quick-release structure for LED beads according to this utility model, a through groove is provided on the upper surface of the substrate, and a wiring port is provided on the inner wall of the through groove.

[0010] To facilitate the installation of the heat dissipation ring, as a quick-release structure for LED beads in this utility model, the outer surface of the external threaded ring is provided with heat dissipation holes, and the outer surface of the internal threaded ring is provided with insertion holes.

[0011] In order to increase the contact area between the heat dissipation ring and the air, as a quick-release structure for LED beads of this utility model, a cylindrical block is fixedly connected to the inner wall of the socket hole, a heat dissipation ring is fixedly connected to one end of the cylindrical block, and an arc groove is formed on the outer surface of the heat dissipation ring.

[0012] In order to limit the position of the cable after wiring, as a quick-release structure for LED beads of this utility model, the upper surface of the top cover is provided with a through groove.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. This quick-release structure for LED beads, through the arrangement of a substrate, external threaded ring, internal threaded ring, lens, top cover, locking block, locking frame, LED chip, locking pin, plug, socket, and mounting base, allows for the following steps: First, separate the locking block and locking frame, remove the two top covers, then rotate the lens to disengage the internal threaded ring from the external threaded ring, allowing the lens to be removed. At this point, only the substrate and LED chip remain. Next, unscrew the screws on the positive and negative leads, then separate the locking pins from the mounting base, and finally remove the plug from the socket. This allows the LED chip to be removed from the substrate, completing the disassembly of the LED bead. This enables quick disassembly of the LED bead and replacement of its components.

[0015] 2. This quick-release structure for LED beads, through the arrangement of a substrate, lens, top cover, LED chip, clips, pins, socket, card holder, positive pin, negative pin, and through slot, allows for rapid assembly of the LED beads. First, insert the pins into the socket, then pass the positive and negative pins through the through slot into the wiring port. At this point, insert the clips into the card holder and screw on the positive and negative pins to fix the LED chip onto the substrate. Then, screw the inner threaded ring onto the outer threaded ring to complete the lens installation. After connecting the wires, install the top cover onto the substrate to complete the assembly of the LED beads. This allows for quick assembly of the LED beads.

[0016] 3. This quick-release structure for LED beads, through the design of heat dissipation holes, insertion holes, heat dissipation rings, cylindrical blocks, and arc grooves, features a ring of heat dissipation holes on the outer threaded ring and a corresponding ring of insertion holes on the inner threaded ring. The cylindrical block inside the heat dissipation ring is inserted into the insertion hole. The arc groove on the heat dissipation ring increases the contact area between the heat dissipation ring and the air. In this way, the heat inside the LED bead can be transferred from the heat dissipation holes to the cylindrical block, and then transferred out through the heat dissipation ring, thereby improving the heat dissipation efficiency of the LED bead. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a quick-release structure for LED beads according to an embodiment of the present invention;

[0018] Figure 2 This is an isometric structural diagram of a quick-release LED bead structure according to an embodiment of the present invention, viewed from below.

[0019] Figure 3 This is a cross-sectional view of an LED bead quick-release structure according to an embodiment of the present invention;

[0020] Figure 4 This is an exploded view of an LED bead quick-release structure according to an embodiment of the present invention;

[0021] Figure 5 This is an isometric structural diagram of the through groove in a quick-release structure for LED beads according to an embodiment of the present invention;

[0022] Figure 6 This is an isometric structural diagram of the top cover in an LED lamp bead quick-release structure according to an embodiment of the present invention;

[0023] Figure 7 This is an isometric structural diagram of the substrate in an LED bead quick-release structure according to an embodiment of the present invention;

[0024] Figure 8 This is an isometric structural diagram of the LED chip in an LED bead quick-release structure according to an embodiment of the present invention.

[0025] In the diagram: 1. Substrate; 2. External threaded ring; 3. Internal threaded ring; 4. Lens; 5. Top cover; 6. Locking block; 7. Locking frame; 8. LED chip; 9. Locking pin; 10. Pin; 11. Socket; 12. Locking base; 13. Positive pin; 14. Positive wiring slot; 15. Negative pin; 16. Negative wiring slot; 17. Through slot; 18. Wiring port; 19. Heat dissipation hole; 20. Socket hole; 21. Heat dissipation ring; 22. Cylindrical block; 23. Arc groove; 24. Through wire slot. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example

[0028] like Figure 1-8 As shown, a quick-release structure for LED beads includes a substrate 1. An external threaded ring 2 is fixedly connected to the lower surface of the substrate 1. An internal threaded ring 3 is threadedly connected to the outer surface of the external threaded ring 2. A lens 4 is fixedly connected to the lower surface of the internal threaded ring 3. A top cover 5 is fixedly connected to the upper surface of the substrate 1. A locking block 6 is fixedly connected to the upper surface of the substrate 1. Locking frames 7 are fixedly connected to both the front and back of the top cover 5. An LED chip 8 is disposed on the lower surface of the substrate 1. A pin 10 is fixedly connected to one side of the LED chip 8. A locking pin 9 is fixedly connected to the other side of the LED chip 8. A socket 11 is fixedly connected to the lower surface of the substrate 1. A locking seat 12 is fixedly connected to the lower surface of the substrate 1.

[0029] In practical use, the system comprises a substrate 1, an external threaded ring 2, an internal threaded ring 3, a lens 4, a top cover 5, a locking block 6, a locking frame 7, an LED chip 8, locking pins 9, pins 10, a socket 11, and a mounting base 12. The internal threaded ring 3 and the lens 4 are integrated. The lens 4 is screwed onto the external threaded ring 2 of the substrate 1 via the internal threaded ring 3. The LED chip 8 is fixed by being inserted into the mounting base 12 and the socket 11 via the locking pins 9 and 10. The top cover 5 consists of two parts, each with four locking frames 7 corresponding to the locking blocks 6 on the substrate 1, allowing for quick release and release of the LED chips. First, separate the card block 6 and the card frame 7, remove the two top covers 5, and then rotate the lens 4 so that the inner threaded ring 3 is separated from the outer threaded ring 2. The lens 4 can then be removed, leaving only the substrate 1 and the LED chip 8. Then, unscrew the screws on the positive terminal 13 and the negative terminal 15, and then separate the card pin 9 from the card holder 12. Next, remove the pin 10 from the socket 11. At this point, the LED chip 8 can be removed from the substrate 1, completing the disassembly of the LED bead. This allows for quick disassembly of the LED bead and replacement of its components.

[0030] In this embodiment, a positive electrode pin 13 is fixedly connected to the upper surface of the LED chip 8, and a positive electrode wiring groove 14 is formed on the upper surface of the positive electrode pin 13.

[0031] In practical use, the positive terminal is connected to the circuit through the setting of the positive pin 13.

[0032] In this embodiment, a negative electrode pin 15 is fixedly connected to the upper surface of the LED chip 8, and a negative electrode wiring groove 16 is formed on the upper surface of the negative electrode pin 15.

[0033] In practical use, the negative terminal is connected to the line by setting the negative terminal pin 15.

[0034] In this embodiment, a through groove 17 is provided on the upper surface of the substrate 1, and a wiring port 18 is provided on the inner wall of the through groove 17.

[0035] In practical use, the through slot 17 facilitates heat dissipation above the LED chip 8.

[0036] In this embodiment, the outer surface of the external threaded ring 2 is provided with heat dissipation holes 19, and the outer surface of the internal threaded ring 3 is provided with insertion holes 20.

[0037] In practical use, the socket hole 20 facilitates the installation of the heat dissipation ring 21 with the cylindrical block 22.

[0038] In this embodiment, a cylindrical block 22 is fixedly connected to the inner wall of the socket hole 20, and a heat dissipation ring 21 is fixedly connected to one end of the cylindrical block 22. An arc groove 23 is formed on the outer surface of the heat dissipation ring 21.

[0039] In practical use, the arc groove 23 increases the contact area between the heat dissipation ring 21 and the air.

[0040] In this embodiment, a through groove 24 is provided on the upper surface of the top cover 5.

[0041] In practical use, the position of the cable after wiring is restricted by the setting of the cable channel 24.

[0042] Working principle: When quickly removing the LED chip, first separate the clip 6 and the clip frame 7, remove the two top covers 5, then rotate the lens 4 to disengage the inner threaded ring 3 from the outer threaded ring 2, allowing the lens 4 to be removed. At this point, only the substrate 1 and the LED chip 8 remain. Then, unscrew the screws on the positive pin 13 and the negative pin 15, and then separate the clip 9 from the clip 12. Next, remove the pin 10 from the socket 11. The LED chip 8 can then be removed from the substrate 1, completing the LED chip removal process. When disassembling and assembling LED beads, first insert the pin 10 into the socket 11, then let the positive pin 13 and negative pin 15 pass through the through slot 17 into the wiring port 18. At this time, insert the clip 9 into the clip 12, and screw on the positive pin 13 and negative pin 15 to fix the LED chip 8 on the substrate 1. Then screw the inner thread ring 3 onto the outer thread ring 2 to complete the installation of the lens 4. After connecting the wires, install the top cover 5 on the substrate 1 to complete the assembly of the LED beads.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A quick-release structure for LED beads, comprising a substrate (1), characterized in that: An external threaded ring (2) is fixedly connected to the lower surface of the substrate (1). An internal threaded ring (3) is threadedly connected to the outer surface of the external threaded ring (2). A lens (4) is fixedly connected to the lower surface of the internal threaded ring (3). A top cover (5) is fixedly connected to the upper surface of the substrate (1). A locking block (6) is fixedly connected to the upper surface of the substrate (1). A locking frame (7) is fixedly connected to both the front and back of the top cover (5). An LED chip (8) is provided on the lower surface of the substrate (1). A pin (10) is fixedly connected to one side of the LED chip (8). A locking pin (9) is fixedly connected to the other side of the LED chip (8). A socket (11) is fixedly connected to the lower surface of the substrate (1). A card holder (12) is fixedly connected to the lower surface of the substrate (1).

2. The quick-release structure for LED beads according to claim 1, characterized in that: The upper surface of the LED chip (8) is fixedly connected to a positive electrode pin (13), and a positive electrode connection groove (14) is opened on the upper surface of the positive electrode pin (13).

3. The quick-release structure for LED beads according to claim 1, characterized in that: The upper surface of the LED chip (8) is fixedly connected to a negative electrode pin (15), and a negative electrode wiring groove (16) is opened on the upper surface of the negative electrode pin (15).

4. The quick-release structure for LED beads according to claim 1, characterized in that: The upper surface of the substrate (1) is provided with a through groove (17), and the inner wall of the through groove (17) is provided with a wiring port (18).

5. The quick-release structure for LED beads according to claim 1, characterized in that: The outer surface of the external threaded ring (2) is provided with heat dissipation holes (19), and the outer surface of the internal threaded ring (3) is provided with insertion holes (20).

6. The quick-release structure for LED beads according to claim 5, characterized in that: A cylindrical block (22) is fixedly connected to the inner wall of the socket (20), and a heat dissipation ring (21) is fixedly connected to one end of the cylindrical block (22). An arc groove (23) is formed on the outer surface of the heat dissipation ring (21).

7. The quick-release structure for LED beads according to claim 1, characterized in that: The top cover (5) has a through groove (24) on its upper surface.

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