Surface-measuring gluing machine

By designing the surface-measuring and crystal wire-aligning components of the surface-measuring adhesive coating machine, the robot's motion path during silicon rod splicing was optimized, solving the problem of large robot motion and improving operational efficiency.

CN223549583UActive Publication Date: 2025-11-14HANGZHOU ZHONGWEI PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202423241041.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-11-14
Estimated Expiration
2034-12-26

AI Technical Summary

Technical Problem

The robotic arm involves a large amount of movement when splicing silicon rods, resulting in low operating efficiency.

Method used

A surface-testing adhesive coating machine was designed, comprising a surface-testing component and a crystal wire alignment component. The surface-testing component optimizes the motion path of the silicon rod, enabling the robot to complete multiple processes in a single reciprocating motion, reducing the number of reciprocating extensions.

Benefits of technology

The robot's motion path was optimized, improving the efficiency and smoothness of silicon rod splicing while reducing the amount of robot movement.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of silicon rod splicing, in particular to a surface measuring and gluing machine which comprises a surface measuring component, a glue spreading component and a glue spreading component, and the surface measuring component comprises a surface measuring frame which is of a frame structure; a plurality of distance sensors are arranged in the surface measuring part, and the inclination condition of the end face of the silicon rod is calculated according to the distance measuring results of the distance sensors; wherein the number of the surface measuring parts is two, the two surface measuring parts are configured on the two opposite sides of the surface measuring frame, and the action directions of the distance sensors in the two surface measuring parts are oppositely arranged, so that a surface measuring space is formed; the technical problem that the action amount of a mechanical arm is large when the silicon rods are spliced is solved, and the technical effect of optimizing the action path of side face gluing is achieved.
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Description

Technical Field

[0001] This application relates to the field of silicon rod splicing technology, and in particular to a surface coating machine. Background Technology

[0002] During the silicon rod drawing process, some short silicon rods are produced. The usual practice is to manually or semi-automatically glue and splice the short silicon rods of the same specifications and grade to form a rod of qualified length, so as to facilitate subsequent silicon rod processing steps.

[0003] Currently, operations such as surface measurement, crystal wire alignment, and adhesive coating are completely independent. The robotic arm needs to carry the silicon rod in and out of these devices, resulting in a large amount of robotic arm movement.

[0004] Therefore, the technical problem with the existing technology is that the robotic arm requires a large amount of motion when splicing silicon rods. Summary of the Invention

[0005] This application provides a surface coating machine, which solves the technical problem of large motion volume of the robot arm when splicing silicon rods, and achieves the technical effect of optimizing the motion path of surface coating.

[0006] This application provides a surface-measuring adhesive coating machine, which adopts the following technical solution: The surface-measuring adhesive coating machine includes: a surface-measuring assembly, which includes: a surface-measuring frame, which is a frame structure; a surface-measuring section, in which a plurality of distance sensors are arranged, and the end face tilt of the silicon rod is calculated by the distance measurement results of the plurality of distance sensors; wherein, there are two surface-measuring sections, which are arranged on opposite sides of the surface-measuring frame, and the action directions of the distance sensors in the two surface-measuring sections are opposite to each other to form a surface-measuring space.

[0007] Preferably, the distance sensors on the measuring face are divided into two groups, with the distance sensors in the first group being centrally located and the distance sensors in the second group being arranged around the distance sensors in the first group.

[0008] Preferably, the first group has one distance sensor; the second group has four distance sensors, and the four distance sensors are arranged at equal angles to each other.

[0009] Preferably, the distance sensors on the two measuring surfaces are respectively set one-to-one.

[0010] Preferably, the measuring surface further includes: a measuring surface base, which is connected to the measuring surface frame; and a measuring surface bracket, which is connected to the measuring surface base and the distance sensor respectively, so that the position of the distance sensor relative to the measuring surface base can be adjusted through the measuring surface bracket.

[0011] Preferably, the two measuring surfaces are arranged on the upper and lower sides of the measuring surface frame in the vertical direction, so that the silicon rod passes through the measuring surface space in an upright state.

[0012] Preferably, the measuring surface space has a continuous movement path to facilitate the silicon rod passing through the measuring surface assembly.

[0013] Preferably, the front and rear sides or left and right sides of the measuring surface frame are open to construct the motion path in the measuring surface space.

[0014] Preferably, the surface-testing coating machine further includes: a crystal wire assembly, which is disposed on one side of the surface-testing assembly and located on an extension of the motion path, such that the silicon rod is located on the crystal wire assembly after passing through the surface-testing space; and a coating assembly, which is disposed above the crystal wire assembly to perform a coating operation on the end face of the silicon rod on the crystal wire assembly.

[0015] Preferably, the pair of crystal wires is disposed on the straight extension of the motion path.

[0016] The advantages of this application, which differ from the prior art, are:

[0017] By designing a measuring component with a measurement space, the silicon rod can enter from one end and exit from the other, making it easier for the robot to carry the silicon rod through multiple processes in one reciprocating motion. This reduces the number of reciprocating extensions and retractions of the robot in the measuring adhesive coating machine, solves the technical problem of large motion volume of the robot when splicing silicon rods, and achieves the technical effect of optimizing the motion path of the measuring adhesive coating. Attached Figure Description

[0018] Figure 1 This is a top view of the layout of the fully automated silicon rod bonding device in this application;

[0019] Figure 2 This is a top view structural schematic diagram of the silicon rod feeder in this application;

[0020] Figure 3 This is a top-view schematic diagram of a stage when the silicon rod feeder measures the distance to the silicon rod in the first embodiment;

[0021] Figure 4 yes Figure 3 A top-down view of the two-stage distance measurement of silicon rods by the silicon rod feeder;

[0022] Figure 5 This is a top-view schematic diagram of the central robotic arm grasping the silicon rod from another position in the first embodiment;

[0023] Figure 6This is a top-view schematic diagram of a stage when the silicon rod feeder measures the distance to the silicon rod in the second embodiment;

[0024] Figure 7 yes Figure 6 A top-down view of the two-stage distance measurement of silicon rods by the silicon rod feeder.

[0025] Figure 8 This is an exploded view of the adhesive coating mechanism for measuring surfaces in this application;

[0026] Figure 9 This is a schematic diagram of the isometric orientation of the surface coating machine in this application;

[0027] Figure 10 This is a schematic diagram of the axial orientation of the measuring surface of the measuring surface assembly in this application;

[0028] Figure 11 This is a schematic diagram of the front view of the measuring surface component in this application;

[0029] Figure 12 This is a schematic diagram of the isometric orientation of the splicing machine in this application;

[0030] Figure 13 yes Figure 12 Enlarged schematic diagram of the rotating component;

[0031] Figure 14 This is a side sectional view of the transmission section in this application;

[0032] Figure 15 This is a lateral schematic diagram of the central robotic arm during the assembly of bars in this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Central robotic arm; 110. Central gripper; 120. First vision unit; 200. Silicon rod feeder; 210. Feeding section; 211. First rangefinder; 212. Feeding channel; 213. Rangefinder; 220. Rangefinder; 221. Second rangefinder; 300. Surface coating machine; 310. Surface measuring assembly; 311. Surface measuring frame; 312. Surface measuring face; 312a. First surface measuring face; 312b. Second surface measuring face; 3121. Surface measuring base; 3122. Surface measuring bracket; 3123. Distance sensor; 313. Surface measuring face Space; 320, Crystal wire assembly; 321, Crystal wire base; 322, Crystal wire rotating seat; 323, Second vision unit; 330, Adhesive coating assembly; 400, Rod splicing machine; 410, Rod splicing frame; 420, Rotating assembly; 421, Rotation source; 422, Transmission unit; 4221, First gear; 4222, Second gear; 4223, Rotary support; 423, Rotating substrate; 424, Pad; 425, Oil receiving tray; 430, Lower jaw; 440, Upper jaw; 500, Silicon rod; 510, Crystal wire; 600, Adhesive coating layer. Detailed Implementation

[0035] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] To better understand the above technical solutions, a detailed description of the technical solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application.

[0038] This application provides a fully automatic silicone rod bonding device, see reference. Figure 1 The fully automatic silicon rod bonding device is used to bond two short silicon rods 500 into a long silicon rod 500 that meets the requirements for slicing. The fully automatic silicon rod bonding device includes a central robot 100, a silicon rod feeder 200, a surface coating machine 300, and a rod splicing machine 400. The central robot 100 has a gripping range for holding the silicon rod 500. The silicon rod feeder 200, the surface coating machine 300, and the rod splicing machine 400 are located within the gripping range of the central robot 100, so that the central robot 100 can move the silicon rod 500 between the various devices.

[0039] This application embodiment also provides a fully automated method for bonding silicon rods, which includes:

[0040] S100: Obtain the length information of silicon rod 500 and the surface tilt information of silicon rod 500;

[0041] S200. Based on the rod length information and the surface tilt information, determine the first silicon rod 500 and the second silicon rod 500 suitable for splicing.

[0042] S300, first acquire the position information of the crystal line 510 on the first silicon rod 500 and the second silicon rod 500;

[0043] S400: Based on the rod length information of the two silicon rods 500, apply adhesive to the end face of one of the silicon rods 500 that meets the rod length requirements.

[0044] S500, transfer the two silicon rods 500 to the upper jaw 440 and lower jaw 430 of the rod splicing machine 400 respectively;

[0045] S600: After the upper jaw 440 and lower jaw 430 are inserted into the two silicon rods 500, the position information of the crystal line 510 on the silicon rods 500 is obtained for the second time.

[0046] S700: Based on the crystal line 510 position information obtained the second time, adjust the position of the crystal line 510 of the silicon rod 500 on the upper jaw 440 and / or adjust the position of the crystal line 510 of the silicon rod 500 on the lower jaw 430 so that the crystal lines 510 on the two silicon rods 500 are aligned.

[0047] S800: After the crystal lines 510 of the two silicon rods 500 are aligned, the adjacent end faces of the two silicon rods 500 are bonded together by the rod splicing machine 400.

[0048] It is understood that the numbering of steps in this application is not to restrict the order of the steps, but rather to facilitate clear explanation of the steps. Where there is no clear logical chain between steps, the order of the steps can be adjusted.

[0049] For a detailed description of step S100, in one embodiment, refer to Figure 3 and Figure 4 The steps for obtaining the length information of silicon rod 500 include: S110, obtaining a first distance from the distance determining device to the first end face of silicon rod 500 through the distance determining device; S120, controlling the silicon rod 500 to rotate so that the second end face of silicon rod 500 faces the second rangefinder 221; S130, obtaining a second distance from the second rangefinder 221 to the second end face of silicon rod 500 through the second rangefinder 221; S140, determining the length of silicon rod 500 based on the first distance, the second distance and a third preset value corresponding to the material receiving channel 212 where silicon rod 500 is located.

[0050] Define the first distance as X, the second distance as Y, and the third preset value as Z; in Figure 3 In the middle, the first distance was measured as X1; reference Figure 4 After rotating the silicon rod 500, the second distance is measured as Y1. Therefore, the length of the silicon rod 500 is L = Z1 - X1 - Y1. As long as the central robotic arm 100 grasps the silicon rod 500 at the positioning point, regardless of the first distance, the calculation formula L = ZXY in this application holds true; for specific comparison... Figure 3 ,refer to Figure 5 , Figure 5 The first distance X2 in the silicon rod is less than 500. Figure 3 X1 measured under the condition, but Figure 5 The second distance Y2 of the silicon rod 500 in the current state will increase accordingly to compensate for the reduction in the first distance.

[0051] Specifically, the step of controlling the rotation of the silicon rod 500 in step S120 includes: S121, obtaining the gripping position of the central robotic arm 100 based on the distance determination device, and adjusting the gripping position of the central robotic arm 100 on the silicon rod 500; S122, after adjusting the gripping position of the central robotic arm 100 on the silicon rod 500, controlling the central robotic arm 100 to grip and rotate the silicon rod 500. The gripping position of the central robotic arm 100 is identified and adjusted by the distance determination device to ensure that the gripping position of the central robotic arm 100 is accurate each time, ensuring that the silicon rod 500 after being gripped and rotated by the central robotic arm 100 can be aligned with the second rangefinder 221, ensuring that the expected distance value can be accurately measured based on the second rangefinder 221, and ensuring that the scheme of reducing the number of rangefinders by detecting the movement of the silicon rod 500 in this application can be stably executed.

[0052] Regarding the third preset value described in step S140, the third preset value is determined in advance, and there are various ways to determine it. In one embodiment, the step of obtaining the third preset value corresponding to the material receiving channel 212 includes: S141, after transporting a standard silicon rod 500 of known length to the material receiving channel 212, obtaining a first distance between the distance determining device and the first end face of the standard silicon rod 500 through the distance determining device; S142, controlling the standard silicon rod 500 to rotate around the positioning point until the second end face faces the second distance measuring device 221; S143, obtaining a second distance between the second distance measuring device 221 and the second end face of the standard silicon rod 500 through the second distance measuring device 221; S144, setting the sum of the first distance, the second distance, and the length of the standard silicon rod 500 as the third preset value corresponding to the material receiving channel 212. The aforementioned steps for obtaining the third preset value are quick, and the method of determining the third preset value by actual measurement using a standard silicon rod 500 has few variables. Errors in the grasping and rotation process of the central robotic arm 100 can be compensated, and the measured relative third preset value is accurate.

[0053] In another embodiment, the step of obtaining the third preset value corresponding to the material receiving channel 212 includes: S141, determining the position of a positioning point on the material receiving channel 212 and setting a marker at the positioning point; wherein, the positioning point is the intersection of the distance measuring devices of the distance determining device and the second rangefinder 221; S142, obtaining the third distance between the distance determining device and the marker through the distance determining device; S143, obtaining the fourth distance between the second rangefinder 221 and the marker through the second rangefinder 221; S144, setting the sum of the third distance and the fourth distance as the third preset value corresponding to the material receiving channel 212. This step of obtaining the third preset value ensures accurate measurement of the points and precise measurement of the third preset value.

[0054] Furthermore, regarding step S100, in one embodiment, the step of obtaining the surface tilt information of the silicon rod 500 includes: S150, obtaining the distance from the distance sensor 3123 to multiple measurement points on one end face of the silicon rod 500 through the distance sensor 3123, and determining the surface tilt information of the silicon rod 500 based on the difference between the position of the multiple measurement points on the end face and the distances corresponding to the multiple measurement points. It is understood that the surface tilt information is used to determine whether the end face of the silicon rod 500 is suitable for splicing. In order to improve the accuracy of multi-point detection of surface tilt, the central robot 100 can also rotate a second time around the central axis of the silicon rod 500 after the surface tilt information of the silicon rod 500 is detected for the first time by the surface measuring component 310, so that the distance sensor 3123 on the surface measuring component 310 detects different positions on the same end face of the silicon rod 500, that is, one distance sensor 3123 detects multiple points at different positions on the end face of the silicon rod 500, thereby improving the detection accuracy of the surface tilt information of the end face of the silicon rod 500.

[0055] It is understandable that in step S100, the steps of obtaining the length information of the silicon rod 500 and obtaining the surface tilt information of the silicon rod 500 are completed independently in two steps. For example, obtaining the length information of the silicon rod 500 is performed in the silicon rod receiving machine 200, and obtaining the surface tilt information of the silicon rod 500 is performed in the surface coating machine 300. Alternatively, the rod length information and surface tilt information in S100 are completed in one operation step. Specifically, when performing the step of obtaining the surface tilt information of the silicon rod 500, the position of the silicon rod 500 is defined, and the rod length information is determined after simultaneously or successively measuring the surface tilt information of both ends of the silicon rod 500. Understandably, the steps for calculating the rod length information after simultaneously or successively measuring the surface inclination information of both ends of the silicon rod 500 include: distance sensor 3123 measuring distances A1 and A2 from two specific positions at both ends of the silicon rod 500 to the two end faces of the silicon rod 500, respectively, and the distance between the two specific positions of distance sensor 3123 is A, and the rod length information L = A - A1 - A2. Here, A1 and A2 can be values ​​obtained from a single measurement point, or values ​​averaged from multiple measurement points.

[0056] Regarding step S200, since the finished long silicon rod 500 in this application is composed of two short silicon rods 500 spliced ​​together, there are requirements for the length information of the two short silicon rods 500 and the surface tilt information of the splicing surface of the short silicon rods 500. Specifically, after obtaining the rod length information and surface tilt information in step S100, step S200 uses the central processing unit set in the fully automatic silicon rod bonding device or an external central processing unit to formulate a pairing strategy between the short silicon rods 500, so as to select the first silicon rod 500 and the second silicon rod 500 suitable for pairing. Silicon rods 500 that are not suitable for the current splicing operation can be placed on an empty splicing station or returned to the silicon rod 500 storage point.

[0057] Regarding step 300, obtaining the crystal line 510 position of the silicon rod 500 is preferably performed in the surface coating machine 300. More preferably, the silicon rod 500 is placed on a rotatable station so that it can rotate relative to other executing components. That is, with the silicon rod 500 having the ability to rotate relative to other components, the side of the silicon rod 500 can be observed through the second vision unit 323. Alternatively, with the silicon rod 500 having the ability to rotate relative to other components, the end face of the silicon rod 500 can be coated with adhesive by the coating assembly 330. It is understood that obtaining the crystal line 510 position information of the first silicon rod 500 and obtaining the crystal line 510 position information of the second silicon rod 500 can be achieved by setting multiple rotatable stations to simultaneously identify the crystal line 510 position information on the two silicon rods 500, or by successively placing the first and second silicon rods 500 on rotatable stations for crystal line 510 identification.

[0058] Regarding the timing of step S400, it is understood that since the identification of the crystal wire 510 position is performed on the side of the silicon rod 500, while the coating operation is performed on the end face of the silicon rod 500, the two operations correspond to two different faces; the same applies to other steps. Therefore, the order of steps can be adjusted. Step S400 only needs to be executed between steps S200 and S800. For example, step S400 can be executed before, after, or simultaneously with step S300; that is, step S300 can be executed first, or step S400 can be executed first; or steps S300 and S400 can be executed synchronously. Furthermore, steps S300 and S400 are preferably performed at the same station, both completed on the surface coating machine 300. For example, step S400 can be performed during the execution of step S500, or step S400 can be executed after step S500, that is, step S400 is executed after the silicon rod 500 is transferred to the assembly machine 400.

[0059] For a detailed explanation of step S600, please refer to [link / reference]. Figure 15 In one embodiment, step S600 includes: S610, after the central robot 100 transports two silicon rods 500 to the splicing machine 400, the central robot 100 adjusts its posture and / or position so that the two silicon rods 500 are within the recognition range of the first vision unit 120 configured on the central robot 100, and obtains the position information of the crystal lines 510 on the silicon rods 500 through the first vision unit 120. It should be noted that the aforementioned adjustment of posture and / or position of the central robot 100 is to ensure that the recognition range of the first vision unit 120 on the central robot 100 covers the silicon rods 500 on the splicing machine 400. Specifically regarding the details of the central robotic arm 100 identifying the position information of the crystal line 510 on the silicon rod 500, it is possible that the first vision unit 120 identifies the position of the crystal line 510 of the first silicon rod 500 and the position of the crystal line 510 of the second silicon rod 500 at the same time; or it is possible that the first vision unit 120 identifies the position of the crystal line 510 of one silicon rod 500, and then the first vision unit 120 adjusts its posture and / or position to identify the position of the crystal line 510 of the second silicon rod 500.

[0060] Regarding the timing and location of acquiring the crystal line 510 position information of the silicon rod 500 for the second time in step S600, based on the crystal line 510 position information acquired the first time, before the silicon rod 500 is transferred to the splicing machine 400, the position of the silicon rod 500 is adjusted so that the crystal line 510 of the silicon rod 500 on the splicing machine 400 is within the detection range of the second acquisition of the crystal line 510 position information; or, after the silicon rod 500 is transferred to the splicing machine 400, based on the crystal line 510 position information acquired the first time, the position of the silicon rod 500 on the splicing machine 400 is adjusted so that the crystal line 510 of the silicon rod 500 on the splicing machine 400 is within the detection range of the second acquisition of the crystal line 510 position information.

[0061] Regarding the explanation of the bonding of adjacent end faces of two silicon rods 500 controlled by the splicing machine 400 in step S800, the first silicon rod 500 and the second silicon rod 500 in the splicing machine 400 are positioned vertically. In other words, the aforementioned bonding of adjacent end faces of the two silicon rods 500 refers to the bonding of the upper end face of the first silicon rod 500 and the lower end face of the second silicon rod 500. Specifically, the bonding process of adjacent end faces can be achieved by the upper jaw 440 moving the second silicon rod 500 downwards towards the first silicon rod 500, or by the lower jaw 430 moving the first silicon rod 500 upwards towards the second silicon rod 500. Of course, it is also feasible for the upper jaw 440 and the lower jaw 430 to move simultaneously.

[0062] The fully automated silicon rod bonding method of this application can be specifically applied to the fully automated silicon rod bonding device of this application.

[0063] Regarding the configuration quantity and layout of each piece of equipment in the specific fully automatic silicon rod bonding device, the number of equipment or workstations of the silicon rod feeder 200, the surface coating machine 300, and the rod splicing machine 400 are configured according to the processing cycle of each piece of equipment. For example, one central robot 100 cooperates with a three-station silicon rod feeder 200, a two-station surface coating machine 300, and a four-station rod splicing machine 400. After determining the configuration quantity of each piece of equipment, the layout of the silicon rod feeder 200, the surface coating machine 300, and the rod splicing machine 400 is preferably arranged in a clockwise or counterclockwise order around the central robot 100, so that the central robot 100 can carry the silicon rod 500 to perform operations on the silicon rod feeder 200, the surface coating machine 300, and the rod splicing machine 400 in turn.

[0064] This application embodiment also provides a silicon rod feeding machine 200, which is the silicon rod feeding machine 200 in the above-mentioned fully automatic silicon rod bonding device. (Reference) Figure 2 The silicon rod feeder 200 is used to input silicon rods 500 and measure the length of the input silicon rods 500.

[0065] The silicon rod feeding machine 200 includes a feeding section and a distance measuring section. The feeding section 210 includes a feeding channel 212 and a distance determining device. The feeding channel 212 carries silicon rods 500. The distance determining device is located at one end of the feeding channel 212 and corresponds to the feeding channel 212. The distance determining device measures the distance from the distance determining device to the first end face of the silicon rod 500. The distance measuring section 220 is disposed on one side of the feeding section 210, and a second distance measuring device 221 is disposed on the distance measuring section 220. The second distance measuring device 221 faces and acts on several feeding sections 210, and detects the silicon rods 500 on the feeding sections 210.

[0066] In one embodiment, the silicon rod feeder 200 includes a feeding section 210 and a ranging section 220. Several feeding sections 210 are arranged side-by-side. Each feeding section 210 includes a feeding channel 212 and a distance determining device. The feeding channel 212 is used to transport silicon rods 500 and is provided with positioning points. The silicon rod 500 includes a first end face and a second end face, the first end face being the end face of the silicon rod 500 near the end of its transport path along the feeding channel 212. The distance determining device is disposed on the feeding channel 212. The device is used to obtain a first distance between the end of the transport path of the incoming material channel 212 and the first end face of the silicon rod 500; a ranging unit 220 is provided, which is disposed on the same side of all the incoming material channels 212, and a second rangefinder 221 is provided on the ranging unit 220, which faces and acts on the incoming material channel 212; wherein, when the silicon rod 500 is controlled to rotate around the positioning point until the second end face faces the second rangefinder 221, a second distance between the second rangefinder 221 and the second end face of the silicon rod 500 is obtained through the second rangefinder 221. It can be understood that the silicon rod feeder 200 includes a plurality of incoming material sections 210 and a ranging unit 220. The incoming material sections 210 are used to transport the silicon rod 500, and the plurality of incoming material sections 210 cooperate with the ranging unit 220 to measure the length of the silicon rod 500 on each incoming material section 210. In addition, in order to facilitate distance measurement with the distance measuring unit 220, it is preferable that several material receiving units 210 are arranged side by side, and the distance measuring unit 220 is located on the same side of all material receiving units 210. A second distance measuring device 221 is provided on the distance measuring unit 220, and the second distance measuring device 221 faces the material receiving unit 210 so that the distance measuring range of the second distance measuring device 221 covers all material receiving units 210.

[0067] Incoming Materials Department 210, for reference Figure 2The material receiving section 210 includes a material receiving channel 212 and a distance determining device. The material receiving channel 212 is used to transport the silicon rod 500 and is provided with positioning points. The silicon rod 500 includes a first end face and a second end face, the first end face being the end face of the silicon rod 500 near the end of the transport path of the material receiving channel 212. The distance determining device is disposed on the material receiving channel 212 and is used to obtain a first distance between the end of the transport path of the material receiving channel 212 and the first end face of the silicon rod 500.

[0068] Distance measuring unit 220, reference Figure 2 The ranging unit 220 is used to measure a second distance related to the length information of the silicon rod 500. In one embodiment, the second rangefinder 221 provided on the ranging unit 220 is located on the same straight line as the positioning points of all incoming material channels 212, so that after the central robot arm 100 grasps the silicon rod 500 according to the positioning point and rotates it, regardless of which incoming material channel 210 the silicon rod 500 is on, the second end face of the silicon rod 500 is facing the second rangefinder 221, thereby enabling the second rangefinder 221 to measure the distance stably. Alternatively, by configuring only one ranging unit 220 for multiple incoming material channels 210, one second rangefinder 221 can measure the distance of the silicon rods 500 on several incoming material channels 210. Compared with the traditional scheme of setting two laser rangefinders opposite each incoming material channel 210, this scheme uses fewer rangefinders.

[0069] The distance determining device comes in two forms. In one embodiment, reference is made to... Figure 3The distance determining device includes a first rangefinder 211, which, exemplarily, is an infrared rangefinder or a laser rangefinder. The first rangefinder 211 is positioned at the end of the transport path of the receiving channel 212, allowing it to directly measure the distance to the first end face of the silicon rod 500 stationary on the receiving channel 212. Furthermore, the measuring direction of the first rangefinder 211 is parallel to the transport direction of the receiving channel 212, and the measuring direction of the second rangefinder 221 has a preset angle with the transport direction of the receiving channel 212. This allows the first rangefinder 211 to measure the distance to the first end face of the silicon rod 500 stationary on the receiving channel 212, and after the silicon rod 500 rotates at the preset angle relative to the central robotic arm 100, the second rangefinder 221 can measure the distance to the second end face of the silicon rod 500, ensuring that the second rangefinder 221 can measure the distance to the silicon rod 500 on each receiving section 210. The preset angle can be set from 0 to 90°. It is understood that the preset angle can be set according to requirements. In one embodiment, the preset angle is 90°, meaning the measuring direction of the first rangefinder 211 is parallel to the transport direction of the material inlet channel 212, and the measuring direction of the second rangefinder 221 is perpendicular to the transport direction of the material inlet channel 212. This facilitates the measurement of the first end face of the silicon rod 500 stationary on the material inlet channel 212 by the first rangefinder 211, allowing the silicon rod 500 to be positioned based on the center... After the central robotic arm 100 rotates 90°, the second rangefinder 221 can measure the distance to the second end face of the silicon rod 500, ensuring that the second rangefinder 221 can measure the silicon rods 500 on each of the feeding sections 210. In another embodiment, the preset included angle is 30° or 45°, so that after the silicon rod 500 rotates 30° or 45° based on the central robotic arm 100, it will not interfere with other feeding sections 210, making the design of the silicon rod feeding machine 200 more compact and reducing the space occupied. In another embodiment, refer to Figure 6 and Figure 7The distance determining device includes a spacer 213, which is disposed on the transport path of the material receiving channel 212 to limit the position of the silicon rod 500 on the material receiving channel 212, so that the first distance is a first preset value. For example, the spacer 213 is a liftable baffle. Specifically, the spacer 213 is located between the end of the transport path of the material receiving channel 212 and the positioning point. The distance between the spacer 213 and the end of the transport path of the material receiving channel 212 is the first preset value. Therefore, the spacer 213 can limit the position of the silicon rod 500 to measure the distance of the first end face of the silicon rod 500 on the material receiving channel 212, and facilitate the central robot arm 100 to rotate the silicon rod 500 after grasping it at the positioning point. In one embodiment, the spacer 213 has two states relative to the feeding channel 212. In the first state, the spacer 213 restricts the movement of the silicon rod 500, that is, the silicon rod 500 moves toward the spacer 213 and abuts against the spacer 213, so that the silicon rod 500 and the spacer 213 stably reach a preset first preset value. In the second state, the spacer 213 avoids the movement of the silicon rod 500, so as to leave room for the rotation of the silicon rod 500, so that the central robot arm 100 can grasp the silicon rod 500 and drive the silicon rod 500 to rotate. It should be noted that, since the spacer 213 is used, if Figure 7 The first preset value is a fixed value, which can be directly deducted when setting the third preset value Z. That is, the silicon rod length L = ZXY proposed earlier in this application can be simplified to silicon rod length L = Z2 - Y3.

[0070] This application also provides a method for measuring the distance of incoming silicon rods, which is applied to the silicon rod feeder 200 of any of the above embodiments. (Reference) Figure 3 and Figure 4 The specific method for measuring the distance of incoming silicon rods is as follows: S110, after the silicon rod 500 is transported to the material channel 212, the first distance between the end of the transport path of the material channel 212 and the first end face of the silicon rod 500 is obtained by the distance determining device; S120, the silicon rod 500 is controlled to rotate around the positioning point until the second end face faces the second distance measuring device 221; S130, the second distance between the second distance measuring device 221 and the second end face of the silicon rod 500 is obtained by the second distance measuring device 221; S140, the length of the silicon rod 500 is determined based on the first distance, the second distance and the third preset value corresponding to the material channel 212 where the silicon rod 500 is located.

[0071] This application embodiment also provides a surface coating machine 300, which is the surface coating machine 300 of the above-mentioned fully automatic silicone rod bonding device, see reference. Figure 8 and Figure 9The surface coating machine 300 is used to measure the surface tilt information of the end face of the silicon rod 500, obtain the position information of the crystal line 510 on the side of the silicon rod 500, and perform a coating operation on the end face of the silicon rod 500. The surface coating machine 300 includes a surface measuring assembly 310, which includes a surface measuring frame 311 and a surface measuring surface 312. The surface measuring surface 312 is provided with a plurality of distance sensors 3123. The tilt of the end face of the silicon rod 500 is calculated by measuring the distance results of the plurality of distance sensors 3123. There are two surface measuring surfaces 312, which are arranged on opposite sides of the surface measuring frame 311, and the action directions of the distance sensors (3123) in the two surface measuring surfaces 312 are opposite to each other to form a surface measuring space 313.

[0072] In one embodiment, the surface-testing and coating machine 300 includes a surface-testing component 310, a crystal wire assembly 320, and a coating component 330. The surface-testing component 310 and the crystal wire assembly 320 are independently arranged, and preferably the surface-testing component 310 and the crystal wire assembly 320 are located under one motion path of the central robot 100, so that the silicon rod 500 can be transported to the crystal wire assembly 320 after surface testing; while the coating component 330 is located above the crystal wire assembly 320, so as to perform the coating operation on the silicon rod 500 located in the crystal wire assembly 320.

[0073] Surface measuring component 310, reference Figure 10 and Figure 11 It is used to perform multi-point distance measurement on the end face of silicon rod 500. The measuring surface assembly 310 is located between the central robot 100 and the crystal wire assembly 320, and the measuring surface space 313 is open on both sides relative to the central robot 100 and the crystal wire assembly 320, so that the central robot 100 can carry the silicon rod 500 through the measuring surface assembly 310 for measuring and then go to the crystal wire assembly 320, thus optimizing the movement path of the central robot 100 carrying the silicon rod 500 between the measuring surface assembly 310 and the crystal wire assembly 320.

[0074] The surface measurement assembly 310 includes a surface measurement frame 311 and a surface measurement area 312. The surface measurement area 312 is provided with a plurality of distance sensors 3123. The inclination of the end face of the silicon rod 500 is calculated by measuring the distances of the plurality of distance sensors 3123. There are two surface measurement areas (312), which are arranged on opposite sides of the surface measurement frame (311). The distance sensors (3123) in the two surface measurement areas (312) are arranged in opposite directions to form a surface measurement space (313).

[0075] Specifically, in one embodiment, the surface measurement assembly 310 includes a surface measurement frame 311 and a surface measurement surface 312. The surface measurement frame 311 is hollow and preferably has open front and rear sides or left and right sides to construct the motion path of the central robot 100 in the surface measurement space 313. The surface measurement surface 312 includes several distance sensors 3123. There are two surface measurement surfaces 312, which are arranged on the upper and lower sides of the surface measurement frame 311. The distance sensors 3123 in the two surface measurement surfaces 312 are arranged in opposite directions to form a surface measurement space 313 that is through in the front and back direction. After the silicon rod 500 enters the surface measurement space 313, the two end faces of the silicon rod 500 correspond to the two oppositely arranged surface measurement surfaces 312. The surface measurement surfaces 312 obtain the surface inclination information of the silicon rod 500 through the distance measurement results of the several distance sensors 3123 on them.

[0076] It is understandable that the distance sensors 3123 on the face measuring device 312 are divided into two groups. The distance sensors 3123 in the first group are centrally located, while the distance sensors 3123 in the second group are arranged around the periphery of the first group. (Reference) Figure 10 For example, the first group has one distance sensor 3123; the second group has four distance sensors 3123, and the four distance sensors 3123 are arranged at equal angles. (Reference) Figure 11 The two measuring surfaces 312 are divided into a first measuring surface 312a and a second measuring surface 312b. Distance sensors 3123 on the first measuring surface 312a and the second measuring surface 312b are respectively and correspondingly arranged. Specifically, in one embodiment, the first measuring surface 312a and the second measuring surface 312b are configured on the upper and lower sides of the measuring surface frame 311 in the vertical direction, so that the silicon rod 500 passes through the measuring surface space 313 in an upright state.

[0077] It should also be noted that the measuring surface 312 includes a measuring surface base 3121 and a measuring surface support 3122. The measuring surface base 3121 is used to connect with the measuring surface frame 311. Multiple measuring surface supports 3122 are provided on the measuring surface base 3121. Each measuring surface support 3122 is used to connect and fix one or more distance sensors 3123. The measuring surface support 3122 allows the position of the distance sensor 3123 relative to the measuring surface base 3121 to be adjustable, so that the direction of the distance sensor 3123 toward the silicon rod 500 can be controlled based on the measuring surface support 3122.

[0078] For the 320 crystal wire module, refer to Figure 9The device is used to accommodate the silicon rod 500 and rotate it within the recognition range of the second vision unit 323. The crystal wire assembly 320 is disposed on one side of the surface measurement assembly 310. The crystal wire assembly 320 is located on the path extension of the central robot 100 moving towards the surface measurement assembly 310, and either the crystal wire assembly 320 or the surface measurement assembly 310 has space allowing the central robot 100 to pass through while holding the silicon rod 500, so that after passing the crystal wire assembly 320 or the surface measurement assembly 310, the central robot 100 places the silicon rod 500 onto the aforementioned other assembly. Preferably, the crystal wire assembly 320 is located on the path extension of the central robot 100 moving linearly towards the surface measurement assembly 310. Specifically, the crystal wire assembly 320 includes a crystal wire base 321, a crystal wire rotating seat 322, and a second vision section 323. The crystal wire rotating seat 322 and the second vision section 323 are both disposed on the crystal wire base 321, and the second vision section 323 faces the silicon rod receiving area of ​​the crystal wire rotating seat 322, so as to identify the crystal wire 510 on the silicon rod 500 when the silicon rod 500 rotates on the crystal wire rotating seat 322.

[0079] Glue-applied component 330, reference Figure 9 The coating assembly 330, having degrees of freedom of movement, is used to apply adhesive to the end faces of the silicon rod 500 to form an adhesive layer 600. The coating assembly 330 is positioned above the wafer assembly 320 to perform the adhesive application operation on the end faces of the silicon rod 500 on the wafer assembly 320. In one embodiment, the coating assembly 330 has three degrees of freedom of movement to facilitate flexible movement for applying adhesive to the end faces of the silicon rod 500 located below.

[0080] This application embodiment also provides a rod splicing machine 400, which is the rod splicing machine 400 in the above-mentioned fully automatic silicon rod bonding device. (Reference) Figure 12 and Figure 15 The rod splicing machine 400 is used to clamp two silicon rods 500 and control the adjacent end faces of the two to fit together.

[0081] The splicing machine 400 includes: a splicing frame 410; a lower jaw 430 disposed below the splicing frame 410 for holding a first silicon rod 500; an upper jaw 440 disposed above the splicing frame 410 for holding a second silicon rod 500; and a rotating assembly 420 disposed on the splicing frame 410. The rotating assembly 420 includes: a rotation source 421; a rotating substrate 423; and a pad 423. The rotating sources 421 are connected by a transmission mechanism, and the rotating substrate 423 is connected to one of the lower jaws 430 or 440, so that the lower jaws 430 and 440 can rotate relative to each other; wherein the lower jaws 430, the upper jaws 440 and the rotating assembly 420 are located on a vertical axis, and the lower jaws 430 and / or the upper jaws 440 have the freedom to move along the axis, so that the first silicon rod 500 on the lower jaws 430 and the second silicon rod 500 on the upper jaws 440 are spliced ​​together.

[0082] In one embodiment, the splicing machine 400 includes a splicing frame 410, a rotating assembly 420, a lower jaw 430 for holding a first silicon rod 500, and an upper jaw 440 for holding a second silicon rod 500. The rotating assembly 420 is located below the lower jaw 430, which is indirectly positioned below the splicing frame 410 by being fixed to the rotating assembly 420, and the lower jaw 430 has the ability to rotate via the rotating assembly 420. The upper jaw 440 is positioned on the splicing frame. Above 410; the lower jaw 430 and / or the upper jaw 440 have the freedom to move along the axis, and the upper jaw 440, the lower jaw 430 and the rotating assembly 420 are all located on a vertical axis; so as to ensure that after the lower jaw 430 rotates the first silicon rod 500, the position of the crystal line 510 of the first silicon rod 500 corresponds to the position of the crystal line 510 of the second silicon rod 500, which facilitates the subsequent relative approach of the first silicon rod 500 and the second silicon rod 500 to splice together, ensuring the quality of splicing.

[0083] 410-piece pegboard frame (reference) Figure 12 This serves as a connection base for other components. The splicing frame 410 has a first connecting surface and a second connecting surface. The first connecting surface is a horizontal surface used for connecting the splicing frame and the rotating component 420. The second connecting surface is a vertical surface located above and to the side of the first connecting surface. The second connecting surface is used for connecting the splicing frame and the upper clamping claw 440. For example, the splicing frame 410 has an L-shaped structure, where the horizontal surface is used to connect the rotating component 420, and the vertical surface is used to connect the upper clamping claw 440.

[0084] Rotating component 420, reference Figure 12 and Figure 13The rotating assembly 420 is used to drive the lower jaw 430 to rotate, thereby changing the position of the crystal line 510 of the first silicon rod 500 relative to the second silicon rod 500. The rotating assembly 420 also includes a transmission part 422, which connects the rotating substrate 423 and the rotation source 421, causing the rotating substrate 423 to rotate. Furthermore, to protect the silicon rods from damage and to collect waste oil, the rotating assembly 420 also includes a pad 424, which is disposed on the rotating substrate 423 and corresponds to the area below the clamping region of the lower jaw 430 used to clamp the silicon rod 500; and an oil collection tray 425, which is sleeved around the pad 424 and has a flange to form an oil collection space.

[0085] Specifically, in one embodiment, the rotating assembly 420 is disposed below the splicing rod frame 410. The rotating assembly 420 includes a rotating source 421, a transmission part 422, a rotating base plate 423, and a pad 424. The transmission part 422 is connected to the rotating source 421 and the rotating base plate 423 respectively. The rotating source 421 causes the rotating base plate 423 to rotate. The rotating base plate 423 is connected to the lower jaw 430 and the pad 424 to prevent damage to the silicon rod 500 if it falls, so that the first silicon rod 500 can rotate relative to the upper jaw 440 when it is held by the lower jaw 430. It should be noted that during the rotation of the first silicon rod 500 held by the lower jaw 430, the lower end face of the first silicon rod 500 does not contact the pad 424. The function of the pad 424 is to support the falling silicon rod 500 if the lower jaw 430 fails to hold it, thus preventing damage to the silicon rod 500. Understandably, an oil receiving tray 425 can also be provided above the rotating substrate 423 and below the pad 424 to receive the clamping portions of the upper jaw 440 and lower jaw 430, as well as impurities and dirt generated by the silicon rod 500. Specifically, the oil receiving tray 425 is sleeved around the pad 424, and the oil receiving tray 425 has a flange to form an oil receiving space.

[0086] Transmission unit 422, reference Figure 12This is used to drive the silicon rod 500 to rotate. In one embodiment, the transmission unit 422 is a set of gears, which controls the rotation accuracy of the rotating substrate 423. For example, the transmission unit 422 is a set of meshing gears, which includes a first gear 4221, a second gear 4222, and a rotary support 4223. The first gear 4221 is an internal gear and is connected to the rotation source 421. The second gear 4222 is an external gear connected to the rotating substrate 423. The position of the second gear 4222 is defined by the rotary support 4223 located around it. The second gear 4222 is sleeved outside the first gear 4221 and meshes with the first gear 4221. The second gear 4222 drives the rotating substrate 423 to rotate due to the rotation of the first gear 4221. The reduction design of the transmission unit 422 is beneficial to increase the torque and meet the precise rotation of the heavy silicon rod 500, so as to facilitate the alignment operation of the crystal line 510 of the first silicon rod 500 and the second silicon rod 500, and avoid the situation that the crystal line 510 of the second silicon rod 500 cannot be aligned due to the rotation error after the first silicon rod 500 is rotated.

[0087] Lower jaw 430 and upper jaw 440, see reference Figure 12 The upper jaw 440 and the lower jaw 430 have basically the same structure, each including two jaw bodies and an actuator. The actuator connects the two jaw bodies in a one-to-two manner, enabling the two jaw bodies to move synchronously. The two jaw bodies are symmetrically arranged on both sides with the vertical axis shared by the lower jaw 430, the upper jaw 440, and the pad 424 as the center line. The inner surface of the jaw body is provided with a pad, which ensures that the jaw body applies force evenly when it contacts the silicon rod 500.

[0088] In one embodiment, the lower jaw 430 has a degree of freedom to move along the axis relative to the rotating substrate 423. This allows the lower jaw 430 to adjust the distance between the short silicon rod and the pad 424, and also facilitates the lower jaw to clamp the middle portion of the short silicon rod.

[0089] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0090] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A surface coating machine, characterized in that, The surface coating machine includes: A surface measuring assembly (310), the surface measuring assembly (310) comprising: The measuring frame (311) is a frame structure; Measuring face (312), wherein a plurality of distance sensors (3123) are provided in the measuring face (312), and the tilt of the end face of the silicon rod (500) is calculated by the distance measurement results of the plurality of distance sensors (3123); There are two measuring surfaces (312), which are arranged on opposite sides of the measuring surface frame (311), and the distance sensors (3123) in the two measuring surfaces (312) are arranged in opposite directions to form a measuring surface space (313).

2. The surface coating machine according to claim 1, characterized in that, The distance sensors (3123) on the measuring face (312) are divided into two groups. The distance sensors (3123) in the first group are centrally located, and the distance sensors (3123) in the second group are arranged around the periphery of the distance sensors (3123) in the first group.

3. The surface coating machine according to claim 2, characterized in that, The first group has one distance sensor (3123); the second group has four distance sensors (3123), and the four distance sensors (3123) are arranged at equal angles.

4. The surface coating machine according to claim 1, characterized in that, The distance sensors (3123) on the two measuring surfaces (312) are respectively set one-to-one.

5. A surface coating machine according to claim 1, characterized in that, The measuring face (312) also includes: Measuring base (3121), the measuring base (3121) and the measuring frame (311) are connected; A measuring surface support (3122) is provided, which connects the measuring surface base (3121) and the distance sensor (3123) respectively. The measuring surface support (3122) allows for adjustment of the position of the distance sensor (3123) relative to the measuring surface base (3121).

6. A surface coating machine according to claim 1, characterized in that, Two of the measuring surfaces (312) are arranged on the upper and lower sides of the measuring surface frame (311) in the vertical direction, so that the silicon rod (500) passes through the measuring surface space (313) in an upright state.

7. A surface coating machine according to claim 1, characterized in that, The measuring surface space (313) has a continuous movement path so that the silicon rod (500) can pass through the measuring surface assembly (310).

8. A surface coating machine according to claim 7, characterized in that, The front and rear sides or left and right sides of the measuring surface frame (311) are open to construct the motion path in the measuring surface space (313).

9. A surface coating machine according to claim 7, characterized in that, The surface coating machine further includes a crystal wire assembly (320), which is disposed on one side of the surface assembly (310) and is located on an extension of the movement path, such that the silicon rod (500) is located on the crystal wire assembly (320) after passing through the surface space (313). A coating assembly (330) is disposed above the pair of crystal wires assembly (320) to perform a coating operation on the end face of the silicon rod (500) on the pair of crystal wires assembly (320).

10. A surface coating machine according to claim 9, characterized in that, The pair of crystal wire components (320) are disposed on the straight extension of the motion path.