High-reflection aluminum oxide ceramic substrate for LED

Abstract

The high-reflection aluminum oxide ceramic substrate comprises a substrate body, packaging cavities which are recessed downwards are arranged on the top face of the substrate body in an array mode, circuit layers are arranged on the bottom faces of the packaging cavities, and reflection layers are arranged on the side walls of the packaging cavities. According to the high-reflection aluminum oxide ceramic substrate for the LED, the concave packaging cavity is arranged on the substrate body, the reflecting layer is arranged on the side wall of the packaging cavity, and side light emitted by the LED packaged in the packaging cavity is reflected to the opening end of the packaging cavity through the reflecting layer, so that light absorption of the ceramic substrate is reduced, and light output is improved; and light energy waste is prevented.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate technology, and more specifically, to a high-reflectivity alumina ceramic substrate for LEDs. Background Technology

[0002] LED refers to LED chip, which is a solid-state semiconductor device. Its core is a semiconductor wafer, also known as LED light-emitting chip or simply LED.

[0003] Ceramic substrates refer to special process boards where copper foil is directly bonded to the surface (single-sided or double-sided) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrates at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies. Alumina ceramic substrates, due to their excellent insulation properties, good thermal conductivity, low coefficient of thermal expansion, and high mechanical strength, are widely used in electronic packaging fields such as thick-film integrated circuits and LED packaging.

[0004] Patent document CN220986459U discloses an LED substrate, including a substrate; and also including an encapsulation layer, the encapsulation layer including an encapsulation plate and an encapsulation block, the encapsulation block being disposed on one side of the substrate, the encapsulation plate being disposed within the encapsulation block, the encapsulation block being used to improve light uniformity; a heat sink being disposed on the other side of the substrate for heat dissipation; and two mounting plates being disposed on opposite sides of the substrate, located between the substrate and the heat sink, for fixation.

[0005] In existing ceramic substrates, there is no reflective device. Light emitted from the side of the LED chip interferes with each other and shines onto the ceramic substrate, where it is absorbed, resulting in reduced light output and wasted light energy.

[0006] Therefore, it is necessary to propose a high-reflectivity alumina ceramic substrate for LEDs to solve the problems existing in the prior art. Utility Model Content

[0007] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0008] To address the aforementioned problems, this utility model provides a high-reflectivity alumina ceramic substrate for LEDs, comprising a substrate body, an array of downwardly recessed encapsulation cavities on the top surface of the substrate body, a circuit layer on the bottom surface of the encapsulation cavities, and a reflective layer on the sidewalls of the encapsulation cavities.

[0009] Preferably, the encapsulation cavities are arranged in a rectangular array or a cross array on the top surface of the substrate body.

[0010] Preferably, the encapsulation cavity is conical, with the larger end of the cone facing the top surface of the substrate body.

[0011] Preferably, the encapsulation cavity has beveled sidewalls.

[0012] Preferably, the encapsulation cavity has curved sidewalls.

[0013] Preferably, the material of the reflective layer is silver, aluminum, nickel-chromium alloy, or aluminum-magnesium alloy.

[0014] Preferably, heat sinks are disposed on the bottom surface of the encapsulation cavity at intervals from the circuit layer.

[0015] Preferably, heat dissipation holes are formed on the substrate body at positions corresponding to the heat dissipation block, heat dissipation pillars are set in the heat dissipation holes, the top surface of the heat dissipation pillars is fixedly connected to the heat dissipation block, a heat dissipation plate is fixedly set on the lower surface of the substrate body, and the bottom surface of the heat dissipation pillars is fixedly connected to the heat dissipation plate.

[0016] Preferably, the heat sink, heat sink column, and heat sink plate are made of graphene material.

[0017] Preferably, a dam is fixedly installed around the edges of the substrate body extending upwards.

[0018] Compared with the prior art, the present invention has at least the following beneficial effects:

[0019] The high-reflectivity alumina ceramic substrate for LEDs described in this invention has a recessed encapsulation cavity on the substrate body and a reflective layer on the side wall of the encapsulation cavity. The side light emitted by the LED encapsulated in the encapsulation cavity is reflected by the reflective layer to the opening end of the encapsulation cavity, reducing the absorption of light by the ceramic substrate, improving light output, and preventing light energy waste.

[0020] The high-reflectivity alumina ceramic substrate for LEDs described in this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of the high-reflectivity alumina ceramic substrate for LEDs disclosed in this utility model;

[0023] Figure 2 This is a side view of the heat dissipation assembly disclosed in this utility model.

[0024] Figure 3 This is a bottom view of the heat dissipation component disclosed in this utility model. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement it based on the description.

[0026] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0027] like Figure 1-3 As shown, a high-reflectivity alumina ceramic substrate for LEDs includes a substrate body 1, an array of downwardly recessed encapsulation cavities 2 arranged on the top surface of the substrate body 1, a circuit layer 3 arranged on the bottom surface of the encapsulation cavity 2, and a reflective layer 4 arranged on the sidewall of the encapsulation cavity 2.

[0028] Furthermore, the encapsulation cavities 2 are arranged in a rectangular array or a cross array on the top surface of the substrate body 1.

[0029] Furthermore, the encapsulation cavity 2 is conical, with the larger end of the cone facing the top surface of the substrate body 1.

[0030] Furthermore, the encapsulation cavity 2 has a sloped sidewall or an arc-shaped sidewall.

[0031] Furthermore, the material of the reflective layer 4 is silver, aluminum, nickel-chromium alloy, or aluminum-magnesium alloy.

[0032] Furthermore, heat sinks 5 are provided at intervals between the bottom surface of the encapsulation cavity 2 and the circuit layer 3.

[0033] Furthermore, a heat dissipation hole 6 is formed on the substrate body 1 at a position corresponding to the heat dissipation block 5, a heat dissipation column 7 is provided in the heat dissipation hole 6, the top surface of the heat dissipation column 7 is fixedly connected to the heat dissipation block 5, a heat dissipation plate 8 is fixedly provided on the lower surface of the substrate body 1, and the bottom surface of the heat dissipation column 7 is fixedly connected to the heat dissipation plate 8.

[0034] Furthermore, the heat sink 5, heat sink 7, and heat sink 8 are made of graphene material.

[0035] Furthermore, a dam 9 is fixedly installed on the upper edge of the substrate body 1.

[0036] The working principle of the above technical solution is as follows: The alumina ceramic substrate includes a substrate body 1, and multiple arrayed encapsulation cavities 2 are formed on the top surface of the substrate body 1. The encapsulation cavities 2 and the substrate body 1 are integrally formed during sintering. The main component of the substrate body 1 is alumina, and the composition of the ceramic substrate is existing technology and will not be described in detail here.

[0037] The encapsulation cavity 2 is used to encapsulate LED chips. Circuit layers 3 and heat sinks 5 are spaced apart on the bottom surface of the encapsulation cavity 2. Circuit layers 3 can be formed on the bottom surface of the encapsulation cavity 2 by laser activation of metal. Nickel-gold, nickel-palladium-gold, or silver materials can be deposited on the surface of the circuit layers. Then, the LED chips are directly soldered or soldered to the circuit layers through pads. If the circuit layers in the encapsulation cavities that are spaced apart need to be connected, they can be connected by connecting circuits so that the circuit of the entire substrate body 1 forms a whole for powering the LED chips encapsulated in the encapsulation cavity. Circuit holes can be opened on the substrate body 1 at positions corresponding to circuit layers 3. The circuit holes penetrate the substrate body 1 and the heat sink 8. The connecting circuit passes through the circuit holes and is electrically connected to the circuit layers 3. Alternatively, the connecting circuit can be set on the surface of the substrate body 1 and the encapsulation cavity 2, below the reflective layer 4.

[0038] The metal material of the reflective layer 4 can be formed on the side wall of the encapsulation cavity 2 by electroplating. The side wall of the encapsulation cavity 2 is conical, with the large end of the cone facing the upper side of the top surface of the substrate body 1, so that the reflective layer on the side wall of the encapsulation cavity 2 can reflect the light emitted from the side of the LED chip to one end of the opening of the encapsulation cavity 2.

[0039] The material of reflective layer 4 is silver, aluminum, nickel-chromium alloy or aluminum-magnesium alloy. The reflectivity of silver, aluminum, nickel-chromium alloy or aluminum-magnesium alloy is high, reaching more than 95%.

[0040] Depending on the LED chip or the application, the sidewall of the encapsulation cavity 2 can be set as a slope or a curved surface to reflect more light from the LED chip.

[0041] The packaged chip generates heat when it emits light. Heat sink 5 is placed on the bottom surface of the package cavity 2 at intervals from the circuit layer. After the LED chip is packaged, the heat sink 5 is in close contact with the LED chip. Alternatively, silicone grease can be applied between the LED chip and the heat sink 5 to increase the speed of heat conduction between the LED chip and the heat sink 5.

[0042] The beneficial effects of the above technical solution are as follows:

[0043] The high-reflectivity alumina ceramic substrate for LEDs described in this invention has a recessed encapsulation cavity on the substrate body and a reflective layer on the side wall of the encapsulation cavity. The side light emitted by the LED encapsulated in the encapsulation cavity is reflected by the reflective layer to the opening end of the encapsulation cavity, reducing the absorption of light by the ceramic substrate, improving light output, and preventing light energy waste.

[0044] In one embodiment, a heat dissipation assembly is provided on the heat sink 8. The heat dissipation assembly includes a base plate 10 fixedly mounted on the heat sink 8. A plurality of V-shaped heat sinks 11 are fixedly mounted on the side of the base plate 10 away from the heat sink 8. The V-shaped heat sinks 11 are perpendicular to the base plate 10. The top of two adjacent V-shaped heat sinks forms an air inlet 12, and the tail of two adjacent V-shaped heat sinks 11 forms an air outlet 13. The width of the air inlet 12 is greater than the width of the air outlet 13. A fan cover 14 is detachably mounted on the base plate 10. The fan cover 14 is U-shaped and covers the V-shaped heat sinks 11. The end face of the V-shaped heat sinks 11 away from the base plate 10 contacts the inner bottom surface of the fan cover 14. A fan 15 is fixedly mounted on the end face of the base plate 10 and the fan cover 14 at one end of the air inlet 12.

[0045] The working principle of the above technical solution is as follows: A heat dissipation component is installed on the heat sink 8 to dissipate the heat transferred to the heat sink 8. The heat dissipation component includes a base plate 10 fixedly installed on the heat sink 8, and multiple V-shaped heat sinks 11 are fixedly installed on the base plate 10. A fan cover 14 is fitted over the V-shaped heat sinks 11 and is detachably connected to the base plate 10. The V-shapes of the V-shaped heat sinks 11 are aligned, with the vertex of the V-shape being the top end of the V-shaped heat sink and the open end of the V-shape being the tail end of the V-shaped heat sink. The tail ends of two adjacent V-shaped heat sinks 11 are aligned. The V-shaped heat sinks at the end and two edges form an air outlet 13 with the side wall of the fan shroud 14. The length of the fan shroud 14 is the same as that of the base plate 10. The fan 15 is fixed to the end of the base plate 10 and the fan shroud 14 located at the air inlet. A wedge-shaped air duct is formed between the adjacent V-shaped heat sinks. When the air blown out by the fan 15 passes through the air duct, the air velocity in the air duct increases due to the gradually decreasing cross-section of the wedge. The air forms a vortex on the surface of the V-shaped heat sink, which improves the heat exchange efficiency between the air and the V-shaped heat sink and can carry away the heat on the V-shaped heat sink more quickly.

[0046] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0047] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0048] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A high-reflectivity alumina ceramic substrate for LEDs, characterized in that, The substrate includes a substrate body (1), and a series of downwardly recessed encapsulation cavities (2) are arranged on the top surface of the substrate body (1), a circuit layer (3) is arranged on the bottom surface of the encapsulation cavity (2), and a reflective layer (4) is arranged on the side wall of the encapsulation cavity (2). A heat sink plate (8) is fixedly installed on the lower surface of the substrate body (1). A heat sink assembly is installed on the heat sink plate (8). The heat sink assembly includes a base plate (10) fixedly installed on the heat sink plate (8). Multiple V-shaped heat sinks (11) are fixedly installed on the side of the base plate (10) away from the heat sink plate (8). The V-shaped heat sinks (11) are perpendicular to the base plate (10). The top of two adjacent V-shaped heat sinks forms an air inlet (12). The tail of two adjacent V-shaped heat sinks (11) forms an air outlet (13). The width of the air inlet (12) is greater than the width of the air outlet (13).

2. The high-reflectivity alumina ceramic substrate for LEDs according to claim 1, characterized in that, The encapsulation cavity (2) is arranged in a rectangular array or a cross array on the top surface of the substrate body (1).

3. The high-reflectivity alumina ceramic substrate for LEDs according to claim 2, characterized in that, The encapsulation cavity (2) is conical, with the large end of the cone facing the top surface of the substrate body (1).

4. The high-reflectivity alumina ceramic substrate for LEDs according to claim 3, characterized in that, The sidewall of the encapsulation cavity (2) is inclined.

5. The high-reflectivity alumina ceramic substrate for LEDs according to claim 3, characterized in that, The sidewall of the encapsulation cavity (2) is an arc-shaped surface.

6. The high-reflectivity alumina ceramic substrate for LEDs according to claim 1, characterized in that, The material of the reflective layer (4) is silver, aluminum, nickel-chromium alloy or aluminum-magnesium alloy.

7. The high-reflectivity alumina ceramic substrate for LEDs according to claim 1, characterized in that, Heat sinks (5) are provided at intervals between the bottom surface of the encapsulation cavity (2) and the circuit layer (3).

8. The high-reflectivity alumina ceramic substrate for LEDs according to claim 7, characterized in that, A heat dissipation hole (6) is opened on the substrate body (1) at a position corresponding to the heat dissipation block (5). A heat dissipation column (7) is set in the heat dissipation hole (6). The top surface of the heat dissipation column (7) is fixedly connected to the heat dissipation block (5), and the bottom surface of the heat dissipation column (7) is fixedly connected to the heat dissipation plate (8).

9. The high-reflectivity alumina ceramic substrate for LEDs according to claim 8, characterized in that, The heat sink (5), heat sink column (7) and heat sink plate (8) are made of graphene material.

10. The high-reflectivity alumina ceramic substrate for LEDs according to claim 1, characterized in that, A dam (9) is fixedly installed around the edges of the substrate body (1) extending upwards.

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