Anti-cracking transfer trolley for transporting invisibly cut wafers
By designing an anti-crack wafer transport vehicle, and utilizing an inclined loading module and a double shock-absorbing foam structure, the problem of wafer cracking caused by shaking and impact during wafer transportation was solved, thus achieving safe and stable wafer transportation.
Patent Information
- Application Number
- CN202423126611.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-17
AI Technical Summary
In the semiconductor manufacturing process, cut wafers are prone to premature splitting due to their low strength during transportation caused by shaking and impact, posing a quality risk.
A crack-resistant wafer transport vehicle for transporting wafers after stealth dicing was designed. It adopts a frame, a placement platform, an inclined loading module, and a material box shock absorption module. Through the inclined design and double shock-absorbing foam structure, the wafer shaking and impact are reduced, and the transport stability is improved.
It effectively prevents wafers from cracking due to shaking and impact during transportation, thus improving the safety and quality stability of wafer transportation.
Smart Images
Figure CN223546317U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to the field of wafer transfer technology after wafer dicing, specifically a crack-resistant wafer transfer vehicle for transporting wafers after stealth dicing. Background Technology
[0002] In the existing SDBG process flow of semiconductor manufacturing, after the wafer is processed by laser slicing, the wafer is placed in a hopper and manually handled by the operator or pushed to the next process for thinning operation using a transfer cart;
[0003] During the use of the transfer cart, since the wafers have already undergone laser cutting and have low strength, and the current trolley platform is level, the wafers shake violently and impact the tray slots when the operator pushes the trolley for transport. Due to the difficulty in improving the flatness of the ground, the trolley vibrates more when pushed manually, and the force on the wafers increases significantly. The impact force with the tray slots also increases, which can cause premature wafer splitting and create quality risks. Summary of the Invention
[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a wafer transport vehicle for transporting wafers after stealth dicing, in order to solve the difficulties of the prior art.
[0005] To achieve the above and other related objectives, this utility model provides a crack-resistant wafer transport vehicle for transporting wafers after stealth dicing, comprising:
[0006] Frame 1;
[0007] The placement platform 2 is welded to the top of the frame 1. One side of the placement platform 2 is a loading port 15. The placement platform 2 is surrounded by a baffle 11 in the direction away from the loading port 15.
[0008] Inclined loading module 3, which is bolted to the top of the placement platform 2;
[0009] The material box shock absorption module 4 is disposed at the bottom and around the inclined loading module 3.
[0010] According to the preferred embodiment, directional shock-absorbing wheels 12 are bolted to the left and right ends of one side of the bottom of the frame 1, and omnidirectional shock-absorbing wheels 13 are bolted to the left and right ends of the other side of the frame 1.
[0011] According to the preferred embodiment, the tilting loading module 3 includes:
[0012] The heightening vertical support plate 31 is bolted to the side of the placement platform 2 near the loading port 15.
[0013] The feeding plate 32 is L-shaped. One side of the horizontal plate of the feeding plate 32 is connected to the heightening vertical support plate 31 by bolts. One side of the vertical plate of the feeding plate 32 is located on the top of the placement platform 2 away from the feeding port 15. A support vertical rod 33 is provided at the center of the bottom of the horizontal plate side of the feeding plate 32. The support vertical rod 33 is connected to the placement platform 2 by bolts.
[0014] According to the preferred embodiment, the material box shock absorption module 4 includes:
[0015] The No. 1 shock-absorbing foam 41 is attached to the top of the placement platform 2 by pasting. One side of the No. 1 shock-absorbing foam 41 is sleeved on the outside of the heightening vertical support plate 31, and the other side of the No. 1 shock-absorbing foam 41 is placed between the vertical plate in the feeding plate 32 and the placement platform 2.
[0016] Second shock-absorbing foam 42, the second shock-absorbing foam 42 is attached to the top of one side of the horizontal plate of the feeding plate 32 by pasting;
[0017] Shock-absorbing foam 43 is fitted on the left and right sides of the feeding plate 32, and the shock-absorbing foam 43 is located between the feeding plate 32 and the baffle 11.
[0018] According to the preferred embodiment, a push-pull handle 14 is provided on one side of the frame 1 directly above the omnidirectional shock-absorbing wheel 13.
[0019] According to the preferred embodiment, one side of the feed plate 32 is inclined at 13°.
[0020] This utility model employs a frame, a placement platform, an inclined loading module, and a material box shock absorption module. The material box containing the wafers is loaded from the loading port onto the No. 2 shock-absorbing foam on the top of the placement platform. The frame is moved by holding the push-pull handle. It should be noted that one side of the loading plate of this technical solution is inclined at 13°. The loading plate used for loading is designed with a fixed tilt angle, so that the material box is in an inclined state on the transfer vehicle. This ensures that the center of the wafer is offset during transportation, which can prevent the wafer from being unstable and shaking during transportation. Furthermore, if there is a large difference in ground level when pushing the transfer vehicle, the transfer vehicle body vibrates. The vibration is transmitted from the wheels to the placement platform, weakened by the No. 1 shock-absorbing foam, and then transmitted to the loading plate. After a second weakening, it is transmitted to the box containing the wafer. The No. 1 and No. 2 shock-absorbing foams form a double shock absorption, which can prevent the wafer from shaking and hitting the material box.
[0021] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings, so as to facilitate an understanding of the features and advantages of the present invention. Attached Figure Description
[0022] Figure 1 This is shown as the front view of the present invention;
[0023] Figure 2 The image shown is a left view of this utility model.
[0024] Label Explanation
[0025] 1. Chassis; 11. Material guardrail; 12. Directional shock-absorbing wheels; 13. Universal shock-absorbing wheels; 14. Push-pull handle; 15. Loading port;
[0026] 2. Placement platform;
[0027] 3. Inclined loading module; 31. Heightening vertical support plate; 32. Loading plate; 33. Supporting vertical rod;
[0028] 4. Material box shock absorption module; 41. No. 1 shock absorption foam; 42. No. 2 shock absorption foam; 43. Shock absorption foam rubber; Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0030] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this utility model may have fewer components, have other components not shown in the drawings, different components, components arranged differently, or components with different connections, etc. Furthermore, two or more components shown in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.
[0031] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “an” or “a” and similar terms do not necessarily indicate a quantity limitation. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.
[0032] This utility model proposes a crack-resistant wafer transport vehicle for transporting wafers after stealth dicing. It is used in the wafer transport process after laser dicing. This utility model does not limit the specifications and types of wafers to be transported. However, the structure of the frame 1, the placement platform 2, the tilting loading module 3, and the material box shock absorption module 4 is particularly suitable for the design of a safe transport carrier after wafer dicing.
[0033] In general, the anti-crack wafer transport vehicle for stealth-cut wafer transportation proposed in this utility model mainly includes: a frame 1, a placement platform 2, an inclined loading module 3, and a material box shock absorption module 4. (See also...) Figure 1 It shows the arrangement of the frame 1, the placement platform 2, the tilting loading module 3, and the material box shock absorption module 4.
[0034] The anti-crack wafer transport vehicle proposed in this utility model is used by loading the wafer-loaded cassette into the second shock-absorbing foam 42 on the top of the placement platform 2 through the loading port 15. The vehicle frame 1 is moved by holding the push-pull handle 14. It should be noted that the loading plate 32 of this technical solution has one side inclined at 13°. The loading plate 32 used for loading is designed with a fixed tilt angle so that the cassette is in an inclined state on the transport vehicle. This ensures that the center of the wafer is offset during transportation, which can prevent the wafer from being unstable and shaking during transportation. In addition, if there is a large difference in ground level when pushing the transport vehicle, the vehicle body vibrates. The vibration is transmitted from the wheels to the placement platform 2. After being weakened by the first shock-absorbing foam 41, it is transmitted to the loading plate 32. After being weakened twice, it is transmitted to the cassette containing the wafer. The first shock-absorbing foam 41 and the second shock-absorbing foam 42 form a double shock absorption, which can prevent the wafer from shaking and hitting the cassette.
[0035] The bottom of the frame 1 is provided with directional shock-absorbing wheels 12 at both ends of one side by bolts, and universal shock-absorbing wheels 13 at both ends of the other side by bolts. A push-pull handle 14 is provided on one side of the frame 1 directly above the universal shock-absorbing wheels 13. Pulling the push-pull handle can control the free movement of the transfer vehicle, enabling the transfer vehicle to move.
[0036] The aforementioned placement platform 2 is welded to the top of the frame 1. One side of the placement platform 2 is a feeding port 15, and the surrounding area of the placement platform 2 away from the feeding port 15 is provided with a material blocking fence 11.
[0037] The aforementioned tilting loading module 3 is bolted to the top of the placement platform 2. The tilting loading module 3 includes: a heightening vertical support plate 31, a loading plate 32, and a support rod 33. The heightening vertical support plate 31 is bolted to the side of the placement platform 2 near the loading port 15. The loading plate 32 is L-shaped. The horizontal side of the loading plate 32 is bolted to the heightening vertical support plate 31. The horizontal side of the loading plate 32 is tilted at 13°. Setting the loading plate 32 at a fixed 13° tilt angle can shift the center of the wafer and improve the strength of the wafer. The vertical side of the loading plate 32 is located on the top of the placement platform 2 away from the loading port 15. The support rod 33 is located at the bottom center of the horizontal side of the loading plate 32. The support rod 33 is bolted to the placement platform 2.
[0038] The aforementioned shock-absorbing module 4 for the material box is installed at the bottom and around the inclined loading module 3. The shock-absorbing module 4 for the material box includes: a first shock-absorbing foam 41, a second shock-absorbing foam 42, and a shock-absorbing foam rubber 43. The first shock-absorbing foam 41 is attached to the top of the placement platform 2. One side of the first shock-absorbing foam 41 is fitted onto the outside of the heightening vertical support plate 31, and the other side of the first shock-absorbing foam 41 is set between the vertical plate of the loading plate 32 and the placement platform 2. The second shock-absorbing foam 42 is attached to the top of one side of the horizontal plate of the loading plate 32. The shock-absorbing foam rubber 43 is fitted on the left and right sides of the loading plate 32. The shock-absorbing foam rubber 43 is located between the loading plate 32 and the baffle 11.
[0039] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A crack-resistant wafer transport vehicle for transporting wafers after stealth dicing, characterized in that, include: Frame (1); The placement platform (2) is welded to the top of the frame (1). One side of the placement platform (2) is a loading port (15). The placement platform (2) is surrounded by a baffle (11) in the direction away from the loading port (15). Inclined loading module (3), which is bolted to the top of the placement platform (2); The material box shock absorption module (4) is located at the bottom and around the inclined loading module (3).
2. The anti-crack wafer transport vehicle for transporting wafers after stealth dicing according to claim 1, characterized in that, The bottom of the frame (1) is provided with directional shock-absorbing wheels (12) on both the left and right ends of one side by bolts, and the other side of the frame (1) is provided with universal shock-absorbing wheels (13) on both the left and right ends by bolts.
3. The anti-crack wafer transport vehicle for transporting wafers after stealth dicing according to claim 2, characterized in that, The tilting loading module (3) includes: A heightening vertical support plate (31) is bolted to the side of the placement platform (2) near the loading port (15); The feeding plate (32) is L-shaped. One side of the horizontal plate of the feeding plate (32) is connected to the heightening vertical support plate (31) by bolts. One side of the vertical plate of the feeding plate (32) is located on the top of the placement platform (2) away from the feeding port (15). A support vertical rod (33) is provided at the center of the bottom of the horizontal plate of the feeding plate (32). The support vertical rod (33) is connected to the placement platform (2) by bolts.
4. The anti-crack wafer transport vehicle for transporting wafers after stealth dicing according to claim 3, characterized in that, The shock absorption module (4) of the material box includes: No. 1 shock-absorbing foam (41) is attached to the top of the placement platform (2) by pasting. One side of the No. 1 shock-absorbing foam (41) is fitted on the outside of the heightening vertical support plate (31), and the other side of the No. 1 shock-absorbing foam (41) is set between the vertical plate in the feeding plate (32) and the placement platform (2). Second shock-absorbing foam (42), the second shock-absorbing foam (42) is attached to the top of one side of the horizontal plate of the feed plate (32); Shock-absorbing foam (43) is fitted on the left and right sides of the feeding plate (32) and is located between the feeding plate (32) and the baffle (11).
5. The anti-crack wafer transport vehicle for transporting wafers after stealth dicing according to claim 4, characterized in that, A push-pull handle (14) is provided on one side of the frame (1) directly above the omnidirectional shock absorber wheel (13).
6. The anti-crack wafer transport vehicle for transporting wafers after stealth dicing according to claim 5, characterized in that, The feed plate (32) has one side inclined at 13°.