Case with air duct

Abstract

The utility model provides a case with an air duct, and relates to the field of cooling of computer equipment, the case comprises a case body, the case body is internally provided with a containing cavity, the case body is provided with an air inlet and an air outlet, and the air inlet and the air outlet are both communicated with the containing cavity; the air guide structure is located in the containing cavity, connected with the box body and used for dividing the containing cavity into a first air duct and a second air duct, the first air duct and the second air duct are located on the two sides of the air guide structure in the first direction, and the first air duct and the second air duct both communicate with the air inlet and the air outlet; the data processing assembly is located in the first air duct; the graphic processing assembly is located in the second air duct; the air guide structure is movably connected with the box body so as to adjust the size of the first air channel and the size of the second air channel. According to the case, invalid air inlet can be reduced, mutual non-interference of air channels is achieved, and the heat dissipation requirements of the data processing assembly and the graphic processing assembly are met.

Description

Technical Field

[0001] This utility model relates to the field of cooling for computing devices, and more particularly to a chassis with air ducts. Background Technology

[0002] During the operation of computing devices, the electronic components of the computing devices need to be cooled. The computing devices include data processing components and graphics processing components, which are used to process non-graphical data and graphic data, respectively. The relevant chassis guides the external airflow through the air duct to carry the heat of the data processing components and graphics processing components out of the chassis. In this type of chassis, the two components are located in the same heat dissipation space structure, which causes the hot air to interfere with each other. In addition, some of the external airflow enters the chassis and is directly discharged from the chassis without participating in heat dissipation. As a result, the current chassis has low heat dissipation efficiency and it is difficult to meet the cooling needs of the data processing components and graphics processing components at the same time. Utility Model Content

[0003] This invention provides a chassis with air ducts to solve the technical problem of how to simultaneously meet the cooling requirements of data processing components and graphics processing components.

[0004] This utility model embodiment provides a chassis with air ducts, the chassis comprising: a chassis body having a receiving cavity inside the chassis body, the chassis body having an air inlet and an air outlet, both of which are connected to the receiving cavity; an air guide structure located within the receiving cavity and connected to the chassis body, used to divide the receiving cavity into a first air duct and a second air duct, wherein the first air duct and the second air duct are located on opposite sides of the air guide structure in a first direction, and both the first air duct and the second air duct are connected to the air inlet and the air outlet; a data processing component located within the first air duct; and a graphics processing component located within the second air duct; wherein the air guide structure is movably connected to the chassis body to adjust the dimensions of the first air duct and the second air duct.

[0005] In some embodiments, the air guide structure is slidably connected to the housing, and the air guide structure slides along the first direction.

[0006] In some embodiments, the inner surface of the housing has a guide rail that extends along the first direction, and the air guide structure is slidably connected to the guide rail.

[0007] In some embodiments, one end of the air guide structure is rotatably connected to the housing, and the rotation axis of the air guide structure is perpendicular to the first direction.

[0008] In some embodiments, the air inlet and the air outlet are located on opposite sides of the housing in a second direction, the second direction being perpendicular to the first direction and perpendicular to the axis of rotation; wherein the air guide structure is rotatably connected to the side of the housing with the air outlet.

[0009] In some embodiments, the air inlet and the air outlet are located on opposite sides of the housing in the second direction, which is perpendicular to the first direction.

[0010] In some embodiments, the air outlet includes a first air outlet and a second air outlet, the first air outlet being connected to the first air duct and the second air outlet being connected to the second air duct; wherein, in the third direction, the air inlet is located on one side of the housing, and in the first direction, the first air outlet and the second air outlet are respectively located on both sides of the housing, and the third direction is perpendicular to the first direction.

[0011] In some embodiments, the air outlet includes a third air outlet and a fourth air outlet, the third air outlet being connected to the first air duct and the fourth air outlet being connected to the second air duct; wherein, in the fourth direction, the air inlet, the third air outlet and the fourth air outlet are all located on the same side of the chassis, and in the first direction, the third air outlet and the fourth air outlet are located on opposite sides of the air inlet, and the fourth direction is perpendicular to the first direction.

[0012] In some embodiments, the chassis further includes a first air guide plate located within the first air duct and fixedly connected to the chassis body. In the first direction, the first air guide plate extends from the air inlet to a position close to the data processing component, and in the first direction, the data processing component is located between the air guide structure and the first air guide plate. Alternatively, the chassis further includes a second air guide plate located within the second air duct and fixedly connected to the chassis body. In the first direction, the second air guide plate extends from the air inlet to a position close to the graphics processing component, and in the first direction, the graphics processing component is located between the air guide structure and the second air guide plate.

[0013] In some embodiments, the chassis further includes a fan in communication with the air inlet, or the data processing component has a first fan and the graphics processing component has a second fan.

[0014] This utility model embodiment provides a chassis with air ducts. The chassis includes a housing with an internal cavity and an air inlet and an air outlet communicating with the cavity. An air guide structure is located inside the chassis, dividing the cavity into a first air duct and a second air duct. A data processing component is located in the first air duct, and a graphics processing component is located in the second air duct. Both the first and second air ducts are connected to the air inlet and the air outlet. The airflow flowing through the first and second air ducts can cool the data processing component and the graphics processing component respectively. At the same time, the air guide structure is movably connected to the chassis. The size of the first and second air ducts can be adjusted by moving the air guide structure. This allows for adaptive adjustment of the size of the first and second air ducts according to the load of the data processing component and the graphics processing component. Without increasing the overall air intake, more airflow can flow to the processing component with higher heat dissipation requirements. At the same time, the heat dissipation space of the two components is isolated, and the hot air after heat exchange is directly discharged from the chassis without affecting each other. Thus, the chassis can meet the cooling needs of the data processing component and the graphics processing component in different usage scenarios. Attached Figure Description

[0015] Figure 1 A schematic diagram of a chassis with an air duct provided for an embodiment of this utility model;

[0016] Figure 2 A schematic diagram of the assembly of an air guide structure and a housing in a chassis with an air duct provided in an embodiment of this utility model;

[0017] Figure 3 This is a schematic diagram showing the assembly of another air guiding structure and the housing in a chassis with an air duct, as provided in an embodiment of the present utility model.

[0018] Figure 4 A schematic diagram showing the relative positions of an air inlet, a first air outlet, and a second air outlet in a chassis with an air duct provided for an embodiment of this utility model;

[0019] Figure 5 A schematic diagram showing the relative positions of another air inlet, a first air outlet, and a second air outlet in a chassis with an air duct provided for an embodiment of this utility model;

[0020] Figure 6 This is a schematic diagram of another chassis with an air duct provided for an embodiment of the present invention.

[0021] Explanation of reference numerals in the attached figures

[0022] 1. Chassis; 10. Cabinet; 11. Receiving cavity; 111. First air duct; 112. Second air duct; 12. Air inlet; 13. Air outlet; 131. First air outlet; 132. Second air outlet; 14. Guide rail; 20. Air guiding structure; 30. Data processing component; 40. Graphics processing component; 51. First air guide plate; 52. Second air guide plate. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] The specific technical features described in the various embodiments in the detailed implementation can be combined in various ways without contradiction. For example, different implementation methods can be formed by combining different specific technical features. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features in this utility model will not be described separately.

[0025] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0026] Additionally, it should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. In the following description, the terms "first," "second," etc., are used merely to distinguish different objects and do not indicate any similarity or connection between them. It should be understood that the directional descriptions such as "above," "below," "inside," and "outside" refer to the orientation under normal use conditions.

[0027] In the following specific embodiments, the chassis with air ducts can be applied to any type of computing device. For example, the computing device can be a data processing server; it can also be a computer, which can be a desktop or a laptop. The structure of the chassis will be described below using a computer as an example, in conjunction with various embodiments.

[0028] In some embodiments, such as Figure 1As shown, the chassis 1 includes: a housing 10, an air guide structure 20, a data processing component 30, and a graphics processing component 40. The housing 10 has a receiving cavity 11, an air inlet 12, and an air outlet 13. Both the air inlet 12 and the air outlet 13 are connected to the receiving cavity 11. Air can enter the receiving cavity 11 through the air inlet 12 and exchange heat with the electronic components inside the receiving cavity 11. After heat exchange, the air can flow out of the receiving cavity 11 through the air outlet 13, thereby carrying the heat of the electronic components away from the housing 10, thus achieving cooling of the electronic components inside the receiving cavity 11. The air guide structure 20 is located inside the receiving cavity 11 and connected to the housing 10. It is used to divide the receiving cavity 11 into a first air duct 111 and a second air duct 112. In a first direction, the first air duct 111 and the second air duct 112 are located on both sides of the air guide structure 20. The first air duct 111 and the second air duct 112 are both connected to the air inlet 12 and the air outlet 13. Different electronic components are placed in the first air duct 111 and the second air duct 112. The air flow in the first air duct 111 and the second air duct 112 can cool the electronic components in different air ducts respectively.

[0029] Specifically, in this embodiment of the invention, the data processing component 30 and the graphics processing component 40 are cooled by the first air duct 111 and the second air duct 112, respectively. The graphics processing component 40 is a processing device of a computing device for targeted processing of graphics data. For example, the graphics processing component 40 is used for geometric calculations or rendering of graphics. The graphics processing component 40 can be, for example, a graphics card. The data processing component 30 is a processing device of a computing device for processing other processing tasks besides graphics data. For example, the data processing component 30 is used for processing text data or for data storage and retrieval operations. The data processing component 30 can be, for example, a central processing unit. During use, the data processing component 30 and the graphics processing component 40 have different cooling requirements. By placing the data processing component 30 in the first air duct 111 and the graphics processing component 40 in the second air duct 112, the data processing component 30 and the graphics processing component 40 can be cooled by the two air ducts, and the dimensions of the two air ducts can meet the cooling requirements of the data processing component 30 and the graphics processing component 40, respectively.

[0030] However, computing devices need to perform different tasks in different scenarios, and the cooling requirements of data processing component 30 and graphics processing component 40 will change. For example, when rendering graphics data, graphics processing component 40 operates under high load, while data processing component 30 operates under low load, resulting in high cooling requirements for graphics processing component 40 and low cooling requirements for data processing component 30. Conversely, when performing high-frequency data access, data processing component 30 operates under high load, while graphics processing component 30 operates under low load, resulting in low cooling requirements for data processing component 30 and high cooling requirements for graphics processing component 40. The dimensions of the heat dissipation air ducts in the chassis are fixed. When one of the two processing components is operating under high load, the only way to increase the cooling fan speed is to simultaneously increase the airflow in both air ducts, increasing the power demand of the cooling fans. Furthermore, the airflow also... A large amount of airflow will enter the air duct where the processing components are operating at low load, resulting in insufficient cooling capacity for the processing components operating at high load. The air guide structure 20 provided in this embodiment is movably connected to the housing 10. The size of the first air duct 111 and the second air duct 112 can be adjusted by the movement of the air guide structure 20. The size of the first air duct 111 and the second air duct 112 can be adjusted according to the load status of the two processing components. Without increasing the overall air intake, more airflow can flow to the processing components with higher heat dissipation requirements. For example, when the computing device is performing graphics rendering, the size of the second air duct 112 can be increased and the size of the first air duct 111 can be decreased by the movement of the air guide structure 20, so that more airflow can enter the second air duct 112 to cool the graphics processing component 40. That is, in different usage scenarios, the housing 1 can take into account the cooling needs of the data processing component 30 and the graphics processing component 40.

[0031] Meanwhile, since the data processing component 30 and the graphics processing component are isolated by two separate air ducts, the airflow is directly discharged from the chassis after heat exchange with the two processing components, reducing the mutual influence of heat between the two processing components. In addition, the air ducts can also guide the incoming airflow to the two data processing devices more concentratedly, reducing ineffective air intake.

[0032] This utility model embodiment provides a chassis with air ducts. The chassis includes a housing with an internal cavity and an air inlet and an air outlet communicating with the cavity. An air guide structure is located inside the chassis, dividing the cavity into a first air duct and a second air duct. A data processing component is located in the first air duct, and a graphics processing component is located in the second air duct. Both the first and second air ducts are connected to the air inlet and the air outlet. The airflow flowing through the first and second air ducts can cool the data processing component and the graphics processing component respectively. At the same time, the air guide structure is movably connected to the chassis. The size of the first and second air ducts can be adjusted by moving the air guide structure. This allows for adaptive adjustment of the size of the first and second air ducts according to the load of the data processing component and the graphics processing component. Without increasing the overall air intake, more airflow can flow to the processing component with higher heat dissipation requirements. At the same time, the heat dissipation space of the two components is isolated, and the hot air after heat exchange is directly discharged from the chassis without affecting each other. Thus, the chassis can meet the cooling needs of the data processing component and the graphics processing component in different usage scenarios.

[0033] In some embodiments, such as Figure 1 As shown, the air guide structure 20 is slidably connected to the housing 10, and the air guide structure 20 is along the first direction (the first direction is as follows). Figure 1 (As indicated by the middle arrow) By sliding the air guide structure 20 in the first direction, the size of the first air duct 111 and the second air duct 112 can be adjusted. By moving the air guide structure away from the processing component under high load, the size of the air duct where the processing component under high load is located can be increased, so that more airflow can flow through the processing component under high load. For example, when the data processing component 30 is under high load and the graphics processing component 40 is under low load, by sliding the air guide structure 20 towards the graphics processing component 40, the first air duct 111 can have a larger size and the second air duct 112 can have a smaller size, so that the chassis 1 can simultaneously meet the cooling requirements of the data processing component 30 and the graphics processing component 40.

[0034] In some embodiments, such as Figure 2 As shown, the inner surface of the housing 10 has a guide rail 14, and the guide rail 14 is along a first direction (the first direction is as follows). Figure 2 As shown by the middle arrow, the air guide structure 20 is slidably connected to the guide rail 14. This can be understood as the guide rail 14 providing guidance for the sliding of the air guide structure 20, thereby making the adjustment of the dimensions of the first air duct 111 and the second air duct 112 more accurate.

[0035] In some embodiments, such as Figure 3As shown, one end of the air guide structure 20 is rotatably connected to the housing 10, and the other end of the air guide structure 20 is located in the receiving cavity 11, forming a free end. The rotation axis L1 of the air guide structure 20 is perpendicular to the first direction. By rotating the air guide structure 20 around the rotation axis L1, the free end of the air guide structure 20 can move closer to or further away from the data processing component 30 in the first direction. That is, the size of the first air duct 111 and the size of the second air duct 112 are changed by the deflection of the air guide structure 20. Specifically, the free end of the air guide structure 20 is moved away from the processing component that is in a high-load working state. This allows the air duct where the processing components are located under high load to have a larger size, so that more airflow can flow through the processing components under high load. For example, when the data processing component 30 is under high load and the graphics processing component 40 is under low load, the free end of the air guide structure 20 is tilted toward the graphics processing component 40, which allows the first air duct 111 to have a larger size and the second air duct 112 to have a smaller size, so that the chassis 1 can simultaneously meet the cooling requirements of the data processing component 30 and the graphics processing component 40.

[0036] In some embodiments, such as Figure 1 As shown, in the second direction (the second direction is as follows) Figure 1 (As shown by the dashed arrow) The air inlet 12 and air outlet 13 are located on opposite sides of the housing, respectively. The second direction and the first direction (the first direction is as shown by the dashed arrow) Figure 4 (As indicated by the solid arrow) is vertical, which can be understood as the first air duct 111 and the second air duct 112 both extending in a straight line and the air inlet 12 and the air outlet 13 can form convection between them, thereby enabling better cooling of the data processing component 30 and the graphics processing component 40. The air guide structure 20 is slidably or rotatably connected to the housing 10.

[0037] Optional, such as Figure 3 As shown, one end of the air guide structure 20 is rotatably connected to the side of the housing 10 with the air outlet 13. By directing the free end of the air guide structure 20 away from the processing component under high load, not only can the size of the air duct where the processing component under high load is located be increased, but the air duct can also form a structure with a large air inlet and a small air outlet. The airflow will accelerate in the air duct, thereby carrying away the heat of the processing component under high load from the housing more quickly, further increasing the cooling capacity of the processing component under high load.

[0038] In some embodiments, such as Figure 4 As shown, Figure 1 The air outlet 13 includes a first air outlet 131 and a second air outlet 132. The first air outlet 131 is connected to the first air duct 111, and the second air outlet 132 is connected to the second air duct 112. In the third direction (e.g., the third direction...), Figure 4 (As shown by the dashed arrow) The upper air inlet 12 is located on one side of the housing 10, in the first direction (the first direction is as shown by the dashed arrow). Figure 4 As shown by the solid arrow, the first air outlet 131 and the second air outlet 132 are located on both sides of the housing 10, with the third direction perpendicular to the first direction. This can be understood as the airflow within the two ducts flowing along both the first and third directions. Even with a smaller size in the first direction, the space in the third direction of the housing 10 allows for the arrangement of two air ducts within the housing 10. For example, in the case of a laptop computer, the air inlet 12 is located at the bottom of the housing 10. The housing 10 is smaller in thickness, and a keyboard or other operating structure needs to be installed at the top of the housing 10, making it impossible to place the air outlets within the first direction. The air outlets are positioned at the top, opposite the bottom, and on the side of the housing 10. This allows for full utilization of the horizontal dimensions of the housing 10, enabling a sufficiently long air duct within the housing 10 to adequately cool the data processing component 30 and the graphics processing component 40. Simultaneously, the first air outlet 131 and the second air outlet 132 are located on opposite sides of the housing 10 in the first direction, causing the airflow to flow in opposite directions within the two air ducts. This reduces the possibility of heat interaction between the first air duct 111 and the second air duct 112, further enhancing the cooling capacity of the data processing component 30 and the graphics processing component 40.

[0039] It should be noted that even when the first air outlet 131 and the second air outlet 132 are located on both sides of the housing 10, the air guide structure 20 can still adjust the size of the first air duct 111 and the second air duct 112 by moving relative to the housing 10. For example, the air guide structure 20 extends along a third direction, thereby forming the first air duct 111 and the second air duct 112 by surrounding the air guide structure 20 and the inner wall of the receiving cavity 11. By sliding the air guide structure 20 in the housing 10 along a first direction, the size of the first air duct 111 and the second air duct 112 can be adjusted. For example, the air guide structure 20 includes a fixed part and a sliding part. The sliding part extends along a third direction, and the fixed part extends along the first direction. The sliding part, the fixed part, and the inner wall of the receiving cavity surround and form a heat dissipation space. The sliding part divides the heat dissipation part to form the first air duct and the second air duct. The sliding part can slide relative to the housing and the fixed part in the first direction, thereby adjusting the size of the first air duct and the second air duct.

[0040] In some embodiments, such as Figure 5 As shown, the air outlet 13 includes a third air outlet 133 and a fourth air outlet 134. The third air outlet 133 is connected to the first air duct 111, and the fourth air outlet 134 is connected to the second air duct 112. In the fourth direction (the fourth direction is as shown in the diagram),... Figure 5As shown by the dashed arrow, the air inlet 12, the third air outlet 133, and the fourth air outlet 134 are all located on the same side of the housing 10. The fourth direction is the same as the first direction (as shown by the dashed arrow). Figure 5 (As indicated by the solid arrow) Vertical, it can be understood that the airflow in both air ducts flows along the first and fourth directions. Thus, even when there is no space to set air outlets on the other sides of the housing 10, two air ducts can still be set inside the housing 10. At the same time, in the first direction, the third air outlet 133 and the fourth air outlet 134 are located on both sides of the air inlet 12. That is, the airflow flows in opposite directions in the two air ducts along the first direction, which reduces the possibility of heat mutual influence in the first air duct 111 and the second air duct 112, and further improves the cooling capacity of the data processing component 30 and the graphics processing component 40.

[0041] When the first air outlet 131 and the second air outlet 132 are located on the same side of the housing 10, the air guiding structure 20 can still adjust the size of the first air duct 111 and the second air duct 112. The way the air guiding structure 20 adjusts the size of the first air duct 111 and the second air duct 112 is similar to the way the air guiding structure 20 adjusts the size of the first air duct 111 and the second air duct 112 when the first air outlet 131 and the second air outlet 132 are located on both sides of the housing 10, so it will not be described again here.

[0042] In some embodiments, such as Figure 6 As shown, the chassis 1 also includes a first air guide plate 51, which is located inside the first air duct 111 and fixedly connected to the chassis 10, in the first direction (the first direction is as shown in the figure). Figure 6 As shown by the middle arrow, the first air guide plate 51 extends from the air inlet 12 to a position close to the data processing component 30. In the first direction, the data processing component 30 is located between the air guide structure 20 and the first air guide plate 51. It can be understood that the first air guide plate 51 is used to guide the airflow entering from the air inlet 12 closer to the data processing component 30, that is, to make the airflow more concentrated for cooling the data processing component 30, thereby improving the cooling effect of the data processing component 30.

[0043] In some embodiments, such as Figure 6 As shown, the chassis 1 also includes a second air guide plate 52, which is located inside the second air duct 112 and fixedly connected to the chassis 10. In the first direction, the second air guide plate 52 extends from the air inlet 12 to a position close to the graphics processing component 40. In the first direction, the graphics processing component 40 is located between the air guide structure 20 and the second air guide plate 52. It can be understood that the second air guide plate 52 is used to guide the airflow entering from the air inlet 12 to be closer to the graphics processing component 40, that is, to make the airflow more concentrated for cooling the graphics processing component 40, thereby improving the cooling effect of the graphics processing component 40.

[0044] In some embodiments, the chassis further includes a fan connected to an air inlet, meaning that two cooling channels share a single fan, which simultaneously controls the airflow within both channels. In other embodiments, the data processing component has a first fan, and the graphics processing component has a second fan, meaning that the airflow within the two channels is controlled by the first and second fans respectively, thereby enabling control of the airflow within the channels according to the actual load of the processing components.

[0045] The above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model.

Claims

1. A chassis with an air duct, characterized in that, The chassis includes: The housing has a receiving cavity, and the housing has an air inlet and an air outlet, both of which are connected to the receiving cavity; An air guide structure is located inside the receiving cavity and connected to the box body, used to divide the receiving cavity into a first air duct and a second air duct, and in a first direction the first air duct and the second air duct are located on both sides of the air guide structure, and the first air duct and the second air duct are both connected to the air inlet and the air outlet; The data processing component is located within the first air duct; The graphics processing component is located within the second air duct; The air guide structure is movably connected to the housing to adjust the size of the first air duct and the size of the second air duct.

2. The chassis according to claim 1, characterized in that, The air guide structure is slidably connected to the housing, and the air guide structure slides along the first direction.

3. The chassis according to claim 2, characterized in that, The inner surface of the housing has a guide rail, which extends along the first direction, and the air guide structure is slidably connected to the guide rail.

4. The chassis according to claim 1, characterized in that, One end of the air guide structure is rotatably connected to the housing, and the rotation axis of the air guide structure is perpendicular to the first direction.

5. The chassis according to claim 4, characterized in that, In the second direction, the air inlet and the air outlet are located on opposite sides of the housing, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the axis of rotation; The air guide structure is rotatably connected to the side of the housing with the air outlet.

6. The chassis according to any one of claims 1 to 4, characterized in that, In the second direction, the air inlet and the air outlet are located on opposite sides of the housing, and the second direction is perpendicular to the first direction.

7. The chassis according to any one of claims 1 to 4, characterized in that, The air outlet includes a first air outlet and a second air outlet, wherein the first air outlet is connected to the first air duct and the second air outlet is connected to the second air duct. In the third direction, the air inlet is located on one side of the housing, and in the first direction, the first air outlet and the second air outlet are located on both sides of the housing, respectively. The third direction is perpendicular to the first direction.

8. The chassis according to any one of claims 1 to 4, characterized in that, The air outlet includes a third air outlet and a fourth air outlet. The third air outlet is connected to the first air duct, and the fourth air outlet is connected to the second air duct. In the fourth direction, the air inlet, the third air outlet, and the fourth air outlet are all located on the same side of the chassis. In the first direction, the third air outlet and the fourth air outlet are located on opposite sides of the air inlet. The fourth direction is perpendicular to the first direction.

9. The chassis according to any one of claims 1 to 4, characterized in that, The chassis also includes a first air guide plate, which is located within the first air duct and fixedly connected to the chassis. In the first direction, the first air guide plate extends from the air inlet to a position close to the data processing component, and in the first direction, the data processing component is located between the air guide structure and the first air guide plate. And / or, The chassis also includes a second air guide plate, which is located inside the second air duct and fixedly connected to the chassis. In the first direction, the second air guide plate extends from the air inlet to a position close to the graphics processing component, and in the first direction, the graphics processing component is located between the air guide structure and the second air guide plate.

10. The chassis according to claim 1, characterized in that, The chassis also includes a fan, which is connected to the air inlet. or, The data processing component has a first fan, and the graphics processing component has a second fan.

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