Photoresist stripping simulation test device

Abstract

The utility model discloses a photoresist stripping simulation test device, which comprises an experiment bin, a liquid storage tank, a liquid supply pipeline, a liquid outlet pipeline, a liquid inlet pipeline, a liquid outlet pipeline, a liquid outlet pipeline and a liquid outlet pipeline, and the experiment bin is connected with the liquid storage tank through the liquid supply pipeline; the liquid supply pipeline comprises a feeding pipeline and a recycling pipeline; the liquid supply pipeline is used for spraying and recycling feed liquid; a fixed tray is mounted in an inner cavity of the experiment bin through a transmission shaft, a porous nozzle is arranged at the top of the fixed tray, and a cleaning pipeline is arranged on one side of the fixed tray, comprises a first pipeline and a second pipeline and is used for cleaning wafers. According to the utility model, the wafer on the fixed tray is driven by the transmission shaft to rotate, the heated feed liquid is sprayed by the liquid supply pipeline and the porous nozzle to carry out a photoresist stripping experiment, the wafer is cleaned by the cleaning pipeline, and the feed liquid is recovered by the collecting tray, so that a photoresist stripping process under actual production conditions can be effectively simulated.

Description

Technical Field

[0001] This utility model relates to the field of photoresist stripping equipment technology, and specifically to a photoresist stripping simulation test device. Background Technology

[0002] Photoresist stripping solution is a chemical solution used to remove photoresist, widely applied in semiconductor manufacturing, microelectronics processing, and micro / nanotechnology. In photolithography, photoresist is typically used to form patterns on the wafer surface, but it needs to be removed during subsequent cleaning. Photoresist stripping solution dissolves or peels off the photoresist through a chemical reaction, ensuring effective removal of the photoresist from the wafer surface. When using it, factors such as the type of photoresist, processing time, and process temperature must be considered to ensure no surface damage during the stripping process and to maintain the integrity of the device.

[0003] During the research and development process, it is difficult to control the temperature, pressure, flow rate and other conditions in laboratory beaker experiments with the precision required to match the actual production of customers. Such experiments cannot reproduce the complex physicochemical reactions and precise control of equipment involved in large-scale production, resulting in poor reliability and repeatability of experimental data, which in turn affects the promotion and application of research and development results. Utility Model Content

[0004] The purpose of this invention is to provide a photoresist peeling simulation test device to solve the above problems.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution, including:

[0006] An experimental chamber is connected to a storage tank via a liquid supply pipeline, which includes an inlet pipeline and a recovery pipeline. The liquid supply pipeline is used for spraying and recovering the liquid.

[0007] The experimental chamber has a fixed tray mounted on its internal cavity via a drive shaft. The top of the fixed tray is equipped with a multi-hole nozzle, and a cleaning pipeline is provided on one side of the fixed tray. The cleaning pipeline includes a first pipeline and a second pipeline, and the cleaning pipeline is used to clean the wafer.

[0008] As a further description of the above technical solution, the feed pipeline is connected to the top of the experimental chamber via a telescopic pipe, and the recovery pipeline is connected to one side of the bottom of the experimental chamber.

[0009] As a further description of the above technical solution, the liquid supply pipeline is equipped with a control valve, a pneumatic pump, and a flow meter.

[0010] As a further description of the above technical solution, the top of the fixed tray is provided with a multi-hole nozzle, the multi-hole nozzle is connected to the telescopic tube, and the spray angle of the multi-hole nozzle is 0-180 degrees.

[0011] As a further description of the above technical solution, the first pipeline is disposed on one side of the top of the fixed tray, and the second pipeline is disposed on one side of the bottom of the fixed tray.

[0012] As a further description of the above technical solution, the transmission shaft and the drive device are rotatably connected, and the drive device drives the fixed tray to rotate through the transmission shaft.

[0013] As a further description of the above technical solution, a collection disc is installed on the outside of the drive shaft, and the edge of the collection disc is below the recycling pipeline.

[0014] As a further description of the above technical solution, the cleaning pipeline is connected to the external pipeline on one side of the experimental chamber, and the external pipeline includes a water supply pipeline and a gas supply pipeline.

[0015] As a further description of the above technical solution, the cleaning pipeline is provided with a tee interface, and the cleaning pipeline and the external pipeline are provided with control valves.

[0016] As a further description of the above technical solution, a heat tracing cable is provided on the outside of the liquid storage tank, and a thermometer is provided inside the liquid storage tank.

[0017] The beneficial effects of this utility model are as follows:

[0018] This invention uses a drive shaft to rotate a wafer on a fixed tray, sprays heated liquid through a liquid supply line and a multi-hole nozzle to perform a photoresist stripping experiment, cleans the wafer through a cleaning line, and recovers the liquid through a collection tray. This method can effectively simulate the photoresist stripping process under actual production conditions.

[0019] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the photoresist peeling simulation test device of this utility model.

[0021] Figure label:

[0022] 1. Experimental chamber; 11. Fixed tray; 12. Telescopic tube; 13. Multi-hole nozzle; 14. Drive shaft; 15. Drive equipment; 16. Collection tray; 2. Liquid supply line; 21. Feed line; 22. Recovery line; 23. Pneumatic pump; 24. Flow meter; 3. Storage tank; 31. Heating tape; 32. Thermometer; 4. Cleaning line; 41. First line; 42. Second line; 43. T-junction; 5. Control valve; 6. External line; 61. Water supply line; 62. Air supply line. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0024] like Figure 1 As shown, in one embodiment, a photoresist peeling simulation test device includes: an experimental chamber 1, which is connected to a storage tank 3 via a liquid supply line 2, for transporting the liquid in the storage tank 3 into the experimental chamber 1 to conduct a photoresist peeling experiment, and for recycling excess liquid back into the storage tank 3 for reuse or external disposal.

[0025] The experimental chamber 1 has a fixed tray 11 installed inside the cavity via a drive shaft 14, which is used to hold and fix the wafer to be subjected to the photoresist stripping experiment. A cleaning pipeline 4 is also provided on one side of the fixed tray 11, which is used to clean the wafer after the experiment is completed, remove residual substances from the photoresist stripping process, and ensure that the wafer surface is clean and free of contaminants.

[0026] Furthermore, a heating cable 31 is installed on the outside of the storage tank 3 to heat the liquid inside the tank. The heating cable 31 gradually raises the temperature of the liquid inside the tank by heating the surface of the storage tank 3, ensuring that the photoresist stripping experiment can be carried out smoothly under the required temperature conditions. A thermometer 32 is installed inside the storage tank 3 to monitor the temperature change of the liquid in real time, automatically adjust the heating power of the heating cable 31, or prompt the experimenter to intervene through an alarm system.

[0027] Please continue reading. Figure 1 In this embodiment, the liquid supply line 2 includes an inlet line 21 and a recovery line 22. The inlet line 21 is connected to the top of the experimental chamber 1 through a telescopic pipe 12, and the recovery line 22 is connected to one side of the bottom of the experimental chamber 1.

[0028] Furthermore, the liquid supply line 2 is equipped with a control valve 5, which can be automatically or manually opened and closed according to experimental needs to adjust the flow rate and pressure; the liquid supply line 2 is equipped with a pneumatic pump 23 and a flow meter 24, the pneumatic pump 23 increases the pressure of the liquid flow, and the flow meter 24 monitors the liquid supply in real time.

[0029] Please continue reading. Figure 1 In this embodiment, a multi-hole nozzle 13 is provided on the top of the fixed tray 11. The multi-hole nozzle 13 can be set at different heights according to the actual experimental parameters. The multi-hole nozzle 13 is connected to the telescopic tube 12. The spray angle of the multi-hole nozzle 13 is 0-180 degrees, so as to achieve a uniform spraying effect.

[0030] Furthermore, the drive shaft 14 and the drive device 15 are rotatably connected. The drive device 15 can be a common electric device such as a drive motor. Its output end drives the drive shaft 14 to rotate through a gear drive mechanism, which in turn drives the fixed tray 11 to rotate continuously at a set speed, increasing the speed of dehydration and drying after washing. Specifically, a collection tray 16 is installed on the outside of the drive shaft 14, and the edge of the collection tray 16 is below the recovery pipeline 22. When the multi-hole nozzle 13 sprays liquid onto the wafers dripping from the fixed tray 11, it can quickly collect at the inlet of the recovery pipeline 22 below, facilitating the reuse or discharge of the liquid.

[0031] Please continue reading. Figure 1 In this embodiment, the cleaning pipeline 4 includes a first pipeline 41 and a second pipeline 42. The first pipeline 41 is disposed on one side of the top of the fixed tray 11, and the second pipeline 42 is disposed on one side of the bottom of the fixed tray 11.

[0032] Furthermore, the cleaning pipeline 4 is connected to the external pipeline 6 on one side of the experimental chamber 1. The external pipeline 6 includes a water supply pipeline 61 and an air supply pipeline 62. The water supply pipeline 61 is used to supply pure water to quickly rinse away the residual liquid. The air supply pipeline 62 is used to supply nitrogen to increase the evaporation of moisture and achieve a drying effect. The cleaning pipeline 4 is equipped with a three-way interface 43 to achieve synchronous spraying of the first pipeline 41 and the second pipeline 42. Both the cleaning pipeline 4 and the external pipeline 6 are equipped with control valves 5 to control the cleaning process.

[0033] Working principle:

[0034] The heating cable 31 outside the storage tank 3 continuously heats the liquid inside. When the thermometer 32 detects that the temperature meets the test process requirements, the drive device 15 is started. The drive device 15 drives the wafer on the fixed tray 11 to rotate through the transmission shaft 14. Then the control valve 5 is opened. Driven by the pneumatic pump 23, the liquid is sprayed from the multi-hole nozzle 13 through the feed line 21 and the telescopic tube 12 to perform the photoresist peeling experiment. Excess liquid drips down and is collected through the collection tray 16 below and then returned to the storage tank 3 through the recovery line 22 or discharged externally. Then, pure water and nitrogen are sprayed through the cleaning line 4 to clean and dry the wafer.

[0035] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A photoresist peeling simulation testing device, characterized in that, Includes: an experimental chamber (1), wherein the experimental chamber (1) is connected to a storage tank (3) via a liquid supply line (2), wherein the liquid supply line (2) includes an inlet line (21) and a recovery line (22), wherein the liquid supply line (2) is used for spraying and recovering liquid; The experimental chamber (1) has a fixed tray (11) installed inside the cavity via a drive shaft (14). The fixed tray (11) has a multi-hole nozzle (13) on its top and a cleaning pipeline (4) on one side. The cleaning pipeline (4) includes a first pipeline (41) and a second pipeline (42). The cleaning pipeline (4) is used to clean the wafer.

2. The photoresist peeling simulation test apparatus according to claim 1, characterized in that, The feed line (21) is connected to the top of the experimental chamber (1) via the telescopic pipe (12), and the recovery line (22) is connected to one side of the bottom of the experimental chamber (1).

3. The photoresist peeling simulation test apparatus according to claim 2, characterized in that, The liquid supply line (2) is equipped with a control valve (5), and the liquid supply line (2) is equipped with a pneumatic pump (23) and a flow meter (24).

4. The photoresist peeling simulation test apparatus according to claim 1, characterized in that, The multi-hole nozzle (13) is connected to the telescopic tube (12), and the spray angle of the multi-hole nozzle (13) is 0-180 degrees.

5. The photoresist peeling simulation test apparatus according to claim 1, characterized in that, The first pipeline (41) is located on the top side of the fixed tray (11), and the second pipeline (42) is located on the bottom side of the fixed tray (11).

6. The photoresist peeling simulation test apparatus according to claim 1, characterized in that, The drive shaft (14) and the drive device (15) are rotatably connected, and the drive device (15) drives the fixed tray (11) to rotate through the drive shaft (14).

7. The photoresist peeling simulation test apparatus according to claim 6, characterized in that, A collection disc (16) is mounted on the outside of the drive shaft (14), with the edge of the collection disc (16) below the recycling pipeline (22).

8. The photoresist peeling simulation test apparatus according to claim 1, characterized in that, The cleaning pipeline (4) is connected to the external pipeline (6) on one side of the experimental chamber (1), and the external pipeline (6) includes a water supply pipeline (61) and an air supply pipeline (62).

9. The photoresist peeling simulation test apparatus according to claim 8, characterized in that, The cleaning pipeline (4) is provided with a three-way interface (43), and the cleaning pipeline (4) and the external pipeline (6) are provided with control valves (5).

10. The photoresist peeling simulation test apparatus according to claim 1, characterized in that, The liquid storage tank (3) is provided with a heat tracing cable (31) on the outside and a thermometer (32) inside.

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