Temperature equalizing plate for optimizing evaporation cavity and radiator

Abstract

The utility model discloses a vapor chamber and radiator for optimizing evaporation chamber, vapor chamber includes upper body, lower body, first capillary structure and second capillary structure, the lower body includes first bottom plate and two second bottom plate, the first bottom plate is equipped with a plurality of stand column, the second bottom plate is equipped with a plurality of second capillary structure. The first capillary structure is connected to the outer surface of the first bottom plate, the second capillary structure is connected to the outer surface of the second bottom plate, the outer surface of the first bottom plate and the outer surface of the stand columns, and the first capillary structure is communicated with the second capillary structure. Along with the rising of the gaseous medium, the pressure in the closed cavity is increased, the stand columns and the first bottom plate are designed to be of an integrated structure, the strength is higher, the temperature-uniforming plate is effectively prevented from deforming or cracking, the service life of the temperature-uniforming plate is prolonged, the backflow speed of the liquid working medium in the temperature-uniforming plate is increased, and the heat dissipation performance of the temperature-uniforming plate is improved.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to an optimized evaporator cavity heat spreader and radiator. Background Technology

[0002] A vapor chamber (VC) is a common rapid heat conduction and dissipation mechanism. Its working principle is that the working medium circulates in the closed plate-shaped cavity in the state of evaporation and condensation to achieve rapid heat conduction and heat diffusion, thus achieving rapid temperature uniformity.

[0003] The existing support columns inside the heat spreader are mostly made of solid or hollow capillary columns or powder columns. Inside the heat spreader's evaporation chamber, the liquid medium changes into a gaseous medium, which increases the pressure inside the evaporation chamber. This increased pressure causes the heat spreader to deform or crack, seriously affecting its service life. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide an optimized evaporation chamber heat exchanger and radiator. By setting multiple columns on the first base plate, the compressive strength of the sealed cavity is improved, while the storage space for the liquid working medium is increased, effectively preventing the heat exchanger from deforming or cracking, extending its service life, and improving its heat dissipation power.

[0005] To achieve the above objectives, this utility model provides an optimized evaporation chamber temperature distribution plate, comprising an upper body, a lower body, a first capillary structure, and a second capillary structure. The first capillary structure is located on the inner surface of the upper body, and the upper body and the lower body form a closed cavity, wherein a working medium is provided inside the cavity.

[0006] The lower body includes a first base plate and two second base plates. The two second base plates are located at both ends of the first base plate, and the height of the second base plate is higher than that of the first base plate. The first base plate is provided with multiple columns. The second capillary structure is connected to the outer surface of the second base plate, the first base plate and the columns. The first capillary structure is in communication with the second capillary structure.

[0007] Preferably, the upper surface of the column is flush with the upper surface of the second base plate.

[0008] Preferably, the plurality of columns are evenly distributed on the first base plate.

[0009] Preferably, a powder column is sintered on the outer wall of the column, and the powder column has a circular or conical cross-sectional structure.

[0010] Preferably, the temperature distribution plate further includes a support column, the two ends of which are fixedly connected to the upper body and the lower body respectively. A third capillary structure is also provided on the outer surface of the support column, and the third capillary structure is connected to the first capillary structure and the second capillary structure.

[0011] Preferably, the support column is configured to be solid or hollow.

[0012] Preferably, the support column has a circular, annular, or frustum-shaped cross-section structure.

[0013] Meanwhile, this utility model provides an optimized evaporator chamber radiator, including a heat spreader.

[0014] The beneficial effects of this utility model are as follows: The optimized evaporation chamber heat exchange plate and radiator provided by this utility model, by setting multiple columns on the first base plate, the columns and the first base plate are an integrated structure. After the liquid medium transforms into a gaseous medium, the pressure in the closed cavity increases as the gaseous medium rises. The integrated structure of the columns and the first base plate has higher strength, effectively preventing the heat exchange plate from deforming or cracking, and extending the service life of the heat exchange plate. The continuous and interconnected first capillary structure and second capillary structure on the upper body, columns and lower body can improve the reflux speed of the liquid working medium in the heat exchange plate, increase the storage space of the liquid working medium, and improve the heat dissipation performance of the heat exchange plate. Attached Figure Description

[0015] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0016] Figure 1 This is a schematic diagram of the internal structure of the optimized evaporator heat dissipation cavity in the embodiment;

[0017] Figure 2 This is a schematic diagram of the appearance of the heat sink in the embodiment. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings.

[0019] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] Example: Please refer to Figures 1 to 2 ,

[0021] An optimized evaporation chamber temperature distribution plate includes an upper body 1, a lower body 2, a first capillary structure 3, and a second capillary structure 4. The first capillary structure 3 is located on the inner surface of the upper body 1. The upper body 1 and the lower body 2 form a closed cavity 5, and a working medium (not shown in the figure) is provided inside the closed cavity 5.

[0022] The lower body 2 includes a first base plate 21 and two second base plates 22. The two second base plates 22 are located at both ends of the first base plate 21, and the height of the second base plate 22 is higher than that of the first base plate 21. The first base plate 21 is provided with multiple columns 23. The second capillary structure 4 is connected to the outer surfaces of the second base plate 22, the first base plate 21 and the columns 23. The first capillary structure 3 communicates with the second capillary structure 4.

[0023] Multiple columns 23 are evenly distributed on the first base plate 21. The second capillary structure 4 is connected to the outer surfaces of the second base plate 22, the first base plate 21, and the columns 23. A working medium is provided in the closed cavity 5. The working medium is liquid in the non-working state. In the working state, the lower part of the first base plate 21 is in contact with the heat source. In this embodiment, the heat source is the chip 6. Due to the negative pressure in the closed cavity 5, the extremely low temperature causes the liquid working medium inside to vaporize into a gaseous state. The gaseous working medium carries heat upward in the closed cavity 5, transferring the heat to the upper body 1. The higher temperature gaseous working medium encounters the lower temperature upper body 1 and condenses into a liquid working medium. Then, it flows back to the first base plate 21 along the first capillary structure 3. This cycle repeats, continuously transferring the heat of the chip 6 out. The heat is then dissipated by the heat sink 7 above the heat spreader, ultimately transferring the heat from the chip 6 to achieve the effect of heat dissipation and cooling.

[0024] In this embodiment, multiple columns 23 are evenly distributed on the first base plate 21. The multiple columns 23 and the first base plate 21 are an integrated structure. The liquid medium is converted into a gaseous medium, which increases the pressure inside the closed cavity 5. The multiple columns 23 and the first base plate 21 are an integrated structure, which has higher strength and effectively prevents the temperature distribution plate from deforming or cracking, thus extending the service life of the temperature distribution plate.

[0025] The upper surface of the column 23 is flush with the upper surface of the second base plate 22, which helps to improve the strength of the column 23 and thus ensures that the column 23 will not deform or crack during the process of increasing pressure in the closed cavity 5.

[0026] Multiple columns 23 are evenly distributed on the first base plate 21. This even distribution is beneficial for the even distribution of pressure and for enhancing the pressure resistance inside the closed cavity 5.

[0027] A powder column is sintered on the outer wall of the column 23. The powder column has a circular or conical cross-section structure. A second capillary structure 4 is provided on the outer wall of the powder column. Since the sintered powder column has a more porous internal structure than the column 23, the powder column and the second capillary structure 4 together can enhance the ability of the heat spreader to adsorb liquid working medium. At the same time, it can also increase the strength of the column 23 and prevent the inner wall from cracking when the pressure inside the closed cavity 5 is high. In addition, the increased outer surface area of ​​the column 23 also increases the storage space of the liquid working medium.

[0028] The heat spreader also includes support columns 24, with attachments Figure 1 Only one support column 24 is shown in the diagram. Depending on actual needs, there will be multiple support columns 24. The two ends of the support column 24 are fixedly connected to the upper body 1 and the lower body 2, respectively. A third capillary structure 25 is also provided on the outer surface of the support column 24. The third capillary structure 25 is connected to the first capillary structure 3 and the second capillary structure 4. Similarly, as the pressure inside the closed cavity 5 increases during the rise of the gaseous working medium, the main function of the support column 24 is to enhance the compressive strength between the upper body 1 and the lower body 2. The third capillary structure 25 is connected to the first capillary structure 3 and the second capillary structure 4, which can increase the adsorption capacity of the liquid working medium, so that the liquid working medium can flow back to the bottom of the lower body 2 as soon as possible, thereby improving the heat dissipation power of the heat spreader.

[0029] The support column 24 can be solid or hollow, depending on actual needs. The support column 24 has one or more of the following cross-sectional structures: circular, annular, or frustum-shaped.

[0030] In this embodiment, an optimized evaporator heat sink is also provided, consisting of a vapor chamber plate and a heat sink. The heat sink is located above the vapor chamber plate, and its working principle is the same as described above, so it will not be repeated here.

[0031] In summary, the optimized evaporation chamber heat exchanger and radiator provided by this utility model, by setting multiple columns on the first base plate, with the columns and the first base plate being an integrated structure, allows the pressure inside the closed cavity to increase as the liquid medium transforms into a gaseous medium and rises. The integrated structure of the columns and the first base plate provides higher strength, effectively preventing deformation or cracking of the heat exchanger and extending its service life. The continuous and interconnected first and second capillary structures on the upper body, columns, and lower body can improve the reflux rate of the liquid working medium in the heat exchanger, increase the storage space of the liquid working medium, and improve the heat dissipation performance of the heat exchanger.

[0032] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications can be made based on the above-described invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. An optimized evaporator chamber temperature distribution plate, characterized in that: It includes an upper body, a lower body, a first capillary structure, and a second capillary structure. The first capillary structure is located on the inner surface of the upper body. The upper body and the lower body form a closed cavity, and a working medium is provided inside the cavity. The lower body includes a first base plate and two second base plates. The two second base plates are located at both ends of the first base plate, and the height of the second base plate is higher than that of the first base plate. The first base plate is provided with multiple columns. The second capillary structure is connected to the outer surface of the second base plate, the first base plate and the columns. The first capillary structure is in communication with the second capillary structure.

2. The optimized evaporation chamber temperature distribution plate according to claim 1, characterized in that: The upper surface of the column is flush with the upper surface of the second base plate.

3. The optimized evaporation chamber temperature distribution plate according to claim 1, characterized in that: The columns are evenly distributed on the first base plate.

4. The optimized evaporation chamber temperature distribution plate according to claim 1, characterized in that: The outer wall of the column is sintered with a powder column, which has a circular or conical cross-section structure.

5. The optimized evaporation chamber temperature distribution plate according to claim 1, characterized in that: The temperature distribution plate also includes a support column, with both ends of the support column fixedly connected to the upper body and the lower body respectively. A third capillary structure is also provided on the outer surface of the support column, and the third capillary structure is connected to the first capillary structure and the second capillary structure.

6. The optimized evaporation chamber temperature distribution plate according to claim 5, characterized in that: The support column can be solid or hollow.

7. The optimized evaporation chamber temperature distribution plate according to claim 5, characterized in that: The support column has a circular, annular, or frustum cross-section structure.

8. An optimized evaporator chamber radiator, characterized in that: Includes a temperature distribution plate, wherein the temperature distribution plate is the optimized evaporation chamber temperature distribution plate according to any one of claims 1-7.

Images