Current sensor structure capable of reducing influence of plastic coating high temperature on magnetic core

Abstract

The utility model discloses a current sensor structure capable of reducing the influence of plastic coating high temperature on a magnetic core, and the current sensor structure capable of reducing the influence of plastic coating high temperature on the magnetic core comprises a magnetic core body, a housing, and a chip board. An accommodating space for accommodating the magnetic core body and a placing space for accommodating the chip board are formed in the shell, the Hall chip of the chip board is kept in the air gap space, a supporting bottom is formed on the bottom wall of the accommodating space, the inner wall part of the accommodating space extends inwards to form at least one first attaching and pressing part, and the first attaching and pressing part is used for attaching and pressing the Hall chip of the chip board. The supporting bottom and the first attaching and pressing part are attached to the magnetic core body in an opposite mode, and a first isolation space is formed in the position, back on to the supporting bottom, of the surface of the magnetic core body, so that the contact area between a high-temperature liquid injection molding material used for forming the shell and the magnetic core body is reduced. Measurement errors of the current sensor caused by magnetism reduction of the magnetic core body due to heating and cooling are reduced.

Description

Technical Field

[0001] This utility model relates to the field of current sensor technology, and in particular to a current sensor structure that can reduce the impact of high temperature on the magnetic core caused by plastic coating. Background Technology

[0002] With the development of technology, current sensors have emerged to automatically detect current. A current sensor consists of a housing, a magnetic core, and a Hall effect chip. The magnetic core is installed inside the housing, and the Hall effect chip is placed in the air gap formed by the magnetic core. A energized copper busbar passes through the housing. When the magnitude of the current flowing through the energized copper busbar changes, causing a change in the magnetic flux through the Hall effect chip, the change in current flowing through the energized copper busbar is calculated.

[0003] Since a magnetic field is generated around the energized copper busbar after current is applied, in order to prevent the magnetic field around the energized copper busbar from causing the magnetic core to deviate inside the housing, it is necessary to improve the integrity between the magnetic core and the housing. Therefore, when manufacturing the current sensor, the magnetic core is directly injection molded to form the housing, and after installing components such as Hall chips inside the housing, the housing is sealed to form the current sensor.

[0004] In existing technology, the magnetic core is completely immersed in a high-temperature liquid injection molding material, and after the material cools and solidifies, a shell is formed around the core. However, the high temperature of the magnetic core due to the liquid molding material causes its temperature to rise, reducing or even eliminating its magnetism. Although the magnetism may recover somewhat after cooling, the loss is irreversible. This leads to a decrease in the core's performance, reducing the magnetic flux passing through the Hall effect sensor, and consequently increasing the error of the current sensor. Utility Model Content

[0005] To solve the above-mentioned technical problems and achieve at least one advantage of this utility model, this utility model provides a current sensor structure that can reduce the impact of high temperature on the magnetic core caused by plastic coating, wherein the current sensor structure that can reduce the impact of high temperature on the magnetic core caused by plastic coating includes:

[0006] A magnetic core, wherein the magnetic core forms an air gap space;

[0007] A housing, the housing forming a receiving space and a placement space for accommodating the magnetic core, and a supporting bottom forming on the bottom wall of the receiving space, the supporting bottom conforming to the bottom surface of the magnetic core in the thickness direction, the housing further having at least one first pressing portion, the inner wall portion of the receiving space extending inward to form the first pressing portion, and the first pressing portion conforming to the surface of the magnetic core facing away from the supporting bottom, forming a first isolation space on the surface of the magnetic core facing away from the supporting bottom; and

[0008] A chip board is disposed in the placement space, the chip board has a Hall chip, and the Hall chip of the chip board is held in the air gap space.

[0009] According to one embodiment of the present invention, the first pressing part is implemented as four, and the four first pressing parts are respectively disposed at the four corners of the magnetic core.

[0010] According to one embodiment of the present invention, the housing further forms at least three second isolation spaces, the three second isolation spaces being respectively formed between the edge of the magnetic core away from the air gap space and the inner wall of the receiving space.

[0011] According to one embodiment of the present invention, the housing further forms a plurality of reinforcing strips, which are arranged around the inner walls of the accommodating space and the placement space, and the reinforcing strips are partially attached to the magnetic core.

[0012] According to one embodiment of the present invention, the magnetic core further forms a through space for passing through an energized copper busbar, and the housing further has a fixing cylinder, one end of which is connected to the support base, and the fixing cylinder passes through the through space in a manner that fits against the inner wall of the through space.

[0013] According to one embodiment of the present invention, the fixing cylinder has a second pressing portion, and the end of the fixing cylinder away from the support base is radially extended to form the second pressing portion, which is attached to the surface of the magnetic core facing away from the support base.

[0014] According to one embodiment of the present invention, the fixing cylinder is provided with a first clamping groove along the extension direction of the through space. The first clamping groove is adapted to the thickness of the chip board. The chip board is partially inserted into the first clamping groove, and the inner wall of the first clamping groove is pressed against the chip board.

[0015] According to one embodiment of the present invention, the current sensor structure that can reduce the impact of high temperature on the magnetic core further includes a reinforcing member, the reinforcing member being connected to the inner wall of the placement space, the reinforcing member having at least one second pressing strip that conforms to the magnetic core body, the reinforcing member extending towards the surface of the magnetic core body to form at least one second pressing strip, the housing having at least one first pressing strip opposite to the second pressing strip, the first pressing strip being formed by extending towards the surface of the magnetic core body from one of the inner wall portions of the second isolation space.

[0016] According to one embodiment of the present invention, the reinforcement further forms at least one second clamping groove, the at least one second clamping groove being adapted to the thickness of the chip board, the chip board being partially inserted into the at least one second clamping groove, and the inner wall of the at least one second clamping groove being pressed against the chip board.

[0017] According to an embodiment of the present invention, the current sensor structure that can reduce the impact of high temperature on the magnetic core of plastic coating further includes a cover body. The cover body includes a cover plate body and a plurality of connectors. The plurality of connectors are disposed on the cover plate body. The cover plate body has a cover plate through hole corresponding to the through space. The cover plate body is disposed on the housing through the connectors in a manner that closes the accommodating space and the placement space and keeps the cover plate through hole corresponding to the through space. Attached Figure Description

[0018] Figure 1 A perspective view of a preferred embodiment of the present invention is shown.

[0019] Figure 2 An exploded view of a preferred embodiment of the present invention is shown.

[0020] Figure 3 A perspective view of the magnetic core and the chip board according to a preferred embodiment of the present invention is shown.

[0021] Figure 4 The diagram shows a perspective view of the magnetic core, the housing, the chip board, and the reinforcement components according to a preferred embodiment of the present invention.

[0022] Figure 5 It shows Figure 4 A schematic cross-sectional view of the component.

[0023] Figure 6 A perspective view of the housing and the reinforcement components according to a preferred embodiment of the present invention is shown.

[0024] Figure 7 A perspective view of the cover body according to a preferred embodiment of the present invention is shown. Detailed Implementation

[0025] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0026] Those skilled in the art should understand that, in the disclosure of this utility model, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this utility model.

[0027] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0028] refer to Figures 1 to 7 The current sensor structure according to a preferred embodiment of the present invention, which can reduce the impact of high temperature on the magnetic core of the plastic coating, will be described in detail below. The current sensor structure that can reduce the impact of high temperature on the magnetic core of the plastic coating includes a magnetic core body 10, a housing 20 and a chip board 30.

[0029] Specifically, the magnetic core 10 forms an air gap space 101.

[0030] The housing 20 forms a receiving space 201 and a placement space 204 for accommodating the magnetic core 10, and a support base 21 is formed on the bottom wall of the receiving space 201. The support base 21 is attached to the bottom surface of the magnetic core 10 in the thickness direction. The housing 20 also has at least one first pressing part 22, the inner wall portion of the receiving space 201 extends inward to form the first pressing part 22, and the first pressing part 22 is attached to the surface of the magnetic core 10 facing away from the support base 21, and a first isolation space 202 is formed on the surface of the magnetic core 10 facing away from the support base 21, so as to fix the magnetic core 10 to the receiving space 201 under the constraint of the support base 21, the first pressing part 22 and the inner wall of the receiving space 201.

[0031] The chip board 30 is disposed in the placement space 204. The chip board 30 has a Hall chip, and the Hall chip of the chip board 30 is held in the air gap space 101.

[0032] It is worth mentioning that when high-temperature liquid injection molding material is injected into the outer periphery of the magnetic core 10, and the injection molding material is cooled to form the shell 20, under the action of the first isolation space 202 and the placement space 204, the contact area between the high-temperature liquid injection molding material used to form the shell 20 and the surface of the magnetic core 10 is reduced. The total heat conducted from the high-temperature liquid injection molding material to the magnetic core 10 is reduced, the degree of heat absorption and temperature rise of the magnetic core 10 is reduced, and the irreversible effect of the heat absorption and temperature rise of the magnetic core 10 on its own magnetism is reduced. As a result, the magnetism of the magnetic core 10 after cooling is more likely to recover to its original state. Compared with the prior art, since the contact area between the magnetic core 10 and the shell 20 is reduced, the measurement error of the current sensor caused by the decrease in magnetism of the magnetic core 10 due to heat cooling is reduced.

[0033] As an example, four first pressing parts 22 are implemented, and the four first pressing parts 22 are respectively located at the four corners of the magnetic core 10, thereby fixing the position of the magnetic core 10 in the receiving space 201 by the mutual pressing of the four first pressing parts 22 and the support base 21.

[0034] Preferably, the housing 20 further forms at least three second isolation spaces 203. The three second isolation spaces 203 are respectively formed between the edge of the magnetic core 10 away from the air gap space 101 and the inner wall of the receiving space 201, so as to reduce the contact area between the magnetic core 10 and the housing 20 by means of at least three second isolation spaces 203.

[0035] It is understandable that the presence of the first isolation space 202, at least three second isolation spaces 203, and the placement space 204 reduces the contact area between the high-temperature liquid injection molding material used to form the housing 20 and the surface of the magnetic core 10. Simultaneously, the magnetic core 10 can be fixed to the receiving space 201 under the constraints of the support base 21, the first pressing part 22, and the inner wall of the receiving space 201. In other words, while ensuring that the magnetic core 10 is stably fixed to the receiving space 201, the combined effect of the first isolation space 202, at least three second isolation spaces 203, and the placement space 204 reduces the measurement error of the current sensor caused by the decrease in magnetism of the magnetic core 10 due to heat cooling.

[0036] It should be noted that when the current sensor is in use, the magnetic field generated by the energized copper busbar will cause the magnetic core 10 to sway within the accommodating space 201 due to the magnetic force, which in turn causes the housing 20 to sway due to the magnetic core 10.

[0037] In this embodiment, the housing 20 also forms a plurality of reinforcing strips 23. The reinforcing strips 23 are arranged around the inner walls of the receiving space 201 and the placement space 204, and the reinforcing strips 23 are partially attached to the magnetic core 10, so as to reinforce the inner walls of the receiving space 201 and the placement space 204 by means of the reinforcing strips 23, to prevent the housing 20 from bending and shaking due to the thinness of the inner walls of the receiving space 201 and the placement space 204, and at the same time, the partial attachment of the reinforcing strips 23 to the magnetic core 10 stabilizes the position of the magnetic core 10 in the receiving space 201, preventing the magnetic core 10 from shaking in the receiving space 201.

[0038] As deformable, the reinforcing strip 23 is arranged around the outer wall of the receiving space 201 and the placement space 204.

[0039] Specifically, the magnetic core 10 also forms a through space 102 for passing through a energized copper busbar. The housing 20 also has a fixing cylinder 24. One end of the fixing cylinder 24 is connected to the support base 21, and the fixing cylinder 24 passes through the through space 102 in a manner that conforms to the inner wall of the through space 102, so as to stabilize the position of the magnetic core 10 in the through space 102.

[0040] It is worth mentioning that when the energized copper busbar passes through the passage space 102, the magnetic core 10 can be prevented from being damaged by the impact of the energized copper busbar under the protection of the fixed cylinder 24.

[0041] The fixing cylinder 24 has a second pressing portion 241. The end of the fixing cylinder 24 away from the support base 21 extends radially to form the second pressing portion 241. The second pressing portion 241 is attached to the surface of the magnetic core 10 facing away from the support base 21.

[0042] It is understandable that while the first pressing part 22 and the support base 21 are opposite to each other and both are attached to the surface of the magnetic core 10, the second pressing part 241 and the support base 21 are opposite to each other and both are attached to the surface of the magnetic core 10, which makes the magnetic core 10 more stable in the receiving space 201.

[0043] Preferably, the fixing cylinder 24 has a first clamping groove 2401 formed along the extending direction of the through space 102. The first clamping groove 2401 is adapted to the thickness of the chip board 30. The chip board 30 is partially inserted into the first clamping groove 2401, and the inner wall of the first clamping groove 2401 is pressed against the chip board 30, so as to clamp and fix the chip board 30 by the inner wall of the first clamping groove 2401, so that the Hall chip of the chip board 30 is stably held in the air gap space 101.

[0044] Preferably, the current sensor structure that reduces the impact of high temperature on the magnetic core after plastic coating further includes a reinforcement member 40. The reinforcement member 40 is connected to the inner wall of the placement space 204 to fill the placement space 204 where the chip board 30 is not placed.

[0045] Since the reinforcement member 40 is disposed in the placement space 204, the inner wall of the placement space 204 is reinforced by the reinforcement member 40. In other words, the reinforcement of the inner wall of the placement space 204 can prevent it from bending and shaking due to force.

[0046] The reinforcing member 40 has at least one second pressing strip 41 that adheres to the magnetic core 10, and the reinforcing member 40 extends partially toward the surface of the magnetic core 10 to form at least one second pressing strip 41. The housing 20 has at least one first pressing strip 25 opposite to the second pressing strip 41, and the first pressing strip 25 is formed by extending from a portion of the inner wall of one of the second isolation spaces 203 toward the surface of the magnetic core 10. This stabilizes the position of the magnetic core 10 in the receiving space 201 under the combined action of the at least one first pressing strip 25 and the at least one second pressing strip 41 disposed opposite to each other.

[0047] The reinforcement member 40 also forms at least one second clamping groove 401. The at least one second clamping groove 401 is adapted to the thickness of the chip board 30. The chip board 30 is partially inserted into the at least one second clamping groove 401, and the inner wall of the at least one second clamping groove 401 is pressed against the chip board 30, so as to clamp and fix the chip board 30 by the inner wall of the at least one second clamping groove 401, so that the Hall chip of the chip board 30 is stably held in the air gap space 101.

[0048] It is understood that after the chip board 30 is simultaneously inserted into the first clamping plate groove 2401 and at least one of the second clamping plate grooves 401, the inner walls of the first clamping plate groove 2401 and at least one of the second clamping plate grooves 401 will simultaneously press against the surface of the chip board 30, so as to stabilize the chip board 30 under the combined action of the inner walls of the first clamping plate groove 2401 and at least one of the second clamping plate grooves 401, so that the Hall chip of the chip board 30 is stably held in the air gap space 101.

[0049] Preferably, the reinforcement 40 is implemented in a grid shape.

[0050] Preferably, the housing 20 and the reinforcement 40 are integrally cast from high-temperature liquid injection molding material.

[0051] Preferably, the current sensor structure that reduces the impact of high temperature on the magnetic core after plastic coating further includes a cover 50. The cover 50 includes a cover plate body 51 and a plurality of connectors 52. The plurality of connectors 52 are disposed on the cover plate body 51. The cover plate body 51 has a cover plate through hole 5101 corresponding to the through space 102. The cover plate body 51 is disposed on the housing 20 via the connectors 52 in a manner that closes the receiving space 201 and the placement space 204 and maintains the cover plate through hole 5101 corresponding to the through space 102.

[0052] In this embodiment, the housing 20 is provided with a plurality of connecting through holes 205. The plurality of connecting through holes 205 correspond to the connecting member 52. The connecting member 52 has a snap-fit ​​portion 521 adapted to the connecting through hole 205, so that the snap-fit ​​portion 521 of the connecting member 52 snaps into the connecting through hole 205, and the snap-fit ​​portion 521 abuts against the inner wall of the connecting through hole 205, so that the cover plate body 51 is disposed in the housing 20 in a manner that closes the receiving space 201 and the placement space 204 while maintaining the cover plate through hole 5101 corresponding to the through space 102.

[0053] Preferably, the fixing cylinder 24 further forms a mating space 2402, which is formed on the inner side of the fixing cylinder 24 facing the through space 102. The inner wall of the cover plate through hole 5101 of the cover plate body 51 extends into the mating space 2402 to form a cover plate fixing member 511. The cover plate fixing member 511 is adapted to the inner diameter of the mating space 2402 so that when the cover plate body 51 is disposed on the housing 20, the cover plate fixing member 511 is inserted into the mating space 2402 and abuts against the inner wall of the mating space 2402 to improve the stability of the cover plate body 51 disposed on the housing 20.

[0054] Preferably, the cover 50 further includes at least one pressing member 53. The pressing member 53 is fixed to the cover body 51 in such a way that it can press against the magnetic core 10 when the cover body 51 is disposed on the housing 20, so as to press the magnetic core 10 against the support base 21 by the pressing member 53 to stabilize the position of the magnetic core 10 in the receiving space 201.

[0055] In this embodiment, it can be understood that the chip board 30 is connected to the connection pins of the housing 20 through an adapter circuit board, and can then be connected to external components through the connection pins of the housing 20.

[0056] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been shown and explained in the embodiments, and any modifications or variations may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A current sensor structure that can reduce the impact of high temperature on the magnetic core caused by plastic coating, characterized in that, The current sensor structure that reduces the impact of high temperature on the magnetic core after plastic coating includes: A magnetic core, wherein the magnetic core forms an air gap space; A housing, the housing forming a receiving space and a placement space for accommodating the magnetic core, and a supporting bottom forming on the bottom wall of the receiving space, the supporting bottom conforming to the bottom surface of the magnetic core in the thickness direction, the housing further having at least one first pressing portion, the inner wall portion of the receiving space extending inward to form the first pressing portion, and the first pressing portion conforming to the surface of the magnetic core facing away from the supporting bottom, forming a first isolation space on the surface of the magnetic core facing away from the supporting bottom; and A chip board is disposed in the placement space, the chip board has a Hall chip, and the Hall chip of the chip board is held in the air gap space.

2. The current sensor structure according to claim 1, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that, The first pressing part is implemented as four, and the four first pressing parts are respectively located at the four corners of the magnetic core.

3. The current sensor structure according to claim 2, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that... The housing also forms at least three second isolation spaces, which are respectively formed between the edge of the magnetic core away from the air gap space and the inner wall of the receiving space.

4. The current sensor structure according to claim 3, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that... The housing also forms a plurality of reinforcing strips, which are arranged around the inner walls of the receiving space and the placement space, and the reinforcing strips are partially attached to the magnetic core.

5. The current sensor structure according to claim 4, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that... The magnetic core also forms a through space for passing through an energized copper busbar. The housing also has a fixing cylinder, one end of which is connected to the support base. The fixing cylinder passes through the through space in a manner that fits against the inner wall of the through space.

6. The current sensor structure according to claim 5, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that, The fixing cylinder has a second pressing portion, which is radially extended at one end away from the support base to form the second pressing portion, and the second pressing portion is attached to the surface of the magnetic core facing away from the support base.

7. The current sensor structure according to claim 6, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that... The fixing cylinder has a first clamping groove along the extension direction of the through space. The first clamping groove is adapted to the thickness of the chip board. The chip board is partially inserted into the first clamping groove, and the inner wall of the first clamping groove is pressed against the chip board.

8. The current sensor structure according to claim 7, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that, The current sensor structure that can reduce the impact of high temperature on the magnetic core after plastic coating also includes a reinforcing member connected to the inner wall of the placement space. The reinforcing member has at least one second pressure strip that conforms to the magnetic core body. The portion of the reinforcing member extends toward the surface of the magnetic core body to form at least one second pressure strip. The housing has at least one first pressure strip opposite to the second pressure strip. The first pressure strip is formed by one of the inner wall portions of the second isolation space extending toward the surface of the magnetic core body.

9. The current sensor structure according to claim 8, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that, The reinforcement also forms at least one second clamping groove, which is adapted to the thickness of the chip board. The chip board is partially inserted into the at least one second clamping groove, and the inner wall of the at least one second clamping groove is pressed against the chip board.

10. The current sensor structure according to claim 9, which reduces the impact of high temperature on the magnetic core caused by plastic coating, is characterized in that, The current sensor structure that can reduce the impact of high temperature on the magnetic core after plastic coating also includes a cover body. The cover body includes a cover plate body and several connectors. Several connectors are disposed on the cover plate body. The cover plate body has a cover plate through hole corresponding to the through space. The cover plate body is disposed on the housing through the connectors in a manner that closes the accommodating space and the placement space and keeps the cover plate through hole corresponding to the through space.

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