Semiconductor device pin rib cutting device

Abstract

The utility model relates to the technical field of semiconductor device processing, and discloses a semiconductor device pin rib cutting device which comprises a processing table, the processing table is connected with a clamping block through a pushing assembly, the left end of the clamping block is fixedly connected with a blade used for cutting a pin, and the middle of the bottom end of the processing table is fixedly connected with a concave frame. A double-shaft motor is fixedly connected to the inner wall of the concave frame, blanking grooves are formed in the front portion and the rear portion, close to the left side of the baffle, of the top end of the machining table, cut pins can fall to the bottom of the machining table, a wedging frame is fixedly connected to the position, located on the outer sides of the blanking grooves, of the bottom end of the machining table, and a material collecting box is embedded in the inner wall of the opposite end of the wedging frame. The collecting device is used for collecting the cut pins. According to the cutting device, limiting of the limiting block on the clamping block is removed, then the clamping block is pulled out of the clamping groove, the blade of the same specification is replaced again, and the cutting effect of the cutting device is kept.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing technology, and in particular to a semiconductor device lead cutting device. Background Technology

[0002] Semiconductor devices are electronic components made using semiconductor materials. They play various key roles in electronic circuits. Generally, multiple electronic components are integrated on a single chip to achieve complex functions and are widely used in computers, communications, and other fields.

[0003] During the manufacturing process of semiconductor devices, the layout and size of their pins may need to be adjusted to accommodate different package types and circuit board designs. Cutting the pins ensures that they conform to standard pin spacing and arrangement.

[0004] Currently, existing cutting devices are generally integrated designs, and the cutting blades and drive components are fixedly connected. Therefore, after repeated use, when the blades wear out, it is difficult to replace them, which in turn affects the cutting effect of the device. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor device lead cutting device that removes the limiting block from the card block, thereby allowing for the replacement of blades of the same specification while maintaining the cutting effect of the device.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A semiconductor device lead cutting device includes a processing table. The processing table is connected to a clamping block via a pushing assembly. A blade is fixedly connected to the left end of the clamping block for cutting the leads. A pressure plate is provided on the left side of the top of the processing table for pressing the leads. A baffle is fixedly connected to the right side of the pressure plate at the top of the processing table for clamping the leads in conjunction with the pressure plate. Slide plates are fixedly connected to the front and rear ends of the processing table. A concave frame is fixedly connected to the middle of the bottom end of the processing table. A dual-axis motor is fixedly connected to the inner wall of the concave frame. The dual-axis motor is connected to the slide plates via a gear set. Drop grooves are provided on the front and rear sides of the left side of the top of the processing table close to the baffle, allowing the cut leads to fall to the bottom of the processing table. A matching frame is fixedly connected to the bottom end of the processing table outside the drop grooves. A receiving box is embedded in the inner wall of the opposite end of the matching frame for collecting the cut leads.

[0008] Furthermore, the pushing component includes a connecting plate fixedly connected to the right side of the top of the processing table, a hydraulic rod fixedly connected to the left end of the connecting plate, a push plate fixedly connected to the driving end of the hydraulic rod, and an elastic component installed at the top of the push plate for limiting the structure.

[0009] Furthermore, the inner wall of the push plate is provided with slots on both the front and rear sides, and the shape of the inner wall of the slot matches the shape of the outer wall of the card block.

[0010] Furthermore, the elastic component includes a recycling cylinder fixedly connected to the top of the push plate on the opposite side of the slot, a limit block slidably connected to the inner wall of the recycling cylinder at one end, a spring fixedly connected to the opposite end of the limit block, and the other end of the spring fixedly connected to the inner wall of the recycling cylinder.

[0011] Furthermore, the gear set includes a drive rod rotatably connected to the inner walls of the left and right ends of the concave frame and a T-shaped plate slidably connected to the inner wall of the slide plate. A rack is fixedly connected to the bottom end of the T-shaped plate, and a spur gear is fixedly connected to the opposite end of the drive rod. The spur gear and the rack are meshed. The opposite ends of the drive rod are respectively fixedly connected to the drive ends on both sides of the dual-axis motor.

[0012] Furthermore, a linkage plate is fixedly connected to the top left side of the T-shaped plate, and the opposite end of the linkage plate is fixedly connected to the front and rear ends of the pressure plate.

[0013] Furthermore, intercepting plates are fixedly connected to the left and right sides of the outer wall of the card block, and the distance between the opposite ends of the intercepting plates on the left and right sides is the same as the thickness of the push plate.

[0014] Furthermore, the distance between the upper and lower ends of the card block is the same as the distance from the bottom end of the limiting block to the bottom end of the inner wall of the card slot.

[0015] This utility model has the following beneficial effects:

[0016] 1. In this utility model, by pressing the limiting block into the recycling cylinder, the limiting block is released from the limiting block's restriction on the card block. Then, the card block is pulled out from the card slot so that the blade can be disengaged from the push plate side, thereby replacing it with a blade of the same specification and maintaining the cutting effect of the device.

[0017] 2. In this utility model, after the blade cuts the device pins, the dual-axis motor is started to reverse, which causes the spur gear to reverse, thereby causing the pressure plate to reset. At this time, the cut pins fall from the drop trough into the collection box under gravity, and the cut pins are collected to avoid scattering and being difficult to clean. Attached Figure Description

[0018] Figure 1 This is a perspective view of a semiconductor device lead trimming device proposed in this utility model;

[0019] Figure 2 This is a cross-sectional view of the processing table for a semiconductor device lead cutting device proposed in this utility model;

[0020] Figure 3This is a schematic diagram of the pusher plate structure of a semiconductor device lead cutting device proposed in this utility model;

[0021] Figure 4 This is a schematic diagram of the large-area structure of a semiconductor device lead trimming device proposed in this utility model;

[0022] Figure 5 This is a cross-sectional view of the recycling cylinder of a semiconductor device lead trimming device proposed in this utility model;

[0023] Figure 6 This is a half-sectional view of the processing table for a semiconductor device lead cutting device proposed in this utility model;

[0024] Figure 7 This is a schematic diagram of the fitting frame structure of a semiconductor device lead trimming device proposed in this utility model;

[0025] Figure 8 This is a schematic diagram of the receiving box structure of a semiconductor device lead trimming device proposed in this utility model.

[0026] Legend:

[0027] 1. Processing table; 2. Connecting plate; 3. Hydraulic rod; 4. Push plate; 5. Recycling cylinder; 6. Blade; 7. Baffle; 8. Drop chute; 9. Pressure plate; 10. Slide plate; 11. T-shaped plate; 12. Rack; 13. Linkage plate; 14. Spur gear; 15. Drive rod; 16. Concave frame; 17. Dual-axis motor; 18. Limit block; 19. Slot; 20. Block; 21. Interceptor plate; 22. Spring; 23. Receiving box; 24. Fitting frame. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Reference Figure 1 and Figure 2This utility model provides an embodiment of a semiconductor device lead cutting device, including a processing table 1. The processing table 1 is connected to a clamping block 20 via a pushing assembly. A blade 6 is fixedly connected to the left end of the clamping block 20 for cutting the leads. A pressure plate 9 is provided on the left side of the top of the processing table 1 for pressing the leads. A baffle 7 is fixedly connected to the right side of the pressure plate 9 at the top of the processing table 1 for clamping the leads in conjunction with the pressure plate 9. Sliding plates 10 are fixedly connected to the front and rear ends of the processing table 1. A concave frame 16 is fixedly connected to the middle of the bottom end of the processing table 1. The inner wall of the concave frame 16... A dual-axis motor 17 is fixedly connected to the inner walls of the left and right ends of the concave frame 16, along with drive rods 15 rotatably connected to the inner walls of the slide plate 10. A T-shaped plate 11 is slidably connected to the inner wall of the slide plate 10. A rack 12 is fixedly connected to the bottom end of the T-shaped plate 11. A spur gear 14 is fixedly connected to the opposite end of the drive rod 15, and the spur gear 14 and rack 12 are meshed. The opposite ends of the drive rod 15 are fixedly connected to the drive ends on both sides of the dual-axis motor 17. A linkage plate 13 is fixedly connected to the top left side of the T-shaped plate 11, and the opposite ends of the linkage plate 13 are fixedly connected to the front and rear ends of the pressure plate 9. (Refer to...) Figures 6-8 The top of the processing table 1 is close to the left side of the baffle 7 and has two material drop grooves 8, which are used to allow the cut pins to fall to the bottom of the processing table 1. The bottom of the processing table 1 is fixedly connected to the outside of the material drop groove 8. The inner wall of the opposite end of the fitting frame 24 is embedded with a material collection box 23, which is used to collect the cut pins.

[0030] Specifically, the device is placed in the middle between the baffle 7 and the pressure plate 9. Then, the dual-axis motor 17 is started so that the drive rods 15 on both sides drive the spur gear 14 to rotate, thereby causing the rack 12 to move to the right. Then, through the connection between the T-shaped plate 11 and the linkage plate 13, the pressure plate 9 moves to the right. Its concave part is stuck on the outside of the device, and the right side of the pressure plate 9 cooperates with the left side of the baffle 7 to clamp the pin.

[0031] To further explain, the drive component pushes the blade 6 to move, causing it to pass through the grooves on both sides of the baffle 7 and cut the pins. Then, the dual-axis motor 17 is started to reverse, causing the spur gear 14 to reverse, which in turn causes the pressure plate 9 to reset. The cut pins fall from the drop chute 8 into the collection box 23 under gravity, collecting the cut pins to prevent them from scattering and being difficult to clean. Then, the two sides of the collection box 23 are pulled out from the fitting frame 24, and the pins are poured out.

[0032] Reference Figures 3-5A connecting plate 2 is fixedly connected to the top right side of the processing table 1. A hydraulic rod 3 is fixedly connected to the left end of the connecting plate 2. A push plate 4 is fixedly connected to the drive end of the hydraulic rod 3. An intercepting plate 21 is fixedly connected to the left and right sides of the outer wall of the clamping block 20. The distance between the opposite ends of the left and right intercepting plates 21 is the same as the thickness of the push plate 4. The distance between the upper and lower ends of the clamping block 20 is the same as the distance from the bottom end of the limiting block 18 to the bottom end of the inner wall of the slot 19. Slots 19 are opened on the front and rear sides of the inner wall of the push plate 4. The shape of the inner wall of the slot 19 matches the shape of the outer wall of the clamping block 20. A recycling cylinder 5 is fixedly connected to the top of the push plate 4 on the opposite side of the slot 19. A limiting block 18 is slidably connected to the inner wall of the recycling cylinder 5 on the opposite side. A spring 22 is fixedly connected to the opposite end of the limiting block 18. The other end of the spring 22 is fixedly connected to the inner wall of the recycling cylinder 5.

[0033] Specifically, the hydraulic rod 3 is activated, causing its drive end to push the push plate 4 to move to the left, so that the blades 6 on both sides pass through the groove of the baffle 7 to cut the pin. After the original blades 6 on the device have been used multiple times, the limiting block 18 is pressed into the recycling cylinder 5 and the spring 22 is squeezed to release the limiting block 18 from the locking block 20. Then the locking block 20 is pulled out from the locking groove 19 so that the blades 6 can be disengaged from the side of the push plate 4, thereby replacing the blades 6 of the same specification and maintaining the cutting effect of the device.

[0034] Working principle: First, the device is placed in the middle between the baffle 7 and the pressure plate 9. Then, the dual-axis motor 17 is started, causing the drive rods 15 on both sides to drive the spur gear 14 to rotate, thereby moving the rack 12 to the right. Then, through the connection between the T-shaped plate 11 and the linkage plate 13, the pressure plate 9 moves to the right, and its concave part is stuck on the outside of the device. The right end of the pressure plate 9, together with the left end of the baffle 7, clamps the pin. Then, the hydraulic rod 3 is started, and its drive end pushes the push plate 4 to the left, so that the blades 6 on both sides pass through the groove of the baffle 7 to cut the pin. After that, the dual-axis motor 17 is started to reverse. This causes the spur gear 14 to reverse, thereby resetting the pressure plate 9. The cut pins fall from the drop trough 8 into the collection box 23 under gravity, collecting the cut pins to prevent them from scattering and being difficult to clean. Then, the two sides of the collection box 23 are pulled out from the fitting frame 24, and the pins are poured out. By pressing the limiting block 18 into the recycling cylinder 5 and squeezing the spring 22, the limiting block 18's limiting effect on the locking block 20 is released. Then, the locking block 20 is pulled out from the locking slot 19 so that the blade 6 can be disengaged from the push plate 4 side, thereby replacing the blade 6 of the same specification and maintaining the cutting effect of the device.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor device lead trimming device, characterized in that, The system includes a processing table (1), which is connected to a locking block (20) via a push assembly. A blade (6) is fixedly connected to the left end of the locking block (20) for cutting the pins. A pressure plate (9) is provided on the left side of the top of the processing table (1) for pressing the pins. A baffle (7) is fixedly connected to the right side of the pressure plate (9) at the top of the processing table (1) for clamping the pins in conjunction with the pressure plate (9). Slide plates (10) are fixedly connected to the front and rear ends of the processing table (1). A concave shape is fixedly connected to the middle of the bottom end of the processing table (1). The frame (16) has a dual-axis motor (17) fixedly connected to its inner wall. The dual-axis motor (17) is connected to the slide plate (10) through a gear set. The top of the processing table (1) is close to the baffle (7) and has two material drop grooves (8) on the front and back sides, so that the cut pins can fall to the bottom of the processing table (1). The bottom of the processing table (1) is fixedly connected to a fitting frame (24) outside the material drop groove (8). The fitting frame (24) has a receiving box (23) embedded on the inner wall of one end of the fitting frame (24) for collecting the cut pins.

2. The semiconductor device lead trimming device according to claim 1, characterized in that: The pushing component includes a connecting plate (2) fixedly connected to the right side of the top of the processing table (1), a hydraulic rod (3) fixedly connected to the left end of the connecting plate (2), a push plate (4) fixedly connected to the driving end of the hydraulic rod (3), and an elastic component installed at the top of the push plate (4) for limiting the structure.

3. The semiconductor device lead trimming device according to claim 2, characterized in that: The push plate (4) has slots (19) on both the front and rear sides of its inner wall, and the shape of the inner wall of the slot (19) matches the shape of the outer wall of the block (20).

4. A semiconductor device lead trimming device according to claim 2, characterized in that: The elastic component includes a recycling cylinder (5) whose top end is fixedly connected to the opposite side of the slot (19) of the push plate (4). A limiting block (18) is slidably connected to the inner wall of the recycling cylinder (5) at one end. A spring (22) is fixedly connected to the opposite end of the limiting block (18). The other end of the spring (22) is fixedly connected to the inner wall of the recycling cylinder (5).

5. The semiconductor device lead trimming device according to claim 1, characterized in that: The gear set includes a drive rod (15) rotatably connected to the inner walls of the left and right ends of the concave frame (16) and a T-shaped plate (11) slidably connected to the inner wall of the slide plate (10). A rack (12) is fixedly connected to the bottom end of the T-shaped plate (11). A spur gear (14) is fixedly connected to the opposite end of the drive rod (15). The spur gear (14) and the rack (12) are meshed. The opposite ends of the drive rod (15) are respectively fixedly connected to the drive ends on both sides of the dual-shaft motor (17).

6. The semiconductor device lead trimming device according to claim 5, characterized in that: A linkage plate (13) is fixedly connected to the top left of the T-shaped plate (11), and the linkage plate (13) is fixedly connected to the front and rear ends of the pressure plate (9) at opposite ends.

7. The semiconductor device lead trimming device according to claim 1, characterized in that: The card block (20) has interceptor plates (21) fixedly connected to the left and right sides of its outer wall. The distance between the interceptor plates (21) on the left and right sides is the same as the thickness of the push plate (4).

8. The semiconductor device lead trimming device according to claim 1, characterized in that: The distance between the upper and lower ends of the card block (20) is the same as the distance between the bottom end of the limiting block (18) and the bottom end of the inner wall of the card slot (19).

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