Buffering, absorbing and radiating adhesive tape for lower support of OLED screen

Abstract

The utility model discloses an adhesive tape for supporting, buffering, absorbing and radiating under an OLED (Organic Light Emitting Diode) screen. The adhesive tape comprises a carrier layer, a buffering silica gel layer, a copper foil layer, an adhesive layer and a release layer, the buffer silica gel layer is attached and fixed on the upper surface of the carrier layer; the copper foil layer is attached and fixed on the upper surface of the buffer silica gel layer; the adhesive layer is adhered and fixed on the lower surface of the carrier layer; and the release layer is adhered and fixed on the lower surface of the adhesive layer. The buffer silica gel layer and the adhesive layer are attached and fixed to the upper surface and the lower surface of the carrier layer respectively, the buffer silica gel layer and the adhesive layer have the buffer function and the adhesive function respectively, the functions of structural materials of all layers of the product are independent, the use performance and stability of the product are guaranteed, meanwhile, the product is of an integrated structure, and the service life of the product is prolonged. And secondary lamination is not needed, attenuation and influence on functional characteristics of each layer of material are avoided, imported buffer foam is not needed, and the material cost is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of adhesive tape, and in particular to an adhesive tape for supporting, buffering, absorbing and absorbing heat dissipation under OLED screens. Background Technology

[0002] OLED (Organic Light-Emitting Diode) is a relatively new product in mobile phone OLED displays, hailed as a "dream display." Unlike traditional LCD displays, OLED technology does not require a backlight. It uses a very thin coating of organic material and a glass substrate (or a flexible organic substrate). When an electric current passes through, these organic materials emit light. Furthermore, OLED screens can be made lighter and thinner, have wider viewing angles, and significantly reduce power consumption.

[0003] During OLED screen manufacturing, adhesive tape needs to be bonded under the screen to support, cushion, absorb, and dissipate heat. In existing technology, to ensure thermal conductivity, support, and impact cushioning performance, the main structure of the tape currently includes an imported cushioning foam layer, a copper foil layer, an adhesive layer, and a release layer. The copper foil layer is bonded to the upper surface of the imported cushioning foam layer, the adhesive layer to the lower surface, and the release layer to the lower surface of the adhesive layer. This four-layer composite structure has a complex processing technology, high waste, and the uneven, porous surface of the imported cushioning foam poses a risk of delamination. Furthermore, the imported cushioning foam is expensive, increasing manufacturing costs. Additionally, the imported cushioning foam lacks adhesive properties and requires separate backing adhesive. To address this, another type of tape has emerged that uses a silicone-based cushioning gel layer to replace the imported cushioning foam layer and adhesive layer. While this does solve the aforementioned problems, the silicone-based cushioning gel layer of this tape needs to simultaneously perform both cushioning and adhesive functions, making it difficult to guarantee both performance and stability. Furthermore, the silicone-based cushioning gel layer requires secondary lamination during die-cutting, which can degrade and affect the functional properties of each layer. Therefore, it is necessary to improve the current tape. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a heat dissipation and buffering tape for under-OLED screen support, which can effectively solve the problems of poor performance and stability of existing tapes.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A heat dissipation and buffering tape for under-display support of OLED screens includes a carrier layer, a buffer silicone gel layer, a copper foil layer, an adhesive layer, and a release layer. The buffer silicone gel layer is bonded and fixed to the upper surface of the carrier layer. The copper foil layer is bonded and fixed to the upper surface of the buffer silicone gel layer. The adhesive layer is bonded and fixed to the lower surface of the carrier layer. The release layer is bonded and fixed to the lower surface of the adhesive layer.

[0007] As a preferred embodiment, the carrier layer is made of PET material with a thickness of 4-36 μm.

[0008] As a preferred embodiment, the thickness of the buffered silicone gel layer is 50-150 μm.

[0009] As a preferred embodiment, the impact absorption rate of the buffered silicone gel layer is ≥40%, and antistatic particles and thermally conductive particles are uniformly distributed on it.

[0010] As a preferred embodiment, the thickness of the copper foil layer is 6-100 μm.

[0011] As a preferred embodiment, the copper foil layer is a composite copper foil, a copper alloy, a rolled copper foil, or an electrolytic copper foil.

[0012] As a preferred embodiment, the adhesive layer is an acrylic self-leveling grid adhesive layer, which has good leveling properties, excellent air release properties, and high stability.

[0013] As a preferred embodiment, the thickness of the adhesive layer is 10-50 μm.

[0014] As a preferred embodiment, the release layer is a grid release film layer, which is easier to peel off.

[0015] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0016] By bonding and fixing the buffer silicone gel layer and adhesive layer to the upper and lower surfaces of the carrier layer respectively, the buffer silicone gel layer and adhesive layer serve the functions of buffering and bonding, thereby making the functions of each layer of the product independent, thus ensuring the performance and stability of the product. At the same time, this product is an integrated structure, which eliminates the need for secondary bonding, avoiding the attenuation and impact on the functional characteristics of each layer of material, and also eliminates the need for imported buffer foam, greatly reducing material costs.

[0017] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0018] Figure 1 This is a perspective view of a preferred embodiment of the present utility model;

[0019] Figure 2 This is an exploded view of a preferred embodiment of the present invention;

[0020] Figure 3 This is a cross-sectional view of a preferred embodiment of the present invention.

[0021] Explanation of reference numerals in the attached diagram:

[0022] 10. Carrier layer; 20. Buffer silica gel layer

[0023] 30. Copper foil layer; 40. Adhesive layer

[0024] 50. Release layer. Detailed Implementation

[0025] Please refer to Figures 1 to 3 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a carrier layer 10, a buffer silicone gel layer 20, a copper foil layer 30, an adhesive layer 40, and a release layer 50.

[0026] The carrier layer 10 is made of PET material and has a thickness of 4-36μm.

[0027] The buffer silicone gel layer 20 is adhered and fixed to the upper surface of the carrier layer 10. In this embodiment, the thickness of the buffer silicone gel layer 20 is 50-150 μm. Furthermore, the impact absorption rate of the buffer silicone gel layer 20 is ≥40%, and antistatic and thermally conductive particles are uniformly distributed on it. The buffer silicone gel layer 20 possesses high-performance impact absorption, antistatic, and heat dissipation properties. Combined with the integral molding and thermal bonding of the buffer silicone gel layer 20 to the carrier layer 10, its performance is superior to imported foam, avoiding the risks of technical and material limitations, reducing costs, and promoting the process of complete domestic production. Moreover, the buffer silicone gel layer 20 can be die-cut in a Class 1000 cleanroom under normal conditions without refrigeration, and is extremely easy to separate, greatly reducing process difficulty and minimizing adhesion and excess adhesive on the silicone gel layer's adhesive surface. Simultaneously, it reduces bonding steps and material waste, lowering the quality loss of the die-cutting process.

[0028] The copper foil layer 30 is bonded and fixed to the upper surface of the buffer silicone gel layer 20. The thickness of the copper foil layer 30 is 6-100 μm. Furthermore, the copper foil layer 30 can be a composite copper foil, copper alloy, rolled copper foil, or electrolytic copper foil, etc., and is not limited thereto.

[0029] The adhesive layer 40 is adhered and fixed to the lower surface of the carrier layer 10. In this embodiment, the adhesive layer 40 is an acrylic self-leveling mesh adhesive layer. Furthermore, the thickness of the adhesive layer 40 is 10-50 μm, the steel plate peel force of the adhesive layer 40 is ≥1200g, and the mesh adhesive surface automatically levels after being rolled and left to stand for 24 hours. It exhibits high adhesion, good leveling properties, excellent air release, and high stability.

[0030] The release layer 50 is adhered and fixed to the lower surface of the adhesive layer 40. In this embodiment, the release layer 50 is a mesh release film layer.

[0031] The manufacturing and usage methods of this embodiment are detailed below:

[0032] During manufacturing, a thermal bonding process is used to stack the carrier layer 10, the buffer silicone gel layer 20, the copper foil layer 30, and the adhesive layer 40 to form an integrated structure, and the release layer 50 is bonded and fixed to the lower surface of the adhesive layer 40.

[0033] To use, peel off the release layer 50, and then attach and fix the adhesive layer 40 to the corresponding position under the OLED screen.

[0034] The key design feature of this invention is that by bonding and fixing the buffer silicone gel layer and the adhesive layer to the upper and lower surfaces of the carrier layer respectively, the buffer silicone gel layer and the adhesive layer respectively play the functions of buffering and bonding, thereby making the functions of each layer of the product independent, thus ensuring the performance and stability of the product. At the same time, this product is an integrated structure, which does not require secondary bonding, avoiding the attenuation and impact on the functional characteristics of each layer of material, and also eliminating the need to use imported buffer foam, which greatly reduces material costs.

[0035] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A heat dissipation and buffering tape for supporting OLED screens, characterized in that: It includes a carrier layer, a buffer silicone gel layer, a copper foil layer, an adhesive layer, and a release layer; the buffer silicone gel layer is bonded and fixed to the upper surface of the carrier layer; the copper foil layer is bonded and fixed to the upper surface of the buffer silicone gel layer; the adhesive layer is bonded and fixed to the lower surface of the carrier layer; and the release layer is bonded and fixed to the lower surface of the adhesive layer.

2. The heat dissipation tape for under-display support, buffering, and absorption of heat from an OLED screen according to claim 1, characterized in that: The carrier layer is made of PET material with a thickness of 4-36μm.

3. The heat dissipation tape for under-display support, buffering, and absorption of heat from an OLED screen according to claim 1, characterized in that: The thickness of the buffered silica gel layer is 50-150 μm.

4. The heat dissipation tape for under-display support, buffering, and absorption of heat from an OLED screen according to claim 1 or 3, characterized in that: The impact absorption rate of the buffered silicone gel layer is ≥40%, and antistatic particles and thermally conductive particles are uniformly distributed on it.

5. The heat dissipation tape for under-display support, buffering, and absorption of OLED screens according to claim 1, characterized in that: The thickness of the copper foil layer is 6-100 μm.

6. The heat dissipation tape for under-display support, buffering, and absorption of heat from an OLED screen according to claim 1 or 5, characterized in that: The copper foil layer is a composite copper foil, a copper alloy, a rolled copper foil, or an electrolytic copper foil.

7. The heat dissipation tape for under-display support, buffering, and absorption of OLED screens according to claim 1, characterized in that: The adhesive layer is an acrylic self-leveling mesh adhesive layer.

8. The heat dissipation tape for under-display support, buffering, and absorption of heat from an OLED screen according to claim 1 or 7, characterized in that: The thickness of the adhesive layer is 10-50 μm.

9. The heat dissipation tape for under-display support, buffering, and absorption of OLED screens according to claim 1, characterized in that: The release layer is a grid release film layer.

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