Monitoring equipment for ground surface settlement deformation

By using a flat plate structure and settlement block design, combined with monitoring wells and PVC sleeve protection, the signal error and maintenance problems of traditional settlement detection equipment are solved, achieving low-cost and accurate settlement monitoring results.

CN223538305UActive Publication Date: 2025-11-11HENAN CANGSHENG SURVEYING & MAPPING CO LTD
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Patent Information

Application Number
CN202422821391.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-19
Publication Date
2025-11-11
Estimated Expiration
2034-11-19

AI Technical Summary

Technical Problem

The base of traditional settlement detection equipment is prone to settling with the soil during installation, resulting in large signal errors of the vibrating wire displacement sensor, high cost, and difficulty in long-term maintenance.

Method used

The rigid fixed connection between the flat base plate and the support beam, combined with the settlement block and monitoring well, ensures the stability of the vibrating wire displacement sensor. It is protected by PVC sleeve and elastic material to prevent sensor movement and corrosion.

Benefits of technology

It achieves low-cost and accurate settlement monitoring, reduces sensor movement errors and corrosion problems, and facilitates long-term use and maintenance.

✦ Generated by Eureka AI based on patent content.

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Abstract

Monitoring equipment for ground surface settlement deformation achieves settlement monitoring with low cost, the influence of monitoring position settlement on monitoring is small, and the monitoring equipment comprises a data acquisition box, a settlement monitoring sensor and two supporting tables which are located above a bottom plate of a flat-plate-shaped structure and integrally arranged. A supporting beam is detachably, jointly and fixedly connected between the outer walls of the two supporting tables, and a mounting column used for mounting a settlement monitoring sensor for settlement monitoring is arranged below the supporting beam in a protruding mode; the mounting column, the supporting beam, the supporting table and the bottom plate form a rigid fixed connection structure; the settlement block is in close contact with landfill soil in the monitoring area; the settlement monitoring sensor is a vibrating wire displacement sensor, and the two ends of the vibrating wire displacement sensor are detachably and fixedly connected with the mounting column and the settlement block respectively.
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Description

Technical Field

[0001] This utility model relates to the field of settlement monitoring, specifically to a monitoring device for surface settlement and deformation. Background Technology

[0002] Ground subsidence, also known as land subsidence or sinkhole, is a localized downward movement caused by the compression of loose underground strata and the consolidation of soil layers, resulting in a decrease in the elevation of the Earth's crust. To reduce the harm caused by ground subsidence, long-term monitoring and recording of the monitored areas are necessary to support public safety prediction and early warning systems.

[0003] Settlement detection can be carried out using a variety of monitoring methods. Among them, vibrating wire displacement sensors are widely used because they are less affected by the environment. Moreover, the structure of vibrating wire displacement sensors is relatively closed, which makes them well adaptable to underground humid environments.

[0004] Traditional settlement detection equipment uses a cast-in-concrete base for installation. If the base is too small, it will settle along with the soil at the installation location, causing the vibrating wire displacement sensor to move and settle as well. This results in a large error in the sensor's signal and an inability to accurately reflect settlement information. Conversely, casting a large base increases costs and hinders its widespread application. Utility Model Content

[0005] In view of the problems existing in the current monitoring equipment for surface subsidence and deformation, this utility model is proposed to solve the problem of achieving subsidence monitoring at a lower cost and with less impact of subsidence on the monitoring location.

[0006] Therefore, the purpose of this utility model is to provide a monitoring device for surface settlement deformation, including a data acquisition box, a settlement monitoring sensor, and two integrally formed support platforms located above a flat base plate. A support beam is detachably and fixedly connected between the outer walls of the two support platforms. An installation block is fixedly connected to the upper surface of the support beam for fixing the data acquisition box. The base plate is provided with mounting holes corresponding to the lower settlement monitoring positions. An installation column for installing the settlement monitoring sensor is protruding below the support beam. The installation column, support beam, support platforms, and base plate form a rigid fixed connection structure. It also includes a settlement block buried underground in the settlement monitoring area, with the settlement block in close contact with the soil in the monitoring area. The settlement monitoring sensor is a vibrating wire displacement sensor, with both ends of the vibrating wire displacement sensor detachably and fixedly connected to the installation column and the settlement block, respectively.

[0007] Preferably, the base plate is cast in place, the support beam is a precast concrete component, and the two ends of the support beam extend downward to form connecting seats that are fixedly connected to each of the support platforms. The connecting seats and the support platforms are rigidly fixedly connected by anchor bolts.

[0008] Preferably, the upper end of the settlement block is hinged to the hinge hole of the vibrating wire displacement sensor via a lifting ring; the settlement block is formed by concrete casting.

[0009] Preferably, it further includes a PVC sleeve fitted around the periphery of the vibrating wire displacement sensor, and the PVC sleeve further includes a monitoring well located below the mounting hole at a depth at least equal to the length of the vibrating wire displacement sensor.

[0010] Preferably, the space between the PVC sleeve and the outer periphery of the vibrating wire displacement sensor is filled with an elastic material to form a structure that is in close contact with the vibrating wire displacement sensor.

[0011] Preferably, the system further includes a data acquisition system, which includes at least a microcontroller, a memory, and a communication unit. The vibrating wire displacement sensor is connected to the signal acquisition terminal of the microcontroller via a digital signal input port. The memory is connected to the controller via a communication interface and is used to store the signal data acquired by the vibrating wire displacement sensor. The communication unit is connected to the microcontroller and is used to communicate with a host computer. The communication unit is connected to the host computer via wireless or wired communication.

[0012] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0013] In this invention, the base plate of the on-site cast-in-place plate structure has a wide contact surface with the soil surface, which allows for the installation of monitoring sensors and data acquisition boxes with relatively thin concrete slabs. When settlement occurs at the monitoring location, due to the large contact area of ​​the plate structure, the impact of settlement at a certain point on the base plate is small. Therefore, the upper end of the vibrating wire displacement sensor can be kept stable with the support beam, avoiding the problem of traditional column-shaped structures moving with the settlement position.

[0014] This invention achieves the independence of the vibrating wire displacement sensor by setting up a monitoring well, with only the bottom settlement block in contact with the settlement monitoring position. This avoids the problems of the vibrating wire displacement sensor being difficult to maintain and easily corroded by the soil, making it easy to use and maintain for a long time. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a top view of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the vibrating wire displacement sensor in this utility model.

[0019] Figure 4 This is a schematic diagram of the data acquisition system. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0021] This utility model discloses a monitoring device for surface subsidence and deformation, including a data acquisition system 100 and a ground installation system 200.

[0022] The data acquisition system 100 includes a microcontroller 101, a memory 102, a communication unit 103, and a power supply unit 104. The vibrating wire displacement sensor 106 is connected to the signal acquisition terminal of the microcontroller 101 via a digital signal input port. The memory 102 is connected to the controller via a communication interface and is used to store the signal data acquired by the vibrating wire displacement sensor. The communication unit 103 is connected to the microcontroller 101 and is used to communicate with a host computer. The communication unit 103 is connected to the host computer via wireless or wired communication. The microcontroller 101 can be an STM32 microcontroller, and the communication unit 103 uses an ATK-ESP8266 WIFI module. The ATK-ESP8266 module communicates with the MCU (or other serial port devices) via a serial port (LVTTL) and has a built-in TCP / IP protocol stack, which can realize the conversion between serial port and WIFI. The memory 102 can be a RAM memory. Of course, the vibrating string sensor is equipped with a data acquisition module, such as a VM501 data acquisition module 105. The digital signal output terminal of the VM501 module is connected to the microcontroller 101 for communication.

[0023] Preferably, the system includes a flat base plate 201, which is formed by cast-in-place concrete and has dimensions of 80-120mm. A mounting hole 209 corresponding to the lower settlement monitoring position is formed at the center of the base plate 201. Two support platforms 202 are integrally formed on both sides of the mounting hole 209. A support beam 203 is detachably and fixedly connected between the outer walls of the two support platforms 202. An installation block 204 is fixedly connected to the upper surface of the support beam 203. Preferably, the support beam 203 is a precast concrete component. Both ends of the support beam 203 extend downwards to form connecting seats 207 that are fixedly connected to each support platform 202. The connecting seats 207 and the support platforms 202 are rigidly fixedly connected by anchor bolts. Anchor bolt holes are pre-drilled at the connecting seats 207 at both ends of the support beam 203, and corresponding anchor bolts are pre-embedded above the support platforms 202, forming a rigid connectable structure. The installation block 204 is used to fix and install the data acquisition box.

[0024] A support beam 203 is provided, and a mounting column 205 for installing a settlement monitoring sensor is provided below the support beam 203. The mounting column 205, the support beam 203, the support platform 202, and the base plate 201 form a rigid fixed connection structure.

[0025] Settlement block 206 is buried underground in the settlement monitoring area. A vertical monitoring well is installed directly below the mounting column 205. The diameter of the monitoring well is larger than that required for the vibrating wire displacement sensor, thus isolating the vibrating wire displacement sensor from the surrounding soil and enabling its long-term use against interference. The settlement block 206 is in close contact with the backfill soil in the monitoring area. Both ends of the vibrating wire displacement sensor are detachably and fixedly connected to the mounting column 205 and the settlement block 206, respectively. The upper end of the settlement block 206 is hinged to the hinge hole of the vibrating wire displacement sensor via a lifting ring. The settlement block 206 is cast in concrete. To achieve better movement with the surrounding backfill soil, protruding structures such as ribs and flanges are provided around the settlement block 206.

[0026] To further protect the vibrating wire displacement sensor, preferably, a PVC sleeve 208 is fitted around the periphery of the vibrating wire displacement sensor. The PVC sleeve 208 also includes a monitoring well located below the mounting hole 209, at least as deep as the length of the vibrating wire displacement sensor. An elastic material is filled between the PVC sleeve 208 and the periphery of the vibrating wire displacement sensor to form a structure that is in close contact with the vibrating wire displacement sensor. The elastic material can be elastic silicone.

[0027] In this invention, the base plate 201 of the on-site cast-in-place plate structure has a wide contact surface with the soil surface, which allows for the installation of monitoring sensors and data acquisition boxes with relatively thin concrete slabs. When settlement occurs at the monitoring location, due to the large contact area of ​​the plate structure, the impact of settlement at a certain point on the base plate 201 is small. Therefore, the upper end of the vibrating wire displacement sensor can be kept stable with the support beam 203, avoiding the problem of traditional column-shaped structures moving with the settlement position.

[0028] This invention achieves the independence of the vibrating wire displacement sensor by setting up a monitoring well, with only the bottom settlement block 206 in contact with the settlement monitoring position. This avoids the problems of the vibrating wire displacement sensor being difficult to maintain and easily corroded by the soil, making it easy to use and maintain for a long time.

[0029] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A monitoring device for surface settlement and deformation, comprising a data acquisition box and a settlement monitoring sensor, characterized in that, The system includes two integrally formed support platforms (202) located above a flat base plate (201). A support beam (203) is detachably and fixedly connected between the outer walls of the two support platforms (202). An mounting block (204) is fixedly connected to the upper surface of the support beam (203), and the mounting block (204) is used to fix and install the data acquisition box. The base plate (201) is provided with mounting holes (209) corresponding to the lower settlement monitoring position. A protruding part is provided below the support beam (203) for mounting... The settlement monitoring sensor has an installation column (205); the installation column (205), support beam (203), support platform (202), and base plate (201) form a rigid fixed connection structure; it also includes a settlement block (206) buried underground in the settlement monitoring area, the settlement block (206) being in close contact with the soil in the monitoring area; the settlement monitoring sensor is a vibrating wire displacement sensor, and the two ends of the vibrating wire displacement sensor are detachably fixedly connected to the installation column (205) and the settlement block (206) respectively.

2. The monitoring device for surface subsidence and deformation according to claim 1, characterized in that, The base plate (201) is formed by on-site casting, and the support beam (203) is a precast concrete component. The two ends of the support beam (203) extend downward to form a connecting seat (207) that is fixedly connected to each of the support platforms (202). The connecting seat (207) and the support platform (202) are rigidly fixedly connected by anchor bolts.

3. The monitoring device for surface subsidence and deformation according to claim 2, characterized in that, The upper end of the settlement block (206) is hinged to the hinge hole of the vibrating wire displacement sensor through a lifting ring; the settlement block (206) is formed by concrete casting.

4. The monitoring device for surface subsidence and deformation according to claim 3, characterized in that, It also includes a PVC sleeve (208) fitted around the periphery of the vibrating wire displacement sensor, and the PVC sleeve (208) also includes a monitoring well located below the mounting hole (209) at a depth at least equal to the length of the vibrating wire displacement sensor.

5. A monitoring device for surface subsidence and deformation according to claim 4, characterized in that, The PVC sleeve (208) and the outer periphery of the vibrating wire displacement sensor are filled with elastic material to form a structure that is in close contact with the vibrating wire displacement sensor.

6. The monitoring device for surface subsidence and deformation according to any one of claims 1-5, characterized in that, It also includes a data acquisition system (100), which includes at least a microcontroller (101), a memory (102), and a communication unit (103). The vibrating wire displacement sensor is connected to the signal acquisition terminal of the microcontroller (101) via a digital signal input port. The memory (102) is connected to the controller via a communication interface. The memory (102) is used to store the signal data acquired by the vibrating wire displacement sensor. The communication unit (103) is connected to the microcontroller (101) and is used to communicate with the host computer. The communication unit (103) is connected to the host computer via wireless or wired communication.