Punching equipment and punching machine for negative electrode substrate

Abstract

The utility model provides punching equipment and a punching machine for a negative electrode substrate. The stamping equipment for the negative electrode substrate comprises a pre-stamping mechanism and a forming stamping mechanism, the pre-stamping mechanism comprises a first upper punch and a first lower punch, a first anti-explosion stamping boss is arranged at the end, close to the first lower punch, of the first upper punch in a protruding mode, and a first anti-explosion groove is formed in the first lower punch; the forming punching mechanism comprises a second upper punch and a second lower punch, a second anti-explosion punching boss is arranged at the end, close to the second lower punch, of the second upper punch in a protruding mode, a second anti-explosion groove is formed in the second lower punch, and the diameter of the second upper punch is larger than that of the first upper punch. The diameter of the second anti-explosion groove is larger than that of the first anti-explosion groove. And the base plate is subjected to secondary stamping through the pre-stamping mechanism and the forming stamping mechanism, so that the hardness of the formed explosion-proof valve structure is more uniform.

Description

Technical Field

[0001] This disclosure relates to the field of stamping apparatus, and in particular to a stamping device and press for a negative electrode substrate. Background Technology

[0002] The negative electrode substrate is the carrier of the negative electrode in a lithium-ion battery. It holds the negative electrode active material and provides a path for electron conduction. To improve battery safety, an explosion-proof valve is installed on the negative electrode substrate. When the internal pressure of the battery becomes too high, the explosion-proof valve is opened, releasing the high-pressure gas inside the battery to the outside.

[0003] For the negative electrode substrate integrally formed with the explosion-proof valve, the explosion-proof valve is stamped onto the negative electrode substrate using a stamping machine. That is, the explosion-proof valve and the negative electrode substrate are made of the same material, and the thickness of the explosion-proof valve is less than the thickness of the negative electrode substrate. When the internal gas pressure of the battery is too high, the explosion-proof valve will open to release the high-pressure gas inside the battery. However, in the prior art, the stamping machine performs a single stamping of the negative electrode substrate to form the explosion-proof valve. However, the explosion-proof valve formed in a single stamping has the problem of uneven hardness, which prevents the explosion-proof valve from opening under the preset pressure, resulting in poor accuracy.

[0004] Therefore, there is an urgent need for a stamping equipment that can make the hardness of explosion-proof valves uniform, thereby improving the accuracy of explosion-proof valves. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a stamping device and press for a negative electrode substrate that enables the explosion-proof valve to have uniform hardness, thereby improving the accuracy of the explosion-proof valve.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A stamping apparatus for a negative electrode substrate, comprising:

[0008] A pre-stamping mechanism includes a first upper punch and a first lower punch. The first upper punch is used to connect with a cylinder so that the first upper punch is close to or away from the first lower punch. A first explosion-proof stamping boss is provided at one end of the first upper punch adjacent to the first lower punch. A first explosion-proof groove is provided at one end of the first lower punch adjacent to the first upper punch. The first explosion-proof stamping boss and the first explosion-proof groove are correspondingly arranged so that the first explosion-proof stamping boss presses the negative electrode substrate portion into the first explosion-proof groove.

[0009] A forming stamping mechanism includes a second upper punch and a second lower punch. The second upper punch is used to connect to a cylinder so that it can move closer to or further away from the second lower punch. A second explosion-proof stamping boss is provided at one end of the second upper punch adjacent to the second lower punch, and a second explosion-proof groove is provided at one end of the second lower punch adjacent to the second upper punch. The second explosion-proof stamping boss and the second explosion-proof groove are correspondingly arranged. The diameter of the second upper punch is larger than the diameter of the first upper punch, and the diameter of the second explosion-proof groove is larger than the diameter of the first explosion-proof groove.

[0010] In one embodiment, the diameter of the first upper punch is 7.8mm-8.0mm, and the diameter of the first explosion-proof groove is 7.8mm-8.0mm.

[0011] In one embodiment, the diameter of the second upper punch is 8.0mm-8.2mm, and the diameter of the first explosion-proof groove is 8.0mm-8.2mm.

[0012] In one embodiment, the height of the second upper punch is greater than the height of the first upper punch, and the depth of the second explosion-proof groove is greater than the depth of the first explosion-proof groove.

[0013] In one embodiment, the stamping equipment for the negative electrode substrate further includes a riveting stamping mechanism, which is located between the pre-stamping mechanism and the forming stamping mechanism. The riveting stamping mechanism includes a third upper punch and a third lower punch. The third upper punch is used to connect with a cylinder so that the third upper punch is close to or away from the third lower punch. A cutting block is protruding from one end of the third upper punch adjacent to the third lower punch. The third lower punch has a through hole, and the cutting block is correspondingly arranged with the through hole.

[0014] In one embodiment, there are two punching blocks and two through holes, with each punching block and each through hole corresponding to the other.

[0015] In one embodiment, a guide post protrudes from one end of the second upper punch adjacent to the second lower punch. The guide post is spaced apart from the second explosion-proof stamping boss. The second lower punch has a guide hole. The guide post is correspondingly arranged with the guide hole. The guide post is used to pass through the guide hole when the second upper punch approaches the second lower punch.

[0016] In one embodiment, the guide post has a conical cross-section.

[0017] In one embodiment, there are two guide posts and two guide holes, with each guide post and guide hole corresponding to the other.

[0018] A punch press, comprising the stamping equipment for a negative electrode substrate as described in any of the above embodiments.

[0019] Compared with the prior art, this disclosure has at least the following advantages:

[0020] The aforementioned stamping equipment for the negative electrode substrate uses a cylinder to drive a first upper punch to move towards a first lower punch, causing a first explosion-proof stamping boss to press the substrate portion into a first explosion-proof groove, thereby initially forming an explosion-proof valve structure on the substrate. Then, the substrate is placed in a second lower punch, and the cylinder drives a second upper punch to move towards a second lower punch, causing a second explosion-proof stamping boss to press the initially formed explosion-proof valve structure into a second explosion-proof groove. The diameter of the second upper punch is larger than the diameter of the first upper punch, and the diameter of the second explosion-proof groove is larger than the diameter of the first explosion-proof groove. This allows the explosion-proof valve structure of the required shape and size to be formed after a second stamping. Specifically, the substrate is stamped a second time through a pre-stamping mechanism and a forming stamping mechanism, resulting in a more uniform hardness of the formed explosion-proof valve structure. This allows the explosion-proof valve structure to be punched open under a preset pressure, improving the accuracy of the explosion-proof valve structure. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a stamping device for a negative electrode substrate according to an embodiment;

[0023] Figure 2 for Figure 1 Another schematic diagram of a stamping device for a negative electrode substrate is shown.

[0024] Figure 3 for Figure 1 The diagram shows another structural schematic of a stamping device for a negative electrode substrate.

[0025] Figure 4 for Figure 3 The diagram shows the structure of the third upper punch in the stamping equipment used for the negative electrode substrate. Detailed Implementation

[0026] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] This disclosure provides a stamping apparatus for a negative electrode substrate, including a pre-stamping mechanism and a forming stamping mechanism. The pre-stamping mechanism includes a first upper punch and a first lower punch. The first upper punch is connected to a cylinder to move closer to or further away from the first lower punch. A first explosion-proof stamping boss is provided at one end of the first upper punch adjacent to the first lower punch, and a first explosion-proof groove is provided at one end of the first lower punch adjacent to the first upper punch. The first explosion-proof stamping boss and the first explosion-proof groove are correspondingly arranged so that the first explosion-proof stamping boss presses a portion of the negative electrode substrate against the first lower punch. The forming stamping mechanism includes a second upper punch and a second lower punch. The second upper punch is used to connect with a cylinder so that the second upper punch is close to or away from the second lower punch. A second explosion-proof stamping boss is provided at one end of the second upper punch adjacent to the second lower punch. A second explosion-proof groove is provided at one end of the second lower punch adjacent to the second upper punch. The second explosion-proof stamping boss and the second explosion-proof groove are correspondingly arranged. The diameter of the second upper punch is larger than the diameter of the first upper punch, and the diameter of the second explosion-proof groove is larger than the diameter of the first explosion-proof groove.

[0030] The aforementioned stamping equipment for the negative electrode substrate uses a cylinder to drive a first upper punch to move towards a first lower punch, causing a first explosion-proof stamping boss to press the substrate portion into a first explosion-proof groove, thereby initially forming an explosion-proof valve structure on the substrate. Then, the substrate is placed in a second lower punch, and the cylinder drives a second upper punch to move towards a second lower punch, causing a second explosion-proof stamping boss to press the initially formed explosion-proof valve structure into a second explosion-proof groove. The diameter of the second upper punch is larger than the diameter of the first upper punch, and the diameter of the second explosion-proof groove is larger than the diameter of the first explosion-proof groove. This allows the explosion-proof valve structure of the required shape and size to be formed after a second stamping. Specifically, the substrate is stamped a second time through a pre-stamping mechanism and a forming stamping mechanism, resulting in a more uniform hardness of the formed explosion-proof valve structure. This allows the explosion-proof valve structure to be punched open under a preset pressure, improving the accuracy of the explosion-proof valve structure.

[0031] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0032] like Figure 1 and Figure 2 As shown, a stamping device 10 for a negative electrode substrate in one embodiment includes a pre-stamping mechanism 100 and a forming stamping mechanism 200. The pre-stamping mechanism 100 includes a first upper punch 110 and a first lower punch 120. The first upper punch 110 is used to connect with a cylinder so that the first upper punch 110 is close to or away from the first lower punch 120. A first explosion-proof stamping boss 111 is provided at one end of the first upper punch 110 adjacent to the first lower punch 120. A first explosion-proof groove 121 is provided at one end of the first lower punch 120 adjacent to the first upper punch 110. The first explosion-proof stamping boss 111 and the first explosion-proof groove 121 are correspondingly arranged so that the first explosion-proof stamping boss 111 presses the negative electrode substrate portion into the first explosion-proof groove 121.

[0033] Furthermore, the forming stamping mechanism 200 includes a second upper punch 210 and a second lower punch 220. The second upper punch 210 is used to connect with the cylinder so that the second upper punch 210 is close to or away from the second lower punch 220. A second explosion-proof stamping boss 211 is provided at one end of the second upper punch 210 adjacent to the second lower punch 220, and a second explosion-proof groove 221 is provided at one end of the second lower punch 220 adjacent to the second upper punch 210. The second explosion-proof stamping boss 211 and the second explosion-proof groove 221 are correspondingly arranged. The diameter of the second upper punch 210 is larger than the diameter of the first upper punch 110, and the diameter of the second explosion-proof groove 221 is larger than the diameter of the first explosion-proof groove 121, so that the required shape and size of the explosion-proof valve can be formed after the second stamping.

[0034] In this embodiment, a cylinder drives the first upper punch 110 to move, so that the first explosion-proof stamping boss 111 presses the substrate portion into the first explosion-proof groove 121 to initially form an explosion-proof valve structure. Further, the substrate after the first stamping is placed on the second lower punch 220, and the cylinder drives the second upper punch 210 to move, so that the second explosion-proof stamping boss 211 presses the initially formed explosion-proof valve structure into the second explosion-proof groove 221, i.e., a second stamping of the explosion-proof valve structure is performed. Since the diameter of the second upper punch 210 is larger than the diameter of the first upper punch 110, and the diameter of the second explosion-proof groove 221 is larger than the diameter of the first explosion-proof groove 121, the diameter of the explosion-proof valve structure is further enlarged during the second stamping, and the thickness of the explosion-proof valve structure is less than the thickness of the substrate, thereby stamping and forming an explosion-proof valve structure of the required shape and size. Thus, by performing secondary stamping on the substrate through the pre-stamping mechanism 100 and the forming stamping mechanism 200, compared with the traditional one-time stamping forming, the explosion-proof valve structure formed by this application has more uniform hardness, so that the explosion-proof valve structure can be punched open under the preset pressure.

[0035] The aforementioned stamping equipment 10 for the negative electrode substrate uses a cylinder to drive the first upper punch 110 to move towards the first lower punch 120, causing the first explosion-proof stamping boss 111 to press the substrate portion into the first explosion-proof groove 121, thereby initially forming an explosion-proof valve structure on the substrate. Then, the substrate is placed in the second lower punch 220, and the cylinder drives the second upper punch 210 to move towards the second lower punch 220, causing the second explosion-proof stamping boss 211 to press the initially formed explosion-proof valve structure into the second explosion-proof groove 221. The diameter of the second upper punch 210 is larger than the diameter of the first upper punch 110, and the diameter of the second explosion-proof groove 221 is larger than the diameter of the first explosion-proof groove 121, so that the explosion-proof valve structure of the required shape and size is formed after the second stamping. Specifically, the substrate is subjected to secondary stamping by the pre-stamping mechanism 100 and the forming stamping mechanism 200, which makes the hardness of the formed explosion-proof valve structure more uniform, thereby enabling the explosion-proof valve structure to be punched open under the preset pressure, thus improving the accuracy of the explosion-proof valve structure.

[0036] In one embodiment, the diameter of the first upper punch 110 is 7.8mm-8.0mm, and the diameter of the first explosion-proof groove 121 is 7.8mm-8.0mm. In this embodiment, the diameter of the first upper punch 110 is equal to the diameter of the first explosion-proof groove 121, and both the diameter of the first upper punch 110 and the first explosion-proof groove 121 is 7.8mm, that is, the diameter of the explosion-proof valve structure initially formed after the first stamping is 7.8mm.

[0037] In one embodiment, the diameter of the second upper punch 210 is 8.0mm-8.2mm, and the diameter of the first explosion-proof groove 121 is 8.0mm-8.2mm. In this embodiment, the diameter of the second upper punch 210 is equal to the diameter of the second explosion-proof groove 221, and both the diameter of the second upper punch 210 and the second explosion-proof groove 221 is 8.0mm, meaning that the explosion-proof valve structure formed after the second stamping is 8.0mm.

[0038] In one embodiment, the height of the second upper punch 210 is greater than the height of the first upper punch 110, and the depth of the second explosion-proof groove 221 is greater than the depth of the first explosion-proof groove 121. In this embodiment, the height of the second upper punch 210 is greater than the height of the first upper punch 110, and the depth of the second explosion-proof groove 221 is greater than the depth of the first explosion-proof groove 121, which reduces the thickness of the explosion-proof valve structure after secondary stamping, further ensuring that the explosion-proof valve can be opened under a preset pressure.

[0039] like Figure 3 and Figure 4 As shown, in one embodiment, the stamping equipment 10 for the negative electrode substrate further includes a riveting punching mechanism 300. The riveting punching mechanism 300 is located between the pre-stamping mechanism 100 and the forming stamping mechanism 200. The riveting punching mechanism 300 includes a third upper punch 310 and a third lower punch 320. The third upper punch 310 is connected to a cylinder to allow it to move closer to or further away from the third lower punch 320. A cutting block 311 protrudes from one end of the third upper punch 310 adjacent to the third lower punch 320. The third lower punch 320 has a through hole 321, and the cutting block 311 corresponds to the through hole 321. It is understood that the substrate is riveted to the housing using rivets, requiring the riveting holes to be stamped on the substrate. The riveting punching mechanism 300 stamps the substrate to form the riveting holes. Specifically, the riveting punching mechanism 300 is located between the pre-punching mechanism 100 and the forming punching mechanism 200. That is, after the substrate is punched once, the riveting punching forming process is performed. First, the substrate after the first punching is placed on the third lower punch 320. The cylinder drives the third upper punch 310 to move closer to the third lower punch 320 so that the punching block 311 punches the substrate along the direction of the through hole 321, thereby forming a riveting hole on the substrate.

[0040] like Figure 3 and Figure 4As shown, in one embodiment, there are two punching blocks 311 and two through holes 321, with each punching block 311 and through hole 321 corresponding to the other. In this embodiment, there are two punching blocks 311 and two through holes 321, with each punching block and through hole 321 corresponding to the other, so that after the riveting hole punching mechanism 300 completes one action, two riveting holes are formed on the substrate.

[0041] like Figure 1 and Figure 2 As shown, in one embodiment, the second upper punch 210 has a guide post 212 protruding from one end adjacent to the second lower punch 220. The guide post 212 is spaced apart from the second explosion-proof stamping boss 211. The second lower punch 220 has a guide hole 222, and the guide post 212 is correspondingly arranged with the guide hole 222. The guide post 212 is used to pass through the guide hole 222 when the second upper punch 210 approaches the second lower punch 220. In this embodiment, after the substrate passes through the riveting stamping mechanism 300, it enters the forming stamping mechanism 200. At this time, the cylinder drives the second upper punch 210 to approach the second lower punch 220, so that the second explosion-proof stamping boss 211 further stamps the initially formed explosion-proof valve structure. At the same time, the guide post 212 of the second upper punch 210 passes through the guide hole 222 of the second lower punch 220 to play a guiding role.

[0042] like Figure 2 As shown, in one embodiment, the guide post 212 has a conical cross-section to allow the guide post 212 to enter the guide hole 222 more accurately and better.

[0043] like Figure 1 and Figure 2 As shown, in one embodiment, there are two guide posts 212 and two guide holes 222, with each guide post 212 and guide hole 222 corresponding to the other. In this embodiment, there are two rivet holes formed on the substrate. By providing two guide posts 212 on the second upper punch 210 and two guide holes 222 on the second lower punch 220, with each guide post 212 and guide hole 222 corresponding to the other, the accuracy of the second upper punch 210 and the second lower punch 220 during stamping is further improved.

[0044] This application also provides a punch press, including the stamping equipment 10 for negative electrode substrates described in any of the above embodiments.

[0045] Compared with the prior art, this disclosure has at least the following advantages:

[0046] The aforementioned stamping equipment 10 for the negative electrode substrate uses a cylinder to drive the first upper punch 110 to move towards the first lower punch 120, causing the first explosion-proof stamping boss 111 to press the substrate portion into the first explosion-proof groove 121, thereby initially forming an explosion-proof valve structure on the substrate. Then, the substrate is placed in the second lower punch 220, and the cylinder drives the second upper punch 210 to move towards the second lower punch 220, causing the second explosion-proof stamping boss 211 to press the initially formed explosion-proof valve structure into the second explosion-proof groove 221. The diameter of the second upper punch 210 is larger than the diameter of the first upper punch 110, and the diameter of the second explosion-proof groove 221 is larger than the diameter of the first explosion-proof groove 121, so that the explosion-proof valve structure of the required shape and size is formed after the second stamping. Specifically, the substrate is subjected to secondary stamping by the pre-stamping mechanism 100 and the forming stamping mechanism 200, which makes the hardness of the formed explosion-proof valve structure more uniform, thereby enabling the explosion-proof valve structure to be punched open under the preset pressure, thus improving the accuracy of the explosion-proof valve structure.

[0047] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A stamping apparatus for a negative electrode substrate, characterized in that, include: A pre-stamping mechanism includes a first upper punch and a first lower punch. The first upper punch is used to connect with a cylinder so that the first upper punch is close to or away from the first lower punch. A first explosion-proof stamping boss is provided at one end of the first upper punch adjacent to the first lower punch. A first explosion-proof groove is provided at one end of the first lower punch adjacent to the first upper punch. The first explosion-proof stamping boss and the first explosion-proof groove are correspondingly arranged so that the first explosion-proof stamping boss presses the negative electrode substrate portion into the first explosion-proof groove. A forming stamping mechanism includes a second upper punch and a second lower punch. The second upper punch is used to connect to a cylinder so that it can move closer to or further away from the second lower punch. A second explosion-proof stamping boss is provided at one end of the second upper punch adjacent to the second lower punch, and a second explosion-proof groove is provided at one end of the second lower punch adjacent to the second upper punch. The second explosion-proof stamping boss and the second explosion-proof groove are correspondingly arranged. The diameter of the second upper punch is larger than the diameter of the first upper punch, and the diameter of the second explosion-proof groove is larger than the diameter of the first explosion-proof groove.

2. The stamping equipment for a negative electrode substrate according to claim 1, characterized in that, The diameter of the first upper punch is 7.8mm-8.0mm, and the diameter of the first explosion-proof groove is 7.8mm-8.0mm.

3. The stamping equipment for a negative electrode substrate according to claim 1, characterized in that, The diameter of the second upper punch is 8.0mm-8.2mm, and the diameter of the first explosion-proof groove is 8.0mm-8.2mm.

4. The stamping equipment for a negative electrode substrate according to claim 1, characterized in that, The height of the second upper punch is greater than the height of the first upper punch, and the depth of the second explosion-proof groove is greater than the depth of the first explosion-proof groove.

5. The stamping equipment for a negative electrode substrate according to claim 1, characterized in that, The stamping equipment for the negative electrode substrate further includes a riveting stamping mechanism, which is located between the pre-stamping mechanism and the forming stamping mechanism. The riveting stamping mechanism includes a third upper punch and a third lower punch. The third upper punch is used to connect with a cylinder so that the third upper punch is close to or away from the third lower punch. A cutting block is protruding from one end of the third upper punch adjacent to the third lower punch. The third lower punch has a through hole, and the cutting block is correspondingly arranged with the through hole.

6. The stamping apparatus for a negative electrode substrate according to claim 5, characterized in that, The number of punching blocks is two, and the number of through holes is two, with each punching block and each through hole corresponding to the other.

7. The stamping equipment for a negative electrode substrate according to claim 1, characterized in that, The second upper punch has a guide post protruding from one end adjacent to the second lower punch. The guide post is spaced apart from the second explosion-proof stamping boss. The second lower punch has a guide hole. The guide post is correspondingly arranged with the guide hole. The guide post is used to pass through the guide hole when the second upper punch approaches the second lower punch.

8. The stamping apparatus for a negative electrode substrate according to claim 7, characterized in that, The guide post has a conical cross-section.

9. The stamping apparatus for a negative electrode substrate according to claim 7, characterized in that, The number of guide posts is two, and the number of guide holes is two, with each guide post and guide hole corresponding to the other.

10. A punch press, characterized in that, The stamping apparatus for a negative electrode substrate includes any one of claims 1 to 9.

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