Driving structure of developing machine

Abstract

The utility model relates to a driving structure of a developing machine, which comprises a reaction vessel arranged on a machine table shell and a silicon wafer and glass sheet adsorption rotating component arranged on the reaction vessel, an air cylinder mounting plate is arranged below the reaction vessel, and a movable plate is arranged on the inner side of the air cylinder mounting plate. The lower portion of the silicon wafer glass sheet rotating assembly is installed on a movable plate, the movable plate is connected with the air cylinder installation plate through a sliding assembly, and a driving device used for driving the movable plate to move up and down is arranged on the air cylinder installation plate. The silicon wafer developing device is reasonable in design and convenient to use, the driving device is arranged to drive the movable plate, the hollow shaft servo motor, the hollow shaft and the suction cup to ascend and descend synchronously, silicon wafers on the suction cup are soaked into a developing solution or moved out of the developing solution, stability is good, it is guaranteed that silicon wafer developing is uniform, the developing time and effect are controllable, and the developing work efficiency and quality are effectively improved.

Description

Technical Field

[0001] This utility model relates to a drive structure for a developing machine. Background Technology

[0002] Photolithography is a crucial process in semiconductor chip manufacturing. It involves transferring patterns from a photomask to a substrate using a photoresist (also known as photoresist). The process typically includes substrate surface cleaning and drying, primer coating, photoresist coating, soft baking, alignment and exposure, post-baking, development, hard baking, etching, and inspection. Currently, manual development is required in the microfluidic chip fabrication process. Manual development is not only inefficient, but also lacks control over development time and quality, and operators are prone to damaging the chips / wafers. Existing spray-type developing and cleaning machines spray developing solution onto the silicon wafer by placing a developing solution spray head above the wafer and pointing downwards. However, when the wafer area is large, the spray head cannot spray the developing solution onto the entire wafer area, resulting in uneven development. To solve these problems, this device first introduces the developing solution into a reaction vessel, then immerses the silicon wafer or glass plate in the developing solution. However, to achieve the lifting and lowering movement of the silicon wafer to contact or separate it from the developing solution, a lifting drive structure is needed to stably move the silicon wafer. This invention addresses this issue. Utility Model Content

[0003] This invention addresses the aforementioned problem by providing a driving structure for a developing machine. By setting up this driving structure, the silicon wafers on the suction cup are immersed in or removed from the developing solution, thereby ensuring uniform development of the silicon wafers, controllable development time and effect, and improving the efficiency and effect of the developing process.

[0004] This utility model is constructed as follows: it includes a reaction vessel mounted on a machine housing and a silicon wafer / glass plate adsorption and rotation assembly mounted on the reaction vessel. A cylinder mounting plate is provided below the reaction vessel, and a movable plate is provided inside the cylinder mounting plate. The lower part of the silicon wafer / glass plate rotation assembly is mounted on the movable plate. The movable plate and the cylinder mounting plate are connected by a sliding assembly. The cylinder mounting plate is provided with a driving device for driving the movable plate to move up and down.

[0005] Furthermore, the sliding assembly includes sliders disposed on both outer sides of the motor mounting plate, and guide rails are disposed on both inner sides of the cylinder mounting plate, the guide rails slidingly engaging with the sliders.

[0006] Furthermore, the movable plate includes a motor fixing plate, a push plate is fixed below the motor fixing plate, the drive device is installed at the lower part of the cylinder mounting plate, and the telescopic end of the drive device extends upward through the cylinder mounting plate and connects to the push plate.

[0007] Furthermore, the driving device is a cylinder.

[0008] Furthermore, cylinder reinforcement plates are provided at the front and rear of the cylinder mounting plate.

[0009] Furthermore, the silicon wafer glass sheet adsorption and rotation assembly includes a suction cup, a rotating component, and a hollow shaft servo motor arranged sequentially from top to bottom. The hollow shaft servo motor is mounted on the motor fixing plate of the movable plate. The suction cup has suction holes for adsorbing silicon wafers. An air suction pipe is provided inside the hollow shaft of the hollow shaft servo motor. The upper end of the air suction pipe is connected to the suction hole of the suction cup, and the lower end of the air suction pipe is connected to an external vacuum pump via a vacuum pump pipeline. The hollow shaft servo motor is used to drive the rotating component and the suction cup to rotate.

[0010] Furthermore, a ball-shaped cover fixing seat is provided above the reaction vessel, and a hemispherical cover body is provided on the ball-shaped cover fixing seat. A spray cleaning nozzle is provided in the middle of the hemispherical cover body.

[0011] Furthermore, the reaction vessel is provided with an inlet and an outlet.

[0012] Furthermore, a dry plate positioning plate is provided on the upper part of the reaction vessel.

[0013] Compared with the prior art, this utility model has the following advantages: The device is reasonably designed, simple in structure, and easy to use. It uses negative pressure to adsorb and fix the silicon wafer onto the suction cup; the developing solution enters through the inlet of the reaction vessel and is quantitatively measured; after the quantitative input of the developing solution in the immersion tray is completed, the cylinder of the lifting mechanism drives the hollow shaft servo motor and motor fixing plate to move downwards, causing the silicon wafer on the suction cup to also move downwards, immersing the silicon wafer in the quantitatively measured developing solution in the reaction vessel for a period of time. This immersion time can be 3-4 seconds or other required times. During silicon wafer immersion, the hollow shaft servo motor drives the suction cup and the silicon wafer on the suction cup to rotate slowly, ensuring relative flow between the silicon wafer and the developing solution, guaranteeing uniform contact between the silicon wafer and the developing solution; after the developing process is completed, the cylinder of the lifting mechanism drives the hollow shaft servo motor and motor fixing plate... The device moves upward, causing the silicon wafer on the suction cup to also move upward, thus removing the silicon wafer from the developing solution. The developing solution in the reaction vessel is discharged through the drain port. The hollow shaft servo motor drives the silicon wafer on the suction cup to rotate at high speed, centrifugally drying the developing solution on the silicon wafer. The spray nozzles on the hemispherical cover spray pure water evenly onto the silicon wafer to clean it. After cleaning, the hollow shaft servo motor continues to drive the silicon wafer on the suction cup to rotate at high speed, drying the water on the silicon wafer. Finally, the hemispherical cover is opened, the vacuum pump is turned off, and the silicon wafer is removed. This device uses a drive mechanism to synchronously raise and lower the movable plate, hollow shaft servo motor, hollow shaft, and suction cup, allowing the silicon wafer on the suction cup to be immersed in or removed from the developing solution. It has good stability, controllable developing time and effect, precise developing time, ensures uniform silicon wafer developing, and improves silicon wafer developing efficiency. Attached Figure Description

[0014] Figure 1 Three-dimensional representation of the present utility model Figure 1 ;

[0015] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0016] Figure 3 This is a schematic diagram of the reaction vessel and lifting mechanism in an embodiment of the present invention. Figure 1 ;

[0017] Figure 4 This is a partial schematic diagram of the reaction vessel and lifting mechanism in an embodiment of the present invention. Figure 1 ;

[0018] Figure 5 This is a partial schematic diagram of the reaction vessel and lifting mechanism in an embodiment of the present invention. Figure 2 ;

[0019] Figure 6 Three-dimensional representation of the present utility model Figure 2 ;

[0020] Figure 7 This is a top view of an embodiment of the present utility model;

[0021] Figure 8 for Figure 7 Sectional view AA in the middle;

[0022] Figure 9 for Figure 7 Sectional view BB in the middle;

[0023] Figure 10 This is a partial schematic diagram of an embodiment of the present utility model;

[0024] In the diagram: 1-Machine housing, 2-Reaction vessel, 3-Silicon wafer / glass sheet adsorption and rotation assembly, 301-Suction cup, 3011-Suction hole, 302-Rotating component, 303-Hollow shaft servo motor, 304-Hollow shaft, 3041-Suction pipe, 4-Lifting mechanism, 401-Cylinder mounting plate, 402-Motor fixing plate, 403-Slider, 404-Guide rail, 405-Push plate, 406-Cylinder, 407-Cylinder reinforcing plate, 5-Spherical cover fixing seat, 6-Hemispherical cover, 7-Spray cleaning nozzle, 8-Dry plate positioning plate. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0026] Example: Figures 1-10 As shown in the present invention, a driving structure for a developing machine is provided, including a machine base housing 1, a reaction dish 2 disposed on the machine base housing, and a silicon wafer / glass slide adsorption and rotation assembly 3 disposed on the reaction dish. A lifting mechanism 4 is disposed below the silicon wafer / glass slide adsorption and rotation assembly. The lifting mechanism includes a cylinder mounting plate 401 disposed below the reaction dish. A movable plate is disposed inside the cylinder mounting plate. The lower part of the silicon wafer / glass slide rotation assembly is mounted on the movable plate. The movable plate and the cylinder mounting plate are connected by a sliding assembly. A driving device for driving the movable plate to move up and down is provided on the cylinder mounting plate.

[0027] The lifting mechanism drives the silicon wafer and glass sheet adsorption and rotation assembly to move up and down relative to the reaction vessel. The cylinder drives the movable plate, the hollow shaft servo motor of the silicon wafer and glass sheet adsorption and rotation assembly, the suction cup, and the silicon wafer on the suction cup to move up and down synchronously. When the silicon wafer and glass sheet adsorption and rotation assembly is lowered, the silicon wafer or glass sheet on the suction cup comes into contact with and is immersed in the quantitative developer in the reaction vessel to complete the development and etching work. When the silicon wafer and glass sheet adsorption and rotation assembly is raised, the silicon wafer or glass sheet on the suction cup is removed from the developer.

[0028] In this embodiment of the utility model, the sliding component includes sliders 403 disposed on the two outer sides of the motor fixing plate, and guide rails 404 disposed on the two inner sides of the cylinder mounting plate, the guide rails slidingly engaging with the sliders.

[0029] In this embodiment of the utility model, the movable plate includes a motor fixing plate 402, which is used to install the hollow shaft servo motor of the silicon wafer glass sheet adsorption and rotation assembly. A push plate 405 is fixed below the motor fixing plate. The driving device is installed on the lower part of the cylinder mounting plate. The telescopic end of the driving device extends upward through the cylinder mounting plate and connects to the lower part of the push plate. The driving device is a cylinder 406.

[0030] In this embodiment of the utility model, in order to enhance the stability of the cylinder mounting plate, cylinder reinforcing plates 407 are provided at the front and rear of the cylinder mounting plate; the upper part of the cylinder reinforcing plate is fixed to the bottom of the reaction vessel, and the side part of the cylinder reinforcing plate is fixed to the cylinder mounting plate.

[0031] In this embodiment of the invention, the silicon wafer glass sheet adsorption and rotation assembly 3 includes a suction cup 301, a rotating component 302, and a hollow shaft servo motor 303 arranged sequentially from top to bottom. The suction cup has a suction hole 3011 for adsorbing the silicon wafer. The hollow shaft 304 of the hollow shaft servo motor is provided with a suction pipe 3041 inside. The upper end of the suction pipe is connected to the suction hole of the suction cup, and the lower end of the suction pipe is connected to a vacuum pump located externally via a vacuum pump pipeline. The hollow shaft servo motor is used to drive the rotating component and the suction cup to rotate. The hollow shaft of the hollow shaft servo motor passes through the reaction vessel and is fixed to the rotating component. The suction cup is fixed to the rotating component. Of course, a sealing structure, such as a sealing ring, is provided at the connection between the rotating shaft and the reaction vessel to ensure the sealing of the reaction vessel.

[0032] In this embodiment of the utility model, a ball cover fixing seat 5 is provided above the reaction vessel, and a hemispherical cover body 6 is provided on the ball cover fixing seat. A spray cleaning nozzle 7 is provided in the middle of the hemispherical cover body. The spray cleaning nozzle penetrates the middle of the hemispherical cover body, with its nozzle facing downward. The spray cleaning nozzle is connected to an external pure water source through a pipeline.

[0033] The spray cleaning nozzle is positioned directly above the silicon wafer. After the silicon wafer has completed the development process, the hollow shaft servo motor of the silicon wafer glass plate adsorption and rotation assembly drives the suction cup and silicon wafer to rotate, thus drying the silicon wafer. Then, the spray cleaning nozzle sprays pure water downwards onto the silicon wafer. The water sprayed from the spray cleaning nozzle is in the form of a mist. Then, the hollow shaft servo motor drives the suction cup and silicon wafer to rotate again, and the water on the silicon wafer is dried by centrifugal spin-drying.

[0034] The aforementioned hemispherical cover is fixed to the cover fixing seat, which is movably connected to the machine housing. One end of the cover fixing seat is hinged to the machine housing, and the other end of the hemispherical cover is connected to the machine housing via a lock. The lock can be controlled to close or open the hemispherical cover.

[0035] In this embodiment of the invention, the reaction vessel is provided with an inlet and an outlet; an inlet pipe can be connected to the inlet, and an outlet pipe can be connected to the outlet. Valves can be provided on the inlet and outlet pipes. The inlet pipe can be connected to an external developer source to quantitatively input developer into the reaction vessel.

[0036] In this embodiment of the invention, a dry plate positioning plate 8 is provided on the upper part of the reaction vessel.

[0037] In this embodiment of the utility model, during operation: (1) the hemispherical cover on the machine housing is opened, the silicon wafer is placed on the suction cup, the vacuum pump is started, and the negative pressure generated by the vacuum pump adsorbs and fixes the silicon wafer on the suction cup. The hemispherical cover is then closed; (2) the developer enters through the inlet of the reaction vessel and is quantitatively measured; (3) after the quantitative input of the developer in the immersion tray is completed, the cylinder of the lifting mechanism drives the hollow shaft servo motor and the motor fixing plate to move downward, which in turn moves the silicon wafer on the suction cup downward, so that the silicon wafer is immersed in the quantitative developer in the reaction vessel for a period of time. The immersion time here can be 3-4 seconds or other required time. During the immersion of the silicon wafer, the hollow shaft servo motor drives the suction cup and the silicon wafer on the suction cup to rotate slowly, so that the silicon wafer is immersed in the quantitative developer in the reaction vessel for a period of time. The wafer and the developing solution have relative flow, ensuring that the silicon wafer and the developing solution are in uniform contact; (4) After the developing work is completed, the cylinder of the lifting mechanism drives the hollow shaft servo motor and the motor fixing plate to move upward, which drives the silicon wafer on the suction cup to move upward, so that the silicon wafer on the suction cup is removed from the developing solution; (5) The developing solution in the reaction vessel is discharged through the drain port, and the hollow shaft servo motor drives the silicon wafer on the suction cup to rotate at high speed, centrifuging and drying the developing solution on the silicon wafer; the spray cleaning nozzle on the hemispherical cover sprays pure water evenly onto the silicon wafer to clean it. After cleaning, the hollow shaft servo motor continues to drive the silicon wafer on the suction cup to rotate at high speed, drying the water on the silicon wafer; (6) Finally, the hemispherical cover is opened, the vacuum pump is turned off, and the silicon wafer is taken out.

[0038] Unless otherwise stated, if any of the technical solutions disclosed in this utility model discloses a numerical range, then the disclosed numerical range is a preferred numerical range. Any person skilled in the art should understand that the preferred numerical range is merely one among many feasible numerical values ​​that has a more obvious or representative technical effect. Because there are many numerical values, it is impossible to list them all. Therefore, this utility model discloses only some numerical values ​​to illustrate the technical solutions of this utility model. Furthermore, the numerical values ​​listed above should not constitute a limitation on the scope of protection of this utility model.

[0039] Meanwhile, if the present invention discloses or relates to mutually fixedly connected parts or structural components, then unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (e.g., using bolts or screws), or a non-detachable fixed connection (e.g., riveting, welding). Of course, the mutually fixed connection can also be replaced by an integral structure (e.g., manufactured by casting process) (except where it is obviously impossible to use an integral forming process).

[0040] In addition, unless otherwise stated, the terms used to indicate positional relationships or shapes in any of the technical solutions disclosed in this utility model above include states or shapes that are similar to, close to, or approximate with them.

[0041] Any component provided by this utility model can be assembled from multiple individual components, or it can be a single component manufactured by a one-piece molding process.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.

Claims

1. A driving structure for a developing machine, characterized in that, The device includes a reaction vessel mounted on a machine housing and a silicon wafer / glass slide adsorption and rotation assembly mounted on the reaction vessel. A cylinder mounting plate is provided below the reaction vessel, and a movable plate is provided inside the cylinder mounting plate. The lower part of the silicon wafer / glass slide rotation assembly is mounted on the movable plate, and the movable plate and the cylinder mounting plate are connected by a sliding assembly.

2. The driving structure of a developing machine according to claim 1, characterized in that, The cylinder mounting plate is equipped with a drive device for driving the movable plate to move up and down.

3. The driving structure of a developing machine according to claim 1, characterized in that, The sliding assembly includes sliders disposed on the two outer sides of the motor mounting plate, and guide rails disposed on the two inner sides of the cylinder mounting plate, the guide rails slidingly engaging with the sliders.

4. The driving structure of a developing machine according to claim 2, characterized in that, The movable plate includes a motor fixing plate, a push plate is fixed below the motor fixing plate, the drive device is installed at the lower part of the cylinder mounting plate, and the telescopic end of the drive device passes through the cylinder mounting plate and connects to the push plate.

5. The driving structure of a developing machine according to claim 2 or 4, characterized in that, The driving device is a cylinder.

6. The driving structure of a developing machine according to claim 1, characterized in that, Cylinder reinforcement plates are provided at the front and rear of the cylinder mounting plate.

7. The driving structure of a developing machine according to claim 1, characterized in that, The silicon wafer / glass sheet adsorption and rotation assembly includes a suction cup, a rotating component, and a hollow shaft servo motor arranged sequentially from top to bottom. The hollow shaft servo motor is mounted on a motor fixing plate of a movable plate. The suction cup has suction holes for adsorbing silicon wafers. An air suction pipe is provided inside the hollow shaft of the hollow shaft servo motor. The upper end of the air suction pipe is connected to the suction hole of the suction cup, and the lower end of the air suction pipe is connected to an external vacuum pump via a vacuum pump pipeline. The hollow shaft servo motor is used to drive the rotating component and the suction cup to rotate.

8. The driving structure of a developing machine according to claim 1, characterized in that, A spherical cover fixing seat is provided above the reaction vessel, and a hemispherical cover body is provided on the spherical cover fixing seat. A spray cleaning nozzle is provided in the middle of the hemispherical cover body.

9. The driving structure of a developing machine according to claim 1, characterized in that, The reaction vessel is equipped with an inlet and an outlet.

10. The driving structure of a developing machine according to claim 1, characterized in that, A dry plate positioning plate is provided on the upper part of the reaction vessel.

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