Micro-channel radiator

Abstract

The utility model provides a microchannel radiator, which comprises a liquid inlet pipe and a radiating plate, the liquid inlet pipe is arranged at one end of the radiating plate, the radiating plate comprises a first back plate and a second back plate which are arranged up and down, a first fin arranged below the first back plate and a second fin arranged above the second back plate; a first clamping plate is arranged between the first fin and the second fin, and one end of the first clamping plate is bent to form an upper layer and a lower layer; a first radiator is arranged in a space formed by the first clamping plate along the bent position. The utility model provides a micro-channel radiator which can reduce the occupied space of parts of a refrigerator so as to increase the volume of the refrigerator.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, and in particular to a microchannel heat sink. Background Technology

[0002] In a refrigeration system, the evaporator, radiator, compressor, and expansion valve are the four essential components. The refrigerant absorbs heat from the object being cooled, achieving refrigeration. The radiator releases this heat, transferring the heat absorbed by the evaporator, along with the heat generated by the compressor, to the cooling medium. Radiators are typically large, resulting in larger refrigerators and air conditioners, which are less aesthetically pleasing. Furthermore, in refrigerator systems, excessively large radiators reduce the refrigerator's storage capacity. Utility Model Content

[0003] The purpose of this invention is to provide a microchannel heat sink that solves the problem of excessively large heat sinks that occupy too much space in the prior art.

[0004] According to one aspect of the present invention, a microchannel heat sink is provided, comprising: an inlet pipe and a heat sink plate, wherein the inlet pipe is disposed at one end of the heat sink plate, the heat sink plate includes a first back plate and a second back plate disposed vertically, a first fin disposed below the first back plate and a second fin disposed above the second back plate; a first clamping plate is disposed between the first fin and the second fin, one end of the first clamping plate is bent to form upper and lower layers; a first heat sink is disposed within the space formed by the bend in the first clamping plate.

[0005] Furthermore, the first heat sink includes a first bent portion, a second bent portion, a first heat dissipation surface, and a second heat dissipation surface. The first bent portion and the second bent portion are disposed opposite to each other, and the first heat dissipation surface and the second heat dissipation surface are disposed opposite to each other. The first bent portion is connected to the first heat dissipation surface, and the other end of the first heat dissipation surface connected to the first bent portion is connected to the second bent portion. The other end of the second bent portion is connected to the second heat dissipation surface. The first bent portion, the first heat dissipation surface, and the second heat dissipation surface form a first heat dissipation channel, and the second bent portion, the first heat dissipation surface, and the second heat dissipation surface form a second heat dissipation channel.

[0006] Furthermore, a first connecting part is provided at one end of the first back plate that is connected to the liquid inlet pipe. The first connecting part has an arc-shaped structure and fits into the liquid inlet pipe. A second connecting part is provided at one end of the second back plate that is connected to the liquid inlet pipe. The second connecting part has an arc-shaped structure and fits into the liquid inlet pipe.

[0007] Furthermore, the first fin is connected to the first back plate and the first clamping plate to form a third heat dissipation channel; the second fin is connected to the second back plate and the first clamping plate to form a fourth heat dissipation channel.

[0008] Furthermore, the first heat sink includes at least one set of first heat dissipation channels and a second heat dissipation channel, and the first heat sink is integrally formed.

[0009] Furthermore, the microchannel heat sink includes at least one set of third heat dissipation channels and a fourth heat dissipation channel, and the first fin and the second fin are integrally formed.

[0010] Furthermore, the liquid inlet pipe includes a first liquid inlet pipe and a second liquid inlet pipe, the second liquid inlet pipe being connected to the heat sink, and the first liquid inlet pipe being embedded inside the second liquid inlet pipe.

[0011] This utility model provides a microchannel radiator that is horizontally longer than traditional radiators. This microchannel radiator can be embedded in the refrigerator body and dissipates heat through a specific air duct, further reducing the space occupied by refrigerator components and thus increasing the refrigerator's volume. Attached Figure Description

[0012] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0013] Figure 1 A three-dimensional view of a microchannel heat sink provided for this utility model.

[0014] Figure 2 A partial schematic diagram of a microchannel heat sink provided by this utility model. Figure 1 .

[0015] Figure 3 A partial schematic diagram of a microchannel heat sink provided by this utility model. Figure 2 .

[0016] Figure 4 A partial schematic diagram of a microchannel heat sink provided by this utility model. Figure 3 .

[0017] Explanation of icon numbers:

[0018] 100. Microchannel radiator; 10. Liquid inlet pipe; 101. First liquid inlet pipe; 102. Second liquid inlet pipe; 20. Heat sink plate; 201. First back plate; 2011. First connecting part; 202. Second back plate; 2021. Second connecting part; 203. First fin; 2031. Third heat dissipation channel; 204. Second fin; 2041. Fourth heat dissipation channel; 205. First clamping plate; 206. First radiator; 2061. First bend; 2062. Second bend; 2063. First heat dissipation surface; 2064. Second heat dissipation surface; 2065. First heat dissipation channel; 2066. Second heat dissipation channel. Detailed Implementation

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] To keep the drawings concise, only the parts relevant to this invention are shown schematically in each figure, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of the components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0021] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0022] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0025] See Figures 1 to 4 This application provides a microchannel heat sink, including an inlet pipe 10 and a heat sink 20. The inlet pipe 10 is disposed at one end of the heat sink 20. The heat sink 20 includes a first back plate 201 and a second back plate 202 disposed vertically, a first fin 203 disposed below the first back plate 201 and a second fin 204 disposed above the second back plate 202; a first clamping plate 205 is disposed between the first fin 203 and the second fin 204, one end of the first clamping plate 205 is bent to form upper and lower layers; a first heat sink 206 is disposed in the space formed by the bend in the first clamping plate 205. Specifically, the heat sink structure from top to bottom consists of a first backplate 201, a first fin 203, a first clamping plate 205, a first heat sink 206, a second fin 204, and a second backplate 202. The first fin 203 and the second fin 204 are a continuously bent, integrally formed structure. In this embodiment, the first fin 203 forms a heat dissipation channel with the first backplate 201 and the first clamping plate 205, and the second fin 204 forms a heat dissipation channel with the second backplate 202 and the first clamping plate 205. The bending of the first fin 203 and the second fin 204 creates a continuous heat dissipation channel, resulting in higher heat dissipation efficiency.

[0026] Further, see Figure 4 The first heat sink 206 includes a first bent portion 2061, a second bent portion 2062, a first heat dissipation surface 2063, and a second heat dissipation surface 2064. The first bent portion 2061 and the second bent portion 2062 are disposed opposite to each other, and the first heat dissipation surface 2063 and the second heat dissipation surface 2064 are disposed opposite to each other. The first bent portion 2061 is connected to the first heat dissipation surface 2063. The other end of the first heat dissipation surface 2063 connected to the first bent portion 2061 is connected to the second bent portion 2062, and the other end of the second bent portion 2062 is connected to the second heat dissipation surface 2064. The first bent portion 2061, the first heat dissipation surface 2063, and the second heat dissipation surface 2064 form a first heat dissipation channel 2065, and the second bent portion 2062, the first heat dissipation surface 2063, and the second heat dissipation surface 2064 form a second heat dissipation channel 2066. The first radiator 206 is continuously provided with a first heat dissipation channel 2065 and a second heat dissipation channel 2066. By providing a first heat dissipation surface 2063 and a second heat dissipation surface 2064, the contact area between the air and the first radiator 206 is increased, thereby improving the heat dissipation efficiency.

[0027] Further, see Figure 2 A first connecting part 2011 is provided at one end of the first back plate 201 that connects to the liquid inlet pipe 10. The first connecting part 2011 has an arc-shaped structure and fits snugly against the liquid inlet pipe 10. A second connecting part 2021 is provided at one end of the second back plate 202 that connects to the liquid inlet pipe 10. The second connecting part 2021 has an arc-shaped structure and fits snugly against the liquid inlet pipe 10. To make the connection between the liquid inlet pipe 10 and the heat sink 20 more stable, the first connecting part 2011 and the second connecting part 2021 are provided. The first connecting part 2011 and the second connecting part 2021 fit the shape of the liquid inlet pipe 10 and are set into an arc-shaped structure. Heat transfer is achieved through the connection between the liquid inlet pipe 10 and the first connecting part 2011 and the second connecting part 2021.

[0028] Furthermore, the first fin 203 is connected to the first back plate 201 and the first clamping plate 205 to form a third heat dissipation channel 2031; the second fin 204 is connected to the second back plate 202 and the first clamping plate 205 to form a fourth heat dissipation channel 2041.

[0029] Furthermore, the first heat sink includes at least one set of first heat dissipation channels 2065 and second heat dissipation channels 2066, and the first heat sink is integrally formed.

[0030] Furthermore, the microchannel heat sink includes at least one set of third heat dissipation channel 2031 and fourth heat dissipation channel 2041, with the first fin 203 and the second fin 204 being integrally formed.

[0031] This embodiment provides a microchannel heat sink. Through the bending structure of the first fin 203 and the second fin 204 and the integral molding design, a third heat dissipation channel 2031 and a fourth heat dissipation channel 2041 are formed during the combination with the first back plate 201, the first clamping plate 205, and the second back plate 202. A first heat dissipation channel 2065 and a second heat dissipation channel 2066 are formed through the arrangement of the first bending portion 2061, the first heat dissipation surface 2063, the second bending portion 2062, and the second heat dissipation surface 2064 of the first heat sink 206. This embodiment provides a microchannel heat sink with at least one set of each of the first heat dissipation channel 2065, the second heat dissipation channel 2066, the third heat dissipation channel 2031, and the fourth heat dissipation channel 2041, thus achieving higher heat dissipation efficiency.

[0032] Furthermore, the liquid inlet pipe 10 includes a first liquid inlet pipe 101 and a second liquid inlet pipe 102. The second liquid inlet pipe 102 is connected to the heat sink 20, and the first liquid inlet pipe 101 is embedded inside the second liquid inlet pipe 102. To ensure a stable connection between the liquid inlet pipe and the heat sink 20, the first liquid inlet pipe 101 and the second liquid inlet pipe 102 are provided. The first liquid inlet pipe 101 is embedded inside the second liquid inlet pipe 102, and the second liquid inlet pipe 102 is connected to the first back plate 201 and the second back plate 202.

[0033] The microchannel radiator provided in this application embodiment has a longer lateral length than traditional radiators. It is embedded in the refrigerator body and dissipates heat through specific heat dissipation channels, further reducing the space occupied by refrigerator components and thus increasing the refrigerator volume.

[0034] It will be apparent to those skilled in the art that various modifications and variations can be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, it is intended that the present invention cover modifications and variations falling within the scope of the appended claims and their equivalents.

Claims

1. A microchannel heat sink, characterized in that, include: The liquid inlet pipe is disposed at one end of the heat sink. The heat sink includes a first back plate and a second back plate disposed vertically, a first fin disposed below the first back plate and a second fin disposed above the second back plate. A first clamping plate is disposed between the first fin and the second fin. One end of the first clamping plate is bent to form upper and lower layers. A first radiator is disposed in the space formed by the bend in the first clamping plate.

2. A microchannel heat sink as described in claim 1, characterized in that, The first heat sink includes a first bent portion, a second bent portion, a first heat dissipation surface, and a second heat dissipation surface. The first bent portion and the second bent portion are disposed opposite to each other, and the first heat dissipation surface and the second heat dissipation surface are disposed opposite to each other. The first bent portion is connected to the first heat dissipation surface, and the other end of the first heat dissipation surface connected to the first bent portion is connected to the second bent portion. The other end of the second bent portion is connected to the second heat dissipation surface. The first bent portion, the first heat dissipation surface, and the second heat dissipation surface form a first heat dissipation channel, and the second bent portion, the first heat dissipation surface, and the second heat dissipation surface form a second heat dissipation channel.

3. A microchannel heat sink as described in claim 2, characterized in that, The first back plate has a first connecting part at one end connected to the liquid inlet pipe. The first connecting part has an arc-shaped structure and fits into the liquid inlet pipe. The second back plate has a second connecting part at one end connected to the liquid inlet pipe. The second connecting part has an arc-shaped structure and fits into the liquid inlet pipe.

4. A microchannel heat sink as described in claim 3, characterized in that, The first fin is connected to the first back plate and the first clamping plate to form a third heat dissipation channel; the second fin is connected to the second back plate and the first clamping plate to form a fourth heat dissipation channel.

5. A microchannel heat sink as described in claim 4, characterized in that, The first heat sink includes at least one set of first heat dissipation channels and a second heat dissipation channel, and the first heat sink is integrally formed.

6. A microchannel heat sink as described in claim 5, characterized in that, The microchannel heat sink includes at least one set of third heat dissipation channels and a fourth heat dissipation channel, and the first fin and the second fin are integrally formed.

7. A microchannel heat sink as described in claim 6, characterized in that, The liquid inlet pipe includes a first liquid inlet pipe and a second liquid inlet pipe, the second liquid inlet pipe is connected to the heat sink, and the first liquid inlet pipe is embedded inside the second liquid inlet pipe.

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