Full-automatic detection equipment suitable for server mainboard

Abstract

The utility model discloses full-automatic detection equipment suitable for a server mainboard. The full-automatic detection equipment comprises a lower box body module and an upper box body module, the lower box body module comprises a jacking assembly, a carrier plate assembly and a side insertion assembly; the jacking assembly is arranged in the lower box module and used for driving the carrier plate assembly to jack up or descend. The carrier plate assembly is arranged on the jacking assembly and used for bearing a server mainboard; the side insertion assembly is arranged in the lower box body module, is located on one side of the jacking assembly and is used for butt joint of an interface on a server mainboard; the upper box body module is arranged above the lower box body module; an upper pressing plate assembly is arranged in the upper box body module; and the upper pressing plate assembly is oppositely arranged above the carrier plate assembly and is used for testing the server mainboard.

Description

Technical Field

[0001] This utility model relates to the field of motherboard functional testing technology, specifically a fully automatic testing device for server motherboards. Background Technology

[0002] With the continuous development and progress of science and technology, the output of servers and automated equipment in various fields has increased exponentially. People have increasingly higher performance requirements for electronic devices and components, especially for server systems, indirectly increasing the difficulty of the fixture testing industry. Many testing scenarios require mastering the characteristics of server systems and applying database server systems, web server systems, cloud computing server systems, etc. In recent years, with the deepening of research, the middleware utilizing network web server systems and DBMS has shown promising development prospects. This middleware is responsible for handling all application server systems, including transaction processing and data access control between the web server system and the backend application or database. Computer software that manages unique server system resources and provides services to users is generally divided into file servers, database servers, and application servers. The computer or computer system running the above software is also called a server system. This facilitates the formation of data feedback systems.

[0003] However, to ensure the stable operation of server systems, automated testing equipment is typically used to inspect server motherboards. This allows staff to identify problems before product assembly, significantly reducing waste of manpower, financial resources, and materials. However, this testing method still has shortcomings. For example, the connection between the automated testing equipment and the server motherboard is mostly done manually. This requires distinguishing different connectors and connecting them to the automated testing equipment, making the process complex, time-consuming, and labor-intensive, thus extending the time required for motherboard insertion and removal. Secondly, due to human factors, the force applied during each insertion and removal between the server motherboard and the automated testing equipment is inconsistent. Over time, this can damage the connectors of the automated testing equipment, reducing its lifespan.

[0004] To address this problem, the inventors have proposed a fully automated testing device for server motherboards. Utility Model Content

[0005] To address the shortcomings of the aforementioned technologies, this invention provides a fully automated testing device for server motherboards.

[0006] To achieve the above objectives, this utility model adopts the following technical solution: a fully automatic testing device for server motherboards, comprising a lower housing module and an upper housing module; the lower housing module includes a lifting assembly, a carrier assembly, and a side insertion assembly; the lifting assembly is disposed within the lower housing module and is used to drive the carrier assembly to lift or lower; the carrier assembly is disposed on the lifting assembly and is used to support the server motherboard; the side insertion assembly is disposed within the lower housing module and located on one side of the lifting assembly, and is used for docking interfaces on the server motherboard; the upper housing module is disposed above the lower housing module; an upper pressure plate assembly is disposed within the upper housing module; the upper pressure plate assembly is disposed opposite to the carrier assembly above and is used for testing the server motherboard.

[0007] As further explained, the lifting assembly includes a rising guide rail, a first pushing drive component, and two sets of parallel guide rails; the two sets of parallel guide rails are symmetrically arranged within the lower housing module; the first pushing drive component is located between the two sets of parallel guide rails and connected to one end of the rising guide rail; the two sides of the rising guide rail are slidably connected to the parallel guide rails respectively, and the top end of the rising guide rail abuts against the bottom end of the carrier plate assembly; the first pushing drive component drives the rising guide rail to reciprocate along the extension direction of the parallel guide rails.

[0008] As further explained, the rising guide rail includes two sets of first side plates and two sets of second side plates. The first side plates and the second side plates are connected end to end to form a frame structure. The first side plates are slidably connected to the parallel guide rail. The first side plates are provided with multiple sets of equally spaced first step portions and second step portions. The first step portions and the second step portions are staggered. The height of the first step portion is lower than the height of the second step portion.

[0009] As further explained, the first step portion and the second step component are provided with inclined sliding grooves; the sliding groove is provided with a snap-fit ​​portion at one end near the first step portion, and the sliding groove is slidably connected to the carrier plate assembly.

[0010] As a further explanation, two sets of buffer rods for buffering are provided on one side of the rising guide rail; the two sets of buffer rods are symmetrically arranged on one side of the rising guide rail.

[0011] As further explained, the carrier plate assembly includes a carrier plate for supporting the server motherboard and a pin plate; the pin plate is disposed on the lifting assembly and is provided with multiple sets of floating springs; the carrier plate is disposed on the pin plate; and upper and lower mold positioning bushings are provided between the pin plate and the carrier plate.

[0012] As further explained, the carrier plate is provided with multiple sets of circumferentially arranged guide posts; the carrier plate is provided with multiple sets of circumferentially arranged product positioning posts, and the product positioning posts are located inside the guide posts; the carrier plate is provided with multiple sets of circumferentially arranged equal-height screws.

[0013] As further explained, the side insertion assembly includes a mounting bracket and a first fixing plate; the mounting bracket is disposed within the lower housing module and located on one side of the lifting assembly; the first fixing plate is slidably disposed on the mounting bracket, and a moving guide rail is provided between the first fixing plate and the mounting bracket; the first fixing plate and the mounting bracket are connected by a second push drive component; the first fixing plate is provided with a PSU assembly, an OPC assembly, and a BMC assembly.

[0014] As further explained, the upper pressure plate assembly includes a second fixing plate; the second fixing plate is provided with a CPU module, an NVME module, a USB module, an HDMI module, a SATA side-mounted module, and a DIMM module; the CPU module, NVME module, USB module, HDMI module, SATA side-mounted module, and DIMM module are circumferentially disposed on the second fixing plate.

[0015] As further explained, the NVME module includes a fixing block; one end of the fixing block is provided with an adapter card; the other end of the fixing block is provided with a guide block, and the adapter card passes through the guide block.

[0016] In summary, this utility model has the following beneficial effects: By setting up a lifting component and a side insertion component, the server motherboard is placed on the carrier board component, and then lifted by the lifting component and pressed against the upper pressure plate component. After pressing, the side insertion component moves towards the insertion interface of the server motherboard under the action of the second push drive component, thereby realizing the automatic insertion of the server motherboard and the automatic detection equipment. There is no need to manually distinguish the insertion interface, simplifying the insertion steps of the server motherboard and improving the insertion efficiency of the server motherboard. At the same time, through the automatic insertion between the side insertion component and the server motherboard, compared with manual insertion, the side insertion component can ensure the consistency of insertion and removal force each time under the action of the second push drive component, avoiding excessive insertion and removal force, thereby improving the service life of the automatic detection equipment. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 A three-dimensional structural diagram of the lower housing module provided by this utility model;

[0019] Figure 3 A three-dimensional structural diagram of the lifting assembly provided by this utility model;

[0020] Figure 4 A three-dimensional structural diagram of the side-insertion assembly provided by this utility model;

[0021] Figure 5 A side view of the side-mounted assembly provided by this utility model;

[0022] Figure 6 A three-dimensional structural diagram of the upper pressure plate assembly provided by this utility model;

[0023] Figure 7 This is a three-dimensional structural diagram of the NVME module provided by this utility model.

[0024] Numbering on the map:

[0025] 10. Lower housing module; 11. Upper housing module; 20. Lifting assembly; 21. Lifting guide rail; 211. First side plate; 212. Second side plate; 213. First step; 214. Second step; 215. Slide groove; 22. First push drive component; 23. Parallel guide rail; 24. Buffer rod; 30. Carrier plate assembly; 31. Carrier plate; 32. Needle plate; 321. Floating spring; 33. Upper and lower mold positioning bushings; 40. Side insertion assembly; 41. Installation. 42. Frame; 43. First fixing plate; 44. Moving guide rail; 45. PSU assembly; 46. OPC assembly; 47. BMC assembly; 58. Second push drive component; 59. Upper pressure plate assembly; 50. Second fixing plate; 51. CPU module; 52. NVME module; 53. Fixing block; 54. Adapter card; 55. Guide block; 56. USB module; 57. HDMI module; 58. SATA side-insertion module; 59. DIMM module. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figure 1-7As shown, this utility model discloses a fully automatic testing device for server motherboards, including a lower housing module 10 and an upper housing module 11. The lower housing module 10 includes a lifting assembly 20, a carrier assembly 30, and a side insertion assembly 40. The lifting assembly 20 is located within the lower housing module 10 and is used to drive the carrier assembly 30 to rise or fall. The carrier assembly 30 is located on the lifting assembly 20 and is used to support the server motherboard. The side insertion assembly 40 is located within the lower housing module 10 and is situated to one side of the lifting assembly 20, used for interface docking on the server motherboard. The upper housing module 11 is located above the lower housing module 10. An upper pressure plate assembly 50 is provided within the upper housing module 11. The upper pressure plate assembly 50 is positioned opposite the carrier assembly 30 above it and is used for testing the server motherboard.

[0028] In this embodiment, multiple sets of circumferentially arranged fasteners are provided between the upper housing module 11 and the lower housing module 10. The fasteners enable quick fixing and disassembly of the upper housing module 11 and the lower housing module 10, which facilitates routine maintenance or replacement of the components in the automatic testing equipment by the staff and simplifies the disassembly steps.

[0029] By setting up the lifting component 20 and the side insertion component 40, the server motherboard is placed on the carrier board component 30, and then lifted by the lifting component 20 and pressed against the upper pressure plate component 50. After pressing, the side insertion component 40 moves towards the interface of the server motherboard under the action of the second push drive component 47, thereby realizing the automatic connection between the server motherboard and the automatic detection equipment. There is no need to manually distinguish the interface, simplifying the connection steps of the server motherboard and improving the connection efficiency of the server motherboard. At the same time, through the automatic connection between the side insertion component 40 and the server motherboard, compared with manual connection, the side insertion component 40 can ensure the consistency of the insertion and removal force each time under the action of the second push drive component 47, avoiding excessive insertion and removal force, thereby improving the service life of the automatic detection equipment.

[0030] Preferably, the lifting assembly 20 includes a rising guide rail 21, a first push drive component 22, and two sets of parallel guide rails 23. The two sets of parallel guide rails 23 are symmetrically arranged within the lower housing module 10. The first push drive component 22 is located between the two sets of parallel guide rails 23 and connected to one end of the rising guide rail 21. The first push drive component 22 is a cylinder. The two sides of the rising guide rail 21 are slidably connected to the parallel guide rails 23, and the top end of the rising guide rail 21 abuts against the bottom end of the carrier plate assembly 30. The first push drive component 22 drives the rising guide rail 21 to reciprocate along the extension direction of the parallel guide rails 23. When the first push drive component 22 is activated, it moves the rising guide rail 21 to the left or right, causing the rising guide rail 21 to lift or retract the carrier plate assembly 30, thereby achieving the lifting or retraction of the carrier plate assembly 30.

[0031] Specifically, the rising guide rail 21 includes two sets of first side plates 211 and two sets of second side plates 212, with the first side plates 211 and second side plates 212 connected end-to-end to form a frame structure. The first side plates 211 are slidably connected to the parallel guide rail 23, and the first side plates 211 are provided with multiple sets of equally spaced first step portions 213 and second step portions 214, which are staggered. The height of the first step portion 213 is lower than the height of the second step portion 214. By setting the first step portions 213 and second step portions 214 with different heights, the carrier plate assembly 30 moves back and forth between the first step portions 213 and second step portions 214 under the action of the first push drive member 22, thereby realizing the lifting or retraction of the carrier plate 31.

[0032] Furthermore, the first step portion 213 and the second step portion 214 are provided with inclined sliding grooves 215. A locking portion is provided at one end of the sliding groove 215 near the first step portion 213, and the sliding groove 215 is slidably connected to the carrier plate assembly 30. By providing the sliding groove 215, the carrier plate assembly 30 can move smoothly when lifted or retracted, preventing the carrier plate assembly 30 from shaking.

[0033] Furthermore, two sets of buffer rods 24 are provided on one side of the rising guide rail 21 for buffering. The two sets of buffer rods 24 are symmetrically arranged on one side of the rising guide rail 21. By setting the buffer rods 24, the rising guide rail 21 is buffered when it is lifted into place, and abnormal noise is also prevented between the rising guide rail 21 and the lower housing module 10 when it is lifted into place.

[0034] Preferably, the carrier assembly 30 includes a carrier plate 31 and a pin plate 32 for supporting the server motherboard. The pin plate 32 is disposed on the lifting assembly 20 and is provided with multiple sets of floating springs 321. The carrier plate 31 is disposed on the pin plate 32. Upper and lower mold positioning bushings 33 are provided between the pin plate 32 and the carrier plate 31. By setting the upper and lower mold positioning bushings 33, the carrier assembly 30 can move smoothly when lifted or retracted, avoiding the phenomenon of shaking of the carrier assembly 30. Furthermore, by setting the floating springs 321, the movement stability of the carrier plate 31 is ensured, further preventing the carrier assembly 30 from shaking during movement.

[0035] Furthermore, the carrier plate 31 is provided with multiple sets of circumferentially arranged guide posts. The carrier plate 31 is also provided with multiple sets of circumferentially arranged product positioning posts (not shown in the figure), which are located inside the guide posts. The carrier plate 31 is also provided with multiple sets of circumferentially arranged equal-height screws. By setting the guide posts and product positioning posts, the server motherboard is initially positioned by the guide posts, and then its position is further defined by the product positioning posts. This allows the server motherboard to be accurately fixed onto the carrier plate 31 on the carrier plate assembly 30, ensuring precise insertion between the server motherboard and the side insertion assembly 40 and the upper pressure plate assembly 50, thereby improving the accuracy of server motherboard testing.

[0036] Preferably, the side-mounted component 40 includes a mounting bracket 41 and a first fixing plate 42. The mounting bracket 41 is located inside the lower housing module 10 and on one side of the lifting component 20. The first fixing plate 42 is slidably mounted on the mounting bracket 41, and a moving guide rail 43 is provided between the first fixing plate 42 and the mounting bracket 41. The first fixing plate 42 and the mounting bracket 41 are connected by a second push drive component 47, which is a cylinder. The first fixing plate 42 is provided with a PSU component 44, an OPC component 45, and a BMC component 46. When the server motherboard is lifted to the detection position by the lifting component 20, the second push drive component 47 is activated. The second push drive component 47 drives the first fixing plate 42 to move toward the side-mounted interface on the server motherboard, so that the PSU component 44, OPC component 45, and BMC component 46 are connected to each other one by one to the side-mounted interface on the server motherboard, so as to facilitate the automatic detection equipment to detect the server motherboard, simplify the connection steps of the server motherboard interface, and thus improve the detection efficiency of the server motherboard.

[0037] Preferably, the upper pressure plate assembly 50 includes a second fixing plate 51. The second fixing plate 51 is provided with a CPU module 52, an NVME module 53, a USB module 54, an HDMI module 55, a SATA side-mounted module 56, and a DIMM module 57. The CPU module 52, NVME module 53, USB module 54, HDMI module 55, SATA side-mounted module 56, and DIMM module 57 are circumferentially arranged on the second fixing plate 51. When the server motherboard is lifted to the detection position by the lifting assembly 20, the CPU module 52, NVME module 53, USB module 54, HDMI module 55, SATA side-mounted module 56, and DIMM module 57 on the second fixing plate 51 are respectively connected to the corresponding interfaces on the server motherboard, facilitating automatic detection of the server motherboard, simplifying the connection steps of the interfaces on the server motherboard, and thus improving the detection efficiency of the server motherboard.

[0038] Furthermore, the NVME module 53 includes a fixing block 531. One end of the fixing block 531 has an adapter card 532. The other end of the fixing block 531 has a guide block 533, and the adapter card 532 passes through the guide block 533. By providing the guide block 533, the guide block 533 guides the connector on the server motherboard, allowing the connector to be accurately inserted into the adapter card 532, thus improving the accuracy of the connection between the connector and the adapter card 532.

[0039] In this embodiment, a floating block is provided on the fixed block 531, and a spring is provided between the guide block 533 and the floating block. By setting the spring and the floating block, the fixed block 531 and the server motherboard can make flexible contact, avoiding large impact forces when the two are plugged in, thereby improving the service life of the NVME module 53.

[0040] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0041] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A fully automated testing device for server motherboards, characterized in that, include: The lower housing module includes a lifting assembly, a carrier plate assembly, and a side insertion assembly; The lifting assembly is located inside the lower housing module and is used to drive the carrier board assembly to lift or lower; the carrier board assembly is located on the lifting assembly and is used to support the server motherboard; the side insertion assembly is located inside the lower housing module and is located on one side of the lifting assembly, and is used for docking the interfaces on the server motherboard. An upper enclosure module is located above the lower enclosure module; an upper pressure plate assembly is provided inside the upper enclosure module; the upper pressure plate assembly is located opposite the carrier board assembly and is used for testing the server motherboard.

2. The fully automatic testing device for server motherboards according to claim 1, characterized in that: The lifting assembly includes a rising guide rail, a first pushing drive component, and two sets of parallel guide rails; the two sets of parallel guide rails are symmetrically arranged within the lower housing module; the first pushing drive component is located between the two sets of parallel guide rails and connected to one end of the rising guide rail; the two sides of the rising guide rail are slidably connected to the parallel guide rails respectively, and the top end of the rising guide rail abuts against the bottom end of the carrier plate assembly; the first pushing drive component drives the rising guide rail to reciprocate along the extension direction of the parallel guide rails.

3. The fully automatic testing device for server motherboards according to claim 2, characterized in that: The rising guide rail includes two sets of first side plates and two sets of second side plates. The first side plates and the second side plates are connected end to end to form a frame structure. The first side plates are slidably connected to the parallel guide rail. The first side plates are provided with multiple sets of equally spaced first step portions and second step portions. The first step portions and the second step portions are staggered. The height of the first step portion is lower than the height of the second step portion.

4. The fully automatic testing device for server motherboards according to claim 3, characterized in that: The first step portion and the second step component are provided with inclined sliding grooves; the sliding groove is provided with a snap-fit ​​portion at one end near the first step portion, and the sliding groove is slidably connected to the carrier plate assembly.

5. The fully automatic testing device for server motherboards according to claim 2, characterized in that: Two sets of buffer rods for buffering are provided on one side of the rising guide rail; the two sets of buffer rods are symmetrically arranged on one side of the rising guide rail.

6. The fully automatic testing device for server motherboards according to claim 1, characterized in that: The carrier plate assembly includes a carrier plate for supporting the server motherboard and a pin plate; the pin plate is disposed on the lifting assembly and is provided with multiple sets of floating springs; the carrier plate is disposed on the pin plate; and upper and lower mold positioning bushings are provided between the pin plate and the carrier plate.

7. A fully automatic testing device for server motherboards according to claim 6, characterized in that: The carrier plate is provided with multiple sets of circumferentially arranged guide posts; the carrier plate is provided with multiple sets of circumferentially arranged product positioning posts, and the product positioning posts are located inside the guide posts; the carrier plate is provided with multiple sets of circumferentially arranged equal-height screws.

8. The fully automatic testing device for server motherboards according to claim 1, characterized in that: The side-mounted assembly includes a mounting bracket and a first fixing plate; the mounting bracket is disposed within the lower housing module and located on one side of the lifting assembly; the first fixing plate is slidably disposed on the mounting bracket, and a moving guide rail is provided between the first fixing plate and the mounting bracket; the first fixing plate and the mounting bracket are connected by a second push drive component; the first fixing plate is provided with a PSU assembly, an OPC assembly, and a BMC assembly.

9. The fully automatic testing device for server motherboards according to claim 1, characterized in that: The upper pressure plate assembly includes a second fixing plate; the second fixing plate is provided with a CPU module, an NVME module, a USB module, an HDMI module, a SATA side-mounted module, and a DIMM module; the CPU module, NVME module, USB module, HDMI module, SATA side-mounted module, and DIMM module are circumferentially disposed on the second fixing plate.

10. A fully automatic testing device for server motherboards according to claim 9, characterized in that: The NVME module includes a fixing block; one end of the fixing block is provided with an adapter card; the other end of the fixing block is provided with a guide block, and the adapter card passes through the guide block.

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