Electronic equipment
The speaker assembly, which combines a vibrating plate and a piezoelectric element, solves the problems of large speaker footprint and high cost of heat dissipation materials, enabling miniaturization and efficient heat dissipation of electronic devices and improving user experience.
Patent Information
- Application Number
- CN202422972053.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Existing speakers occupy a large space and have expensive and heavy heat dissipation materials, which affects the miniaturization and cost-effectiveness of electronic devices.
The speaker assembly uses a combination of a vibrating plate and a piezoelectric element. The vibrating plate is driven to vibrate by an electrical signal to generate an audio signal and promote airflow for heat dissipation. It combines a sound output channel and an air exchange channel design.
It effectively reduces the space occupied by speakers, lowers costs, enables the miniaturization of electronic devices and better heat dissipation, and improves the user experience.
Smart Images

Figure CN223540693U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display device technology, specifically to an electronic device with sound-speaking and heat dissipation functions. Background Technology
[0002] Currently, the speakers used in electronic devices are generally voice coil speakers, which occupy a large space in electronic devices and are not conducive to further miniaturization of electronic devices. On the other hand, existing electronic devices usually need to incorporate heat dissipation materials such as graphite, copper foil, and VC, which have problems such as high cost, large weight, and large thickness space occupation. Utility Model Content
[0003] The purpose of this application is to provide an electronic device that can reduce the space occupied by the speaker, reduce costs, and increase heat dissipation.
[0004] To address the aforementioned technical problems, this application provides an electronic device, characterized in that it includes a housing and a speaker assembly and a circuit board installed within the housing. The speaker assembly includes a vibrating plate, a piezoelectric element, and an electrical signal transmission carrier. The circuit board is electrically connected to the piezoelectric element via the electrical signal transmission carrier. The vibrating plate is elastic and mounted on the piezoelectric element. The circuit board is used to transmit electronic signals to the piezoelectric element via the electrical signal transmission carrier to drive the piezoelectric element to deform, thereby driving the vibrating plate to vibrate and generate an audio signal corresponding to the electronic signal. When the vibrating plate vibrates, it also drives the airflow within the housing, thereby dissipating heat for the electronic device.
[0005] Optionally, the housing is provided with an output channel for assisting the transmission of audio signals from the housing and an exchange channel for assisting the exchange of gas between the inside and outside of the housing.
[0006] Optionally, the electronic device also includes shielding components for protecting the circuit board, with the shielding components respectively disposed on both sides of the circuit board.
[0007] Optionally, the electronic device also includes a CPU disposed on one side of the circuit board, and a shield on the side where the CPU is located has a heat dissipation channel for assisting air to flow through the area adjacent to the CPU.
[0008] Optionally, the vibrating plate includes a sound-generating part in contact with the piezoelectric element and a driving part connected to the sound-generating part for driving airflow within the housing, the driving part being oscillating relative to the sound-generating part.
[0009] Optionally, the electronic device also includes a buffer disposed between the speaker assembly and the housing, and adhesive for securing the speaker assembly to the housing.
[0010] Optionally, the electronic device also includes a display module mounted on the housing and disposed on the outside of the piezoelectric element.
[0011] Optionally, the electronic device also includes a sealing ring for connecting the display module to the housing.
[0012] Optionally, the sealing ring, the vibrating plate, the display module, and the housing are together enclosed to form a sound-correcting cavity for eliminating noise in the audio signal.
[0013] Optionally, the electronic device may also include a dustproof mesh for sealing the opening of the sound outlet channel on the outer surface of the housing.
[0014] In operation, the electronic device of this application transmits electronic signals to an electrical signal transmission carrier, which then transmits the signals to a piezoelectric element to drive the element to deform. This, in turn, drives a vibrating plate to vibrate, generating an audio signal corresponding to the electronic signal. Simultaneously, the vibration of the vibrating plate also drives airflow within the housing, dissipating heat generated by the electronic device's CPU through ventilation and heat dissipation channels. This electronic device integrates the speaker and heat dissipation devices, effectively saving installation space and facilitating further miniaturization and multifunctionality. It also more effectively reduces the surface temperature of the electronic device, resulting in a better user experience.
[0015] The above description is merely an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without any creative effort.
[0017] Figure 1 This is a cross-sectional schematic diagram of the electronic device provided in Embodiment 1 of this application;
[0018] Figure 2 This is a front view schematic diagram of the electronic device provided in Embodiment 1 of this application;
[0019] Figure 3 for Figure 1 A cross-sectional schematic diagram of the electronic device in its working state;
[0020] Figure 4 This is a cross-sectional schematic diagram of the electronic device provided in Embodiment 2 of this application;
[0021] Figure 5 This is a front view schematic diagram of the electronic device provided in Embodiment 2 of this application.
[0022] The realization of the objectives, functional features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation
[0023] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0024] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Optionally, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which needs to be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.
[0025] Example 1
[0026] like Figure 1As shown, the first preferred embodiment of the present invention provides an electronic device, including: a housing (11) and a speaker assembly (15) and a circuit board (16) installed in the housing (11). The speaker assembly (15) includes a vibrating plate (151), a piezoelectric element (152) and an electrical signal transmission carrier (153). The circuit board (16) is electrically connected to the piezoelectric element (152) through the electrical signal transmission carrier (153). The vibrating plate (151) is elastic and installed on the piezoelectric element (152). The circuit board (16) is used to transmit electronic signals to the piezoelectric element (152) through the electrical signal transmission carrier (153) to drive the piezoelectric element (152) to deform, thereby driving the vibrating plate (151) to vibrate to generate an audio signal corresponding to the electronic signal. When the vibrating plate (151) vibrates, it is also used to drive the air flow in the housing (11) to dissipate heat for the electronic device.
[0027] The following is combined with Figure 1 A detailed introduction to each component of the smart terminal:
[0028] The electronic device includes a speaker assembly (15) and a circuit board (16). The speaker assembly (15) includes a vibrating plate (151), a piezoelectric element (152), and an electrical signal transmission carrier (153). The vibrating plate (151) can deform significantly when subjected to external force. When the piezoelectric element (152) receives an electrical signal, it can vibrate. The piezoelectric element (152) is connected to the circuit board (16) through the electrical signal transmission carrier (153). The electrical signal transmission carrier (153) can be connected to 16 and conduct electricity through any method such as welding or spring contact.
[0029] The housing (11) of the electronic device includes a sound outlet channel (111) and a ventilation channel (112). The sound outlet channel (111) is used to assist the transmission of audio signals from the housing (11), and the ventilation channel (112) assists the exchange of gas between the inside and outside of the housing (11). The electronic device also includes a dustproof mesh (14) to seal the opening of the sound outlet channel (111) on the outer surface of the housing (11) to prevent dust from falling into the housing (11). When the electronic device is working, the deformation of the vibrating plate (151) drives the air to vibrate and generate sound. The generated audio signal can be transmitted out of the housing (11) with the assistance of the dustproof mesh (14) and the sound outlet channel (111), so that the corresponding electronic signal conversion sound can be heard outside the electronic device. When the vibrating plate (151) deforms, it accelerates the air flow, allowing the hot and cold air inside the housing (11) to circulate and exchange through the ventilation channel (112).
[0030] The vibrating plate (151) also includes a sound-generating part (1511) in contact with the piezoelectric element (152) and a driving part (1512) connected to the sound-generating part (1511). The driving part (1512) is used to drive the airflow inside the housing (11), and the driving part (1512) can be oscillating relative to the sound-generating part (1511). When the electronic device starts to operate, the electronic signal of the electronic device is transmitted to the piezoelectric element (152) through the circuit board (16) and the electrical signal transmission carrier (153). The piezoelectric element (152) converts the electrical signal into mechanical deformation. While the piezoelectric element (152) is mechanically deformed, it drives the vibrating plate (151) to amplify the deformation amplitude. The sound-generating part (1511) of the vibrating plate (151) deforms, causing the air to vibrate and generate sound. The sound passes through the dustproof net (14) and the sound outlet channel (111) and is transmitted out of the electronic device, so that the corresponding signal conversion sound can be heard outside the electronic device. At the same time, the amplitude of the swing of the driving part (1512) at the far end of the vibrating plate (151) is further amplified. The driving part (1512) swings up and down, driving the air flow and accelerating the air flow in the housing (11) and the exchange of cold and hot air in the ventilation channel (112).
[0031] The electronic device also includes a shield (18) for protecting the circuit board (16) and a CPU (17) disposed on one side of the circuit board (16); the shield (18) is disposed on both sides of the circuit board (16). When the CPU (17) is operating, it transmits electronic signals to the piezoelectric element (152) via the circuit board (16) and the electrical signal transmission carrier (153), generating a large amount of heat. The piezoelectric element (152) converts the electrical signals into mechanical deformation. While the piezoelectric element (152) is mechanically deformed, it drives the vibrating plate (151) to amplify the deformation amplitude, causing the sound-producing part (1511) of the vibrating plate (151) to vibrate and produce sound. The driving part (1512) swings up and down to push the hot air (3002) generated by the CPU (17) to move away from the CPU (17) with the air flow. Because the air flowing out of the heat source creates a pressure difference, the relatively cool air (3001) at a distance will flow to the vicinity of the heat source. Through the continuous flow of air, the air exchange between hot and cold is realized, reducing the temperature of the heat source, thereby promoting the heat dissipation of the electronic device. In a further embodiment, the CPU (17) can be replaced by other main heat source devices.
[0032] The electronic device also includes a display module (12), a back support plate (13), and a power supply (20); the display module (12) is mounted on the housing (11) and located on the outside of the piezoelectric element (152), the back support plate (13) is mounted on the other side of the housing (11), and the power supply (20) controls the switching of the electronic device. The electronic device also includes a sealing ring (193), adhesive backing (192), and a buffer (191). The sealing ring (193) connects the display module (12) to the housing (11). The sealing ring (193), the vibrating plate (151), the display module (12), and the housing (11) together form a sound-correcting cavity, which is used to eliminate noise in the audio signal. The adhesive backing (192) is disposed between the speaker assembly (15) and the housing (11) to fix the speaker assembly (15) to the housing (11). The buffer (191) is installed between the speaker assembly (15) and the housing (11) to prevent the speaker assembly (15) from hitting the housing (11) when deformed. The material of the buffer (191) is usually relatively soft and will not significantly affect the deformation range of the speaker assembly (15). In a further embodiment, the buffer (191) can be omitted if necessary.
[0033] Example 2
[0034] like Figure 4 As shown, the first preferred embodiment of the present invention provides an electronic device, including: a housing (11) and a speaker assembly (15) and a circuit board (16) installed in the housing (11). The speaker assembly (15) includes a vibrating plate (151), a piezoelectric element (152) and an electrical signal transmission carrier (153). The circuit board (16) is electrically connected to the piezoelectric element (152) through the electrical signal transmission carrier (153). The vibrating plate (151) is elastic and installed on the piezoelectric element (152). The circuit board (16) is used to transmit electronic signals to the piezoelectric element (152) through the electrical signal transmission carrier (153) to drive the piezoelectric element (152) to deform, thereby driving the vibrating plate (151) to vibrate to generate an audio signal corresponding to the electronic signal. When the vibrating plate (151) vibrates, it is also used to drive the air flow in the housing (11) to dissipate heat for the electronic device.
[0035] The following is combined with Figure 4 A detailed introduction to each component of the smart terminal:
[0036] The arrangement of the circuit board (16), the vibrating plate (151), the piezoelectric element (152), and the electrical signal transmission carrier (153) is consistent with that described in the previous embodiment. However, in this embodiment, the vibrating plate (151) includes a sound-generating part (1511) in contact with the piezoelectric element (152), and there are two piezoelectric elements (152), which are respectively disposed at both ends of the sound-generating part (1511). When the electronic device starts to operate, the electronic signal of the electronic device is transmitted to the piezoelectric element (152) through the circuit board (16) and the electrical signal transmission carrier (153). The piezoelectric element (152) converts the electrical signal into mechanical deformation. While the piezoelectric element (152) is mechanically deformed, it drives the vibrating plate (151) to amplify the deformation amplitude. The sound-generating part (1511) of the vibrating plate (151) deforms, which drives the air to vibrate and generate sound. The sound passes through the sound outlet channel (111) and is transmitted out of the electronic device, so that the corresponding signal conversion sound can be heard outside the electronic device. At the same time, the vibrating plate (151) swings up and down, which drives the air flow and accelerates the air flow in the housing (11) and the exchange of hot and cold gases in the heat dissipation channel (181).
[0037] The electronic device also includes a shield (18) for protecting the circuit board (16) and a CPU (17) disposed on one side of the circuit board (16); the shield (18) is disposed on both sides of the circuit board (16), and a heat dissipation channel (181) is provided on the shield (18) located on the side of the CPU (17). The heat dissipation channel (181) is used to assist air to flow through the area adjacent to the CPU (17), and the two ends of the vibrating plate (151) are respectively connected to the two ends of the heat dissipation channel (181). When the CPU (17) is operating, it transmits electronic signals to the piezoelectric element (152) via the circuit board (16) and the electrical signal transmission carrier (153), generating a large amount of heat. The piezoelectric element (152) converts the electrical signals into mechanical deformation. While the piezoelectric element (152) is mechanically deformed, it drives the vibrating plate (151) to amplify the deformation amplitude, causing the sound-producing part (1511) of the vibrating plate (151) to vibrate and produce sound. The vibrating plate (151) swings up and down to push the hot air (3002) generated by the CPU (17) to move away from the CPU (17) with the air flow. Due to the pressure difference generated by the air flowing out of the heat source, the relatively cool air (3001) at a distance will flow to the vicinity of the heat source. Through the continuous flow of air, the air heat exchange is realized, the temperature of the heat source is reduced, thereby promoting the heat dissipation of the electronic device. In a further embodiment, the CPU (17) can be replaced by other main heat source devices.
[0038] The electronic device also includes a sealing ring (193) and an adhesive backing (192). The sealing ring (193) connects the display module (12) to the housing (11) and the shield (18) to the housing (11), respectively. The adhesive backing (192) is disposed between the speaker assembly (15) and the shield (18) for fixing the speaker assembly (15) to the shield (18). The structure and arrangement of other components are consistent with those described in the foregoing embodiments.
[0039] In summary, this invention provides an electronic device in which electronic signals are emitted from the CPU (17) and transmitted to the piezoelectric element (152) via the circuit board (16) and the electrical signal transmission carrier (153). The piezoelectric element (152) converts the electrical signals into mechanical deformation. Simultaneously, the mechanical deformation of the piezoelectric element (152) drives the vibrating plate (151) to amplify the deformation amplitude. The sound-generating part (1511) of the vibrating plate (151) deforms, causing the air to vibrate and generate sound that passes through the sound outlet channel (111) and transmits the sound out of the electronic device, so that the corresponding signal conversion sound can be heard outside the electronic device. Simultaneously, the vibrating plate (151) and its driving part (1512) swing up and down, pushing the hot air (3002) generated by the CPU (17) to move away from the CPU (17) with the air flow. Due to the pressure difference generated by the air flowing out of the heat source, the relatively cool air (3001) at a distance will flow to the vicinity of the heat source. Through the continuous flow of air, the exchange of heat and cold air is realized, reducing the temperature of the heat source and thus promoting the heat dissipation of the electronic device. Through the technical solution of this utility model, the speaker device and heat dissipation device of the electronic device are combined into one, which effectively saves installation space and is conducive to the further miniaturization and multi-functionality of electronic devices; at the same time, it can also effectively reduce the surface temperature of the electronic device, resulting in a better user experience. In addition, the material cost used in this utility model is low, which can reduce the cost of electronic devices.
[0040] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. An electronic device, characterized in that, The device includes a housing (11) and a speaker assembly (15) and a circuit board (16) installed within the housing (11). The speaker assembly (15) includes a vibrating plate (151) and a piezoelectric element (152). The vibrating plate (151) is elastic and mounted on the piezoelectric element (152). The circuit board (16) is used to transmit electronic signals directly or indirectly to the piezoelectric element (152) to drive the piezoelectric element (152) to deform, thereby driving the vibrating plate (151) to vibrate to generate an audio signal corresponding to the electronic signal. When the vibrating plate (151) vibrates, it also drives the airflow within the housing (11) to dissipate heat for the electronic device.
2. The electronic device as claimed in claim 1, characterized in that, The housing (11) has a sound outlet channel (111) for assisting the audio signal to be transmitted from the housing (11) and a ventilation channel (112) for assisting the exchange of gas between the inside and outside of the housing (11).
3. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes shielding members (18) for protecting the circuit board (16), the shielding members (18) being disposed on both sides of the circuit board (16).
4. The electronic device as claimed in claim 3, characterized in that, The electronic device also includes a CPU (17) disposed on one side of the circuit board (16), and the shield (18) located on the side of the CPU (17) has a heat dissipation channel (181) for assisting air to flow through the area adjacent to the CPU (17).
5. The electronic device as claimed in claim 1, characterized in that, The vibrating plate (151) includes a sound-generating part (1511) in contact with the piezoelectric element (152) and a driving part (1512) connected to the sound-generating part (1511) for driving the airflow within the housing (11), the driving part (1512) being oscillatingly disposed relative to the sound-generating part (1511).
6. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes a buffer (191) disposed between the speaker assembly (15) and the housing (11), and adhesive backing (192) for fixing the speaker assembly (15) to the housing (11).
7. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes a display module (12), which is mounted on the housing (11) and disposed on the outside of the piezoelectric element (152).
8. The electronic device as claimed in claim 7, characterized in that, The electronic device also includes a sealing ring (193) for connecting the display module (12) to the housing (11).
9. The electronic device as claimed in claim 8, characterized in that, The sealing ring (193), the vibrating plate (151), the display module (12), and the housing (11) together form a sound-correcting cavity for eliminating noise in the audio signal.
10. The electronic device as claimed in claim 2, characterized in that, The electronic device also includes a dustproof mesh (14) for sealing the opening of the sound outlet channel (111) on the outer surface of the housing (11).