Semiconductor voltage regulating module

Abstract

The utility model discloses a semiconductor voltage regulating module, relates to the technical field of semiconductor devices, and aims to solve the problems that a single disc spring is less in elastic deformation compensation, temperature rises due to the fact that a pressure drop value is easy to increase due to thermal stress deformation, and the capability of regulating chip pressure does not exist. A chip is installed at the center position of the anode bottom plate, the chip is electrically connected with a cathode electrode column, the cathode electrode column is sleeved with a main spring, the cathode electrode column is further sleeved with a pressing plate, the two ends of the main spring abut against the chip and the pressing plate respectively, and four bolts are arranged on the pressing plate in a penetrating mode. And the bolt is in threaded connection with the anode bottom plate.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor devices, and specifically to a semiconductor voltage regulation module. Background Technology

[0002] The core purpose of using disc springs to control voltage drop in semiconductor equipment is to achieve precise control and constant pressure through the elastic characteristics of disc springs, and to compensate for system changes, ultimately ensuring process stability and equipment reliability.

[0003] Existing semiconductor modules all use a single disc spring to press the chip to control the voltage drop. However, a single disc spring has limited elastic deformation compensation, and thermal stress deformation can easily increase the voltage drop value, leading to temperature rise. It also lacks the ability to adjust the chip pressure. Utility Model Content

[0004] To address the aforementioned issues—namely, the limited elastic deformation compensation of a single disc spring, the tendency for thermal stress deformation to increase voltage drop leading to temperature rise, and the lack of ability to regulate chip pressure—this invention proposes a semiconductor voltage regulating module. The module includes an anode base plate, a chip mounted at its center, a cathode electrode post electrically connected to the chip, a main spring sleeved on the cathode electrode post, and a pressure plate sleeved on the cathode electrode post. The two ends of the main spring abut against the chip and the pressure plate, respectively. Four bolts pass through the pressure plate and are threadedly connected to the anode base plate.

[0005] A further feature of this invention is that each bolt is fitted with a pressure adjusting spring, the pressure adjusting spring being positioned above the pressure plate, and both ends of the pressure adjusting spring abutting against the pressure plate and the nut of the bolt, respectively.

[0006] A further feature of this invention is that an insulating pad is provided on the upper surface of the chip, and the bottom end of the main spring abuts against the insulating pad.

[0007] The beneficial effects of this utility model are as follows:

[0008] 1. The combination of the main spring and the adjusting spring significantly increases the compensation space, thereby preventing temperature rise caused by various thermal stresses and greatly improving the reliability of the chip. Simultaneously, the dual-spring design prevents the main spring from wearing down over time, which could affect the chip's pressure resistance.

[0009] 2. Springs can enhance the relaxation and fatigue resistance of a structure, and also enhance visibility. After a failure occurs, the changes in the spring can be observed intuitively, which is more conducive to problem analysis. Attached Figure Description

[0010] Figure 1 A schematic diagram of the structure of this utility model is shown.

[0011] Reference numerals in the attached diagram: 1. Anode base plate; 2. Chip; 3. Cathode electrode post; 4. Main spring; 5. Pressure plate; 6. Bolt; 7. Adjusting spring; 8. Insulating gasket. Detailed Implementation

[0012] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0013] refer to Figure 1 This utility model proposes a semiconductor voltage regulating module, including an anode base plate 1, a chip 2 installed at the center of the anode base plate 1, the chip 2 and the anode base plate 1 in contact to achieve electrical connection, a cathode electrode post 3 electrically connected to the side surface of the chip 2 away from the anode base plate 1, a main spring 4 coaxially sleeved on the cathode electrode post 3, a pressure plate 5 also sleeved on the cathode electrode post 3, the main spring 4 is disposed between the pressure plate 5 and the chip 2, that is, the two ends of the main spring 4 abut against the chip 2 and the pressure plate 5 respectively, so that the elastic force of the main spring 4 can act on the chip 2.

[0014] Four bolts 6 are threaded through the pressure plate 5, arranged in a rectangular pattern. The bolts 6 are threaded to the anode base plate 1. Rotating the bolts 6 can adjust the distance between the pressure plate 5 and the anode base plate 1, thereby adjusting the elastic force of the main spring 4.

[0015] Each bolt 6 is coaxially fitted with a pressure adjusting spring 7, which is located between the pressure plate 5 and the nut of the bolt 6. The two ends of the pressure adjusting spring 7 abut against the pressure plate 5 and the nut of the bolt 6, respectively. That is, rotating the bolt 6 can also adjust the elastic force of the spring.

[0016] An insulating pad 8 is placed on the upper surface of chip 2. The insulating pad 8 is also coaxially sleeved on the cathode electrode post 3. The end of the main spring 4 near chip 2 abuts against chip 2 through the insulating pad 8, thus preventing the main spring 4 from contacting the cathode of chip 2.

[0017] It should be noted that neither the main spring 4 nor the pressure plate 5 is in contact with the cathode electrode post 3.

[0018] In summary, this invention, through the combined action of the main spring 4 and the adjusting spring 7, significantly increases the compensation space, thereby preventing temperature rise caused by various thermal stresses and greatly improving the reliability of chip 2. Simultaneously, the dual-spring configuration prevents the main spring 4 from wearing down over prolonged use, which could affect the pressure applied to chip 2. The springs enhance the structure's relaxation and fatigue resistance, and improve visibility; in the event of a fault, changes in the springs can be observed directly, facilitating problem analysis.

[0019] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0020] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0023] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A semiconductor voltage regulating module, characterized in that: The device includes an anode base plate (1), a chip (2) is installed at the center of the anode base plate (1), a cathode electrode post (3) is electrically connected to the chip (2), a main spring (4) is sleeved on the cathode electrode post (3), and a pressure plate (5) is also sleeved on the cathode electrode post (3). The two ends of the main spring (4) abut against the chip (2) and the pressure plate (5) respectively. Four bolts (6) are threaded through the pressure plate (5), and the bolts (6) are threaded to the anode base plate (1). Each bolt (6) is sleeved with a pressure adjusting spring (7), which is located above the pressure plate (5). The two ends of the pressure adjusting spring (7) abut against the nuts of the pressure plate (5) and the bolts (6) respectively.

2. The semiconductor voltage regulating module according to claim 1, characterized in that: An insulating pad (8) is also provided on the upper surface of the chip (2), and the bottom end of the main spring (4) abuts against the insulating pad (8).

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