Square degree shaping device for semiconductor equipment framework

Abstract

The utility model relates to the technical field of semiconductor equipment shaping, in particular to a semiconductor equipment framework squareness shaping device, which comprises a shaping frame, a plurality of clamping plates and a plurality of clamping plates, the two supporting corners are both in an L shape and are arranged oppositely, and the two supporting corners are fixed to the bottom of the shaping frame inner frame and used for placing the bottom of a framework; and the shaping assembly is arranged at the diagonal position of the top of the shaping frame and comprises a shaping angle and a driving piece connected with the shaping angle, the shaping angle is in an L shape, and the driving piece is fixed to the shaping frame and used for applying force towards the supporting angle at the diagonal position. According to the utility model, through the arrangement of the supporting corners and the shaping assembly on the shaping frame, the shaping corners on the shaping assembly respectively abut against the two ends of the upper part of the semiconductor equipment framework, and the driving piece applies force to the shaping corners, so that the technical effect of correcting the squareness of the deformed semiconductor framework is realized.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment shaping technology, and in particular to a semiconductor equipment skeleton squareness shaping device. Background Technology

[0002] Squareness shaping of semiconductor equipment skeletons refers to ensuring that the geometry of the equipment skeleton meets predetermined squareness requirements during semiconductor manufacturing, thereby guaranteeing the accuracy and stability of the equipment. Skeleton squareness refers to whether the four corners of the skeleton frame are 90° angles and whether the edges of the frame are parallel or perpendicular.

[0003] In existing technologies, CNC machining is often used to improve the precision of machining various parts, and laser welding is used to achieve precise dimensional control. However, steel deformation occurs due to heat during welding, so the semiconductor skeleton equipment needs to be squared before moving to the next process. Utility Model Content

[0004] In view of at least one of the above technical problems, the present invention provides a semiconductor device skeleton squareness shaping device, which adopts structural improvements to achieve squareness shaping of semiconductor devices.

[0005] According to a first aspect of the present invention, a semiconductor device skeleton squareness shaping device is provided, comprising:

[0006] A shaping frame, wherein the shaping frame has a rectangular frame structure;

[0007] Support angles, both of which are L-shaped and facing each other, are fixed to the bottom of the inner frame of the shaping frame for placement of the bottom of the skeleton;

[0008] A shaping component is disposed at a diagonal position on the top of the shaping frame, including a shaping angle and a driving member connected to the shaping angle. The shaping angle is L-shaped, and the driving member is fixed to the shaping frame. The driving member is used to apply force toward the supporting angle at the diagonal position.

[0009] In some embodiments of this utility model, the shaping frame is provided in multiple parallel intervals along a direction perpendicular to the plane on which its frame is located.

[0010] In some embodiments of this utility model, the number of shaping frames is adapted to the length of the skeleton.

[0011] In some embodiments of this utility model, the length of the support angle is greater than the length of the shaping angle.

[0012] In some embodiments of this utility model, the inner sides of both the support angle and the shaping angle have a protective layer.

[0013] In some embodiments of this utility model, the shaping component further includes a fixing plate, which is a right-angled triangle and fixed to the corner of the top of the shaping frame, and the driving component is fixed to the fixing plate.

[0014] In some embodiments of this utility model, the driving component includes a base, a slide rail fixed on the base, a slide table slidably connected to the slide rail, and a lead screw structure rotatably connected to the base and connected to the slide table, wherein the shaping angle is connected to the slide table.

[0015] In some embodiments of this utility model, the lead screw structure includes a lead screw rotatably connected to the base and a nut seat screwed onto the lead screw. The lead screw is arranged parallel to the slide rail, and the nut seat is fixed to the slide table. The lead screw structure also includes a handwheel connected to the lead screw.

[0016] In some embodiments of this utility model, the driving member also has a locking structure for locking the position of the slide table on the slide rail.

[0017] In some embodiments of this utility model, the locking structure includes a fixing clip with one end fixed to the side wall of the slide table, a sliding groove on the side wall of the base, the other end of the fixing clip extending into the sliding groove and being slidably disposed within the sliding groove, and a locking bolt screwed onto the side wall of the fixing clip, which can abut against the side wall of the base.

[0018] The beneficial effects of this utility model are as follows: By setting the support angle and the shaping component on the shaping frame, when shaping the squareness of the semiconductor skeleton, the bottom of the semiconductor device skeleton is first placed on the support angle for support. Then, the shaping angle on the shaping component supports the two ends of the upper part of the semiconductor device skeleton respectively. Finally, the driving component applies force to the shaping angle, thereby achieving the technical effect of correcting the squareness of the deformed semiconductor skeleton. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the semiconductor device skeleton squareness shaping device in an embodiment of this utility model;

[0021] Figure 2This is a front view of the semiconductor device skeleton squareness shaping device in this embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the shaping component in an embodiment of this utility model;

[0023] Figure 4 As an embodiment of this utility model Figure 3 A schematic diagram of the AA-direction cross-section structure.

[0024] Explanation of reference numerals in the attached drawings: 1. Shaping frame; 11. Support angle; 2. Shaping assembly; 21. Shaping angle; 21a. Protective layer; 22. Drive component; 221. Base; 221a. Slide groove; 222. Slide rail; 223. Slide table; 224. Lead screw structure; 224a. Lead screw; 224b. Nut seat; 224c. Handwheel; 225. Locking structure; 225a. Fixing clamp; 225b. Locking bolt; 23. Fixing plate. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] like Figures 1 to 4 The semiconductor device skeleton squareness shaping device shown includes a shaping frame 1, a support angle 11, and a shaping component 2, specifically as follows: Figure 1As shown in the embodiment of this utility model, the shaping frame 1 has a rectangular frame structure, which can be formed by welding profiles during the actual forming process. Two support angles 11 are provided, both L-shaped and facing each other. The two support angles 11 are fixed to the bottom of the inner frame of the shaping frame 1 for placement of the bottom of the skeleton. In this embodiment of the utility model, the distance between the support surfaces of the two support angles 11 is adapted to the width of the semiconductor device skeleton. The shaping component 2 is located at a diagonal position on the top of the shaping frame 1, including a shaping angle 21 and a driving member 22 connected to the shaping angle 21. The shaping angle 21 is L-shaped, and the driving member 22 is fixed to the shaping frame 1. The driving member 22 applies force towards the diagonal support angle 11.

[0029] In the embodiments of this utility model, by setting the support angle 11 and the shaping component 2 on the shaping frame 1, when shaping the squareness of the semiconductor skeleton, the bottom of the semiconductor device skeleton is first placed on the support angle 11 for support. Then, the shaping angle 21 on the shaping component 2 supports the two ends of the upper part of the semiconductor device skeleton respectively. Then, the driving component 22 applies force to the shaping angle 21, thereby achieving the technical effect of correcting the squareness of the deformed semiconductor skeleton.

[0030] Optionally, such as Figure 1 As shown in the embodiment of this utility model, in order to achieve the shaping of semiconductor device frames of different lengths, multiple shaping frames 1 are arranged parallel to each other along a direction perpendicular to the plane where the frame is located. Figure 1 As shown, when the length of the semiconductor device skeleton is long, multiple parts of the skeleton can be connected point-to-point by adding shaping frames. In the embodiment of this utility model, the number of shaping frames 1 is adapted to the length of the skeleton.

[0031] Alternatively, please continue to refer to Figure 1 To further improve the shaping effect, the length of the support angle 11 is greater than the length of the shaping angle 21. This setting makes the support area of ​​the support angle 11 larger, thereby further improving the shaping effect.

[0032] To avoid indentations on the skeleton surface, such as Figure 3 As shown, both the support angle 11 and the shaping angle 21 have a protective layer 21a on their inner sides. The protective layer 21a can be made of a hard yet flexible material such as wood or rubber.

[0033] In embodiments of this utility model, in order to improve the fixing reliability of the shaping component 2, such as... Figure 1As shown, the shaping assembly 2 also includes a fixing plate 23, which is a right-angled triangle and fixed to the top corner of the shaping frame 1. The driving component 22 is fixed to the fixing plate 23. By setting the fixing plate 23, the fixing area of ​​the shaping assembly 2 can be increased, thereby improving the fixing reliability of the shaping assembly 2.

[0034] The specific structure of shaping component 2 is as follows: Figure 3 As shown, the drive unit 22 includes a base 221, a slide rail 222 fixed to the base 221, a slide table 223 slidably connected to the slide rail 222, and a lead screw structure 224 rotatably connected to the base 221 and connected to the slide table 223. The shaping angle 21 is connected to the slide table 223. In this embodiment of the invention, the lead screw structure 224 includes a lead rod 224a rotatably connected to the base 221 and a nut seat 224b screwed onto the lead rod. The lead rod 224a is parallel to the slide rail 222, and the nut seat 224b is fixed to the slide table 223. The lead screw structure 224 also includes a handwheel 224c connected to the lead rod 224a. The rotational connection of the lead rod 224a and the connection method of the nut seat 224b are existing technologies and will not be described in detail here. In the embodiments of this utility model, with such a setting, when performing shaping, the laser can first be emitted to align the wire bundle, and then at the position where squareness shaping is required, the shaping angle 21 is squeezed onto the skeleton by rotating the handwheel 224c, thereby achieving the shaping of the skeleton's squareness.

[0035] Furthermore, in embodiments of this utility model, such as Figure 4 As shown, in order to position the shaping angle 21 after shaping, the drive component 22 also has a locking structure 225 for locking the position of the slide table 223 on the slide rail 222. It should be noted that the locking structure 225 can take many forms, such as locking via a handwheel 224c or a lead screw 224a. In some embodiments of this invention, such as... Figure 4 As shown, the locking structure 225 includes a fixing clip 225a with one end fixed to the side wall of the slide 223, and a groove 221a on the side wall of the base 221. The other end of the fixing clip 225a extends into the groove 221a and can slide relative to it within the groove 221a. A locking bolt 225b is screwed onto the side wall of the fixing clip 225a, which abuts against the side wall of the base 221. By rotating the locking bolt 225b, the top of the locking bolt 225b abuts against the base 221, thereby increasing the friction of the slide 223 and fixing the slide 223, that is, fixing the position of the shaping angle 21.

[0036] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device skeleton squareness shaping device, characterized in that, include: A shaping frame, wherein the shaping frame has a rectangular frame structure; Support angles, both of which are L-shaped and facing each other, are fixed to the bottom of the inner frame of the shaping frame for placement of the bottom of the skeleton; A shaping component is disposed at a diagonal position on the top of the shaping frame, including a shaping angle and a driving member connected to the shaping angle. The shaping angle is L-shaped, and the driving member is fixed to the shaping frame. The driving member is used to apply force toward the supporting angle at the diagonal position.

2. The semiconductor device skeleton squareness shaping device according to claim 1, characterized in that, The shaping frame has multiple parallel spacings along a direction perpendicular to the plane on which its frame is located.

3. The semiconductor device skeleton squareness shaping device according to claim 2, characterized in that, The number of shaping frames is adapted to the length of the skeleton.

4. The semiconductor device skeleton squareness shaping device according to claim 1, characterized in that, The length of the support angle is greater than the length of the shaping angle.

5. The semiconductor device skeleton squareness shaping device according to claim 4, characterized in that, Both the support angle and the shaping angle have a protective layer on their inner sides.

6. The semiconductor device skeleton squareness shaping device according to claim 1, characterized in that, The shaping component also includes a fixing plate, which is a right-angled triangle and fixed to the corner of the top of the shaping frame, and the driving component is fixed to the fixing plate.

7. The semiconductor device skeleton squareness shaping device according to claim 1, characterized in that, The driving component includes a base, a slide rail fixed on the base, a slide table slidably connected to the slide rail, and a lead screw structure rotatably connected to the base and connected to the slide table. The shaping angle is connected to the slide table.

8. The semiconductor device skeleton squareness shaping device according to claim 7, characterized in that, The lead screw structure includes a lead screw rotatably connected to the base and a nut seat screwed onto the lead screw. The lead screw is arranged parallel to the slide rail, and the nut seat is fixed to the slide table. The lead screw structure also includes a handwheel connected to the lead screw.

9. The semiconductor device skeleton squareness shaping device according to claim 7, characterized in that, The drive unit also has a locking structure for locking the position of the slide table on the slide rail.

10. The semiconductor device skeleton squareness shaping device according to claim 9, characterized in that, The locking structure includes a fixing clip with one end fixed to the side wall of the slide table, a sliding groove on the side wall of the base, the other end of the fixing clip extending into the sliding groove and being slidably disposed within the sliding groove, and a locking bolt screwed onto the side wall of the fixing clip, which can abut against the side wall of the base.

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