Chip transfer device, station layout device and sequencing system

Abstract

The utility model discloses a chip transfer device, a station layout device and a sequencing system. The chip transfer device comprises a rack, a station layout device and a sequencing system, the first direction movement mechanism is arranged on the rack; the second direction movement mechanism is connected with the first direction movement mechanism; the third direction movement mechanism is connected with the second direction movement mechanism; the chip grabbing mechanism is arranged on the third direction movement mechanism; the first direction movement mechanism, the second direction movement mechanism and the third direction movement mechanism drive the chip grabbing mechanism to move to achieve three-dimensional movement, so that the chip grabbing mechanism can grab chips at any station and place the chips at another station, multi-station multi-chip sequencing is achieved, and the sequencing efficiency can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of bioanalytical technology, and in particular to a chip transfer device, a workstation layout device, and a sequencing system. Background Technology

[0002] The topics discussed in this section should not be considered prior art simply because they are mentioned in this section. Similarly, technical problems mentioned in this section or related to the topics provided as background art should not be considered as having been previously recognized in the prior art.

[0003] Throughput sequencers play a crucial role in human whole-genome sequencing. Currently, once the sequencing chip is placed inside the sequencer, it corresponds to a single biochemical reaction system and a single imaging system for sequence signal detection. The inability to set up multiple workstations to switch between multiple sequencing chips results in low sequencing efficiency, significantly limiting the industry's development. Utility Model Content

[0004] To at least partially solve one of the above-mentioned technical problems or to provide a practical commercial means, this utility model provides a chip transfer device, a workstation layout device, and a sequencing system.

[0005] This utility model provides a chip transfer device for a sequencing system, the chip transfer device comprising:

[0006] frame;

[0007] A first directional motion mechanism is mounted on the frame;

[0008] A second direction motion mechanism connected to the first direction motion mechanism;

[0009] A third-direction motion mechanism connected to the second-direction motion mechanism; and

[0010] A chip gripping mechanism is installed on the third-party motion mechanism;

[0011] The first direction motion mechanism, the second direction motion mechanism, and the third direction motion mechanism drive the chip gripping mechanism to move to achieve three-dimensional motion, enabling the chip gripping mechanism to grip the chip at any workstation and place the chip at any other workstation.

[0012] In the chip transfer device provided in this embodiment of the utility model, the first direction motion mechanism, the second direction motion mechanism and the third direction motion mechanism drive the chip gripping mechanism to move to achieve three-dimensional motion, so that the chip gripping mechanism can grip the chip at any station and place the chip at another station, thereby realizing multi-station multi-chip sequencing, which can effectively improve sequencing efficiency.

[0013] In some embodiments, the first directional motion mechanism includes:

[0014] A first drive unit is mounted on the frame;

[0015] Synchronous belt assembly connected to the first drive unit; and

[0016] A movable plate that moves under the drive of the synchronous belt assembly, with the second directional motion mechanism disposed on the movable plate.

[0017] In some embodiments, the timing belt assembly includes a first timing pulley, a second timing pulley, and a timing belt wound around the first timing pulley and the second timing pulley, with the moving plate disposed on the timing belt.

[0018] In some embodiments, the moving plate is provided with a first tooth, and the timing belt is provided with a second tooth that matches and connects with the first tooth.

[0019] In some embodiments, the first directional movement mechanism further includes a first guide rail fixedly disposed on opposite sides of the frame and a first guide block disposed on the first guide rail, wherein one end of the moving plate is connected to the first guide block on one side of the frame and the other end is connected to the first guide block on the other side of the frame.

[0020] In some embodiments, the second directional motion mechanism includes:

[0021] The second drive component connected to the first direction motion mechanism; and

[0022] A first connecting component connected to the second driving component, wherein the third-party directional motion mechanism is disposed on the first connecting component.

[0023] In some implementations, the first connection component includes:

[0024] A first connecting plate disposed on the first directional motion mechanism and connected to the second driving member; and

[0025] A fixed plate is disposed on the first directional motion mechanism and fixedly connected to the first connecting plate, and the third directional motion mechanism is disposed on the fixed plate.

[0026] In some embodiments, the second directional motion mechanism further includes a first lead screw connected to the output shaft of the second drive member. The surface of the first lead screw is provided with threads, and the first connecting plate is provided with a threaded hole that matches the first lead screw. The first lead screw passes through the threaded hole, and the threads are threadedly connected to the threaded hole.

[0027] In some embodiments, the second directional motion mechanism further includes a second guide rail disposed on the first directional motion mechanism and a second guide block disposed on the second guide rail, wherein the fixing plate is disposed on the second guide block.

[0028] In some embodiments, the third-party motion mechanism includes:

[0029] A third drive component connected to the second-direction motion mechanism; and

[0030] A second connection component connected to the third driving component, wherein the chip gripping mechanism is disposed on the second connection component.

[0031] In some embodiments, the second connection component includes:

[0032] The second connecting plate connected to the third driving component; and

[0033] A movable seat is fixedly connected to the second connecting plate, and the chip gripping mechanism is disposed on the movable seat.

[0034] In some embodiments, the second connecting assembly further includes a second lead screw connected to the output shaft of the third drive member. The surface of the second lead screw is provided with threads, and the second connecting plate is provided with a threaded hole that matches the second lead screw. The second lead screw passes through the threaded hole, and the threads are threadedly connected to the threaded hole.

[0035] In some embodiments, the third-direction motion mechanism further includes a third guide rail disposed on the second-direction motion mechanism and a third guide block disposed on the third guide rail, with the movable seat disposed on the third guide block.

[0036] In some embodiments, the chip gripping mechanism includes:

[0037] The first gripper drive unit connected to the third-party motion mechanism; and

[0038] The first gripper is connected to the first gripper drive member. The first gripper includes a first gripper member and a second gripper member that are arranged opposite each other. Under the drive of the first gripper drive member, the first gripper member and the second gripper member move closer to each other or further away from each other to grasp or place the chip.

[0039] In some embodiments, both the first gripper and the second gripper are provided with a first positioning pin. When the first gripper and the second gripper move closer to each other or further away from each other, the first positioning pin contacts or moves away from the positioning groove of the chip.

[0040] In some embodiments, the chip gripping mechanism further includes:

[0041] A mounting base is connected to the third-party motion mechanism, and the first gripper drive is disposed on the mounting base;

[0042] A second gripper drive component disposed on the mounting base; and

[0043] The second gripper is connected to the second gripper drive member. The second gripper includes a third gripper and a fourth gripper that are arranged opposite each other. Under the drive of the second gripper drive member, the third gripper and the fourth gripper move closer to each other or further away from each other to grasp or place the chip.

[0044] In some embodiments, both the third and fourth grippers are provided with a second positioning pin, which contacts or disengages from the positioning groove of the chip when the third and fourth grippers approach or move away from each other.

[0045] In some embodiments, the chip gripping mechanism further includes:

[0046] A first connecting block is disposed on the first gripper drive component;

[0047] A first pressing plate is provided on the mounting base; and

[0048] A first elastic element is disposed between the first connecting block and the first pressing plate.

[0049] In some embodiments, the chip gripping mechanism further includes a fourth guide rail disposed on the mounting base and a fourth guide block disposed on the fourth guide rail, wherein the first connecting block is disposed between the first gripper drive and the fourth guide block.

[0050] In some embodiments, the chip gripping mechanism further includes:

[0051] A second connecting block is disposed on the second gripper drive component;

[0052] A second pressing plate is provided on the mounting base; and

[0053] A second elastic element is disposed between the second connecting block and the second pressing plate.

[0054] In some embodiments, the chip gripping mechanism further includes a fifth guide rail disposed on the other side of the mounting base and a fifth guide block disposed on the fifth guide rail, with the second connecting block disposed between the second gripper drive and the fifth guide block.

[0055] In some embodiments, the chip transfer device further includes a rotating mechanism connected to the third-party directional motion mechanism, and the chip gripping mechanism is disposed on the rotating mechanism.

[0056] In some embodiments, the rotating mechanism includes:

[0057] A rotary drive component connected to the third-party motion mechanism; and

[0058] A connector is connected to the rotary drive, and the chip gripping mechanism is disposed on the connector.

[0059] In some embodiments, the output shaft of the rotary drive is provided with a drive gear, and the rotary mechanism further includes a driven gear that meshes with the drive gear and is coaxially arranged with the connecting seat.

[0060] In some embodiments, the rotating mechanism further includes a drive gear connected to the output shaft of the rotating drive member, and a driven gear meshing with the drive gear and coaxially disposed with the connecting seat.

[0061] According to one embodiment of the present invention, a workstation layout device is used in conjunction with the chip transfer device described in any of the above embodiments. The workstation layout device includes at least one first workstation, on which at least one biochemical station, at least one photographing station, at least one loading station and at least one cleaning station are provided. The workstation layout device also includes at least one second workstation or a storage unit, on which at least one recycling station is provided.

[0062] In some embodiments, multiple biochemical sites are provided, and each of the biochemical sites and the imaging sites is arranged sequentially from left to right or from right to left along a first straight line.

[0063] In some implementations, at least one emergency position is also provided on the first workstation.

[0064] In some embodiments, the loading position and the recovery position are arranged in a second straight line, and the cleaning position and the emergency position are arranged in a third straight line. The second straight line and the third straight line are located on both sides of the first straight line, and the loading position and the recovery position are located near the door of the sequencing system.

[0065] A sequencing system according to an embodiment of the present invention includes the chip transfer device described in any of the above embodiments, or the workstation layout device described in any of the above embodiments.

[0066] Additional aspects and advantages of embodiments of the present invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the present invention. Attached Figure Description

[0067] The above and / or additional aspects and advantages of the embodiments of this utility model will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0068] Figure 1 A schematic diagram of the chip transfer device and workstation layout device provided for embodiments of this utility model;

[0069] Figure 2 The embodiments of this utility model are based on Figure 1 A magnified view of part A;

[0070] Figure 3 A schematic diagram of the chip transfer device and workstation layout device provided in an embodiment of the present utility model from another perspective.

[0071] Figure 4 The embodiments of this utility model are based on Figure 3 A magnified view of part B;

[0072] Figure 5 A schematic diagram of the first direction motion mechanism and the second direction motion mechanism provided for the embodiments of this utility model;

[0073] Figure 6 A schematic diagram of the third-party motion mechanism, rotation mechanism, and chip gripping mechanism provided for embodiments of this utility model;

[0074] Figure 7 A schematic diagram of the rotating mechanism and chip gripping mechanism provided for embodiments of this utility model;

[0075] Figure 8 A schematic diagram of the structure of the first gripper provided for an embodiment of this utility model;

[0076] Figure 9 A structural schematic diagram of the first gripper provided in another perspective of an embodiment of this utility model;

[0077] Figure 10 A schematic diagram of the chip structure provided for an embodiment of this utility model;

[0078] Figure 11 A schematic diagram of the structure of the first workstation provided for an embodiment of this utility model;

[0079] Figure 12A schematic diagram of the workstation layout provided for an embodiment of this utility model;

[0080] Figure 13 A schematic flowchart illustrating the chip transfer method provided in this embodiment of the present invention. Detailed Implementation

[0081] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0082] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0083] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0084] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0085] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0086] Please refer to Figure 1 The present invention provides a chip transfer device 1000 for use in a sequencing system. The chip transfer device 1000 includes a rack 100, a first-direction motion mechanism 200, a second-direction motion mechanism 300, a third-direction motion mechanism 400, and a chip gripping mechanism 500. The first-direction motion mechanism 200 is mounted on the rack 100, the second-direction motion mechanism 300 is connected to the first-direction motion mechanism 200, the third-direction motion mechanism 400 is connected to the second-direction motion mechanism 300, and the chip gripping mechanism 500 is mounted on the third-direction motion mechanism 400.

[0087] The first direction motion mechanism 200, the second direction motion mechanism 300, and the third direction motion mechanism 400 drive the chip gripping mechanism 500 to move in three dimensions, enabling the chip gripping mechanism 500 to grip the chip 2000 at any station 10 and place the chip 2000 at any other station 10.

[0088] The sequencing system can be a sequencer, which includes a control device, a liquid path mechanism, and an optical mechanism. Under the control of the control device, the liquid path mechanism allows DNA or RNA samples and biochemical reagents to be introduced into the chip 2000. The optical mechanism can photograph and image the chip 2000. The control device performs sequencing based on the acquired images to obtain sequencing results. Alternatively, the sequencing system can be an integrated system combining a sequencer and a server. The sequencer includes a control device, a communication device, a liquid path mechanism, and an optical mechanism. Under the control of the control device, the liquid path mechanism allows DNA or RNA samples and biochemical reagents to be introduced into the chip 2000. The optical mechanism can photograph and image the chip 2000. The control device performs sequencing based on the acquired images to obtain sequencing results. The control device then controls the communication device to send the sequencing data to the server, where the server stores and / or processes the sequencing data.

[0089] The first direction, the second direction, and the third direction can be mutually perpendicular. For example, the first direction can be... Figure 1 The positive and negative directions of the x-axis are shown; the second direction can be... Figure 1 The positive and negative directions of the y-axis are shown, and the third direction can be... Figure 1 The positive and negative directions of the z-axis are shown. The first direction, the second direction, and the third direction can also refer to other directions, but the first direction, the second direction, and the third direction must be different directions.

[0090] The frame 100 provides support for the first direction motion mechanism 200, the first direction motion mechanism 200 provides support for the second direction motion mechanism 300, the second direction motion mechanism 300 provides support for the third-party motion mechanism 400, and the third-party motion mechanism 400 provides support for the chip gripping mechanism 500.

[0091] Because the second-direction motion mechanism 300 is connected to the first-direction motion mechanism 200, the first-direction motion mechanism 200 drives the second-direction motion mechanism 300 to move in the first direction. Because the third-direction motion mechanism 400 is connected to the second-direction motion mechanism 300, the second-direction motion mechanism 300 drives the third-direction motion mechanism 400 to move in the first direction. Because the chip gripping mechanism 500 is mounted on the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the chip gripping mechanism 500 to move in the first direction. Because the third-direction motion mechanism 400 is connected to the second-direction motion mechanism 300, the second-direction motion mechanism 300 drives the third-direction motion mechanism 400 to move in the second direction. Because the chip gripping mechanism 500 is mounted on the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the chip gripping mechanism 500 to move in the second direction. Because the chip gripping mechanism 500 is mounted on the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the chip gripping mechanism 500 to move upward in the third direction.

[0092] Under the movement of the first direction motion mechanism 200, the second direction motion mechanism 300, and the third direction motion mechanism 400, the chip gripping mechanism 500 can be driven to move upward in the first, second, and third directions, realizing the three-dimensional movement of the chip gripping mechanism 500. This allows the chip gripping mechanism 500 to grip a chip 2000 at any station 10 and place the chip 2000 at any other station 10. For example, station 10 includes a loading station 13, a biochemical station 12, an imaging station 11, a cleaning station 15, and a recycling station 14. Multiple chips 2000 can be placed at the loading station 13, such as placing three chips 2000 at the loading station 13, and a cleaned chip 2000 can be placed at the cleaning station 15. The cleaned chip 2000 can be the same as the chip 2000, because the cleaned chip 2000 only performs a cleaning function and does not perform biochemical reactions or sequencing imaging; hence, it is called a cleaned chip 2000. The chip gripping mechanism 500 grips the first chip 2000 at loading station 13 and places it in biochemical station 12, where the first chip 2000 undergoes a biochemical reaction. After the biochemical reaction is complete, the chip gripping mechanism 500 grips the first chip 2000 again at biochemical station 12 and places it in imaging station 11 for sequencing and imaging. The chip gripping mechanism 500 then grips the cleaning chip 2000 at cleaning station 15 and places it in biochemical station 12 to clean components such as inlet and outlet ports. After cleaning is complete, the chip gripping mechanism 500 grips the cleaning chip 2000 again at biochemical station 12 and places it in cleaning station 15. The chip gripping mechanism 500 then grips the second chip 2000 at loading station 13 and places it in biochemical station 12, where the second chip 2000 undergoes a biochemical reaction. Alternatively, instead of cleaning the biochemical site 12, the chip grabbing mechanism 500 grabs the second chip 2000 at the loading station 13 and places it in the biochemical site 12, where the second chip 2000 undergoes a biochemical reaction. After the first chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 500 grabs the first chip 2000 again at the imaging station 11 and places it in the recovery station 14. After the second chip 2000 at the biochemical site 12 completes its biochemical reaction, the chip grabbing mechanism 500 grabs the second chip 2000 again at the biochemical site 12 and places it in the imaging station 11, where the second chip 2000 undergoes sequencing and imaging. The chip grabbing mechanism 500 then grabs the cleaned chip 2000 at the cleaning station 15 and places it in the biochemical site 12. After cleaning is completed, the chip gripping mechanism 500 grips the cleaned chip 2000 at the biochemical station 12 and places it in the cleaning station 15. The chip gripping mechanism 500 then grips the third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the third chip 2000 undergoes a biochemical reaction.Alternatively, instead of cleaning the biochemical site 12, the chip grabbing mechanism 500 grabs the third chip 2000 at the loading station 13 and places it in the biochemical site 12, where the third chip 2000 undergoes a biochemical reaction. After the second chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 500 grabs the second chip 2000 again at the imaging station 11 and places it in the recovery station 14. After the third chip 2000 at the biochemical site 12 completes its biochemical reaction, the chip grabbing mechanism 500 grabs the third chip 2000 again at the biochemical site 12 and places it in the imaging station 11. After the third chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 500 grabs the third chip 2000 again at the imaging station 11 and places it in the recovery station 14. During the sequencing process of multiple chips 2000, the chip grasping mechanism 500 transfers the chips 2000 between different workstations 10, which can achieve the orderly transfer of each chip 2000. Since there are multiple workstations 10, multiple chips 2000 can work simultaneously at multiple workstations 10. For example, if one chip 2000 is performing a biochemical reaction, another chip 2000 can simultaneously perform sequencing and imaging, thereby effectively improving sequencing efficiency.

[0093] After the chip 2000 completes the biochemical reaction at biochemical site 12 and is transferred to imaging site 11 for sequencing and imaging, there may be cases where sequencing is not yet complete, such as only 1-10 cycles of sequencing. In these cases, 11-20 cycles of sequencing are still required. The chip grabbing mechanism 500 needs to grab the cleaned chip 2000 from cleaning site 15 and transfer it to biochemical site 12 for cleaning before transferring the chip 2000 from imaging site 11 to biochemical site 12. Alternatively, the chip 2000 can be transferred from imaging site 11 to biochemical site 12 without cleaning biochemical site 12, followed by the biochemical reaction. After the biochemical reaction is complete, the chip 2000 is transferred to imaging site 11 for sequencing and imaging. After the chip 2000 completes the sequencing, the chip grabbing mechanism 500 transfers the chip 2000 from imaging site 11 to return site 14. After the chip 2000 is transferred from the biochemical position 12 to the imaging position 11 for the last time, the chip gripping mechanism 500 grips the cleaning chip 2000 from the cleaning position 15 and transfers it to the biochemical position 12 for cleaning, and grips the next chip 2000 from the loading position 13 and transfers it to the biochemical position.

[0094] Furthermore, multiple biochemical sites 12 can be provided to allow multiple chips 2000 to perform biochemical reactions on various biochemical sites 12. Specifically, for a chip 2000 that needs to undergo a biochemical reaction, when a biochemical site 12 is in an idle state (no chip 2000 is currently undergoing a biochemical reaction on that biochemical site 12), if that biochemical site 12 has not previously undergone a biochemical reaction, the chip grasping mechanism 500 will transfer the chip 2000 that needs to undergo a biochemical reaction to the idle biochemical site 12 for the biochemical reaction to proceed. If that biochemical site 12 has previously undergone a biochemical reaction, the chip grasping mechanism 500 will transfer the cleaning chip 2000 from the cleaning site 15 to the biochemical site 12, complete the cleaning, and then transfer the chip 2000 that needs to undergo a biochemical reaction to the biochemical site 12 for the biochemical reaction to proceed. Alternatively, the biochemical site 12 may not be cleaned, and the chip 2000 that needs to undergo a biochemical reaction may be transferred to the biochemical site 12 for the biochemical reaction to proceed. Multiple imaging positions 11 can be provided to allow multiple chips 2000 to perform sequencing imaging on various imaging positions 11. Specifically, for a chip 2000 that needs sequencing imaging, when an imaging position 11 is idle (no chip 2000 is performing sequencing imaging at that imaging position 11), the chip grasping mechanism 500 transfers the chip 2000 that needs sequencing imaging to the idle imaging position 11 for sequencing imaging. Multiple cleaning chips 2000 can be placed on the cleaning position 15. Alternatively, multiple cleaning positions 15 can be provided, with one cleaning chip 2000 placed in each cleaning position 15, so that the chip grasping mechanism 500 can transfer each cleaning chip 2000 to the biochemical position 12 that needs cleaning. Specifically, for a biochemical position 12 that needs cleaning, when there is a cleaning chip 2000 on the cleaning position 15, the chip grasping mechanism 500 transfers the cleaning chip 2000 to the biochemical position 12 that needs cleaning for cleaning. By implementing the above scheme, setting more biochemical sites 12, and / or more imaging sites 11, and / or more cleaning chips 2000, more sequencing processes can be performed simultaneously, such as multiple biochemical reaction processes, and / or multiple sequencing imaging processes, and / or multiple cleaning processes, thereby further improving sequencing efficiency.

[0095] In this embodiment, an initial position can be set, such as the position above the loading position 13. After the chip gripping mechanism 500 completes one gripping and placing operation of the chip 2000, the chip gripping mechanism 500 returns to the initial position. For the next gripping and placing operation of the chip 2000, the chip gripping mechanism 500 starts from the initial position and performs the gripping and placing operation of the chip 2000. Alternatively, after each gripping and placing operation of the chip 2000, the third-party motion mechanism 400 moves the chip gripping mechanism 500 upwards. The chip gripping mechanism 500 stops at this position, and for the next gripping and placing operation of the chip 2000, the chip gripping mechanism 500 starts from this position and performs the gripping and placing operation of the chip 2000.

[0096] For some specific embodiments of this utility model, please refer to Figures 1 to 5 The first directional motion mechanism 200 includes a first drive member 210, a timing belt assembly 220 and a moving plate 230. The first drive member 210 is mounted on the frame 100. The timing belt assembly 220 is connected to the first drive member 210. The moving plate 230 moves under the drive of the timing belt assembly 220. The second directional motion mechanism 300 is mounted on the moving plate 230.

[0097] The timing belt assembly 220 is mounted on the frame 100, and the first drive unit 210 can drive the timing belt assembly 220 to rotate. If the first drive unit 210 is a motor, the output shaft of the motor is connected to the timing belt assembly 220, and when the motor is working, it drives the timing belt assembly 220 to rotate through the output shaft.

[0098] The movable plate 230 is mounted on the synchronous belt assembly 220. When the synchronous belt assembly 220 rotates, the movable plate 230 moves in the first direction because it is mounted on the synchronous belt assembly 220. The second direction motion mechanism 300 moves in the first direction because it is mounted on the movable plate 230. The third direction motion mechanism 400 is connected to the second direction motion mechanism 300, and the second direction motion mechanism 300 moves in the first direction. The chip gripping mechanism 500 moves in the first direction because it is mounted on the third direction motion mechanism 400.

[0099] For some specific embodiments of this utility model, please refer to Figures 1 to 3 , Figure 5The timing belt assembly 220 includes a first timing pulley 224 and a second timing pulley disposed on the frame 100, and a timing belt 221 wound around the first timing pulley 224 and the second timing pulley, with a moving plate 230 disposed on the timing belt 221.

[0100] The timing belt assembly 220 also includes a first fixed seat and a second fixed seat, which are mounted on the frame 100 and located on opposite sides of the same side of the frame 100. A first timing pulley 224 is mounted on the first fixed seat, which provides support for the first timing pulley 224. A second timing pulley is mounted on the second fixed seat, which provides support for the second timing pulley.

[0101] The synchronous belt assembly 220 also includes a first reduction pulley, a second reduction pulley 222, and a reduction belt 223 wound around the first and second reduction pulleys 222. The first reduction pulley is connected to and coaxially arranged with the first drive member 210, and the second reduction pulley 222 is connected to and coaxially arranged with the second synchronous pulley. The first drive member 210 transmits power to the second synchronous pulley through the first and second reduction pulleys 222. The second synchronous pulley then cooperates with the first synchronous pulley 224 to drive the synchronous belt 221 to rotate. This allows for better control of motion precision and avoids situations where excessive power causes the synchronous belt 221 to rotate too fast, preventing the moving plate 230 from moving reliably.

[0102] The synchronous belt 221 is wound around the first synchronous pulley 224 and the second synchronous pulley, and the synchronous belt 221 is set in the same direction as the first direction. Specifically, when the synchronous belt 221 rotates in both directions, it drives the moving plate 230 to move back and forth in the first direction. When the synchronous belt 221 rotates, since the moving plate 230 is set on the synchronous belt 221, the synchronous belt 221 drives the moving plate 230 to move in the first direction. Since the second-direction motion mechanism 300 is set on the moving plate 230, the moving plate 230 drives the second-direction motion mechanism 300 to move in the first direction. Since the third-direction motion mechanism 400 is connected to the second-direction motion mechanism 300, the second-direction motion mechanism 300 drives the third-direction motion mechanism 400 to move in the first direction. Since the chip gripping mechanism 500 is set on the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the chip gripping mechanism 500 to move in the first direction. In this embodiment, the first direction motion mechanism 200 adopts the movement mode of the synchronous belt 221, which can meet the movement requirements of long stroke, while occupying little space, having low cost, and high movement reliability.

[0103] For some specific embodiments of this utility model, please refer to Figure 2 The moving plate 230 is provided with a first tooth, and the timing belt 221 is provided with a second tooth that matches and connects with the first tooth.

[0104] pass Figure 2 The perspective view shows that the movable plate 230 has a first toothed portion at the part that contacts the timing belt 221. The inner ring of the timing belt 221 contacts the movable plate 230, therefore the inner ring of the timing belt 221 has a second toothed portion. The outer ring of the timing belt 221, since it does not contact the movable plate 230, does not have a second toothed portion. Alternatively, the outer ring of the timing belt 221 can contact the movable plate 230, therefore the outer ring of the timing belt 221 has a second toothed portion, while the inner ring of the timing belt 221, since it does not contact the movable plate 230, does not have a second toothed portion. When the timing belt 221 rotates, the engagement of the first and second teeth causes the timing belt 221 to drive the movable plate 230 to move.

[0105] For example, the first tooth is a triangular protrusion, and the second tooth is a triangular protrusion. Alternatively, the first tooth is a trapezoidal protrusion, and the second tooth is a trapezoidal protrusion. Alternatively, the first tooth is a protrusion that is narrow near the synchronous belt 221 and wide away from the synchronous belt 221, and the second tooth is a protrusion that is narrow near the moving plate 230 and wide away from the moving plate 230.

[0106] For some specific embodiments of this utility model, please refer to Figures 1 to 3 , Figure 5 The first directional motion mechanism 200 also includes a first guide rail 240 fixedly disposed on opposite sides of the frame 100 and a first guide block 250 disposed on the first guide rail 240. One end of the moving plate 230 is connected to the first guide block 250 on one side of the frame, and the other end is connected to the first guide block 250 on the other side of the frame.

[0107] The first guide rail 240 is oriented in the same direction as the first direction. During the movement of the movable plate 230, the movable plate 230 drives the first guide block 250 to move on the first guide rail 240. The first guide block 250 and the first guide rail 240 cooperate to provide guidance for the movable plate 230, thereby ensuring the movement accuracy of the movable plate 230. Furthermore, by setting the first guide block 250 and the first guide rail 240, and placing the movable plate 230 on the first guide block 250, a better support function is provided for the movable plate 230, ensuring its smooth movement.

[0108] For some specific embodiments of this utility model, please refer to Figure 1 , Figures 3 to 5 The second directional motion mechanism 300 includes a second drive member 310 and a first connecting component. The second drive member 310 is connected to the first directional motion mechanism 200, and the first connecting component is connected to the second drive member 310. The third directional motion mechanism 400 is disposed on the first connecting component.

[0109] Specifically, the second drive element 310 is mounted on the moving plate 230 of the first direction motion mechanism 200.

[0110] The first connecting component is mounted on the movable plate 230, and the second driving component 310 can drive the first connecting component to move. If the second driving component 310 is a motor, the output shaft of the motor is connected to the first connecting component. When the motor is working, it drives the first connecting component to move in the second direction through the output shaft.

[0111] When the first connecting component moves, since the third-party motion mechanism 400 is mounted on the first connecting component, the first connecting component drives the third-party motion mechanism 400 to move in the second direction. Since the chip gripping mechanism 500 is mounted on the third-party motion mechanism 400, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move in the second direction.

[0112] For some specific embodiments of this utility model, please refer to Figure 1 , Figures 3 to 5 The first connecting component includes a first connecting plate 321 and a fixing plate 322. The first connecting plate 321 is disposed on the first directional motion mechanism 200 and connected to the second driving member 310. The fixing plate 322 is disposed on the first directional motion mechanism 200 and fixedly connected to the first connecting plate 321. The third directional motion mechanism 400 is disposed on the fixing plate 322.

[0113] Specifically, the first connecting plate 321 is disposed on the moving plate 230 of the first direction motion mechanism 200, and the fixing liquid 322 is disposed on the moving plate 230 of the first direction motion mechanism 200.

[0114] The second driving member 310 drives the first connecting plate 321 to move in the second direction. Since the fixed plate 322 is fixedly connected to the first connecting plate 321, the first connecting plate 321 drives the fixed plate 322 to move in the second direction. Since the third-direction motion mechanism 400 is set on the fixed plate 322, the fixed plate 322 drives the third-direction motion mechanism 400 to move in the second direction. Since the chip gripping mechanism 500 is set on the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the chip gripping mechanism 500 to move in the second direction. The third-direction motion mechanism 400 is set on the fixed plate 322, rather than on the first connecting plate 321. When the second driving member 310 drives the first connecting plate 321 to move, the first connecting plate 321 does not directly drive the third-direction motion mechanism 400 to move, but indirectly drives the third-direction motion mechanism 400 to move through the fixed plate 322. The power transmission is more reliable, thereby achieving more precise movement accuracy.

[0115] For some specific embodiments of this utility model, please refer to Figures 1 to 3 , Figure 5 The second directional motion mechanism 300 also includes a first lead screw 331 connected to the output shaft of the second drive member 310. The surface of the first lead screw 331 is provided with threads, and the first connecting plate 321 is provided with a threaded hole that matches the first lead screw 331. The first lead screw 331 passes through the threaded hole, and the threads are threadedly connected to the threaded hole.

[0116] The first lead screw 331 is positioned in the same direction as the second direction. The second driving member 310 drives the first lead screw 331 to rotate. Through the engagement of the thread on the first lead screw 331 with the threaded hole on the first connecting plate 321, the first lead screw 331 drives the first connecting plate 321 to move in the second direction. Specifically, when the first lead screw 331 rotates in both directions, it drives the first connecting plate 321 to reciprocate in the second direction. When the first lead screw 331 drives the first connecting plate 321 to move in the second direction, since the fixed plate 322 is fixedly connected to the first connecting plate 321, the first connecting plate 321 drives the fixed plate 322 to move in the second direction. Since the third-party motion mechanism 400 is mounted on the fixed plate 322, the fixed plate 322 drives the third-party motion mechanism 400 to move in the second direction. Since the chip gripping mechanism 500 is mounted on the third-party motion mechanism 400, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move in the second direction.

[0117] Furthermore, the second directional motion mechanism 300 also includes a third fixed base 332. One end of the first lead screw 331 is connected to the output shaft of the second drive member 310, and the other end of the first lead screw 331 is connected to the third fixed base 332. The third fixed base 332 provides support for the first lead screw 331, so that both ends of the first lead screw 331 are supported. When the first lead screw 331 drives the first connecting plate 321 to move, even after long-term use, the first lead screw 331 is not prone to rotational deviation, thus allowing the first connecting plate 321 to move reliably for a long time.

[0118] For some specific embodiments of this utility model, please refer to Figure 1 , Figures 3 to 5 The second directional motion mechanism 300 also includes a second guide rail 340 disposed on the first directional motion mechanism 200 and a second guide block 350 disposed on the second guide rail 340, and a fixing plate 322 disposed on the second guide block 350.

[0119] Specifically, the second guide rail 340 is mounted on the moving plate 230 of the first direction motion mechanism 200.

[0120] The second guide rail 340 is oriented in the same direction as the second direction. During the movement of the fixed plate 322, the fixed plate 322 drives the second guide block 350 to move on the second guide rail 340. The second guide block 350 and the second guide rail 340 cooperate to provide guidance for the fixed plate 322, thereby ensuring the movement accuracy of the fixed plate 322. Furthermore, by setting the second guide block 350 and the second guide rail 340, and placing the fixed plate 322 on the second guide block 350, better support is provided for the fixed plate 322, ensuring smooth movement.

[0121] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 6 The third-party motion mechanism 400 includes a third drive member 410 and a second connecting component. The third drive member 410 is connected to the second motion mechanism, and the second connecting component is connected to the third drive member 410. The chip gripping mechanism 500 is disposed on the second connecting component.

[0122] Specifically, the third drive element 410 is disposed on the first connecting component of the second direction motion mechanism 300.

[0123] The third driving member 410 is disposed on the first connecting assembly, specifically, the third driving member 410 is disposed on the fixed plate 322. The second driving member 310 drives the first connecting plate 321 to move in the second direction, the first connecting plate 321 drives the fixed plate 322 to move in the second direction, and the fixed plate 322 drives the third driving member 410 to move in the second direction.

[0124] The second connecting component is disposed on the first connecting component; specifically, the second connecting component is disposed on the fixed plate 322. The second driving component 310 drives the first connecting plate 321 to move in the second direction, the first connecting plate 321 drives the fixed plate 322 to move in the second direction, and the fixed plate 322 drives the second connecting component to move in the second direction.

[0125] The third driving component 410 can drive the second connecting component to move. If the third driving component 410 is a motor, the motor's drive shaft is connected to the second connecting component. When the motor is working, it drives the second connecting component to move upward in a third direction through the output shaft.

[0126] When the second connecting component moves, since the chip gripping mechanism 500 is mounted on the second connecting component, the second connecting component drives the chip gripping mechanism 500 to move upward on the third side.

[0127] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 6The second connecting component includes a second connecting plate 421 and a movable seat 422. The second connecting plate 421 is connected to the third driving component 410, and the movable seat 422 is fixedly connected to the second connecting plate 421. The chip gripping mechanism 500 is disposed on the movable seat 422.

[0128] The movable seat 422 is disposed on the first connecting assembly; specifically, the movable seat 422 is disposed on the fixed plate 322. The second driving member 310 drives the first connecting plate 321 to move in the second direction, the first connecting plate 321 drives the fixed plate 322 to move in the second direction, the fixed plate 322 drives the movable seat 422 to move in the second direction, and the movable seat 422 drives the second connecting plate 421 to move in the second direction.

[0129] The third driving component 410 drives the second connecting plate 421 to move upward in a third direction. Since the movable seat 422 is fixedly connected to the second connecting plate 421, the second connecting plate 421 drives the movable seat 422 to move upward in a third direction. Since the chip gripping mechanism 500 is mounted on the movable seat 422, the movable seat 422 drives the chip gripping mechanism 500 to move upward in a third direction. The chip gripping mechanism 500 is mounted on the movable seat 422, rather than on the second connecting plate 421. When the third driving component 410 drives the second connecting plate 421 to move, the second connecting plate 421 does not directly drive the chip gripping mechanism 500 to move, but indirectly drives the chip gripping mechanism 500 to move through the movable seat 422. This makes the power transmission more reliable, thereby achieving more precise movement accuracy.

[0130] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 6 The second connecting assembly also includes a second lead screw connected to the output shaft of the third drive member 410. The surface of the second lead screw is provided with threads, and the second connecting plate 421 is provided with a threaded hole that matches the second lead screw. The second lead screw passes through the threaded hole, and the threads are threadedly connected to the threaded hole.

[0131] The second lead screw is oriented in the same direction as the third direction. The third drive member 410 drives the second lead screw to rotate. Through the thread on the second lead screw engaging with the threaded hole on the second connecting plate 421, the second lead screw drives the second connecting plate 421 to move upward in the third direction. Specifically, when the second lead screw rotates in both directions, it drives the second connecting plate 421 to reciprocate upward in the third direction. When the second lead screw drives the second connecting plate 421 to move upward in the third direction, since the movable seat 422 is fixedly connected to the second connecting plate 421, the second connecting plate 421 drives the movable seat 422 to move upward in the third direction. Since the chip gripping mechanism 500 is mounted on the movable seat 422, the movable seat 422 drives the chip gripping mechanism 500 to move upward in the third direction.

[0132] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 6 The third-direction motion mechanism 400 also includes a third guide rail 430 disposed on the second-direction motion mechanism and a third guide block 440 disposed on the third guide rail 430, with the movable seat 422 disposed on the third guide block 440.

[0133] Specifically, the third guide rail 430 is mounted on the first connecting component of the second direction motion mechanism 300.

[0134] The third guide rail 430 is disposed on the first connecting assembly, specifically on the fixed plate 322. The second driving member 310 drives the first connecting plate 321 to move in the second direction, the first connecting plate 321 drives the fixed plate 322 to move in the second direction, and the fixed plate 322 drives the third guide rail 430 to move in the second direction. Since the movable seat 422 is disposed on the third guide block 440 located on the third guide rail 430, the movable seat 422 moves in the second direction, and the movable seat 422 drives the second connecting plate 421 to move in the second direction.

[0135] The third guide rail 430 is oriented in the same direction as the third direction. During the movement of the movable seat 422 in the third direction, the movable seat 422 drives the third guide block 440 to move on the third guide rail 430. The third guide block 440 and the third guide rail 430 cooperate to provide guidance for the movable seat 422, thereby ensuring the movement accuracy of the movable seat 422. Furthermore, by setting the third guide block 440 and the third guide rail 430, and placing the movable seat 422 on the third guide block 440, better support is provided for the movable seat 422, ensuring its smooth movement.

[0136] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip gripping mechanism 500 includes a first gripper drive 510 and a first gripper. The first gripper drive 510 is connected to a third-party directional motion mechanism. The first gripper is connected to the first gripper drive 510. The first gripper includes a first gripper member 521 and a second gripper member 522 that are arranged opposite to each other. Under the drive of the first gripper drive 510, the first gripper member 521 and the second gripper member 522 move closer to each other or further away from each other to grip or place the chip 2000.

[0137] Specifically, the first gripper drive 510 is disposed on the second connecting component of the third-party directional motion mechanism.

[0138] The first gripper drive 510 is disposed on the second connecting assembly. Specifically, the first gripper drive 510 is disposed on the movable seat 422. The third drive 410 drives the second connecting plate 421 to move upward in a third direction. The second connecting plate 421 drives the movable seat 422 to move upward in a third direction. The movable seat 422 drives the first gripper drive 510 to move upward in a third direction.

[0139] The first gripper 521 has an inwardly curved first claw tip 5211, and the second gripper 522 has an inwardly curved second claw tip 5221. Under the drive of the first gripper drive 510, the first gripper 521 and the second gripper 522 move closer to each other, and the chip 2000 can be gripped through the first claw tip 5211 and the second claw tip 5221.

[0140] Driven by the first directional motion mechanism 200 and the second directional motion mechanism 300, the chip gripping mechanism 500 moves to a position above the chip 2000 to be gripped. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other. Then, the third directional motion mechanism 400 drives the chip gripping mechanism 500 to move upward or downward in the third direction. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move closer to each other. The first claw tip 5211 and the second claw tip 5221 grip the chip. Take chip 2000, and then the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move upward in the third direction. Driven by the first direction motion mechanism 200 and the second direction motion mechanism 300, the chip gripping mechanism 500 moves to the position above where chip 2000 needs to be placed. Then, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move upward in the third direction. The first gripper drive member 510 drives the first gripper member 521 and the second gripper member 522 to move away from each other to place chip 2000.

[0141] Describe the workflow of the chip gripping mechanism 500 in conjunction with workstation 10.

[0142] For example, to transfer chip 2000 from loading position 13 to biochemical position 12, the chip gripping mechanism 500 moves to a position above loading position 13, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other. Then, the third directional motion mechanism 400 drives the chip gripping mechanism 500 to move upwards or downwards, and the first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move closer together, gripping chip 2000 through the first claw tip 5211 and the second claw tip 5221. Then, the third directional motion mechanism 400 drives the chip gripping mechanism 500 to move upwards, and driven by the first directional motion mechanism 200 and the second directional motion mechanism 300, the chip gripping mechanism 500 moves to a position above biochemical position 12. Then, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move upward or downward in the third party. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other so as to place the chip 2000 on the biochemical position 12.

[0143] For example, to transfer chip 2000 from biochemical position 12 to imaging position 11, the chip gripping mechanism 500 moves above biochemical position 12, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other. Then, the third directional motion mechanism 400 moves the chip gripping mechanism 500 upwards or downwards, and the first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move closer together, gripping chip 2000 through the first claw tip 5211 and the second claw tip 5221. Then, the third directional motion mechanism 400 moves the chip gripping mechanism 500 upwards or upwards, and driven by the first directional motion mechanism 200 and the second directional motion mechanism 300, the chip gripping mechanism 500 moves above imaging position 11. Then, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move upward or downward in the third party. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other so as to place the chip 2000 on the photo position 11.

[0144] For example, to transfer chip 2000 from camera position 11 to retrieval position 14, the chip gripping mechanism 500 moves above camera position 11, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other. Then, the third directional motion mechanism 400 moves the chip gripping mechanism 500 upwards or downwards, while the first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move closer together, gripping chip 2000 through the first claw tip 5211 and the second claw tip 5221. Finally, the third directional motion mechanism 400 moves the chip gripping mechanism 500 upwards or upwards, and driven by the first directional motion mechanism 200 and the second directional motion mechanism 300, the chip gripping mechanism 500 moves above retrieval position 14. Then, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move upward or downward in the third party. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other, so as to place the chip 2000 on the recycling position 14.

[0145] For example, to transfer the cleaning chip 2000 from cleaning position 15 to biochemical position 12, the chip gripping mechanism 500 moves to a position above cleaning position 15, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other. Then, the third directional motion mechanism 400 drives the chip gripping mechanism 500 to move upwards or downwards in the third direction. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move closer together, gripping the cleaning chip 2000 through the first claw tip 5211 and the second claw tip 5221. Then, the third directional motion mechanism 400 drives the chip gripping mechanism 500 to move upwards in the third direction. Driven by the first directional motion mechanism 200 and the second directional motion mechanism 300, the chip gripping mechanism 500 moves to a position above biochemical position 12. Then, the third-party motion mechanism 400 drives the chip gripping mechanism 500 to move upward or downward in the third party. The first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other, so as to place the cleaning chip 2000 on the biochemical position 12.

[0146] For some specific embodiments of this utility model, please refer to Figure 8 and Figure 9 The first gripper 521 and the second gripper 522 are both provided with a first positioning pin 523. When the first gripper 521 and the second gripper 522 are close to each other or far away from each other, the first positioning pin 523 contacts or moves away from the positioning groove 2100 of the chip 2000.

[0147] In the first gripper 521, a first positioning pin 523 is disposed on the first gripper tip 5211; in the second gripper 522, the first positioning pin 523 is disposed on the second gripper tip 5221. When the first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move closer together, the first positioning pin 523 contacts the positioning groove 2100 of the chip 2000, and the first gripper tip 5211 and the second gripper tip 5221 hold the chip 2000, thereby achieving the gripping of the chip 2000. When the first gripper drive 510 drives the first gripper 521 and the second gripper 522 to move away from each other, the first positioning pin 523 disengages from the positioning groove 2100 of the chip 2000, thereby achieving the placement of the chip 2000. By setting the first positioning pin 523, the accuracy requirements for gripping the chip 2000 are met, and the situation where the chip 2000 falls due to power failure is prevented.

[0148] For some specific embodiments of this utility model, please refer to Figure 10 The chip 2000 has multiple positioning slots 2100, each having a first shape and a second shape, which are different from each other. For example, the chip 2000 has positioning slots 2100 at each of its four ends. The positioning slots 2100 located at both ends of one long side of the chip 2000 are rectangular and triangular, respectively, while the positioning slots 2100 located at both ends of the other long side of the chip 2000 are also rectangular and triangular, respectively. Two rectangular slots and two triangular slots are opposite each other. By providing multiple positioning slots 2100 with different shapes, the accuracy of grasping the chip 2000 can be further improved.

[0149] For some specific embodiments of this utility model, please refer to Figure 10 The chip 2000 has positioning holes 2200 and anti-fooling holes 2300 at both ends. Please refer to... Figure 11 Workstation 10 is equipped with a worktable, on which a positioning shaft 730 that mates with the positioning hole 2200 and a foolproof shaft 740 that mates with the foolproof hole 2300 are installed. When the chip 2000 is placed on workstation 10, the positioning shaft 730 is inserted into the positioning hole 2200 to position the chip 2000, and the foolproof shaft 740 is inserted into the foolproof hole 2300 to prevent the chip 2000 from being fooled.

[0150] Alternatively, the chip 2000 may have a positioning axis and a foolproof axis at both ends. The workstation 10 is equipped with a worktable, which has positioning holes that mate with the positioning axes and foolproof holes that mate with the foolproof axes. When the chip 2000 is placed on the workstation 10, the positioning axis inserts into the positioning hole to position the chip 2000, and the foolproof axis inserts into the foolproof hole to prevent the chip 2000 from being fooled.

[0151] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip gripping mechanism 500 also includes a mounting base 530, a second gripper drive 540, and a second gripper. The mounting base 530 is connected to a third-direction motion mechanism 400. The first gripper drive 510 is mounted on the mounting base 530, and the second gripper drive 540 is mounted on the mounting base 530. The second gripper is connected to the second gripper drive 540. The second gripper includes a third gripper 551 and a fourth gripper 552 that are arranged opposite to each other. Under the drive of the second gripper drive 540, the third gripper 551 and the fourth gripper 552 move closer to each other or further away from each other to grip or place the chip 2000.

[0152] Specifically, the mounting base 530 connects to the second connection component of the third-party motion mechanism 400.

[0153] Specifically, the first gripper drive 510 is located on one side of the mounting base 530, and the second gripper drive 540 is located on the other side of the mounting base 530.

[0154] Mounting base 530 connects to the second connecting component; specifically, mounting base 530 connects to movable base 422. Third driving component 410 drives second connecting plate 421 to move upwards in a third direction. Second connecting plate 421 drives movable base 422 to move upwards in a third direction. Movable base 422 drives mounting base 530 to move upwards in a third direction. Mounting base 530 then drives first gripper driving component 510 and second gripper driving component 540 to move upwards in a third direction.

[0155] The third gripper 551 has an inwardly curved third claw tip, and the fourth gripper 552 has an inwardly curved fourth claw tip. Under the drive of the second gripper drive 540, the third gripper 551 and the fourth gripper 552 move closer to each other, and can grasp the chip 2000 through the first claw tip 5211 and the second claw tip 5221.

[0156] Driven by the first directional motion mechanism 200 and the second directional motion mechanism 300, the second gripper drive 540 moves to a position above the chip 2000 to be gripped. The second gripper drive 540 then drives the third gripper 551 and the fourth gripper 552 to move away from each other. Next, the third directional motion mechanism 400 drives the second gripper drive 540 to move upwards or downwards in the third direction, causing the third gripper 551 and the fourth gripper 552 to move closer together. The chip 2000 is then gripped by the tips of the third and fourth grippers. Then, the third-party motion mechanism 400 drives the second gripper drive 540 to move upward in the third direction, such as moving upward. Driven by the first direction motion mechanism 200 and the second direction motion mechanism 300, the second gripper drive 540 moves to the position above where the chip 2000 needs to be placed. Then, the third-party motion mechanism 400 drives the second gripper drive 540 to move upward in the third direction, such as moving downward. The second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move away from each other in order to place the chip 2000.

[0157] The workflow of the second gripper drive 540 and the second gripper is described in conjunction with station 10.

[0158] For example, to transfer chip 2000 from loading position 13 to biochemical position 12, the second gripper drive 540 moves to a position above loading position 13, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The second gripper drive 540 then drives the third gripper 551 and the fourth gripper 552 to move away from each other. Next, the third directional motion mechanism 400 drives the second gripper drive 540 to move upwards or downwards, while the second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move closer together, gripping chip 2000 through the third and fourth claw tips. Then, the third directional motion mechanism 400 drives the second gripper drive 540 to move upwards or upwards, moving above biochemical position 12, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. Then, the third-party motion mechanism 400 drives the second gripper drive 540 to move upward or downward in the third party. The second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move away from each other, so as to place the chip 2000 on the biochemical position 12.

[0159] For example, to transfer chip 2000 from biochemical position 12 to imaging position 11, the second gripper drive 540 moves above biochemical position 12, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The second gripper drive 540 then drives the third gripper 551 and the fourth gripper 552 to move away from each other. Next, the third directional motion mechanism 400 moves the second gripper drive 540 upwards (or downwards) in the third direction, driving the third gripper 551 and the fourth gripper 552 to move closer together, gripping chip 2000 through the third and fourth claw tips. Then, the third directional motion mechanism 400 moves the second gripper drive 540 upwards (or upwards) in the third direction, moving above imaging position 11, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. Next, the third-party motion mechanism 400 drives the second gripper drive 540 to move upward or downward in the third party. The second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move away from each other so as to place the chip 2000 on the camera position 11.

[0160] For example, to transfer chip 2000 from image capture position 11 to retrieval position 14, the second gripper drive 540 moves above image capture position 11, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The second gripper drive 540 then drives the third gripper 551 and the fourth gripper 552 to move away from each other. Next, the third directional motion mechanism 400 moves the second gripper drive 540 upwards (or downwards) in the third direction, driving the third gripper 551 and the fourth gripper 552 to move closer together, gripping chip 2000 through the tips of the third and fourth grippers. Then, the third directional motion mechanism 400 moves the second gripper drive 540 upwards (or upwards) in the third direction, moving above retrieval position 14, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. Then, the third-party motion mechanism 400 drives the second gripper drive 540 to move upward or downward in the third party. The second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move away from each other, so as to place the chip 2000 on the recycling position 14.

[0161] For example, to transfer the cleaning chip 2000 from cleaning position 15 to biochemical position 12, the second gripper drive 540 moves above cleaning position 15, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. The second gripper drive 540 then drives the third gripper 551 and the fourth gripper 552 to move away from each other. Next, the third directional motion mechanism 400 moves the second gripper drive 540 upwards or downwards, driving the third gripper 551 and the fourth gripper 552 closer together, gripping the cleaning chip 2000 through the third and fourth claw tips. Then, the third directional motion mechanism 400 moves the second gripper drive 540 upwards or upwards, moving it above biochemical position 12, driven by the first directional motion mechanism 200 and the second directional motion mechanism 300. Next, the third-party motion mechanism 400 drives the second gripper drive 540 to move upward or downward in the third party. The second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move away from each other, so as to place the cleaning chip 2000 on the biochemical position 12.

[0162] In this embodiment, the chip gripping mechanism 500 is equipped with two sets of gripper mechanisms, which expands the application scenarios. For example, one set of gripper mechanisms can grip chip 2000, and the other set of gripper mechanisms can place chip 2000, or the two sets of gripper mechanisms can first grip chip 2000 and then place chip 2000 in sequence, etc. This can shorten the movement path of the chip gripping mechanism 500, reduce the time for gripping and placing chip 2000, and greatly improve efficiency.

[0163] In some specific embodiments of this utility model, both the third gripper 551 and the fourth gripper 552 are provided with a second positioning pin. When the third gripper 551 and the fourth gripper 552 approach each other or move away from each other, the second positioning pin contacts or disengages from the positioning groove 2100 of the chip 2000.

[0164] In the third gripper 551, the second positioning pin is disposed on the tip of the third gripper; in the fourth gripper 552, the second positioning pin is disposed on the tip of the fourth gripper. When the second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move closer together, the second positioning pin contacts the positioning groove 2100 of the chip 2000, and the tips of the third and fourth grippers hold the chip 2000, thereby achieving the gripping of the chip 2000. When the second gripper drive 540 drives the third gripper 551 and the fourth gripper 552 to move away from each other, the second positioning pin disengages from the positioning groove 2100 of the chip 2000, thereby achieving the placement of the chip 2000. By setting the second positioning pin, the accuracy requirements for gripping the chip 2000 are met, and the situation where the chip 2000 falls due to power failure is prevented.

[0165] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip gripping mechanism 500 also includes a first connecting block 571, a first pressing plate 572, and a first elastic element 573. The first connecting block 571 is disposed on the first gripper drive member 510, the first pressing plate 572 is disposed on the mounting base 530, and the first elastic element 573 is disposed between the first connecting block 571 and the first pressing plate 572.

[0166] The first elastic element 573 may include, but is not limited to, a spring, a sheet, a rubber ring, or a rubber sheet.

[0167] The third-direction motion mechanism 400 drives the mounting base 530 to move upward in a third direction. Simultaneously, the mounting base 530 drives the first gripper drive 510, the first connecting block 571, the first pressing plate 572, and the first elastic element 573 to move upward in a third direction. During this movement, the first gripper drive 510, the first connecting block 571, the first pressing plate 572, and the first elastic element 573 remain stationary relative to each other. Then, the first gripper drive 510 drives the first gripper to contact the chip 2000, and the first elastic element 573 provides elastic clearance, enabling the first gripper drive 510 and the first gripper to float and press against the chip 2000, thereby preventing damage to the chip 2000.

[0168] In one embodiment, after the chip gripping mechanism 500 places the chip 2000 on the workstation 10, the chip 2000 is adsorbed onto the workstation 10 using a vacuum adsorption method. For example, the workstation 10 is equipped with an adsorption platform connected to a vacuum pump. After the chip 2000 is placed on the adsorption platform, the vacuum pump removes the air from the adsorption platform, allowing the chip 2000 to adhere to it. By setting a first connecting block 571, a first pressing plate 572, and a first elastic member 573 disposed between the first connecting block 571 and the first pressing plate 572, the first gripper drive member 510 and the first gripper can float and press the chip 2000, ensuring that the chip 2000 is not damaged while also facilitating the first gripper to smoothly grip the chip 2000.

[0169] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip gripping mechanism 500 also includes a fourth guide rail 561 disposed on the mounting base 530 and a fourth guide block 562 disposed on the fourth guide rail 561, and a first connecting block 571 disposed between the first gripper drive member 510 and the fourth guide block 562.

[0170] The fourth guide rail 561 is oriented in the same direction as the third direction. After the first gripper drive 510 drives the first gripper to contact the chip 2000, the first elastic member 573 provides elastic clearance, and the first gripper drive 510 moves away from the chip 2000. The first gripper drive 510 drives the fourth guide block 562 to move on the fourth guide rail 561 through the first connecting block 571. The fourth guide block 562 and the fourth guide rail 561 cooperate to provide guidance for the first gripper drive 510, thereby ensuring the movement accuracy of the first gripper drive 510. In addition, by setting the fourth guide block 562 and the fourth guide rail 561, it can be ensured that the first gripper drive 510, the first gripper, and the first connecting block 571 float in the third direction. The fourth guide rail 561 is set on the mounting base 530, and the fourth guide rail 561, through the fourth guide block 562, can provide good support for the first gripper drive 510, the first gripper, and the first connecting block 571.

[0171] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip gripping mechanism 500 also includes a second connecting block 591, a second pressing plate 592, and a second elastic member 593. The second connecting block 591 is disposed on the second gripper drive member 540, the second pressing plate 592 is disposed on the mounting base 530, and the second elastic member 593 is disposed between the second connecting block 591 and the second pressing plate 592.

[0172] Specifically, the first pressing plate 572 is located on one side of the mounting base 530, and the second pressing plate 592 is located on the other side of the mounting base 530.

[0173] The second elastic element 593 may include, but is not limited to, a spring, a sheet, a rubber ring, or a rubber sheet.

[0174] The third-direction motion mechanism 400 drives the mounting base 530 to move upward in a third direction. Simultaneously, the mounting base 530 drives the second gripper drive 540, the second connecting block 591, the second pressing plate 592, and the second elastic member 593 to move upward in a third direction. During this movement, the second gripper drive 540, the second connecting block 591, the second pressing plate 592, and the second elastic member 593 remain stationary relative to each other. Then, the second gripper drive 540 drives the second gripper to contact the chip 2000, and the second elastic member 593 provides elastic clearance, enabling the second gripper drive 540 and the second gripper to float and press against the chip 2000, thereby preventing damage to the chip 2000.

[0175] In one embodiment, after the chip gripping mechanism 500 places the chip 2000 on the workstation 10, the chip 2000 is adsorbed onto the workstation 10 using a vacuum adsorption method. For example, the workstation 10 is equipped with an adsorption platform connected to a vacuum pump. After the chip 2000 is placed on the adsorption platform, the vacuum pump removes the air from the adsorption platform, allowing the chip 2000 to adhere to it. By setting a second connecting block 591, a second pressing plate 592, and a second elastic member 593 disposed between the second connecting block 591 and the second pressing plate 592, the second gripper drive member 540 and the second gripper can achieve floating pressure on the chip 2000, ensuring that the chip 2000 is not damaged while also facilitating the smooth gripping of the chip 2000 by the second gripper.

[0176] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip gripping mechanism 500 also includes a fifth guide rail 581 disposed on the other side of the mounting base 530 and a fifth guide block 582 disposed on the fifth guide rail 581, and a second connecting block 591 disposed between the second gripper drive member 540 and the fifth guide block 582.

[0177] The fifth guide rail 581 is oriented in the same direction as the third direction. After the second gripper drive 540 drives the second gripper to contact the chip 2000, the second elastic member 593 provides elastic clearance, and the second gripper drive 540 moves away from the chip 2000. The second gripper drive 540 drives the fifth guide block 582 to move on the fifth guide rail 581 through the second connecting block 591. The fifth guide block 582 and the fifth guide rail 581 cooperate to provide guidance for the second gripper drive 540, thereby ensuring the movement accuracy of the second gripper drive 540. In addition, by setting the fifth guide block 582 and the fifth guide rail 581, it can be ensured that the second gripper drive 540, the second gripper, and the second connecting block 591 float in the third direction. The fifth guide rail 581 is set on the mounting base 530, and the fifth guide rail 581, through the fifth guide block 582, can provide good support for the second gripper drive 540, the second gripper, and the second connecting block 591.

[0178] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The chip transfer device 1000 also includes a rotating mechanism 600 connected to a third-party directional motion mechanism 400, and a chip gripping mechanism 500 is disposed on the rotating mechanism 600.

[0179] Because the second-direction motion mechanism 300 is connected to the first-direction motion mechanism 200, the first-direction motion mechanism 200 drives the second-direction motion mechanism 300 to move in the first direction. Because the third-direction motion mechanism 400 is connected to the second-direction motion mechanism 300, the second-direction motion mechanism 300 drives the third-direction motion mechanism 400 to move in the first direction. Because the rotation mechanism 600 is connected to the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the rotation mechanism 600 to move in the first direction. Because the chip gripping mechanism 500 is mounted on the rotation mechanism 600, the rotation mechanism 600 drives the chip gripping mechanism 500 to move in the first direction. Because the third-direction motion mechanism 400 is connected to the second-direction motion mechanism 300, the second-direction motion mechanism 300 drives the third-direction motion mechanism 400 to move in the second direction. Because the rotation mechanism 600 is connected to the third-direction motion mechanism 400, the third-direction motion mechanism 400 drives the rotation mechanism 600 to move in the second direction. Because the chip gripping mechanism 500 is mounted on the rotation mechanism 600, the rotation mechanism 600 drives the chip gripping mechanism 500 to move in the second direction. Since the rotating mechanism 600 is mounted on the third-party motion mechanism 400, the third-party motion mechanism 400 drives the rotating mechanism 600 to move upwards in the third direction. Since the chip gripping mechanism 500 is mounted on the rotating mechanism 600, the rotating mechanism 600 drives the chip gripping mechanism 500 to move upwards in the third direction. Since the chip gripping mechanism 500 is mounted on the rotating mechanism 600, the rotating mechanism 600 drives the chip gripping mechanism 500 to rotate.

[0180] Under the movement of the first direction motion mechanism 200, the second direction motion mechanism 300, the third direction motion mechanism 400, and the rotation mechanism 600, the chip gripping mechanism 500 can be driven to move upward in the first, second, and third directions, and can also be driven to rotate, realizing the multi-dimensional movement of the chip gripping mechanism 500. This enables the chip gripping mechanism 500 to grip the chip 2000 at any station 10 and place the chip 2000 at any other station 10. In addition, it can meet some scenarios, such as gripping the chip 2000 at one station 10, rotating the direction of the chip 2000 at another station 10, and then placing the chip 2000, or gripping the chip 2000 after rotating the direction at one station 10 and placing the chip 2000 at another station 10.

[0181] Furthermore, when the chip gripping mechanism 500 employs two sets of gripper mechanisms, the mounting base 530 is mounted on the rotating mechanism 600. As the rotating mechanism 600 rotates, it drives the mounting base 530 to rotate. The mounting base 530, with itself as the center, drives the two sets of gripper mechanisms to rotate, making these two sets of gripper mechanisms more flexible. This further shortens the movement path, reduces the time spent gripping and placing the chip 2000, and significantly improves efficiency.

[0182] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The rotating mechanism 600 includes a rotating drive 610 and a connecting seat 620. The rotating drive 610 is connected to a third-party directional motion mechanism 400, and the connecting seat 620 is connected to the rotating drive 610. The chip gripping mechanism 500 is disposed on the connecting seat 620.

[0183] The rotary drive 610 is connected to the third-party motion mechanism 400. Specifically, the movable seat 422 has a square structure that runs vertically through the rotary drive 610 and surrounds it. The movable seat 422 provides support for the rotary drive 610 and can also provide a certain degree of protection for the rotary drive 610.

[0184] The rotary drive 610 can be connected to the mounting base 620 for rotation. If the rotary drive 610 is a rotary motor, the output shaft of the rotary motor is connected to the mounting base 620. When the rotary motor is working, it drives the mounting base 620 to rotate through the output shaft.

[0185] When the connector 620 rotates, the chip gripping mechanism 500 is mounted on the connector 620, and the connector 620 drives the chip gripping mechanism 500 to rotate.

[0186] Furthermore, when the chip gripping mechanism 500 employs two sets of gripper mechanisms, the mounting base 530 is mounted on the connecting base 620. When the connecting base 620 rotates, the connecting base 620 drives the mounting base 530 to rotate. The mounting base 530, with itself as the center, drives the two sets of gripper mechanisms to rotate, making the two sets of gripper mechanisms more flexible. This further shortens the movement path, reduces the time for gripping and placing the chip 2000, and greatly improves efficiency.

[0187] For some specific embodiments of this utility model, please refer to Figure 1 , Figure 6 and Figure 7 The output shaft of the rotary drive 610 is provided with a drive gear 631, and the rotary mechanism 600 also includes a driven gear 632 that meshes with the drive gear 631 and is coaxially arranged with the connecting seat 620.

[0188] When the rotary drive 610 is working, the rotary drive 610 drives the driven gear 632 to rotate through the driving gear 631. Since the connecting seat 620 is set on the driven gear 632, the driven gear 632 drives the connecting seat 620 to rotate. Since the chip gripping mechanism 500 is set on the connecting seat 620, the connecting seat 620 drives the chip gripping mechanism 500 to rotate.

[0189] In some specific embodiments of this utility model, the rotating mechanism 600 further includes a drive gear connected to the output shaft of the rotating drive member 610, and a driven gear 632 meshing with the drive gear and coaxially arranged with the connecting seat 620.

[0190] When the rotary drive 610 is working, the rotary drive 610 drives the drive gear to rotate. Since the drive gear and the driven gear 632 mesh with each other, the drive gear drives the driven gear 632 to rotate. Since the connecting seat 620 is set on the driven gear 632, the driven gear 632 drives the connecting seat 620 to rotate. Since the chip gripping mechanism 500 is set on the connecting seat 620, the connecting seat 620 drives the chip gripping mechanism 500 to rotate.

[0191] Please refer to Figure 1 , Figure 11 and Figure 12 The present invention provides a workstation layout device that works in conjunction with the chip transfer device 1000 described in any of the above embodiments. The workstation layout device includes at least one first workstation, on which at least one biochemical station 12, at least one photographing station 11, at least one loading station 13, and at least one cleaning station 15 are provided. The workstation layout device also includes at least one second workstation or hopper, on which at least one recycling station 14 is provided.

[0192] The first workstation can be set up with at least one biochemical station 12, at least one photographing station 11, at least one loading station 13 and at least one cleaning station 15.

[0193] Multiple first workstations can be provided, and the number of first workstations is consistent with the total number of biochemical workstations 12, photographic workstations 11, feeding workstations 13, and cleaning workstations 15. At least one biochemical workstation 12, at least one photographic workstation 11, at least one feeding workstation 13, and at least one cleaning workstation 15 are respectively set on the first workstation. Alternatively, multiple first workstations can be provided, but the total number of first workstations is not consistent with the total number of biochemical workstations 12, photographic workstations 11, feeding workstations 13, and cleaning workstations 15. Some of the multiple workstations 10 are set on a single first workstation, and some of the single workstations 10 are set on a single first workstation.

[0194] The recycling position 14 can be located on a second workstation. There can be one second workstation, with at least one recycling position 14 located on it. Alternatively, there can be multiple second workstations, with the number of second workstations and recycling positions 14 being the same, and multiple recycling positions 14 being located on different second workstations. Or, there can be multiple second workstations, with the number of second workstations and recycling positions 14 not being the same, and at least one recycling position 14 being located on a single second workstation.

[0195] The recycling position 14 can be set on the container body. There can be one container body, and the recycling position 14 is set on the container body. When the recycling position 14 is set on the container body, the chip gripping mechanism 500 can grip the old chip 2000, move it above the container body, release the old chip 2000, and discard the old chip 2000 into the container body.

[0196] The first workstation may include a first contact stage 710 and a first support foot 720 disposed below the first contact stage 710; the first contact stage 710 has a first table surface 711 for placing the chip 2000; the first support foot 720 provides support for the first contact stage 710 and can raise the first contact stage 710, so that when the chip transfer device 1000 needs to grip or place the chip 2000 on the first contact stage 710, the travel distance can be effectively shortened. Alternatively, the first workstation may only have the first contact stage 710; the first contact stage 710 has a first table surface 711 for placing the chip 2000.

[0197] The second workstation may include a second contact stage and a second support leg disposed below the second contact stage; the second contact stage has a second table surface for placing the chip 2000; the second support leg provides support for the second contact stage and can raise the second contact stage, so that when the chip transfer device 1000 needs to grip or place the chip 2000 on the second contact stage, the travel distance can be effectively shortened. Alternatively, the second workstation may only have a second contact stage; the second contact stage has a second table surface for placing the chip 2000.

[0198] The housing may include a cavity into which the old chip 2000 may fall when the chip gripping mechanism 500 discards the old chip 2000.

[0199] The first and second workstations can be independently set up or they can be designed as a single unit.

[0200] In this embodiment, multiple chips 2000 can be placed at the loading station 13, such as three chips 2000, and a cleaning chip 2000 can be placed at the cleaning station 15. The chip gripping mechanism 500 grips the first chip 2000 at the loading station 13 and places it at the biochemical station 12, where the first chip 2000 undergoes a biochemical reaction. After the biochemical reaction is completed, the chip gripping mechanism 500 grips the first chip 2000 again at the biochemical station 12 and places it at the imaging station 11, where the first chip 2000 undergoes sequencing and imaging. The chip gripping mechanism 500 then grips the cleaning chip 2000 at the cleaning station 15 and places it at the biochemical station 12 to clean the components of the biochemical station 12, such as the inlet and outlet ports. After cleaning is completed, the chip gripping mechanism 500 grips the cleaning chip 2000 again at the biochemical station 12 and places it at the cleaning station 15. The chip grabbing mechanism 500 then grabs the second chip 2000 at the loading station 13 and places it in the biochemical reaction station 12, where the second chip 2000 undergoes a biochemical reaction. Alternatively, the biochemical reaction station 12 is not cleaned; the chip grabbing mechanism 500 grabs the second chip 2000 at the loading station 13 and places it in the biochemical reaction station 12, where the second chip 2000 undergoes a biochemical reaction. After the first chip 2000 at the imaging station 11 completes sequencing and imaging, the chip grabbing mechanism 500 grabs the first chip 2000 at the imaging station 11 and places it in the recovery station 14. After the second chip 2000 at the biochemical reaction station 12 completes its biochemical reaction, the chip grabbing mechanism 500 grabs the second chip 2000 at the biochemical station 12 and places it in the imaging station 11, where the second chip 2000 undergoes sequencing and imaging. The chip gripping mechanism 500 then grips the cleaned chip 2000 at the cleaning station 15 and places it in the biochemical station 12. After cleaning is completed, the chip gripping mechanism 500 grips the cleaned chip 2000 again at the biochemical station 12 and places it in the cleaning station 15. The chip gripping mechanism 500 then grips the third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the third chip 2000 undergoes a biochemical reaction. Alternatively, the biochemical station 12 is not cleaned; the chip gripping mechanism 500 grips the third chip 2000 at the loading station 13 and places it in the biochemical station 12, where the third chip 2000 undergoes a biochemical reaction. After the second chip 2000 at the imaging station 11 completes sequencing and imaging, the chip gripping mechanism 500 grips the second chip 2000 again at the imaging station 11 and places it in the recovery station 14. After the third chip 2000 located at biochemical site 12 completes the biochemical reaction, the chip grasping mechanism 500 grasps the third chip 2000 at biochemical site 12 and places it at imaging site 11. After the third chip 2000 located at imaging site 11 completes sequencing and imaging, the chip grasping mechanism 500 grasps the third chip 2000 at imaging site 11 and places it at recycling site 14.During the sequencing process of multiple chips 2000, the chip grasping mechanism 500 transfers the chips 2000 between different workstations 10, which can achieve the orderly transfer of each chip 2000. Since there are multiple workstations 10, multiple chips 2000 can work simultaneously at multiple workstations 10. For example, if one chip 2000 is performing a biochemical reaction, another chip 2000 can simultaneously perform sequencing and imaging, thereby effectively improving sequencing efficiency.

[0201] After the chip 2000 completes the biochemical reaction at biochemical site 12 and is transferred to imaging site 11 for sequencing and imaging, there may be cases where sequencing is not yet complete, such as only 1-10 cycles of sequencing. In these cases, 11-20 cycles of sequencing are still required. The chip grabbing mechanism 500 needs to grab the cleaned chip 2000 from cleaning site 15 and transfer it to biochemical site 12 for cleaning before transferring the chip 2000 from imaging site 11 to biochemical site 12. Alternatively, the chip 2000 can be transferred from imaging site 11 to biochemical site 12 without cleaning biochemical site 12, followed by the biochemical reaction. After the biochemical reaction is complete, the chip 2000 is transferred to imaging site 11 for sequencing and imaging. After the chip 2000 completes the sequencing, the chip grabbing mechanism 500 transfers the chip 2000 from imaging site 11 to return site 14. After the chip 2000 is transferred from the biochemical position 12 to the imaging position 11 for the last time, the chip gripping mechanism 500 grips the cleaning chip 2000 from the cleaning position 15 and transfers it to the biochemical position 12 for cleaning, and grips the next chip 2000 from the loading position 13 and transfers it to the biochemical position.

[0202] Furthermore, multiple biochemical sites 12 can be provided to allow multiple chips 2000 to perform biochemical reactions on various biochemical sites 12. Specifically, for a chip 2000 that needs to undergo a biochemical reaction, when a biochemical site 12 is in an idle state (no chip 2000 is currently undergoing a biochemical reaction on that biochemical site 12), if that biochemical site 12 has not previously undergone a biochemical reaction, the chip grasping mechanism 500 will transfer the chip 2000 that needs to undergo a biochemical reaction to the idle biochemical site 12 for the biochemical reaction to proceed. If that biochemical site 12 has previously undergone a biochemical reaction, the chip grasping mechanism 500 will transfer the cleaning chip 2000 from the cleaning site 15 to the biochemical site 12, complete the cleaning, and then transfer the chip 2000 that needs to undergo a biochemical reaction to the biochemical site 12 for the biochemical reaction to proceed. Alternatively, the biochemical site 12 may not be cleaned, and the chip 2000 that needs to undergo a biochemical reaction may be transferred to the biochemical site 12 for the biochemical reaction to proceed. Multiple imaging positions 11 can be provided to allow multiple chips 2000 to perform sequencing imaging on various imaging positions 11. Specifically, for a chip 2000 that needs sequencing imaging, when an imaging position 11 is idle (no chip 2000 is performing sequencing imaging at that imaging position 11), the chip grasping mechanism 500 transfers the chip 2000 that needs sequencing imaging to the idle imaging position 11 for sequencing imaging. Multiple cleaning chips 2000 can be placed on the cleaning position 15. Alternatively, multiple cleaning positions 15 can be provided, with one cleaning chip 2000 placed in each cleaning position 15, so that the chip grasping mechanism 500 can transfer each cleaning chip 2000 to the biochemical position 12 that needs cleaning. Specifically, for a biochemical position 12 that needs cleaning, when there is a cleaning chip 2000 on the cleaning position 15, the chip grasping mechanism 500 transfers the cleaning chip 2000 to the biochemical position 12 that needs cleaning for cleaning. By implementing the above scheme, setting more biochemical sites 12, and / or more imaging sites 11, and / or more cleaning chips 2000, more sequencing processes can be performed simultaneously, such as multiple biochemical reaction processes, and / or multiple sequencing imaging processes, and / or multiple cleaning processes, thereby further improving sequencing efficiency.

[0203] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 12 At least one emergency station 16 is also set up on the first workstation.

[0204] By setting up an emergency position 16, in special circumstances, such as a problem with the chip 2000 undergoing the biochemical reaction in biochemical position 12, preventing the reaction from proceeding smoothly, the chip 2000 can be transferred from biochemical position 12 to emergency position 16 via the chip grabbing mechanism 500. After troubleshooting, the chip 2000 can be transferred back from emergency position 16 to biochemical position 12 via the chip grabbing mechanism 500, or biochemical position 12 can be temporarily discarded and troubleshooted after the batch of chips 2000 has completed sequencing.

[0205] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 12 Multiple biochemical sites 12 are provided, and each biochemical site 12 and the photographing site 11 are arranged sequentially from left to right or from right to left along the first straight line.

[0206] By setting up multiple biochemical stations 12, the requirement of multiple chips 2000 performing biochemical reactions simultaneously can be met, making full use of each station 10 to avoid resource waste and effectively improving efficiency.

[0207] For example, four biochemical sites 12 and one imaging site 11 are provided. The four biochemical sites 12 and the one imaging site 11 are arranged in a first straight line. The four biochemical sites 12 are arranged from right to left as biochemical site 12a, biochemical site 12b, biochemical site 12c, and biochemical site 12d. The one imaging site 11 is located to one side of biochemical site 12a. The chip gripping mechanism 500 first transfers the four chips 2000 located at the loading site 13 to biochemical sites 12a, 12b, 12c, and 12d in sequence. After the chip 2000 at biochemical site 12a completes the biochemical reaction, the chip 2000 located at biochemical site 12a is transferred to imaging site 11, and biochemical site 12a is in an idle state. After the chip 2000 at imaging position 11 completes sequencing and imaging, it is transferred to recovery position 14. Similarly, after the chip 2000 at biochemical position 12b completes its biochemical reaction, it is transferred back to imaging position 11, leaving biochemical position 12b idle. After the chip 2000 at imaging position 11 completes sequencing and imaging, it is transferred to recovery position 14. And after the chip 2000 at biochemical position 12c completes its biochemical reaction, it is transferred back to imaging position 11, leaving biochemical position 12c idle. After the chip 2000 at imaging position 11 completes sequencing and imaging, it is transferred to recovery position 14. Similarly, after the chip 2000 at biochemical position 12d completes its biochemical reaction, it is transferred to imaging position 11, leaving biochemical position 12d idle. After the chip 2000 at imaging position 11 completes sequencing and imaging, it is transferred to recovery position 14. This process completes the sequencing of all chips 2000. In this process, each workstation 10 is fully utilized, avoiding resource waste and effectively improving efficiency. If, after sequencing and imaging at image position 11, chip 2000 has completed sequencing but not yet fully sequenced, and one of biochemical sites 12a, 12b, 12c, or 12d is idle, then after cleaning, chip 2000 at image position 11 is transferred to biochemical site 12, and the biochemical reaction continues. After the biochemical reaction is completed, it is transferred back to image position 11 for sequencing and imaging. Alternatively, biochemical site 12 is not cleaned; chip 2000 at image position 11 is transferred to biochemical site 12, and the biochemical reaction continues. After the biochemical reaction is completed, it is transferred back to image position 11 for sequencing and imaging. If, after sequencing and imaging at image position 11, chip 2000 has completed full sequencing, the chip grasping mechanism 500 transfers chip 2000 from image position 11 to retrieval position 14.

[0208] Since the chip 2000 typically requires sequencing and imaging after the biochemical reaction, arranging the biochemical site 12 and the imaging site 11 in a straight line effectively shortens the movement path of the chip gripping mechanism 500. Furthermore, placing the imaging site 11 at the outermost edge of the straight line, compared to placing it in the middle, avoids the chip gripping mechanism 500 needing to move to the outermost biochemical site 12 to grip the chip 2000, and then move to the middle imaging site 11 to place the chip 2000. This further shortens the movement path of the chip gripping mechanism 500 and facilitates the layout of the biochemical system for the biochemical reaction of the chip 2000, as well as the layout of the imaging system for sequencing and imaging the chip 2000. In summary, the biochemical position 12 and the imaging position 11 are arranged in a first straight line, with the imaging position 11 located at the outermost edge of the first straight line. This layout of the workstation 10 is more reasonable, which can shorten the movement path of the chip gripping mechanism 500, save the transfer time of the chip 2000, and also help with the layout of surrounding systems such as the biochemical system and the imaging system.

[0209] For some specific embodiments of this utility model, please refer to Figure 1 and Figure 12 The loading position 13 and the recovery position 14 are arranged in a second straight line, and the cleaning position 15 and the emergency position 16 are arranged in a third straight line. The second and third straight lines are located on both sides of the first straight line, and the loading position 13 and the recovery position 14 are located near the door of the sequencing system.

[0210] It should be noted that, although Figure 1 and Figure 3 The rack 100 shown is open on all four sides. In actual scenarios, a cover would be installed around the rack 100 to prevent the external environment from affecting the internal environment. For example, the cover has a door that can be opened and closed automatically or manually. After the door is opened, new chips 2000 can be added at the loading position 13, and old chips 2000 can be recycled at the recycling position 14. Therefore, placing the loading position 13 and the recycling position 14 near the door facilitates the addition and recycling of chips 2000.

[0211] The loading station 13 and the recycling station 14 are arranged in a second straight line, while the cleaning station 15 and the emergency station 16 are arranged in a third straight line. The second and third straight lines are located on either side of the first straight line. Compared to arranging all the stations 10 in a straight line, this arrangement saves space and avoids making the overall machine too large. Furthermore, the loading station 13, recycling station 14, cleaning station 15, and emergency station 16 typically do not require surrounding systems. However, the areas around the biochemical station 12 and the imaging station 11 do require surrounding systems. Therefore, a biochemical system can be placed on one or both sides of the biochemical station 12, and an imaging system can be placed on one or both sides of the imaging station 11. This arrangement of the stations 10 is more rational and makes full use of the internal space.

[0212] Furthermore, when the chip gripping mechanism 500 adopts two sets of gripper mechanisms, the loading position 13 and the recycling position 14, the cleaning position 15 and the emergency position 16 are respectively located on both sides of the biochemical position 12 and the imaging position 11. After the chip gripping mechanism 500 grips the chip 2000 at the biochemical position 12 or the imaging position 11, it can move only in a certain dimension, such as the first direction, and then grip the chip 2000 at the loading position 13, the recycling position 14, the cleaning position 15 or the emergency position 16. When a rotating mechanism 600 is also provided, the movement of the chip gripping mechanism 500 can be more flexible. For example, after the chip gripping mechanism 500 can grip the chip 2000 at the biochemical position 12 or the imaging position 11, if another set of gripper mechanisms is located on the second straight line where the loading position 13 and the recycling position 14 are located, but needs to move to the cleaning position 15 to grip the cleaning chip 2000, the rotating mechanism 600 only needs to drive the chip gripping mechanism 500 to rotate 180°, and then move in a certain dimension such as the first direction, so that the cleaning chip 2000 can be gripped at the cleaning position 15.

[0213] In this embodiment, since the emergency position 16 is used in fewer cases, and the emergency position 16 is farther away from the biochemical position 12 and the photographing position 11 than the cleaning position 15, it can be understood that the emergency position 16 is located in the corner of all the work positions 10. This setting helps the chip gripping mechanism 500 to grip and place the cleaning chip 2000 in the cleaning position 15, and can further shorten the movement path of the chip gripping mechanism 500.

[0214] This utility model provides a sequencing system, including the chip transfer device 1000 described in any of the above embodiments, or including the workstation layout device described in any of the above embodiments.

[0215] The sequencing system can be a sequencer, which includes a control device, a liquid path mechanism, and an optical mechanism. Under the control of the control device, the liquid path mechanism allows DNA or RNA samples and biochemical reagents to be introduced into the chip 2000. The optical mechanism can photograph and image the chip 2000. The control device performs sequencing based on the acquired images to obtain sequencing results. Alternatively, the sequencing system can be an integrated system combining a sequencer and a server. The sequencer includes a control device, a communication device, a liquid path mechanism, and an optical mechanism. Under the control of the control device, the liquid path mechanism allows DNA or RNA samples and biochemical reagents to be introduced into the chip 2000. The optical mechanism can photograph and image the chip 2000. The control device performs sequencing based on the acquired images to obtain sequencing results. The control device then controls the communication device to send the sequencing data to the server, where the server stores and / or processes the sequencing data.

[0216] In the chip transfer device 1000 provided in this embodiment of the present invention, the movement of the first direction motion mechanism 200, the second direction motion mechanism 300 and the third direction motion mechanism 400 can drive the chip gripping mechanism 500 to move upward in the first direction, the second direction and the third direction, thereby realizing the three-dimensional movement of the chip gripping mechanism 500. The chip gripping mechanism 500 can grip the chip 2000 at any station 10 and place the chip 2000 at another station 10, thereby realizing multi-station 10 multi-chip 2000 sequencing, which can effectively improve sequencing efficiency.

[0217] In the workstation layout device provided in this embodiment of the utility model, the workstation layout device cooperates with the chip transfer device 1000. During the sequencing process of multiple chips 2000, the chip gripping mechanism 500 transfers the chips 2000 between different workstations 10, which can realize the orderly transfer of each chip 2000. Since there are multiple workstations 10, multiple chips 2000 can work simultaneously at multiple workstations 10. For example, if one chip 2000 is performing a biochemical reaction, another chip 2000 can simultaneously perform sequencing and imaging, thereby effectively improving sequencing efficiency.

[0218] Please refer to Figure 13 The present invention provides a chip transfer method for use in any of the chip transfer devices described above. The chip transfer method includes the following steps: S1, the chip transfer device transfers the chip located at the loading position to the biochemical position; S2, after the chip completes the biochemical reaction, the chip transfer device transfers the chip located at the biochemical position to the imaging position, and transfers the cleaned chip located at the cleaning position to the biochemical position; S3, after the cleaned chip completes the cleaning at the work station, the chip transfer device transfers the cleaned chip located at the biochemical position to the cleaning position, and after the chip completes sequencing and imaging, the chip transfer device transfers the chip located at the imaging position to the recycling position.

[0219] In this embodiment, after placing the chip 2000 at the loading station 13 and the cleaning chip 2000 at the cleaning station 15, the chip transfer device 1000 transfers the chip 2000 from the loading station 13 to the biochemical station 12, where the chip 2000 undergoes a biochemical reaction. After the biochemical reaction is completed, the chip transfer device 1000 transfers the chip 2000 from the biochemical station 12 to the imaging station 11, where the chip 2000 performs sequencing and imaging. At this time, the biochemical station 12 is idle. The chip transfer device 1000 then transfers the cleaning chip 2000 from the cleaning station 15 to the biochemical station 12 to clean components such as inlet and outlet ports of the biochemical station 12. After the cleaning chip 2000 completes its station cleaning, the chip transfer device 1000 transfers the cleaning chip 2000 from the biochemical station 12 to the cleaning station 15. After the chip 2000 completes sequencing and imaging, the chip transfer device 1000 transfers the chip 2000 located at imaging position 11 to the recovery position 14.

[0220] In some specific embodiments of this utility model, after the chip completes sequencing and imaging, the chip transfer device transfers the chip located at the imaging position to the recycling position, including the following steps: S32, after the chip completes sequencing and imaging and the cleaned chip located at the biochemical position has been transferred to the cleaning position, the chip transfer device transfers the chip located at the imaging position to the biochemical position; S34, after the chip completes the biochemical reaction, the chip transfer device transfers the chip located at the biochemical position to the imaging position and transfers the cleaned chip located at the cleaning position to the biochemical position; S36, repeating S32 and S34 until the chip completes the last round of sequencing and imaging, the chip transfer device transfers the chip located at the imaging position to the recycling position.

[0221] In this embodiment, after the chip 2000 completes the biochemical reaction at biochemical site 12 and transfers to imaging site 11 to complete the sequencing and imaging process, there may be cases where the sequencing is not yet complete. For example, if only 1-10 cycles of sequencing have been performed, and 11-20 cycles of sequencing are still required, then after the chip 2000 completes the sequencing and imaging process, the chip transfer device 1000 does not transfer the chip 2000 located at imaging site 11 to the recovery site 14. Instead, after confirming that the cleaned chip 2000 at biochemical site 12 has been transferred to the cleaning site 15, the chip 2000 located at imaging site 11 is transferred to biochemical site 12. Then, the process of completing the biochemical reaction at biochemical site 12 and completing the sequencing and imaging process at imaging site 11 is repeated. After each biochemical reaction at biochemical site 12 is completed, the chip transfer device 1000 transfers the cleaned chip 2000 to biochemical site 12 to clean biochemical site 12. Once chip 2000 completes the final round of sequencing and imaging, chip transfer device 1000 transfers chip 2000 from imaging position 11 to recovery position 14.

[0222] In some specific embodiments of this utility model, multiple chips 2000 are provided, or multiple chips 2000 are provided and multiple biochemical sites 12 are provided. The chip transfer method further includes the following steps: S42, when the biochemical site is idle, the chip transfer device transfers the next chip located at the loading site to the biochemical site; S44, when the next chip completes the biochemical reaction and the imaging site is idle, the chip transfer device transfers the next chip located at the biochemical site to the imaging site, and transfers the cleaning chip located at the cleaning site to the biochemical site; S46, after the next chip completes sequencing and imaging, the chip transfer device transfers the next chip located at the imaging site to the recycling site; S48, repeating S42, S44 and S46 until all chips are transferred to the recycling site.

[0223] Multiple chips 2000 are provided, and one biochemical reaction station 12 is provided. As an example, after the chip transfer device 1000 transfers the current chip 2000 from the biochemical reaction station 12 to the imaging station 11, the biochemical reaction station 12 is in an idle state. The chip transfer device 1000 then transfers the next chip 2000 located at the loading station 13 to the biochemical reaction station 12, so that the next chip 2000 can undergo a biochemical reaction at the biochemical reaction station 12. After the chip transfer device 1000 transfers the current chip 2000 from the imaging position 11 to the recycling position 14, the imaging position 11 is idle. After the next chip 2000 completes its biochemical reaction, the chip transfer device 1000 transfers the next chip 2000 from the biochemical position 12 to the imaging position 11, allowing the next chip 2000 to perform sequencing and imaging at the imaging position 11. At this time, the biochemical position 12 is idle, and the chip transfer device 1000 transfers the cleaned chip 2000 located at the cleaning position 15 to the biochemical position 12 for cleaning. After the next chip 2000 completes its sequencing and imaging, the chip transfer device 1000 transfers the next chip 2000 located at the imaging position 11 to the recycling position 14. The above steps are repeated until all chips 2000 have been transferred to the recycling position 14.

[0224] Alternatively, there may be multiple chips 2000 and multiple biochemical sites 12. For example, after the chip transfer device 1000 transfers a chip 2000 (e.g., the first chip 2000) from biochemical site 12 to imaging site 11, if a biochemical site 12 is idle, the chip transfer device 1000 can transfer a chip 2000 from loading site 13 (e.g., the second chip 2000) to biochemical site 12, allowing the second chip 2000 to undergo a biochemical reaction at biochemical site 12. Since there are multiple biochemical sites 12, some will still be idle. The chip transfer device 1000 can then transfer a chip 2000 from loading site 13 (e.g., the third chip 2000) to biochemical site 12, allowing the third chip 2000 to undergo a biochemical reaction at biochemical site 12. After the chip transfer device 1000 transfers the first chip 2000 from the imaging position 11 to the retrieval position 14, the imaging position 11 is idle. After the second chip 2000 completes its biochemical reaction, the chip transfer device 1000 transfers the second chip 2000 from the biochemical position 12 to the imaging position 11, enabling sequencing and imaging of the second chip 2000 at imaging position 11. After the second chip 2000 completes its sequencing and imaging, the chip transfer device 1000 transfers it from imaging position 11 to the retrieval position 14, and imaging position 11 is idle. If the third chip 2000 completes its biochemical reaction at this time, the chip transfer device 1000 transfers the third chip 2000 from biochemical position 12 to imaging position 11, enabling sequencing and imaging of the third chip 2000 at imaging position 11. After the third chip 2000 completes its sequencing and imaging, the chip transfer device 1000 transfers it from imaging position 11 to the retrieval position 14. If there are more chips 2000, such as the fourth chip 2000, the fifth chip 2000, etc., after the biochemical site 12 is idle and has been cleaned, the chip transfer device 1000 transfers the chip 2000 to the biochemical site 12. After the imaging site 11 is idle, the chip transfer device 1000 transfers the chip 2000 that has completed the biochemical reaction to the imaging site 11. After the chip 2000 completes sequencing and imaging, the chip transfer device 1000 transfers the chip 2000 that has completed sequencing and imaging to the recovery site 14. This process is repeated until all chips 2000 have been transferred to the recovery site 14.

[0225] Furthermore, if the chip 2000, after completing sequencing imaging at imaging position 11, has not yet completed complete sequencing, the chip transfer device 1000 can transfer the chip 2000 from imaging position 11 to biochemical position 12 after biochemical position 12 is idle and has been cleaned, so that the chip 2000 can then proceed with the biochemical reaction. After imaging position 11 is idle and the chip 2000 has completed the biochemical reaction, the chip transfer device 1000 then transfers the chip 2000 from biochemical position 12 to imaging position 11. This process continues until the chip 2000 completes the final round of sequencing imaging, at which point the chip transfer device 1000 transfers the chip 2000 located at imaging position 11 to return position 14.

[0226] In some specific embodiments of this utility model, the chip gripping mechanism 500 is provided with two gripping mechanisms. The two gripping mechanisms can grip the chip 2000 and / or clean the chip 2000 in sequence, and place the chip 2000 and / or clean the chip 2000 in sequence.

[0227] One of the two gripping mechanisms can be located on one side of the mounting base 530 described in any of the above embodiments, and includes a first gripper drive 510, a first gripper, a first connecting block 571, a first pressing plate 572, a first elastic element 573, a fourth guide rail 561, and a fourth guide block 562. The other gripping mechanism can be located on the other side of the mounting base 530, and includes a second gripper drive 540, a second gripper, a second connecting block 591, a second pressing plate 592, a second elastic element 593, a fifth guide rail 581, and a fifth guide block 582.

[0228] In this embodiment, two sets of gripping mechanisms can grip chip 2000 and / or clean chip 2000 sequentially. After the chip transfer device 1000 moves, the two sets of gripping mechanisms can place chip 2000 and / or clean chip 2000 sequentially, thereby shortening the movement path of the chip gripping mechanism 500, reducing the time for gripping and placing chip 2000 and / or cleaning chip 2000, and greatly improving efficiency.

[0229] In some specific embodiments of this utility model, the chip transfer device 1000 further includes a rotating mechanism 600 disposed between two sets of gripping mechanisms. After the two sets of gripping mechanisms successively grip the chip 2000 and / or clean the chip 2000, the rotating mechanism 600 can drive the two sets of gripping mechanisms to rotate around the rotating mechanism 600 as the rotation center, so as to realize the exchange of the positions of the chip 2000 and / or clean the chip 2000.

[0230] The rotating mechanism 600 may be the same as the rotating mechanism 600 described in any of the above embodiments, including a rotating drive member 610, a connecting seat 620, a driving gear 631 and a driven gear 632, or may include a rotating drive member 610, a connecting seat 620, a driving gear and a driven gear 632.

[0231] In this embodiment, the rotating mechanism 600 can drive two sets of gripping mechanisms to rotate, and the two sets of gripping mechanisms drive the gripped chip 2000 and / or cleaning chip 2000 to rotate, thereby making the two sets of gripping mechanisms more flexible, further shortening the movement path, reducing the time for gripping and placing the chip 2000 and / or cleaning chip 2000, and greatly improving efficiency.

[0232] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "certain examples," "specific example," or "embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0233] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A chip transfer device, characterized in that, For use in a sequencing system, the chip transfer device includes: frame; A first directional motion mechanism is mounted on the frame; A second direction motion mechanism connected to the first direction motion mechanism; A third-direction motion mechanism connected to the second-direction motion mechanism; and A chip gripping mechanism is installed on the third-party motion mechanism; The first direction motion mechanism, the second direction motion mechanism, and the third direction motion mechanism drive the chip gripping mechanism to move to achieve three-dimensional motion, enabling the chip gripping mechanism to grip the chip at any workstation and place the chip at any other workstation.

2. The chip transfer apparatus according to claim 1, characterized in that, The first directional motion mechanism includes: A first drive unit is mounted on the frame; Synchronous belt assembly connected to the first drive unit; and A movable plate that moves under the drive of the synchronous belt assembly, with the second directional motion mechanism disposed on the movable plate.

3. The chip transfer apparatus according to claim 2, characterized in that, The timing belt assembly includes a first timing pulley, a second timing pulley, and a timing belt wound around the first timing pulley and the second timing pulley, and the moving plate is disposed on the timing belt.

4. The chip transfer apparatus according to claim 3, characterized in that, The moving plate is provided with a first tooth, and the synchronous belt is provided with a second tooth that matches and connects with the first tooth.

5. The chip transfer apparatus according to claim 2, characterized in that, The first directional movement mechanism further includes a first guide rail fixedly disposed on opposite sides of the frame and a first guide block disposed on the first guide rail. One end of the moving plate is connected to the first guide block on one side of the frame, and the other end is connected to the first guide block on the other side of the frame.

6. The chip transfer apparatus according to claim 1, characterized in that, The second directional motion mechanism includes: The second drive component connected to the first direction motion mechanism; and A first connecting component connected to the second driving component, wherein the third-party directional motion mechanism is disposed on the first connecting component.

7. The chip transfer apparatus according to claim 6, characterized in that, The first connection component includes: A first connecting plate disposed on the first directional motion mechanism and connected to the second driving member; and A fixed plate is disposed on the first directional motion mechanism and fixedly connected to the first connecting plate, and the third directional motion mechanism is disposed on the fixed plate.

8. The chip transfer apparatus according to claim 7, characterized in that, The second directional motion mechanism further includes a first lead screw connected to the output shaft of the second drive member. The surface of the first lead screw is provided with threads, and the first connecting plate is provided with a threaded hole that matches the first lead screw. The first lead screw passes through the threaded hole, and the threads are threadedly connected to the threaded hole.

9. The chip transfer apparatus according to claim 7 or 8, characterized in that, The second directional motion mechanism further includes a second guide rail disposed on the first directional motion mechanism and a second guide block disposed on the second guide rail, wherein the fixing plate is disposed on the second guide block.

10. The chip transfer apparatus according to claim 1, characterized in that, The third-party sports organization includes: A third drive component connected to the second-direction motion mechanism; and A second connection component connected to the third driving component, wherein the chip gripping mechanism is disposed on the second connection component.

11. The chip transfer apparatus according to claim 10, characterized in that, The second connection component includes: The second connecting plate connected to the third driving component; and A movable seat is fixedly connected to the second connecting plate, and the chip gripping mechanism is disposed on the movable seat.

12. The chip transfer apparatus according to claim 11, characterized in that, The second connecting assembly further includes a second lead screw connected to the output shaft of the third drive member. The surface of the second lead screw is provided with threads, and the second connecting plate is provided with a threaded hole that matches the second lead screw. The second lead screw passes through the threaded hole, and the threads are threadedly connected to the threaded hole.

13. The chip transfer apparatus according to claim 11 or 12, characterized in that, The third-direction motion mechanism further includes a third guide rail disposed on the second-direction motion mechanism and a third guide block disposed on the third guide rail, and the movable seat is disposed on the third guide block.

14. The chip transfer apparatus according to claim 1, characterized in that, The chip gripping mechanism includes: The first gripper drive unit connected to the third-party motion mechanism; and The first gripper is connected to the first gripper drive member. The first gripper includes a first gripper member and a second gripper member that are arranged opposite each other. Under the drive of the first gripper drive member, the first gripper member and the second gripper member move closer to each other or further away from each other to grasp or place the chip.

15. The chip transfer apparatus according to claim 14, characterized in that, Both the first gripper and the second gripper are provided with a first positioning pin. When the first gripper and the second gripper are close to each other or far apart, the first positioning pin contacts or moves away from the positioning groove of the chip.

16. The chip transfer apparatus according to claim 14, characterized in that, The chip gripping mechanism also includes: A mounting base is connected to the third-party motion mechanism, and the first gripper drive is disposed on the mounting base; A second gripper drive component disposed on the mounting base; and The second gripper is connected to the second gripper drive member. The second gripper includes a third gripper and a fourth gripper that are arranged opposite each other. Under the drive of the second gripper drive member, the third gripper and the fourth gripper move closer to each other or further away from each other to grasp or place the chip.

17. The chip transfer apparatus according to claim 16, characterized in that, Both the third and fourth grippers are provided with second positioning pins. When the third and fourth grippers approach or move away from each other, the second positioning pins contact or disengage from the positioning groove of the chip.

18. The chip transfer apparatus according to claim 16 or 17, characterized in that, The chip gripping mechanism also includes: A first connecting block is disposed on the first gripper drive component; A first pressing plate is provided on the mounting base; and A first elastic element is disposed between the first connecting block and the first pressing plate.

19. The chip transfer apparatus according to claim 18, characterized in that, The chip gripping mechanism further includes a fourth guide rail disposed on the mounting base and a fourth guide block disposed on the fourth guide rail, wherein the first connecting block is disposed between the first gripper drive and the fourth guide block.

20. The chip transfer apparatus according to claim 16, characterized in that, The chip gripping mechanism also includes: A second connecting block is disposed on the second gripper drive component; A second pressing plate is provided on the mounting base; and A second elastic element is disposed between the second connecting block and the second pressing plate.

21. The chip transfer apparatus according to claim 20, characterized in that, The chip gripping mechanism further includes a fifth guide rail disposed on the other side of the mounting base and a fifth guide block disposed on the fifth guide rail, with the second connecting block disposed between the second gripper drive and the fifth guide block.

22. The chip transfer apparatus according to claim 1, characterized in that, The chip transfer device further includes a rotating mechanism connected to the third-party directional motion mechanism, and the chip gripping mechanism is disposed on the rotating mechanism.

23. The chip transfer apparatus according to claim 22, characterized in that, The rotating mechanism includes: A rotary drive component connected to the third-party motion mechanism; and A connector is connected to the rotary drive, and the chip gripping mechanism is disposed on the connector.

24. The chip transfer apparatus according to claim 23, characterized in that, The output shaft of the rotary drive is provided with a drive gear, and the rotary mechanism also includes a driven gear that meshes with the drive gear and is coaxially arranged with the connecting seat.

25. The chip transfer apparatus according to claim 23, characterized in that, The rotating mechanism further includes a drive gear connected to the output shaft of the rotating drive member, and a driven gear meshing with the drive gear and coaxially arranged with the connecting seat.

26. A workstation layout device, characterized in that, In conjunction with the chip transfer apparatus according to any one of claims 1 to 25, the station layout device includes at least one first station platform, the first station platform being provided with at least one biochemical station, at least one photographing station, at least one loading station and at least one cleaning station, and the station layout device further includes at least one second station platform or silo, the second station platform or the silo being provided with at least one recycling station.

27. The workstation layout device according to claim 26, characterized in that, Multiple biochemical sites are provided, and each of the biochemical sites and the imaging sites is arranged sequentially from left to right or from right to left along a first straight line.

28. The workstation layout device according to claim 27, characterized in that, At least one emergency stop is also provided on the first workstation.

29. The workstation layout device according to claim 28, characterized in that, The loading position and the recovery position are arranged in a second straight line, and the cleaning position and the emergency position are arranged in a third straight line. The second straight line and the third straight line are located on both sides of the first straight line, and the loading position and the recovery position are located near the door of the sequencing system.

30. A sequencing system, characterized in that, It includes the chip transfer apparatus according to any one of claims 1 to 25, or the workstation layout apparatus according to any one of claims 26 to 29.

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