Wafer detection device and CMP machine table conveying mechanism

Abstract

The utility model provides a wafer detection device and a CMP machine table conveying mechanism. The wafer detection device is used for a CMP machine table conveying mechanism and comprises at least two bases, the bases are sequentially stacked in a wafer feeding mechanism from bottom to top, the upper surface of the base arranged at the top is used for bearing wafers, and an elastic mechanism and a pressure sensor are arranged between every two adjacent bases. According to the wafer detection device, the conveying mechanism of the CMP machine table can adapt to wafers with different edge finishing widths and non-uniform warpage, so that the CMP machine table can process wider wafer types, and the applicability and the flexibility of the machine table are enhanced; through accurate wafer detection, the alarm frequency caused by detection failure or error is reduced, the stability and reliability of a CMP machine are improved, the downtime caused by alarm is reduced, and the operation time of the machine is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, specifically to a wafer detection device and a CMP machine transfer mechanism. Background Technology

[0002] With the continuous development of semiconductor technology, the integration level of wafer manufacturing is increasing, and the requirements for process precision are becoming more stringent. However, in the wafer manufacturing process, the processing effect at the wafer edges is often unsatisfactory, frequently affected by edge trimming effects. The complex and unstable film structure at the wafer edges is prone to delamination or peeling, which not only leads to wafer defects but also causes yield losses. To reduce the impact of wafer edges on yield, edge trimming is usually required to improve the quality of the wafer edges.

[0003] However, the wafer loading mechanism in existing CMP (Chemical Mechanical Polishing) machine transport systems has significant limitations in wafer detection. Most of these mechanisms use water pressure detection, and once the water spray position is fixed, it cannot adapt to the needs of different edge trimming widths. As the edge trimming process width changes, traditional detection methods struggle to ensure accurate detection of the wafer edges.

[0004] Furthermore, wafer warpage is a common phenomenon in the 3D packaging industry, and the degree of warpage is often significant. For positively warped wafers, traditional methods of solving wafer detection problems by changing the position of apertures are inadequate and cannot meet practical needs. Utility Model Content

[0005] In view of the defects and deficiencies of wafer detection devices in existing CMP machine transfer mechanisms, this application provides a wafer detection device and a CMP machine transfer mechanism. The wafer detection device includes at least two base layers disposed within the loading mechanism of the CMP machine transfer mechanism, and an elastic mechanism and pressure sensor disposed between adjacent base layers. It can adapt to wafers with different edge trimming widths and inconsistent warpage, enabling the CMP machine to handle a wider range of wafer types, enhancing the machine's applicability and flexibility. Through accurate wafer detection, it reduces the frequency of alarms caused by detection failures or errors, improves the stability and reliability of the CMP machine, reduces downtime due to alarms, and increases machine uptime.

[0006] One embodiment of this application provides a wafer inspection device for a CMP machine transport mechanism, comprising:

[0007] At least two bases are stacked sequentially from bottom to top within the wafer mounting mechanism, with the upper surface of the top base used to support the wafer;

[0008] An elastic mechanism is disposed between adjacent bases;

[0009] A pressure sensor is disposed between adjacent bases.

[0010] As one embodiment, it also includes a guiding mechanism, which includes a guide post and a through hole. Except for the bottom base, the other bases are provided with through holes at the same position. One end of the guide post is fixed to the upper surface of the bottom base, and the other end of the guide post passes through the through holes of the other bases in sequence.

[0011] In one embodiment, at least three pressure sensors are included between adjacent bases, and the pressure sensors are evenly distributed along the circumference of the base.

[0012] In one embodiment, the pressure sensor is a piezoelectric pressure sensor.

[0013] In one implementation, a plurality of elastic mechanisms are included between adjacent bases, and the plurality of elastic mechanisms are evenly distributed along the circumference of the base.

[0014] In one embodiment, the elastic mechanism is a spring, and the two ends of the spring are respectively fixedly connected to the adjacent base.

[0015] As one implementation, a controller is also included, and the pressure sensor is connected to the controller.

[0016] Another embodiment of this application provides a CMP machine transfer mechanism, including a wafer loading mechanism and the aforementioned wafer detection device disposed within the wafer loading mechanism.

[0017] As described above, the wafer detection mechanism and CMP machine transfer mechanism of this application have the following beneficial effects:

[0018] The wafer detection mechanism of this application, by setting at least two base layers within the wafer loading mechanism and setting an elastic mechanism and pressure sensor between adjacent base layers, can accurately and quickly detect wafers with different edge trimming widths and warpage degrees, ensuring the smooth operation of the CMP process and improving the versatility and flexibility of the equipment; it can accurately identify the position and status of the wafer, reducing downtime caused by false alarms or missed alarms during wafer transfer, which not only improves the utilization rate of the machine, but also reduces production delays and cost losses caused by alarms; it eliminates the need for special design or adjustment for each wafer size, reducing the workload and technical difficulty for CMP equipment manufacturers in the design phase, improving production efficiency and reducing design difficulty. Attached Figure Description

[0019] Figure 1The diagram shown is a top view of the conveyor mechanism of a CMP machine in the prior art.

[0020] Figure 2 The diagram shown is a side view of a wafer detection mechanism according to Embodiment 1 of this utility model.

[0021] Figure 3 The diagram shown is a side view of another wafer detection mechanism according to Embodiment 1 of this utility model.

[0022] Figure 4 The diagram shown is a side view of another wafer detection mechanism according to Embodiment 1 of this utility model.

[0023] Figure 5 The diagram shown is a top view of the CMP machine conveying mechanism according to Embodiment 2 of this utility model.

[0024] Component designation explanation

[0025] 10, Wafer loading mechanism; 11, Positioning pin; 12, Water column opening; 20, Wafer; 100, Base; 200, Elastic mechanism; 300, Pressure sensor; 400, Guide post. Detailed Implementation

[0026] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0027] Please see Figures 1 to 5 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0028] In the current semiconductor manufacturing field, chemical mechanical polishing (CMP) is one of the key processes for achieving wafer surface planarization. In CMP machines, wafer transfer and detection are crucial steps to ensure process accuracy and efficiency. Existing CMP machine transfer mechanisms use wafer detection based on water pressure variations, such as... Figure 1As shown, three water column openings 12 are made near the positioning pin 11 of the upper wafer mechanism 10. When the wafer 20 is present, the wafer 20 will press down and block these water column openings 12, causing the water pressure to rise. This water pressure change is then converted into an electrical signal by a piezoelectric converter and transmitted to the control system. In the user interface (UI) software of the control system, the user can set a suitable threshold to determine whether the wafer 20 is present or not; if it is higher than the threshold, it means that the wafer 20 is present; if it is lower than the threshold, it means that the wafer 20 is not present.

[0029] This wafer detection method based on water pressure variation is simple and effective, providing accurate feedback signals for wafer transfer during CMP processes. However, with the development of CMP technology and the increasing demands of wafer manufacturing, this traditional detection method may face some limitations. For example, for wafers with different edge trimming widths and warpage degrees, a more flexible and accurate detection mechanism may be needed to adapt to process changes and improve production efficiency. Therefore, developing new wafer detection devices for CMP machine transfer mechanisms to meet broader process requirements and improve wafer detection accuracy has become an important research direction in the semiconductor manufacturing field.

[0030] To address the above deficiencies, this application provides a wafer inspection device and a CMP machine transfer mechanism. The following embodiments will provide a detailed description.

[0031] Example 1

[0032] This embodiment provides a wafer inspection device for use in the transfer mechanism of a CMP machine, such as... Figure 2 and Figure 3 As shown, the wafer detection device includes at least two bases 100, an elastic mechanism 200 disposed between the bases 100, and a pressure sensor 300. The bases 100 are stacked sequentially from top to bottom within the wafer mounting mechanism, with the upper surface of the top base 100 used to support the wafer. When a wafer is present, the wafer and the top base 100 apply pressure to the pressure sensor 300, resulting in a relatively large pressure signal output by the pressure sensor 300. When no wafer is present, the upper base 100 returns to its original position under the action of the elastic mechanism 200, no longer applying pressure to the pressure sensor 300, and the pressure signal output by the pressure sensor 300 is relatively small. The presence of a wafer is determined by the magnitude of the pressure signal.

[0033] The wafer detection device provided in this embodiment can accurately and quickly detect wafers with different edge trimming widths and warpage degrees, ensuring the smooth operation of the CMP process and improving the versatility and flexibility of the equipment. This wafer detection device can accurately identify the position and state of the wafer, thus reducing downtime caused by false alarms or missed alarms during wafer transfer. This improvement not only increases machine utilization but also reduces production delays and cost losses due to alarms. The wafer detection device can adapt to wafers with different edge trimming widths and warpage degrees without requiring specialized design or adjustment for each wafer size. This feature greatly reduces the workload and technical difficulty for CMP machine manufacturers during the design phase, improving production efficiency and significantly reducing design complexity. The wafer detection device can automatically adapt to various wafers, reducing discussions and communication caused by wafer size inconsistencies, thereby lowering communication costs between equipment manufacturers and customers.

[0034] Specifically, such as Figure 2 As shown, this embodiment provides an implementation using two bases 100, with multiple elastic mechanisms 200 and multiple pressure sensors 300 disposed between the two bases 100. When there is a wafer, the wafer and the upper base 100 overcome the elastic force of the elastic mechanism 200 under the action of gravity, causing the pressure sensor 300 to sense a larger pressure. When there is no wafer, the upper base 100 returns to its original position under the action of the elastic force of the elastic mechanism 200, and the pressure sensor 300 does not sense any pressure or senses a small pressure.

[0035] like Figure 3As shown, this embodiment provides an implementation using three bases 100, which are, from top to bottom, a first base, a second base, and a third base. Multiple elastic mechanisms 200 and multiple pressure sensors 300 are disposed between the first and second bases, and between the second and third bases. When a wafer is present, the wafer and the first base allow the pressure sensor 300 between the first and second bases to sense a relatively large pressure. When no wafer is present, the second base returns to its original position under the action of the elastic mechanism 200 between the second and third bases, and the pressure sensor 300 between the second and third bases senses a relatively small pressure or no pressure. Similarly, the first base returns to its original position under the action of the elastic mechanism 200 between the first and second bases, and the pressure sensor 300 between the first and second bases senses a relatively small pressure or no pressure. By setting up multiple bases and setting up elastic mechanisms 200 and pressure sensors 300 between adjacent bases, it is possible to prevent the elastic mechanisms 200 and pressure sensors 300 between the remaining bases from continuing to work when the elastic mechanism 200 or pressure sensor 300 between one group of bases fails, which can further improve the accuracy of wafer detection.

[0036] In optional embodiments, such as Figure 4 As shown, the wafer detection device also includes a guiding mechanism, which comprises guide posts 400 and through holes (not shown in the figure). Except for the bottom base 100, all other bases 100 have through holes at the same location. One end of the guide post 400 is fixed to the upper surface of the bottom base 100, and the other end of the guide post 400 passes through the through holes on the other bases 100 in a bottom-to-top order. By setting up the guiding mechanism, the bases 100 can be ensured to move up and down in a straight line, improving the accuracy of the pressure sensor 300.

[0037] In an optional embodiment, the wafer detection device includes at least three pressure sensors 300 between adjacent bases 100. The pressure sensors 300 are evenly distributed along the circumference of the base 100, which is a cylinder, meaning that the angle between any two adjacent pressure sensors 300 and the center of the base 100 is 120 degrees. Providing at least three pressure sensors 300 between adjacent bases 100 helps improve the accuracy of pressure sensor detection.

[0038] In an optional embodiment, the pressure sensor 300 is a piezoelectric pressure sensor.

[0039] In an optional embodiment, a plurality of elastic mechanisms 200 are included between adjacent bases 100. The plurality of elastic mechanisms 200 are evenly distributed along the circumference of the base 100, and the plurality of elastic mechanisms 200 facilitate the upper base 100 to return to its original position.

[0040] In an optional embodiment, the elastic mechanism 200 is a spring, with both ends of the spring fixedly connected to the surfaces of adjacent bases. Springs with suitable spring coefficients can be selected based on the weight of the wafer and base 100. The number, distribution, and spring coefficient of the springs are strongly correlated with the weight of the wafer and base. The selection of the pressure sensor 300 model is also strongly correlated with the number and spring coefficient of the springs.

[0041] In an optional embodiment, the wafer detection device further includes a controller, and a pressure sensor 300 is connected to the controller. The pressure sensor 300 transmits the sensed pressure signal to the controller. By setting a reasonable threshold on the controller's user interface (UI) software, when the detected pressure signal is higher than the threshold, it indicates that there is a wafer; when the detected pressure signal is lower than the threshold, it indicates that there is no wafer.

[0042] Example 2

[0043] This embodiment provides a CMP machine conveying mechanism, such as Figure 5 As shown, the CMP machine's transfer mechanism includes a wafer loading mechanism 10 and three positioning pins 11. The three positioning pins 11 are evenly distributed along the outer circumference of the wafer 20. It also includes the wafer detection device provided in Embodiment 1. The wafer detection device is disposed within the wafer loading mechanism 10. By setting the wafer detection device, the CMP machine's transfer mechanism can adapt to wafers with different edge trimming widths and inconsistent warpage, enabling the CMP machine to handle a wider range of wafer types and enhancing the machine's applicability and flexibility. Through accurate wafer detection, the alarm frequency caused by detection failures or errors is reduced, improving the stability and reliability of the CMP machine, reducing downtime caused by alarms, and increasing the machine's uptime.

[0044] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer inspection device for use in a CMP machine transport mechanism, characterized in that, include: At least two bases are stacked sequentially from bottom to top within the wafer mounting mechanism, with the upper surface of the top base used to support the wafer; An elastic mechanism is disposed between adjacent bases; A pressure sensor is disposed between adjacent bases.

2. The wafer detection device according to claim 1, characterized in that, It also includes a guiding mechanism, which includes a guide post and a through hole. Except for the base at the bottom, the other bases are provided with through holes at the same position. One end of the guide post is fixed to the upper surface of the base at the bottom, and the other end of the guide post passes through the through holes of the other bases in sequence.

3. The wafer detection device according to claim 1, characterized in that, At least three pressure sensors are included between adjacent bases, and the pressure sensors are evenly distributed along the circumference of the base.

4. The wafer detection apparatus according to any one of claims 1 to 3, characterized in that, The pressure sensor is a piezoelectric pressure sensor.

5. The wafer detection device according to claim 1, characterized in that, The adjacent bases include a plurality of elastic mechanisms, which are evenly distributed along the circumference of the base.

6. The wafer detection device according to claim 5, characterized in that, The elastic mechanism is a spring, and the two ends of the spring are fixedly connected to the adjacent base.

7. The wafer detection device according to claim 1, characterized in that, It also includes a controller, to which the pressure sensor is connected.

8. A CMP machine conveying mechanism, characterized in that, The wafer mounting mechanism includes a wafer detection device according to any one of claims 1 to 7 disposed within the wafer mounting mechanism.

Images