Temperature monitoring device and semiconductor process equipment

Abstract

The utility model discloses a temperature monitoring device and semiconductor process equipment. The temperature monitoring device comprises an over-current control loop and an over-temperature control loop; the overcurrent control loop comprises a current sensor and a control module which are connected; the control module comprises a first contactor; the current sensor is connected in series with a first circuit for supplying power to the electromagnetic module in the semiconductor process equipment, and the current sensor generates a first electric signal and sends the first electric signal to the control module under the condition that the current on the first circuit exceeds a first threshold value; under the condition that the control module receives the first electric signal, the first circuit is disconnected through a first contactor connected with the first circuit; the over-temperature control loop comprises an over-temperature sensor and a second contactor which are connected; the over-temperature sensor is connected with the electromagnetic module, when the temperature of the electromagnetic module exceeds a second threshold value, the over-temperature sensor generates a second electric signal and sends the second electric signal to the second contactor connected with the first circuit, and the second contactor disconnects the first circuit when receiving the second electric signal.

Description

Technical Field

[0001] This application belongs to the field of temperature monitoring technology, specifically relating to a temperature monitoring device and semiconductor process equipment. Background Technology

[0002] In specific semiconductor process equipment, such as physical vapor deposition (PVD) equipment, coils need to be wound around the chamber sidewalls. By applying a certain direct current, a magnetic field is generated within the chamber, thereby constraining the direction and velocity of plasma movement and thus adjusting wafer uniformity. By using an electromagnet assembly, multiple sets of electromagnet coils with different positions and numbers of turns can be installed on the chamber sidewalls. Then, by selecting different electromagnet coils and current directions, different processes for adjusting wafer uniformity can be achieved.

[0003] However, in actual use, due to the self-heating effect of the electromagnet coil, the temperature inside the electromagnet assembly will continuously rise when the electromagnet coil is energized. At the same time, since there is no space to design effective cooling measures inside the electromagnet assembly, the temperature accumulates to a certain high temperature, which causes the insulating varnish on the enameled wire wound into the electromagnet coil to fall off, and may even cause the outer high-voltage insulating sleeve to melt and break, resulting in sparking, short circuits and other situations, posing safety problems. Utility Model Content

[0004] The purpose of this application is to provide a temperature monitoring device and semiconductor process equipment that can solve the safety problems caused by excessively high temperature of electromagnet coils.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a temperature monitoring device applied to semiconductor process equipment, comprising: an overcurrent control loop and an overtemperature control loop; wherein, the overcurrent control loop includes a connected current sensor and a control module; the control module includes a first contactor; the current sensor is connected in series in a first circuit in the semiconductor process equipment that supplies power to an electromagnetic module, and when the current in the first circuit exceeds a first threshold, the current sensor generates a first electrical signal and sends it to the control module; upon receiving the first electrical signal, the control module disconnects the first circuit via the first contactor connected to the first circuit; the overtemperature control loop includes a connected overtemperature sensor and a second contactor; the overtemperature sensor is connected to the electromagnetic module, and when the temperature of the electromagnetic module exceeds a second threshold, the overtemperature sensor generates a second electrical signal and sends it to the second contactor connected to the first circuit, and upon receiving the second electrical signal, the second contactor disconnects the first circuit.

[0007] Secondly, embodiments of this application provide a semiconductor process apparatus, including: a DC power supply, a temperature monitoring device as described in the first aspect, a host computer, a slave computer, and a process chamber. The process chamber includes an electromagnetic module. The host computer is connected to the slave computer and is used to control the slave computer. A current sensor is connected to the slave computer, and when the current sensor detects that the current in the first circuit supplying power to the electromagnetic module exceeds a first threshold, it sends a first electrical signal to the slave computer. An over-temperature sensor is connected to the slave computer, and when the temperature of the electromagnetic module exceeds a second threshold, it sends a second electrical signal to the slave computer.

[0008] The temperature monitoring device provided in this application embodiment is applied to semiconductor process equipment and includes an overcurrent control loop and an overtemperature control loop. The overcurrent control loop includes a connected current sensor and a control module; the control module includes a first contactor; the current sensor is connected in series in a first circuit in the semiconductor process equipment that supplies power to an electromagnetic module. When the current in the first circuit exceeds a first threshold, the current sensor generates a first electrical signal and sends it to the control module; upon receiving the first electrical signal, the control module disconnects the first circuit via the first contactor connected to the first circuit. The overtemperature control loop includes a connected overtemperature sensor and a second contactor; the overtemperature sensor is connected to the electromagnetic module. When the temperature of the electromagnetic module exceeds a second threshold, the overtemperature sensor generates a second electrical signal and sends it to the second contactor connected to the first circuit; upon receiving the second electrical signal, the second contactor disconnects the first circuit. Because the temperature of an electromagnetic module rises when there is a high current in the semiconductor process equipment, this temperature monitoring device employs a dual control loop (overcurrent control loop and overtemperature control loop). It not only disconnects the first circuit supplying power to the electromagnetic module when the temperature exceeds a second threshold, but also disconnects the first circuit supplying power when the current flowing through the electromagnetic module in the semiconductor process equipment exceeds the first threshold, i.e., when there is a high current. This prevents the electromagnetic module from being powered on, reducing the possibility of further temperature increases. Compared to related technologies that use a single control loop to monitor the temperature of the electromagnetic module, this is safer. Furthermore, because this temperature monitoring device uses a first contactor and a second contactor to cut off the power supply to the electromagnetic module—that is, through hardware control—the cutting-off action is more reliable and timely than software control. It can promptly and reliably de-energize the electromagnetic module, thereby reducing the possibility of further temperature increases and solving the safety problem caused by excessively high electromagnet coil temperatures.

[0009] Furthermore, the semiconductor process equipment provided in this application embodiment employs the temperature monitoring device provided in this application embodiment, which can promptly and reliably de-energize the electromagnetic module, thereby reducing the possibility of the temperature in the electromagnetic module continuing to rise and solving the safety problem caused by the excessive temperature of the electromagnet coil. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1(a) is a schematic block diagram of a temperature monitoring device according to an embodiment of this application;

[0012] Figure 1(b) is a schematic block diagram of another temperature monitoring device according to an embodiment of this application;

[0013] Figure 2(a) is a schematic block diagram of an overcurrent control circuit of a temperature monitoring device according to another embodiment of this application;

[0014] Figure 2(b) is a schematic block diagram of the overcurrent control circuit of another temperature monitoring device according to another embodiment of this application;

[0015] Figure 3 This is a schematic block diagram of an overcurrent control circuit of a temperature monitoring device according to another embodiment of this application;

[0016] Figure 4(a) is a schematic block diagram of an overcurrent control circuit of a temperature monitoring device according to another embodiment of this application;

[0017] Figure 4(b) is a schematic block diagram of the overcurrent control circuit of another temperature monitoring device according to yet another embodiment of this application;

[0018] Figure 5 This is a schematic block diagram of an over-temperature control circuit of a temperature monitoring device according to another embodiment of this application;

[0019] Figure 6 This is a schematic block diagram of a temperature monitoring device according to another embodiment of this application;

[0020] Figure 7 This is a schematic block diagram of a semiconductor process apparatus according to an embodiment of this application;

[0021] Figure 8 This is a schematic block diagram of a semiconductor process apparatus according to another embodiment of this application;

[0022] Figure 9 This is a schematic block diagram of a control process apparatus for a semiconductor process device according to another embodiment of this application;

[0023] Figure 10 This is a schematic block diagram of a semiconductor process apparatus according to another embodiment of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] The temperature monitoring device and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0027] Figure 1 is a schematic block diagram of a temperature monitoring device according to an embodiment of this application. The temperature monitoring device provided in this application embodiment can be applied to semiconductor process equipment. As shown in Figures 1(a) and 1(b), the temperature monitoring device includes: an overcurrent control loop 11 and an overtemperature control loop 12. The overcurrent control loop 11 includes a current sensor 111 and a control module 112 connected together; the control module 112 includes a first contactor 1121; the current sensor 111 is connected in series with a first circuit 13 in the semiconductor process equipment that supplies power to an electromagnetic module 131. When the current in the first circuit 13 exceeds a first threshold, the current sensor 111 generates a first electrical signal and sends it to the control module 112; upon receiving the first electrical signal, the control module 112 disconnects the first circuit 13 through the first contactor 1121 connected to the first circuit 13.

[0028] The over-temperature control loop 12 includes an over-temperature sensor 121 and a second contactor 122 connected to it. The over-temperature sensor 121 is connected to the electromagnetic module 131. When the temperature of the electromagnetic module 131 exceeds a second threshold, the over-temperature sensor 121 generates a second electrical signal and sends it to the second contactor 122 connected to the first circuit 13. Upon receiving the second electrical signal, the second contactor 122 disconnects the first circuit 13.

[0029] The current sensor is a current sensor with overcurrent protection function, or the current sensor and corresponding matching circuit are used to monitor the current flowing through the electromagnetic module in the first circuit that supplies power to the electromagnetic module, and generate and send a first electrical signal when the current flowing through the electromagnetic module is greater than a set first threshold.

[0030] The over-temperature sensor is a temperature sensor that is placed in the vicinity of the electromagnetic module (connected to the electromagnetic module) to monitor the temperature of the electromagnetic module, and generates and sends a second electrical signal when the temperature of the electromagnetic module exceeds a second threshold.

[0031] Both the second and first contactors can be DC contactors, hybrid DC contactors, etc., and the specific types of the second and first contactors are not limited here. Both are devices capable of quickly cutting off AC or DC main circuits and frequently connecting and disconnecting high-current control circuits, suitable for frequent operation and remote control. Internally, both the second and first contactors include a coil and multiple sets of contacts, which can be normally open or normally closed. After the coil is energized, the corresponding contacts perform corresponding actions: normally open contacts open, and normally closed contacts close.

[0032] Due to the heating effect of the electromagnet coil (electromagnetic module), the higher the current, the higher the temperature. When the current in the first circuit exceeds a first threshold, the current sensor generates a first electrical signal and sends it to the control module. This first electrical signal is the signal that causes the control module to energize the coil of the first contactor, and the contacts of the first contactor to operate accordingly. For example, if the current in the first circuit does not exceed the first threshold, the current sensor sends a "0" signal, and the first contactor does not operate accordingly. If the current in the first circuit exceeds the first threshold, the current sensor sends a "1" signal, and the first contactor operates accordingly.

[0033] When the temperature of the electromagnetic module exceeds the second threshold, the over-temperature sensor generates a second electrical signal and sends it to the second contactor. This second electrical signal energizes the coil of the second contactor, causing the contacts of the second contactor to operate accordingly. For example, if the temperature of the electromagnetic module does not exceed the second threshold, the over-temperature sensor sends a "0" signal, and the second contactor does not operate accordingly. If the temperature of the electromagnetic module exceeds the second threshold, the over-temperature sensor sends a first electrical signal, a "1" signal, and the second contactor operates accordingly.

[0034] The first threshold is a set current value, which can be determined based on the current and temperature change curves within the electromagnet coil (electromagnetic module) and the parameters of the enameled wire of the electromagnet coil, while meeting the current requirements of the semiconductor process equipment.

[0035] The second threshold is a set temperature value, which can be determined by the actual temperature change curve inside the electromagnet coil (electromagnetic module) and the parameters of the enameled wire of the electromagnet coil. For example, if the temperature resistance of the enamel coating of the enameled wire inside the electromagnet coil is 200℃, the limit temperature of the over-temperature sensor should be selected as 200℃, that is, the second threshold is 200℃.

[0036] It should be noted that the connection order of the first contactor, the second contactor, and the current sensor is not limited in the embodiments of this application. It can be as shown in Figure 1(a) or Figure 1(b).

[0037] The temperature monitoring device provided in this application embodiment is applied to semiconductor process equipment and includes an overcurrent control loop and an overtemperature control loop. The overcurrent control loop includes a connected current sensor and a control module; the control module includes a first contactor; the current sensor is connected in series in a first circuit in the semiconductor process equipment that supplies power to an electromagnetic module. When the current in the first circuit exceeds a first threshold, the current sensor generates a first electrical signal and sends it to the control module; upon receiving the first electrical signal, the control module disconnects the first circuit via the first contactor connected to the first circuit. The overtemperature control loop includes a connected overtemperature sensor and a second contactor; the overtemperature sensor is connected to the electromagnetic module. When the temperature of the electromagnetic module exceeds a second threshold, the overtemperature sensor generates a second electrical signal and sends it to the second contactor connected to the first circuit; upon receiving the second electrical signal, the second contactor disconnects the first circuit. Because the temperature of an electromagnetic module rises when there is a high current in the semiconductor process equipment, this temperature monitoring device employs a dual control loop (overcurrent control loop and overtemperature control loop). It not only disconnects the first circuit supplying power to the electromagnetic module when the temperature exceeds a second threshold, but also disconnects the first circuit supplying power when the current flowing through the electromagnetic module in the semiconductor process equipment exceeds the first threshold, i.e., when there is a high current. This prevents the electromagnetic module from being powered on, reducing the possibility of further temperature increases. Compared to related technologies that use a single control loop to monitor the temperature of the electromagnetic module, this is safer. Furthermore, because this temperature monitoring device uses a first contactor and a second contactor to cut off the power supply to the electromagnetic module—that is, through hardware control—the cutting-off action is more reliable and timely than software control. It can promptly and reliably de-energize the electromagnetic module, thereby reducing the possibility of further temperature increases and solving the safety problem caused by excessively high electromagnet coil temperatures.

[0038] In one embodiment, as shown in Figures 2(a) and 2(b), the control module 112 further includes a time relay 21; the time relay 21 is connected to the current sensor 111, and when the duration of the received first electrical signal exceeds a third threshold, the time relay 21 conducts a second circuit 22 connected to the first contactor 1121 to supply power to the first contactor 1121.

[0039] If the control module includes a time relay, the time relay is connected to the signal line of the current sensor.

[0040] Because the longer the energizing time, the higher the temperature, applying a high current to the electromagnet coil (electromagnetic module) for a short period of time will not immediately cause the temperature to reach the critical value. Therefore, a time relay is set to limit the loading time of the high current, thus protecting the enameled wire inside the electromagnet coil while meeting process requirements.

[0041] The third threshold is a set time value, related to the first threshold. It can be determined based on the current and temperature change curves within the electromagnet coil (electromagnetic module) and the parameters of the electromagnet coil's enameled wire, while ensuring the current required for the semiconductor process equipment. For example, if the electromagnet coil temperature remains at 200°C or higher for an extended period, it may damage the enameled wire. If the process requires a current of 25A, and the detected current and temperature change curves show that the electromagnet coil temperature reaches 200°C after 60 seconds of current flowing through it, then the first threshold for the overcurrent sensor is 25A, and the third threshold corresponds to 60 seconds. The power supply to the electromagnetic module has a maximum rated output current. If the maximum rated output current is 50A, and the detected current and temperature change curves show that the electromagnet coil temperature reaches 200°C after 30 seconds of current flowing through it, then the first threshold is 50A, and the third threshold corresponds to 30 seconds.

[0042] A time relay is a type of time relay with a power-on delay. It can be an air-damped time relay, an electronic time relay, an electromagnetic time relay, etc., without specific limitations. A time relay with a power-on delay is one in which, after receiving a first electrical signal, its output circuit needs to be energized for a specified accurate time (a third threshold) before the corresponding contacts will activate (connect or disconnect). If the duration of the received first electrical signal does not reach the specified accurate time (third threshold) and disappears, it will not activate and will return to the state before receiving the first electrical signal. It is an electrical component used in circuits with lower voltage or lower current to connect or disconnect circuits with higher voltage or higher current.

[0043] Optionally, the current sensor 111 described above can be a three-wire system, with the power supply line of the current sensor connected to the time relay to supply power to the time relay. Of course, the current sensor can also be non-three-wire and supply power to the time relay separately.

[0044] It should be noted that the connection order between the time relay and the first contactor is not limited in the embodiments of this application. It can be as shown in Figure 2(a) or Figure 2(b).

[0045] In this embodiment, a time relay is added to the overcurrent control loop and connected to a current sensor. Only when the duration of the first electrical signal received by the time relay exceeds a third threshold—that is, when there is a sustained period of high current in the electromagnetic module of the semiconductor process equipment—is the first contactor controlled to connect to the second circuit supplying power to the first contactor. The first contactor then disconnects the first circuit supplying power to the electromagnetic module. This allows for brief periods of high current in the semiconductor process equipment, where the generated heat does not pose a safety hazard.

[0046] In one embodiment, such as Figure 3 As shown, the first contactor 1121 includes a first coil 31 and a first normally closed contact 32; one end of the first coil 31 is connected to the current sensor 111, and the other end of the first coil 31 is grounded; the first normally closed contact 32 is connected in series with the first circuit 13.

[0047] In one embodiment, as shown in Figures 4(a) and 4(b), the time relay 21 includes a second coil 41 and a first normally open contact 42; one end of the second coil 41 is connected to the current sensor 111, and the other end of the second coil 41 is grounded; the first normally open contact 42 is connected in series with the second circuit 22.

[0048] It should be noted that the connection order of the first normally open contact 42 of the time relay 21 and the first contactor 1121 is not limited in this embodiment. The first normally open contact 42 can be connected in series between the first contactor 1121 and the current sensor 111, as shown in Figure 4(a). The first normally open contact 42 can also be connected in series between the first contactor 1121 and the grounding circuit, as shown in Figure 4(b).

[0049] In one embodiment, such as Figure 5 As shown, the second contactor 122 includes a second coil 51 and a second normally closed contact 52; one end of the second coil 51 is connected to the over-temperature sensor 121, and the other end of the second coil 51 is grounded; the second normally closed contact 52 is connected in series with the first circuit 13.

[0050] Figure 6 This is a schematic block diagram of a temperature monitoring device according to another embodiment of this application. The temperature monitoring device provided in this application can be applied to semiconductor process equipment. Figure 6 As shown, the temperature monitoring device includes: an overcurrent control loop 11 and an overtemperature control loop 12.

[0051] The overcurrent control loop 11 includes a current sensor 111 and a control module 112. The control module 112 includes a time relay 21 and a first contactor 1121. The current sensor 111 is connected in series with a first circuit 13 in the semiconductor process equipment that supplies power to the electromagnetic module 131. The time relay 21 is connected to the current sensor 111. When the current in the first circuit 13 exceeds a first threshold, the current sensor 111 generates a first electrical signal and sends it to the control module 112. When the duration of the first electrical signal received by the time relay 21 exceeds a third threshold, the second circuit 22 connected to the first contactor 1121 that supplies power to the first contactor 1121 is turned on, and the first circuit 13 is turned off through the first contactor 1121 connected to the first circuit 13.

[0052] Specifically, the first contactor 1121 includes a first coil 31 and a first normally closed contact 32. One end of the first coil 31 is connected to the current sensor 111, and the other end of the first coil 31 is grounded. The first normally closed contact 32 is connected in series with the first circuit 13. The time relay 21 includes a second coil 41 and a first normally open contact 42. One end of the second coil 41 is connected to the current sensor 111, and the other end of the second coil 41 is grounded. The first normally open contact 42 is connected in series with the second circuit 22.

[0053] The over-temperature control loop 12 includes an over-temperature sensor 121 and a second contactor 122 connected to it. The over-temperature sensor 121 is connected to the electromagnetic module 131. When the temperature of the electromagnetic module 131 exceeds a second threshold, the over-temperature sensor 121 generates a second electrical signal and sends it to the second contactor 122 connected to the first circuit 13. Upon receiving the second electrical signal, the second contactor 122 disconnects the first circuit 13.

[0054] Specifically, the second contactor 122 includes a second coil 51 and a second normally closed contact 52; one end of the second coil 51 is connected to the over-temperature sensor 121, and the other end of the second coil 51 is grounded; the second normally closed contact 52 is connected in series with the first circuit 13.

[0055] The temperature monitoring device provided in this application embodiment is applied to semiconductor process equipment and includes an overcurrent control loop and an overtemperature control loop. The overcurrent control loop includes a connected current sensor and a control module. The control module includes a first contactor and a time relay. The current sensor is connected in series in a first circuit in the semiconductor process equipment that supplies power to an electromagnetic module. The time relay is connected to the current sensor. When the current in the first circuit exceeds a first threshold, the current sensor generates a first electrical signal and sends it to the control module. When the duration of receiving the first electrical signal reaches a third threshold, the time relay disconnects the first circuit via the first contactor connected to the first circuit. The overtemperature control loop includes a connected overtemperature sensor and a second contactor. The overtemperature sensor is connected to the electromagnetic module. When the temperature of the electromagnetic module exceeds a second threshold, the overtemperature sensor generates a second electrical signal and sends it to the second contactor connected to the first circuit. Upon receiving the second electrical signal, the second contactor disconnects the first circuit. Because the electromagnetic module in semiconductor process equipment experiences high current, its temperature rises due to heating. Considering the duration of high current in the control circuit and the need to control the temperature rise range, this temperature monitoring device employs a dual control loop (overcurrent control loop and overtemperature control loop). It not only disconnects the first circuit supplying power to the electromagnetic module when its temperature exceeds a second threshold, but also disconnects the first circuit when the current flowing through the electromagnetic module in the semiconductor process equipment exceeds the first threshold and the duration of the first electrical signal exceeds the third threshold (the time relay's set threshold), meaning the duration of high current may cause safety issues. This prevents the electromagnetic module from being powered on, reducing the possibility of further temperature increases. Compared to related technologies that use a single control loop to monitor the electromagnetic module's temperature, this is safer. Furthermore, because this temperature monitoring device uses a first contactor and a second contactor to cut off the power supply to the electromagnetic module—that is, through hardware control—the cutting-off action is more reliable and timely than software control, ensuring that the electromagnetic module is promptly and reliably de-energized, thus reducing the possibility of further temperature increases and solving the safety problem caused by excessively high electromagnet coil temperatures.

[0056] Figure 7 This is a schematic block diagram of a semiconductor process apparatus according to an embodiment of this application. The semiconductor process apparatus includes a DC power supply 71, a temperature monitoring device 72, a host computer 73, a slave computer 74, and a process chamber 75, the process chamber including an electromagnetic module 131.

[0057] The internal structure of the temperature monitoring device 72 can be seen in Figures 1 to 12. Figure 6 This will not be elaborated upon here.

[0058] The host computer 73 is connected to the slave computer 74, and the host computer 73 is used to control the slave computer 74; the current sensor 111 is connected to the slave computer 74, and when the current sensor 111 detects that the current on the first circuit 13 supplying power to the electromagnetic module 131 exceeds the first threshold, it sends a first electrical signal to the slave computer 74; the over-temperature sensor 121 is connected to the slave computer 74, and when the temperature of the electromagnetic module 131 exceeds the second threshold, it sends a second electrical signal to the slave computer 74.

[0059] The host computer can have corresponding software settings. When the host computer receives the first or second electrical signal transmitted from the slave computer, it can generate different alarms to notify the staff.

[0060] The host computer sends commands to the slave computer, which then interprets these commands into corresponding timing signals to directly control the corresponding equipment (such as the third and fourth contactors in this application). The host computer can be an industrial personal computer (IPC), or it can be a regular computer configured with the appropriate software. Optionally, the slave computer can be a programmable logic controller (PLC), a microcontroller, or a single-chip microcomputer.

[0061] The semiconductor process equipment provided in this embodiment of the invention includes a DC power supply, as shown in Figures 1 to 14 above. Figure 6 The embodiment includes a temperature monitoring device, a host computer, a slave computer, and a process chamber. The process chamber includes an electromagnetic module. The host computer is connected to the slave computer and controls the slave computer. A current sensor is connected to the slave computer and sends a first electrical signal to the slave computer when the current sensor detects that the current in the first circuit supplying power to the electromagnetic module exceeds a first threshold. An over-temperature sensor is connected to the slave computer and sends a second electrical signal to the slave computer when the temperature of the electromagnetic module exceeds a second threshold. This is possible in Figures 1 to 2018. Figure 6 Based on the solution provided in the implementation example, the message indicating that the hardware has been disconnected is promptly sent to the host computer, allowing staff to understand the situation in a timely manner and carry out inspection and repair.

[0062] In one embodiment, the lower-level machine 74 is connected to the DC power supply 71; when the lower-level machine 74 receives a first electrical signal, it transmits the first electrical signal to the upper-level machine 73; when the upper-level machine 73 receives the first electrical signal, it controls the lower-level machine 74 to stop sending a start signal to the DC power supply; when the lower-level machine 74 receives a second electrical signal, it transmits the second electrical signal to the upper-level machine 73; when the upper-level machine 73 receives the second electrical signal, it controls the lower-level machine 74 to stop sending a start signal to the DC power supply 71.

[0063] The start signal is used to instruct the DC power supply to supply power to the electromagnetic module.

[0064] When the circuit hardware is disconnected, the start signal sent to the DC power supply is stopped. This prevents the host computer from sending the power start signal after receiving a first electrical signal (in case of high current) or a second electrical signal (in case of overheating) returned by the hardware. This keeps the power supply in a state of receiving start-up enable at all times, thus preventing situations that do not meet industry safety certification standards.

[0065] In one embodiment, such as Figure 8 As shown, the temperature monitoring device 72 also includes a temperature sensor 81; the temperature sensor 81 is connected to the electromagnetic module 131 and the lower-level machine 74 respectively to detect the temperature of the electromagnetic module 131 and convert the temperature into a first analog quantity and transmit it to the lower-level machine 74.

[0066] The temperature sensor is a type of temperature sensor that is placed in the vicinity of the electromagnetic module (connected to the electromagnetic module) to monitor the temperature of the electromagnetic module.

[0067] The over-temperature sensor in the temperature monitoring device can detect the current flowing through the electromagnet coil module, convert the current into a second analog quantity, and transmit it to the lower-level computer. Combined with the over-temperature sensor in this embodiment, the lower-level computer can transmit real-time temperature and current to the upper-level computer, displaying them on the upper-level computer's human-machine interface. Operators can monitor the temperature of the electromagnet coil (electromagnetic module) in real time. With the added logic judgment and control calculations in the software set in the upper-level computer, over-temperature interlock judgment can be performed. The temperature is compared with the set temperature to determine whether the electromagnet coil (electromagnetic module) is in an over-temperature state. If an over-temperature state is determined, the upper-level computer controls the lower-level computer to disconnect the DC power supply enable, improving control accuracy. Alternatively, by analyzing real-time temperature changes, the selection of the aforementioned over-temperature sensor and over-current sensor can be determined, and it can also serve as a reference condition for setting the process current.

[0068] In one embodiment, such as Figure 9As shown, the semiconductor process equipment also includes a control process device 91, which includes a current reversing circuit 911 and an electromagnet coil switching circuit 912. The current reversing circuit 911 includes a third contactor 9111, which is connected to the first circuit 13 and to a lower-level machine 74. When the upper-level machine 73 issues a command to switch the current direction, the control device 9111 controls the lower-level machine 74 to switch the current direction in the first circuit 13. The electromagnet coil switching circuit 912 includes a fourth contactor 9121, which is connected to the first circuit 13 and to the lower-level machine 74. When the upper-level machine 73 issues a command to switch the energized coil, the control device 74 controls the lower-level machine 74 to switch the energized electromagnet coil among the multiple electromagnet coils in the electromagnetic module 131.

[0069] Semiconductor process equipment requires switching the direction of the energized coils and the current flowing through them in the electromagnetic modules of the process chamber to meet the needs of different processes.

[0070] In one embodiment, the lower-level machine in the above embodiment is a PLC.

[0071] In one embodiment, the semiconductor process equipment includes PVD process equipment.

[0072] Figure 10 This is a schematic block diagram of a semiconductor process apparatus according to another embodiment of this application. The semiconductor process apparatus includes a DC power supply 71, such as... Figure 6 The temperature monitoring device 72 shown Figure 10 (Only a portion is shown in the image), Industrial Control Computer 73, PLC 74, Process Chamber 75, and so on. Figure 9 The control process device 91 shown ( Figure 10 (Not shown) The process chamber 75 includes an electromagnetic module 131, and the temperature monitoring device 72 also includes a temperature sensor 81.

[0073] An industrial computer 73 is connected to a PLC 74, and the industrial computer 73 is used to control the PLC 74. A current sensor 111 is connected in series in the first circuit 13 that supplies power to the electromagnetic module 131, and is also connected to the PLC 74. It monitors the current in the first circuit 13 and converts the current into a first analog signal, which is then transmitted to the PLC. When the current sensor 111 detects that the current in the first circuit 13 exceeds a first threshold, it sends a first trigger signal to the PLC 74. An over-temperature sensor 121 is connected to the PLC 74. When the temperature of the electromagnetic module 131 exceeds a second threshold, it sends a second trigger signal to the PLC 74. An over-temperature sensor 81 is connected to the electromagnetic module 131, detects the temperature of the electromagnetic module 131, and converts the temperature into a first analog signal, which is then transmitted to the PLC 74. The PLC 74 is connected to the DC power supply 71. When the PLC 74 receives a first electrical signal, it transmits the first electrical signal to the industrial computer 73. When the industrial computer 73 receives the first electrical signal, it controls the PLC 74 to stop sending a start signal to the DC power supply 71. When the PLC 74 receives a second electrical signal, it transmits the second electrical signal to the industrial computer 73. When the industrial computer 73 receives the second electrical signal, it controls the PLC 74 to stop sending a start signal to the DC power supply 71. The start signal is used to instruct the DC power supply to supply power to the electromagnetic module.

[0074] The semiconductor process equipment provided in this application embodiment employs, as follows: Figure 6 The temperature monitoring device shown includes a temperature sensor 81, which is capable of... Figure 6 The temperature monitoring device shown, based on hardware-based reliable temperature monitoring of the electromagnet coil, is further enhanced by software-assisted monitoring of the current magnitude and actual temperature changes within the coil, improving control accuracy. Operators can view the electromagnet coil temperature and current flow in real time, perform over-temperature interlock checks using the software, and determine the selection of over-temperature and over-current sensors by analyzing real-time temperature changes. It can also serve as a reference for setting process currents. Furthermore, it can promptly send a hardware disconnection message to the host computer, stopping the transmission of start signals to the DC power supply and preventing situations that do not meet industry safety certification standards. This facilitates timely monitoring and maintenance by staff.

[0075] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A temperature monitoring device, applied to semiconductor process equipment, characterized in that, This includes overcurrent control circuits and overtemperature control circuits; among which, The overcurrent control loop includes a connected current sensor and a control module; the control module includes a first contactor; the current sensor is connected in series with a first circuit in the semiconductor process equipment that supplies power to the electromagnetic module; when the current in the first circuit exceeds a first threshold, the current sensor generates a first electrical signal and sends it to the control module; upon receiving the first electrical signal, the control module disconnects the first circuit through the first contactor connected to the first circuit. The over-temperature control circuit includes a connected over-temperature sensor and a second contactor. The over-temperature sensor is connected to the electromagnetic module. When the temperature of the electromagnetic module exceeds a second threshold, the over-temperature sensor generates a second electrical signal and sends it to the second contactor connected to the first circuit. Upon receiving the second electrical signal, the second contactor disconnects the first circuit.

2. The temperature monitoring device according to claim 1, characterized in that, The control module also includes a time relay; The time relay is connected to the current sensor. When the duration of the first electrical signal received by the time relay exceeds a third threshold, the time relay conducts a second circuit connected to the first contactor to supply power to the first contactor.

3. The temperature monitoring device according to claim 1, characterized in that, The first contactor includes a first coil and a first normally closed contact; One end of the first coil is connected to the current sensor, and the other end of the first coil is grounded; The first normally closed contact is connected in series with the first circuit.

4. The temperature monitoring device according to claim 2, characterized in that, The time relay includes a second coil and a first normally open contact; One end of the second coil is connected to the current sensor, and the other end of the second coil is grounded; The first normally open contact is connected in series with the second circuit.

5. The temperature monitoring device according to claim 1, characterized in that, The second contactor includes a second coil and a second normally closed contact; One end of the second coil is connected to the over-temperature sensor, and the other end of the second coil is grounded; The second normally closed contact is connected in series with the first circuit.

6. A semiconductor process apparatus, characterized in that, The device includes a DC power supply, a temperature monitoring device as described in any one of claims 1 to 5, a host computer, a slave computer, and a process chamber. The process chamber includes an electromagnetic module. The host computer is connected to the slave computer and is used to control the slave computer. The current sensor is connected to the lower-level machine. When the current sensor detects that the current in the first circuit that supplies power to the electromagnetic module exceeds a first threshold, it sends a first electrical signal to the lower-level machine. The over-temperature sensor is connected to the lower-level machine and sends a second electrical signal to the lower-level machine when the temperature of the electromagnetic module exceeds the second threshold.

7. The semiconductor process equipment according to claim 6, characterized in that, The lower-level machine is connected to the DC power supply; When the lower-level machine receives the first electrical signal, it transmits the first electrical signal to the upper-level machine. When the upper-level machine receives the first electrical signal, the upper-level machine controls the lower-level machine to stop sending the start signal to the DC power supply. When the lower-level machine receives the second electrical signal, it transmits the second electrical signal to the upper-level machine. When the upper-level machine receives the second electrical signal, the upper-level machine controls the lower-level machine to stop sending the start signal to the DC power supply. The start signal is used to instruct the DC power supply to supply power to the electromagnetic module.

8. The semiconductor process equipment according to claim 6 or 7, characterized in that, The temperature monitoring device also includes a temperature sensor; The temperature sensor is connected to the electromagnetic module and the lower-level machine respectively to detect the temperature of the electromagnetic module and convert the temperature into a first analog quantity and transmit it to the lower-level machine.

9. The semiconductor process equipment according to any one of claims 6 to 8, characterized in that, The semiconductor process equipment also includes a process control device, which includes a current commutation circuit and an electromagnet coil switching circuit. The current reversing circuit includes a third contactor; the third contactor is connected to the first circuit and to the lower-level machine. When the upper-level machine issues a current direction switching command, it controls the lower-level machine to switch the current direction in the first circuit through the third contactor. The electromagnet coil switching circuit includes a fourth contactor; the fourth contactor is connected to the first circuit and to the lower-level machine. When the upper-level machine issues a switching command for the energized coil, it controls the lower-level machine to switch the energized electromagnet coil among the multiple electromagnet coils through the fourth contactor.

10. The semiconductor process equipment according to any one of claims 6 to 9, characterized in that, The semiconductor process equipment includes physical vapor deposition (PVD) process equipment.

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