Chip test platform

Abstract

The utility model discloses a chip test platform, comprising a box body; the lower pressing head assembly comprises a bidirectional sliding mechanism and a lower pressing head which is hung below the bidirectional sliding mechanism and can move bidirectionally along the bidirectional sliding mechanism; the bidirectional sliding mechanism comprises an X guide rail and a Y guide rail which are arranged in a crossed mode, and a plurality of adjusting mechanisms used for adjusting the positions of the lower pressing head relative to the X guide rail and the Y guide rail. The supporting plate assembly comprises a supporting plate guide rail and a chip socket which is arranged on the supporting plate guide rail and can slide along the supporting plate guide rail; wherein the lower pressing head assembly and the supporting plate assembly are at least partially arranged in the box body, and the lower pressing head and the chip socket are oppositely arranged up and down. The utility model aims to provide the chip test platform which is simple and convenient to operate when chip types are replaced.

Description

Technical Field

[0001] This utility model belongs to the field of various chip testing equipment, and in particular relates to a semiconductor DUT (such as automotive chips, AI chips) testing platform suitable for testing chips with sizes from 30x30mm to 90x90mm, and providing low temperature (e.g. -100℃~0℃) to normal temperature to high temperature (e.g. +80℃~+150℃) environments. Background Technology

[0002] Current testing equipment designs mainly take two forms: First, both the lower pressure head and the PCB tray are set to a fixed state, and the precise positioning of the chip highly depends on the position adjustment mechanism of the PCB tray. To achieve this, a dedicated PCB tray fixture needs to be customized, which needs to be embedded on the lower tray. This means that when changing the chip type, the entire dedicated fixture needs to be replaced, making the operation cumbersome and time-consuming.

[0003] Secondly, current test chambers are mainly constructed using single-layer sheet metal or single-layer acrylic glass structures. This design has significant shortcomings in thermal management, specifically poor insulation performance, which leads to slow response of the equipment during cooling and heating, affecting the overall testing efficiency and accuracy. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a chip testing platform that is simple and convenient to operate when changing chip types.

[0005] This application provides a chip testing platform, including:

[0006] Box;

[0007] The pressing head assembly includes a bidirectional sliding mechanism and a pressing head suspended below the bidirectional sliding mechanism that can move bidirectionally along the bidirectional sliding mechanism; the bidirectional sliding mechanism includes X-rails and Y-rails arranged in a cross configuration, and multiple adjustment mechanisms for adjusting the position of the pressing head relative to the X-rails and Y-rails respectively.

[0008] A tray assembly includes a tray guide rail and a chip socket disposed on the tray guide rail and slidable along the tray guide rail;

[0009] The pressing head assembly and the tray assembly are at least partially disposed within the housing, with the pressing head and the chip socket arranged vertically opposite each other.

[0010] Specifically, the enclosure is made of double-layer sheet metal filled with fiberglass insulation cotton.

[0011] Specifically, the adjustment mechanism includes a lead screw disposed on the X guide rail or the Y guide rail, and a handwheel disposed at one end of the lead screw for adjusting the lead screw.

[0012] Specifically, there are two sets of adjustment mechanisms, which are respectively set on the X guide rail and the Y guide rail.

[0013] Specifically, there are two parallel X-rails and one Y-rail perpendicular to the X-rails, and the pressing head is suspended below the X-rails.

[0014] Furthermore, the circumferential side of the pressing head is at least partially provided with a cooling section, and the pressing head also has an internal electric heating tube.

[0015] Specifically, the refrigeration unit is wrapped with an antistatic tubing.

[0016] Furthermore, the housing or the pressure head has a built-in RTD sensor to sense the temperature inside the housing and to control the temperature using PID technology.

[0017] Furthermore, the pressure head adopts a floating joint structure, which can realize small-amplitude horizontal movement in the xy plane and small-amplitude rotation in the xyz three axes, which facilitates alignment with the client's DUT (such as chips and sockets).

[0018] Furthermore, a cylinder and an air bladder are provided between the pressing head and the bidirectional sliding mechanism. The pressure of the pressing head is controlled by the cylinder and the air bladder respectively through proportional valves. The proportional valves control the pressure of the cylinder and the air bladder on the DUT (such as a chip).

[0019] The improvements of this application bring the following advantages: The pressing head of the chip testing platform in this application embodiment can be adjusted bidirectionally in the horizontal plane, and the chip socket can also be adjusted unidirectionally, so as to adapt to the position of commonly used chips in the chip socket. There is no need to customize and use a special fixture. When changing the chip type, there is no need to replace the entire special fixture. The operation is simple and convenient, and the cost of use is low. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of a chip testing platform according to an embodiment of this application;

[0021] Figure 2 This is a three-dimensional structural diagram of the lower pressure head assembly and the support plate assembly in the embodiments of this application;

[0022] Figure 3 This is a partial structural schematic diagram of the lower pressure head assembly in an embodiment of this application;

[0023] The components include: housing-1; pressing head assembly-2; bidirectional sliding mechanism-21; pressing head-22; X guide rail-23; Y guide rail-24; adjustment mechanism-25; lead screw-26; handwheel-27; tray assembly-3; tray guide rail-31; chip socket-32; refrigeration unit-4; anti-static tube-5; and cylinder-6. Detailed Implementation

[0024] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0025] Please see Figure 1-3 This application provides a chip testing platform, which includes a housing 1, a pressure head assembly 2, and a tray assembly 3. The pressure head assembly 2 and the tray assembly 3 are at least partially disposed inside the housing 1.

[0026] The pressing head assembly 2 includes a bidirectional sliding mechanism 21 and a pressing head 22 suspended below the bidirectional sliding mechanism 21 and movable bidirectionally along the bidirectional sliding mechanism 21. The bidirectional sliding mechanism 21 includes an X-guide rail 23 and a Y-guide rail 24 arranged in a cross configuration, and a plurality of adjustment mechanisms 25 for adjusting the position of the pressing head 22 relative to the X-guide rail 23 and the Y-guide rail 24, respectively.

[0027] The tray assembly 3 includes a tray guide rail 31 and a chip socket 32 ​​disposed on the tray guide rail 31 and slidable along the tray guide rail 31. The pressing head 22 is disposed vertically opposite to the chip socket 32.

[0028] Specifically, the adjustment mechanism 25 includes a lead screw 26 mounted on the X-rail 23 or the Y-rail 24, and a handwheel 27 mounted on one end of the lead screw 26 for adjusting the lead screw 26. More specifically, there are two adjustment mechanisms 25, mounted on the X-rail 23 and the Y-rail 24 respectively, for adjusting the position of the pressing head 22 on the X-rail 23 and the Y-rail 24 respectively.

[0029] Specifically, there are two parallel X-rails 23 and two Y-rails 24 perpendicular to the X-rails 23, with the pressing head 22 suspended below the X-rails 23. More specifically, an adjustment mechanism 25 is located between the two parallel X-rails 23, and another adjustment mechanism 25 and the Y-rails 24 are respectively located at opposite ends of the two parallel X-rails 23.

[0030] The method of using the test platform in this embodiment is as follows: First, open the housing 1, put the chip to be tested into the chip socket 32, and then move the pressing head 22 and the chip socket 32 ​​to the appropriate position and align them through the bidirectional sliding mechanism 21 and the tray guide rail 31. Then close the housing 1 to perform the test.

[0031] As one embodiment, the circumferential side of the pressure head 22 is at least partially provided with a cooling section 4, and the pressure head 22 also has a built-in electric heater (not shown in the figure, but may be an electric heating element, a ceramic heating element, or other type of heater). The temperature inside the housing 1 is regulated by the cooperation of the cooling section 4 and the electric heating element, that is, the cold source and the heat source are counteracted and mixed to achieve a target temperature. Specifically, the cooling section 4 is wrapped with an anti-static tube 5. The pressure head 22 has a built-in temperature sensor (not shown in the figure) to sense the temperature of the pressure head 22, and the temperature is controlled by temperature control technology (such as PID technology).

[0032] Furthermore, the enclosure 1 is also equipped with an environmental control system, such as, but not limited to: an air drying device (not shown in the figure), which controls the dew point temperature of the dry air by a temperature sensor (not shown in the figure) to prevent condensation after the door is opened to replace the chip, or other environmental parameters, such as ambient temperature, humidity, atmospheric pressure, etc.

[0033] The enclosure 1 is also equipped with a leak sensor (not shown in the diagram) to prevent liquid leaks or condensation from damaging the chip. The enclosure also incorporates other safety systems, including but not limited to: system leaks, pressure loss, environmental imbalances, motherboard location, and chip location detection, ensuring absolute system stability.

[0034] The system is equipped with an electrical control box (not shown in the diagram) and a power distribution box (not shown in the diagram). The electrical control box is mainly used for overall system control, while the power distribution box is mainly used for power distribution throughout the system. This design has significant advantages, as it efficiently distributes power while ensuring strong and weak current isolation. It effectively prevents high-power components from interfering with the control system and provides safety for operation and maintenance personnel.

[0035] As one embodiment, the pressure head 22 employs a floating connector structure to eliminate factors causing the platform to be non-perpendicular to the chip due to manufacturing errors, or to accommodate thickness variations between different DIEs of the chip under test. Specifically, an elastic material is used at the lower end of the pressure head 22 that contacts the chip.

[0036] As an example, a cylinder 6 and an air bag (not shown in the figure) are provided between the pressing head 22 and the bidirectional sliding mechanism 21. The pressure of the pressing head 22 is controlled by the cylinder 6 and the air bag respectively through proportional valves (not shown in the figure). The proportional valve is controlled to control the pressure of the cylinder 6, or the proportional valve is controlled to control the force of the air bag to meet the pressure process requirements of the chip.

[0037] As an example, the enclosure 1 adopts a special thermal insulation and airtight sealing design, such as, but not limited to, double-layer sheet metal filled with glass fiber insulation cotton, which has good thermal insulation effect, fast cooling and fast heating.

[0038] As an example, baffles are provided at both ends of the tray guide rail 31 to prevent the chip socket 32 ​​from coming off the guide rail from both ends; a locking mechanism is also provided between the chip socket 32 ​​and the tray guide rail 31 to fix the chip socket 32 ​​on the tray guide rail 31.

[0039] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A chip testing platform, characterized in that, include: Box; The pressing head assembly includes a bidirectional sliding mechanism and a pressing head suspended below the bidirectional sliding mechanism that can move bidirectionally along the bidirectional sliding mechanism; the bidirectional sliding mechanism includes X-rails and Y-rails arranged in a cross configuration, and multiple adjustment mechanisms for adjusting the position of the pressing head relative to the X-rails and Y-rails respectively. A tray assembly includes a tray guide rail and a chip socket disposed on the tray guide rail and slidable along the tray guide rail; The pressing head assembly and the tray assembly are at least partially disposed within the housing, with the pressing head and the chip socket arranged vertically opposite each other.

2. The chip testing platform according to claim 1, characterized in that, The enclosure adopts a heat-insulating and airtight design, using double-layer sheet metal filled with glass fiber insulation cotton.

3. A chip testing platform according to claim 1 or 2, characterized in that, The adjustment mechanism includes a lead screw disposed on the X guide rail or the Y guide rail, and a handwheel disposed at one end of the lead screw for adjusting the lead screw.

4. A chip testing platform according to claim 2, characterized in that, Two sets of adjustment mechanisms are provided, respectively located on the X guide rail and the Y guide rail.

5. A chip testing platform according to claim 1 or 2, characterized in that, The system includes two parallel X-rails and a Y-rail perpendicular to the X-rails, with the pressure head suspended below the X-rails.

6. A chip testing platform according to claim 1 or 2, characterized in that, The circumferential side of the pressing head is provided with a cooling section in at least part, and the pressing head also has an internal electric heating tube.

7. A chip testing platform according to claim 6, characterized in that, The refrigeration unit is wrapped with antistatic tubing.

8. A chip testing platform according to claim 1 or 2, characterized in that, The housing or the pressure head has a built-in temperature sensor to sense the temperature inside the housing or the pressure head, and the temperature is controlled by PID technology.

9. A chip testing platform according to claim 1 or 2, characterized in that, The pressure head adopts a floating joint structure.

10. A chip testing platform according to claim 1 or 2, characterized in that, A cylinder and an air bladder are provided between the pressing head and the bidirectional sliding mechanism. The pressure of the pressing head is controlled by the cylinder and the air bladder respectively through proportional valves. The pressure of the cylinder is controlled by pulse width modulation of the proportional valves.

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