Circuit board structure of board edge embedded copper block

Abstract

According to the circuit board structure of the board edge embedded copper block provided by the utility model, at least one side surface of the copper block is exposed out of the board edge of the circuit board structure, and the embedded copper block is designed at the board edge of the circuit board for heat dissipation, so that the layout welding area of the circuit board is increased, and the heat dissipation efficiency is improved. The problem that no enough space is provided for arranging the embedded copper block in the board in the prior art is solved. By arranging the bump on the copper block, the adhesive force between the bump and the insulating dielectric layer in the circuit board is increased, and the problem that the binding force is weak when the copper block is embedded at the edge of the board in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, and in particular to a circuit board structure with an embedded copper block on the board edge. Background Technology

[0002] For some electronic modules that require high heat dissipation, copper blocks are usually embedded in the circuit board to effectively improve local heat dissipation efficiency and meet the heat dissipation needs of specific locations.

[0003] However, as the component design density of electronic modules increases, some components that require high heat dissipation are installed in the edge area of ​​the board. Therefore, it is necessary to design the embedded copper block to the edge area of ​​the board. Or, due to the limitation of the high density of the circuit board, there is not enough space in the board to set the embedded copper block. Therefore, the design places the embedded copper block at the edge of the board and dissipates heat to the outside of the board through the side of the horizontal copper block.

[0004] Since the copper blocks embedded on the edge of the board have weaker bonding strength compared to those inside the board, higher precision and structure are required to improve the bonding strength of the copper blocks.

[0005] In view of the above background and problems, there is a need to provide a new type of circuit board structure with embedded copper blocks on the board edge. Utility Model Content

[0006] The present invention aims to solve the problem that the current method requires embedding copper blocks at the edge of a board, but the bonding force between the copper blocks and the board body is weak. The present invention provides a circuit board structure with embedded copper blocks at the edge of the board, wherein at least one exposed side of the copper block is exposed at the edge of the circuit board structure.

[0007] Furthermore, the copper block is covered with an insulating dielectric layer and a surface copper layer on both the top and bottom.

[0008] Furthermore, the three unexposed sides of the copper block are enclosed within the circuit board structure.

[0009] Furthermore, the unexposed side of the copper block is provided with a planar protrusion perpendicular to the unexposed side.

[0010] Furthermore, the planar protrusions are multiple and evenly distributed on the top and bottom edges of the copper block where the sides are not exposed.

[0011] Furthermore, the length of the planar protrusion is 20 μm to 105 μm, and the height is 20 μm to 105 μm.

[0012] Furthermore, the top and bottom surfaces of the copper block are provided with vertical protrusions.

[0013] Furthermore, there are multiple vertical protrusions, evenly distributed along the exposed side edges.

[0014] Furthermore, the length of the vertical protrusion is 20 μm to 105 μm, and the height is 20 μm to 105 μm.

[0015] Furthermore, the circuit board structure includes an inner layer circuit, which is adjacent to the copper block in the planar direction and located within the height range of the copper block in the vertical direction.

[0016] The circuit board structure with an embedded copper block on the board edge proposed in this utility model increases the board surface soldering area by designing the embedded copper block on the board edge for heat dissipation, thus solving the problem of insufficient space within the board for embedding copper blocks in the prior art. Furthermore, by setting bumps on the copper block, the adhesion between the bumps and the insulating dielectric layer inside the circuit board is increased, thus solving the problem of weak bonding force when the embedded copper block is set on the board edge in the prior art. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional schematic diagram of the circuit board structure with the embedded copper block on the board edge according to this utility model;

[0019] Figure 2 This is a three-dimensional structural diagram of the copper block of this utility model;

[0020] Figure 3 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention.

[0021] Explanation of icon numbers:

[0022]

[0023] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0026] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0027] Please see Figure 1 and Figure 2 , Figure 1 This is a cross-sectional schematic diagram of the circuit board structure with the embedded copper block on the board edge according to this utility model; Figure 2 This is a three-dimensional structural diagram of the copper block of this utility model.

[0028] In this embodiment, the circuit board structure 10 with an embedded copper block at the board edge has at least one side of the copper block 100 exposed at the board edge of the circuit board structure 10; Figure 1 In the circuit, the exposed side is called the exposed side 1010, which can be two or three sides, but at least one side is integrated with the inside of the circuit board to form an embedded structure, so that the electronic components on the circuit board can be cooled through the exposed side 1010 of the copper block 100.

[0029] In this embodiment, the copper block 100 is covered with an insulating dielectric layer 200 and a surface copper layer 300 on both the top and bottom. On the one hand, the insulating dielectric layer 200, after being pressed together, forms a tight bond with the copper block 100, thereby fixing the copper block 100. On the other hand, the copper block 100 can be optionally embedded inside the circuit board structure 10, so the space originally designed for heat dissipation on the board surface is released, thereby reserving more wiring space and improving the density of the circuit board.

[0030] To ensure heat dissipation and to make the bond between the copper block 100 and the adjacent insulating dielectric layer 200 more stable, in this embodiment, the three unexposed sides 1020 of the copper block 100 are wrapped inside the circuit board structure 10. The unexposed sides 1020 and the interior of the circuit board structure 10 are pressed and bonded together. The larger the area of ​​the unexposed sides 1020, the larger the contact area with the insulating dielectric layer 200. Therefore, the three unexposed sides 1020 can effectively fix the copper block 100.

[0031] In this embodiment, the unexposed side 1020 of the copper block 100 is provided with a planar protrusion 1020A perpendicular to the side, which facilitates better embedding into the insulating dielectric layer 200. After pressing, the adhesion between the copper block 100 and the insulating dielectric layer 200 is more stable, which strengthens the copper block 100 in the horizontal direction. Moreover, there are multiple planar protrusions 1020A, which are evenly distributed on the top and bottom edges of the unexposed side 1020 of the copper block 100. Compared with a single protrusion, the planar protrusion 1020A is divided into multiple evenly distributed small protrusions, which increases the contact area between the planar protrusion 1020A and the insulating dielectric layer 200. During the pressing process, it can ensure sufficient filling of glue and prevent glue voids, making the bond between the two more solid and further increasing the bonding force between the copper block 100 and the insulating dielectric layer 200.

[0032] It is worth noting that the planar protrusion 1020A in this embodiment is designed to be relatively small, with a length of 20μm to 105μm and a height of 20μm to 105μm. On the one hand, this avoids the planar protrusion 1020A being too large, which would affect the flatness of the board surface and cause local protrusions on the board surface, resulting in instability of the circuit board. On the other hand, it avoids the problem that if the size is too large, the height difference of the grooves on the filling surface of the insulating dielectric layer 200 will be too large. Since the insulating dielectric layer 200 is relatively thin, it is easy to affect the degree of filling of the insulating dielectric layer 200 during the lamination process, resulting in problems such as poor filling.

[0033] In this embodiment, since the exposed side surface 1010 does not contact the insulating dielectric layer 200 in its horizontal direction, vertical protrusions 1030A are provided on both the top surface 1030 and the bottom surface of the copper block 100, so that it can be better fixed to the insulating dielectric layer 200 in the vertical direction, thus providing vertical reinforcement to the copper block 100. Furthermore, there are multiple vertical protrusions 1030A, which are evenly distributed on the edge of the exposed side surface. By dividing the vertical protrusions 1030A into multiple evenly distributed small protrusions, the contact area between the vertical protrusions 1030A and the insulating dielectric layer 200 is increased, as well as the bonding force between the copper block 100 and the insulating dielectric layer 200, further improving the bonding force between the copper block 100 and the board edge of the circuit board structure 10.

[0034] It is worth noting that the length of the vertical protrusion 1030A is 20μm to 105μm and the height is 20μm to 105μm, which is the same as the effect of the planar protrusion 1020A, and will not be described again.

[0035] Specifically, the circuit board structure 10 includes an inner layer circuit 400, which is adjacent to the copper block 100 in the planar direction and located within the height range of the copper block 100 in the vertical direction. This facilitates the formation of a design that extends the pattern to the surface, and allows heat dissipation channels to be designed through the internal circuit 400 for soldering heat-generating components.

[0036] Please see Figure 3 , Figure 3 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention.

[0037] In summary, the specific manufacturing method of this embodiment is as follows: A copper block 100 with planar protrusions 1020A and vertical protrusions 1030A, a windowed core board with inner layer circuitry 400, and a windowed prepreg 500 are fabricated. The copper block 100 is embedded into the windowed pattern of the windowed core board. Then, the windowed prepreg 500, an insulating dielectric layer 200, and a surface copper layer 300 are sequentially covered on both the top and bottom to form a stacked structure 20. The stacked structure 20 is pressed together to form a press plate. The press plate is then milled to expose the exposed side 1010 of the copper block. Finally, a solder resist layer 600 is fabricated on the board surface to form the circuit board structure 10.

[0038] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model and based on the description and drawings of the present utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A circuit board structure with an embedded copper block on the board edge, characterized in that, At least one side of the copper block is exposed at the edge of the circuit board structure; The copper block is covered with an insulating dielectric layer and a surface copper layer on both the top and bottom. The unexposed side of the copper block is provided with a planar protrusion perpendicular to the unexposed side; The planar protrusions are multiple and are evenly distributed on the top and bottom edges of the copper block where the sides are not exposed.

2. The circuit board structure with an embedded copper block on the board edge as described in claim 1, characterized in that, The three unexposed sides of the copper block are enclosed within the circuit board structure.

3. The circuit board structure with an embedded copper block on the board edge as described in claim 1, characterized in that, The length of the planar protrusion is 20 μm to 105 μm, and the height is 20 μm to 105 μm.

4. The circuit board structure with an embedded copper block on the board edge as described in claim 1, characterized in that, The top and bottom surfaces of the copper block are provided with vertical protrusions.

5. The circuit board structure with an embedded copper block on the board edge as described in claim 4, characterized in that, The vertical protrusions are multiple and evenly distributed on the exposed side edges.

6. The circuit board structure with an embedded copper block at the board edge as described in claim 4 or 5, characterized in that, The vertical protrusion has a length of 20 μm to 105 μm and a height of 20 μm to 105 μm.

7. The circuit board structure with an embedded copper block on the board edge as described in claim 1, characterized in that, The circuit board structure includes an inner layer circuit, which is adjacent to the copper block in the planar direction and located within the height range of the copper block in the vertical direction.

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