Current sensor and detection equipment

Abstract

The embodiment of the utility model provides a current sensor and detection equipment, and the current sensor comprises a housing assembly which comprises a bottom housing and a cover plate, and the cover plate is detachably connected to the bottom housing, so as to form an accommodation cavity in an enclosing manner; the chip assembly comprises a chip part and a magnetic core, the magnetic core is provided with an air gap and located in the containing cavity, and the chip part penetrates through the cover plate from the outer side of the cover plate and extends to the air gap. The chip part and the magnetic core are both arranged in the containing cavity of the shell assembly, the bottom shell and the cover plate of the shell assembly are connected in a detachable mode, no injection molding procedure is needed in the installation process, the magnetic core can be replaced, maintainability is improved, and maintenance cost is reduced.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and more specifically, to a current sensor and detection device. Background Technology

[0002] With the increasing sales of new energy vehicles, current sensors are widely used in detecting the magnitude of current in automotive motors. Hall effect current sensors in electric vehicles detect current in the circuit, increasing the stability of the vehicle, monitoring overcurrent in the power system, detecting the drive current of each motor, and comparing the magnitude of the generator discharge current with the actual load current to determine if there are any faults that could impair vehicle performance. This provides accurate data for the automotive electronic system, making its control more precise and improving vehicle safety.

[0003] In related technologies, existing current sensors are difficult to replace. When a single component fails, the entire sensor must be replaced, which increases costs. Utility Model Content

[0004] The purpose of this application is to provide a current sensor and detection device that facilitates maintenance, disassembly, and replacement, thereby improving maintainability and reducing maintenance costs.

[0005] In a first aspect, embodiments of this application provide a current sensor, including: a housing assembly including a bottom shell and a cover plate, the cover plate being detachably connected to the bottom shell to enclose and form a receiving cavity; a chip assembly including a chip and a magnetic core, the magnetic core being configured with an air gap and the magnetic core being located in the receiving cavity, the chip extending through the cover plate from the outside of the cover plate and extending to the air gap.

[0006] In the above implementation process, both the chip and the magnetic core are arranged in the receiving cavity of the housing assembly, and the bottom shell and the cover plate of the housing assembly are connected in a detachable manner. The installation process does not involve injection molding, which allows the magnetic core to be replaced, improving maintainability and reducing maintenance costs.

[0007] In some embodiments, the periphery of the cover plate is provided with a snap fastener, and the periphery of the bottom shell is provided with a snap-fit ​​groove, the snap-fit ​​groove being configured to receive the snap fastener.

[0008] In the above process, the cover plate and the bottom shell can be disassembled and connected by the matching of the buckle and the snap-fit ​​groove. The snap-fit ​​method is simple and easy to operate, and at the same time, it is convenient to replace the magnetic core without scrapping the entire current sensor, which improves maintainability and reduces maintenance costs.

[0009] In some embodiments, the chip assembly further includes a PCB board located on the side of the cover plate opposite to the bottom shell, and the PCB board is connected to the chip.

[0010] In some embodiments, the chip includes a V-shaped Hall effect chip, and the chip is reflow soldered to the side of the PCB board near the magnetic core.

[0011] In the above implementation process, the chip is set with V-shaped pins, which can be directly placed on the PCB board. The chip is connected to the PCB board by reflow soldering, which replaces the wave soldering used for traditional through-hole chips. This shortens the soldering time, improves the convenience of assembly, and thus improves the assembly efficiency of the production line.

[0012] In some embodiments, the bottom shell is provided with a copper busbar via, through which the current-carrying copper busbar passes through the bottom shell and the magnetic core.

[0013] In the above process, the cross-sectional area of ​​the overcurrent copper busbar is larger than that of the wire, which can withstand a larger current and is used to carry the current. When the overcurrent copper busbar carries the current, according to Faraday's law of electromagnetic induction, the overcurrent copper busbar will generate a magnetic field. The generated magnetic field is converged to the air gap by the magnetic core and passes through the chip. At this time, the chip generates an induced electromotive force. After further processing, the magnitude of the current flowing on the overcurrent copper busbar can be obtained, thereby realizing the detection of the current value.

[0014] In some embodiments, a connection hole is provided at a position where the overcurrent copper bus extends to the outside of the bottom housing. Power can be supplied to the overcurrent copper bus through this connection hole, and the current value of the overcurrent copper bus can be detected through the chip assembly.

[0015] In some embodiments, the bottom shell is further provided with a housing groove located outside the copper busbar via.

[0016] In the above implementation process, a housing groove is provided on the outside of the copper busbar through hole in the bottom shell, which can increase the creepage distance and improve safety performance.

[0017] In some embodiments, the inner cavity of the bottom shell is provided with partition walls to divide the inner cavity of the bottom shell into a plurality of mounting slots, each of the mounting slots being provided with the chip and the magnetic core.

[0018] In the above implementation process, the bottom shell forms several mounting slots through partition walls. The chip components and magnetic cores are all arranged in these mounting slots. This not only enables the simultaneous detection of current in several overcurrent copper busbars, but also reduces interference between adjacent chip components during the detection process, thereby improving the accuracy of the detection results.

[0019] In some embodiments, the bottom housing is further provided with an extension, which has a mounting hole. This mounting hole allows the housing assembly to be fixed to the outside environment, facilitating the detection of the current value flowing through the copper busbar.

[0020] Secondly, this application also provides a detection device, including a current sensor as described in any of the preceding claims.

[0021] Since the detection equipment provided in the second aspect includes a current sensor, the detection equipment has all the technical effects of a current sensor, which will not be elaborated here.

[0022] Other features and advantages of this disclosure will be set forth in the following description, or some features and advantages may be inferred from the description or determined without doubt, or may be learned by practicing the techniques described above.

[0023] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the current sensor provided in the embodiments of this application;

[0026] Figure 2 An exploded view of the current sensor provided in the embodiments of this application;

[0027] Figure 3 This is a schematic diagram of the structure of the bottom shell of the current sensor provided in an embodiment of this application.

[0028] Figure Labels

[0029] 100. Housing assembly; 101. Cover plate; 1011. Top cover through hole; 1012. Snap-fit; 102. Bottom shell; 1021. Snap-fit ​​groove; 1022. Copper busbar through hole; 1023. Housing groove; 1024. Fixing mounting hole; 1025. Mounting slot; 1026. Partition wall; 200. Chip assembly; 201. Chip component; 202. Magnetic core; 203. Air gap; 204. PCB board; 300. Current-carrying copper busbar; 301. Connection hole. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0032] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0033] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or a point connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0034] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0035] Example

[0036] Current sensing is a crucial function in power electronic systems such as new energy vehicles and high-voltage electrical appliances. Electric vehicles require inverters to convert the direct current (DC) from the battery into alternating current (AC) to power the three-phase motor; energy recovery systems require rectifiers to convert the AC generated by the motor back to DC and store it in the battery. Therefore, electric vehicles have extremely high demands for current sensors. Consequently, the performance of current sensors directly affects the stability and reliability of power electronic systems. Hall effect-based current sensors offer advantages such as low loss, stable performance, built-in isolation, and strong overload capacity.

[0037] During the design process, the inventors discovered that the current current sensor is currently made of one-piece injection molding, which makes it difficult to replace the core components of the current sensor, such as the magnetic core and the chip. When a single component is damaged, the entire sensor must be replaced, which increases the cost.

[0038] In view of this, such as Figures 1-3 As shown, in a first aspect, this application provides a current sensor, including: a housing assembly 100, including a bottom shell 102 and a cover plate 101, the cover plate 101 being detachably connected to the bottom shell 102 to enclose and form a receiving cavity; a chip assembly 200, including a chip 201 and a magnetic core 202, the magnetic core 202 being provided with an air gap 203 and the magnetic core 202 being located in the receiving cavity, the chip 201 extending from the outside of the cover plate 101 through the cover plate 101 and extending to the air gap 203.

[0039] For example, the bottom shell 102 is provided with a mounting groove 1025 corresponding to the position of the magnetic core 202. The mounting groove 1025 is configured to install the magnetic core 202 so that the magnetic core 202 can be fixed after the cover plate 101 is connected to the bottom shell 102.

[0040] The bottom shell 102 and the cover plate 101 are configured to be distributed along a first direction, which includes a horizontal direction, including but not limited to the left and right directions. The bottom shell 102 is made of materials including but not limited to plastic, and the cover plate 101 is made of materials including but not limited to plastic. Both the bottom shell 102 and the cover plate 101 are generally injection molded. The bottom shell 102 can be used to fix to the outside world, thereby facilitating the detection of current values.

[0041] It is understood that, in order to facilitate the chip's extension to the air gap 203, the cover plate 101 is provided with an upper cover through hole 1011, which is used for the chip to pass through, and the number of the upper cover through holes 1011 includes, but is not limited to, three.

[0042] The magnetic core 202 is made of silicon steel sheet, and the magnetic core 202 is generally in the form of a wound type or a stacked type.

[0043] In the above implementation process, both the chip 201 and the magnetic core 202 are disposed in the receiving cavity of the housing assembly 100, and the bottom shell 102 of the housing assembly 100 and the cover plate 101 are connected in a detachable manner. The installation process does not involve injection molding, which allows the magnetic core 202 to be replaced, improving maintainability and reducing maintenance costs.

[0044] like Figure 2 As shown, the periphery of the cover plate 101 is provided with a buckle 1012, and the periphery of the bottom shell 102 is provided with a snap-fit ​​groove 1021. The snap-fit ​​groove 1021 is configured to accommodate the buckle 1012. For example, a plurality of buckles 1012 are provided, including but not limited to six. The plurality of buckles 1012 are located on the front, back, left, and right side walls of the cover plate 101 to achieve good fixation between the cover plate 101 and the bottom shell 102. The buckles 1012 are located on the outer side of the cover plate 101, and the snap-fit ​​groove 1021 penetrates through the side wall of the bottom shell 102 so that when the buckle 1012 is adapted to the snap-fit ​​groove 1021, the buckle 1012 can undergo a certain deformation relative to the cover plate 101.

[0045] In the above implementation process, the cover plate 101 and the bottom shell 102 can be disassembled and connected by the adaptation of the buckle 1012 and the snap-fit ​​groove 1021. The snap-fit ​​method is simple and easy to operate, and at the same time, it can facilitate the replacement of the magnetic core 202 without scrapping the entire current sensor, which improves maintainability and reduces maintenance costs.

[0046] like Figures 1-2 As shown, the chip assembly 200 also includes a PCB board 204, which is located on the side of the cover plate 101 away from the bottom shell 102, and the PCB board 204 is connected to the chip assembly 201.

[0047] For example, the PCB board 204 is distributed along the first direction and is located on the outside of the housing assembly 100. The PCB board 204 is generally integrated on the main control circuit board, or it can be a separate circuit board.

[0048] In some embodiments, the chip 201 includes a V-shaped Hall chip, specifically, the pins of the V-shaped Hall chip are V-shaped, and the chip is reflow soldered to the side of the PCB board 204 near the magnetic core 202.

[0049] In the above implementation process, the chip is set with V-shaped pins, which can be directly placed on the PCB board 204. The chip is connected to the PCB board 204 by reflow soldering, which replaces the wave soldering used for traditional through-hole chips, shortens the soldering time, improves the convenience of assembly, and thus improves the assembly efficiency of the production line.

[0050] In some embodiments, the bottom shell 102 is provided with a copper busbar through-hole 1022, through which the current-carrying copper busbar 300 passes through the bottom shell 102 and the magnetic core 202.

[0051] For example, the current sensor provided in this application is used to detect the current value of the three phases in the three-phase motor of a new energy vehicle. The overcurrent copper busbar 300 is generally a three-phase current, and the current sensor is used to detect the three-phase current flowing through the overcurrent copper busbar 300.

[0052] The current-carrying copper busbar 300 passes through the copper busbar via 1022. When current flows through the current-carrying copper busbar 300, according to Faraday's law of electromagnetic induction, the alternating current flowing through the current-carrying copper busbar 300 generates a magnetic field around it. The magnetic field is converged by the magnetic core 202. The V-shaped Hall chip is placed in the middle of the air gap 203. The magnetic field passes through the V-shaped Hall chip, and the V-shaped Hall chip generates an induced electromotive force. After being processed by the internal circuit, it generates an analog signal that can reflect the magnitude of the current. This signal is fed back to the control terminal through the PCB board 204, and the control terminal receives and processes the signal.

[0053] This application discloses a current sensor used to detect the amplitude and phase of AC current in the three-phase AC circuit of a motor controller in a new energy vehicle. The current sensor is connected in series with the three-phase AC busbar 300 (i.e., the three-phase AC busbar) of the motor controller in the new energy vehicle to detect the amplitude and phase of the AC current in each phase. In this embodiment, the current sensor is connected in series with the three-phase AC busbar to detect the amplitude and phase of the AC current flowing through the busbar 300. The current amplitude and phase are fed back to the control chip of the control circuit in real time. After the control chip processes the current amplitude and phase, closed-loop control of the motor is achieved, improving the working efficiency and safety of the motor in the new energy vehicle.

[0054] In the above process, the cross-sectional area of ​​the overcurrent copper busbar 300 is larger than that of the wire, which can withstand a larger current and is used to carry the current. When the overcurrent copper busbar 300 carries current, according to Faraday's law of electromagnetic induction, the overcurrent copper busbar 300 will generate a magnetic field. The generated magnetic field is converged to the air gap 203 by the magnetic core 202 and passes through the chip. At this time, the chip generates an induced electromotive force. After further processing, the magnitude of the current flowing on the overcurrent copper busbar 300 can be obtained, thereby realizing the detection of the current value.

[0055] In some embodiments, the overcurrent copper busbar 300 extends to the outer side of the bottom housing 102 and is provided with a connection hole 301, for example, the connection hole 301 is used to connect a motor controller. Power can be supplied to the overcurrent copper busbar 300 through the connection hole 301, and the current value of the overcurrent copper busbar 300 can be detected by the chip assembly 200.

[0056] Please refer to again Figures 1-3 The bottom shell 102 is also provided with a shell groove 1023, which is located outside the copper busbar through hole 1022.

[0057] In the above implementation process, the bottom shell 102 is provided with a shell groove 1023 on the outside of the copper busbar through hole 1022, which can increase the creepage distance and improve safety performance.

[0058] like Figure 3 As shown, the inner cavity of the bottom shell 102 is provided with a partition wall 1026 to divide the inner cavity of the bottom shell 102 into a plurality of mounting slots 1025. Each mounting slot 1025 is provided with the chip 201 and the magnetic core 202. For example, the partition wall 1026 is integrally formed with the bottom shell 102, and there are three mounting slots 1025.

[0059] In the above implementation process, the bottom shell 102 forms several mounting slots 1025 through the partition wall 1026. The chip component 201 and the magnetic core 202 are both arranged in the mounting slots 1025. This not only enables the simultaneous detection of current of several overcurrent copper busbars 300, but also reduces the interference between adjacent chip components 200 during the detection process and improves the accuracy of the detection results.

[0060] In some embodiments, the bottom shell 102 is further provided with an extension, the extension being provided with a fixing mounting hole 1024, for example, the extension being located on the left and right sides of the bottom shell 102. Through the fixing mounting hole 1024, the housing assembly 100 can be fixed to the outside environment, facilitating the detection of the current value flowing through the copper busbar 300.

[0061] Secondly, this application also provides a detection device, including the current sensor described above.

[0062] Since the detection equipment provided in the second aspect includes a current sensor, the detection equipment has all the technical effects of a current sensor, which will not be elaborated here.

[0063] In all embodiments of this application, "large" and "small" are relative terms, "more" and "less" are relative terms, and "upper" and "lower" are relative terms. The embodiments of this application will not elaborate further on the expression of such relative terms.

[0064] It should be understood that the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0065] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0066] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. A current sensor, characterized in that, include: The housing assembly includes a bottom shell and a cover plate, wherein the cover plate is detachably connected to the bottom shell to enclose and form a receiving cavity; A chip assembly includes a chip and a magnetic core. The magnetic core is configured with an air gap and is located in the receiving cavity. The chip extends from the outside of the cover plate through the cover plate and to the air gap. The cover plate is configured with a snap fastener at its periphery, and the bottom shell is configured with a snap-fit ​​groove at its periphery. The snap-fit ​​groove is configured to receive the snap fastener.

2. The current sensor according to claim 1, characterized in that, The chip assembly also includes a PCB board located on the side of the cover plate away from the bottom shell, and the PCB board is connected to the chip.

3. The current sensor according to claim 2, characterized in that, The chip includes a V-shaped Hall effect chip, and the chip is reflow soldered to the side of the PCB board near the magnetic core.

4. The current sensor according to claim 1, characterized in that, The bottom shell is provided with copper busbar vias, through which the current-carrying copper busbar passes through the bottom shell and the magnetic core.

5. The current sensor according to claim 4, characterized in that, The current-carrying copper busbar has a connection hole located at the position where it extends to the outside of the bottom shell.

6. The current sensor according to claim 4, characterized in that, The bottom shell is also provided with a shell groove, which is located on the outside of the copper busbar through hole.

7. The current sensor according to any one of claims 1-6, characterized in that, The inner cavity of the bottom shell is provided with partition walls to divide the inner cavity of the bottom shell into several mounting slots, and each mounting slot is provided with the chip and the magnetic core.

8. The current sensor according to claim 1, characterized in that, The bottom shell is also provided with an extension, and the extension is provided with a fixing mounting hole.

9. A testing device, characterized in that, Including the current sensor as described in any one of claims 1-8.

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