Built-in integrated heat dissipation module and notebook computer

Abstract

The utility model provides a built-in integrated heat dissipation module and a notebook computer, a heat conduction block is arranged at the bottom of a liquid cooling plate, and the liquid cooling plate is covered on the surface of a heat source. The liquid cooling plate is internally provided with a liquid cooling channel in which a liquid medium flows, and the liquid medium is driven by the pump body to circularly flow at the liquid inlet and the liquid outlet, so that heat transfer at a heat source is realized. The air cooling assembly is arranged on the surface, away from the heat source, of the liquid cooling plate, and heat carried by the liquid medium is rapidly cooled. According to the utility model, the liquid cooling plate is installed on the surface of the heat source through the integrated liquid cooling structure, heat is transferred to the air cooling assembly mainly through liquid cooling, and no extra connecting or fixing part is needed to position the water cooling plate. According to the utility model, efficient heat dissipation of the heat source area can be realized, the internal space of the electronic equipment can be fully utilized, the occupied space and the forming thickness of the heat dissipation module are reduced, the light and thin requirements of the heat dissipation module can be met, and the heat dissipation module is particularly suitable for light and thin notebook computers and other portable electronic equipment.

Description

Technical Field

[0001] This utility model relates to a heat dissipation device, and more particularly to a built-in integrated heat dissipation module and a laptop computer. Background Technology

[0002] As highly integrated electronic devices, laptops contain many heat-generating components. To ensure normal operation, cooling components are needed inside to reduce the surface temperature of these components. Heat dissipation is a critical issue for laptops, especially during prolonged use. Currently, most cooling modules on the market use a combination of heat pipes and fans. The heat pipes are filled with a liquid medium that conducts heat back and forth between the heat source and the cooling area through capillary action. However, with the development of laptops, the power consumption of the CPU and GPU is increasing, requiring more and more heat pipes of varying sizes and occupying more space, which contradicts the requirements for thin and light laptops. Therefore, to save space and increase the utilization of internal space, it is necessary to improve the structure of the cooling system and increase its heat dissipation efficiency. Utility Model Content

[0003] To solve the above technical problems, this utility model provides a built-in integrated heat dissipation module, including a liquid cooling plate covering the surface of the heat source. The liquid cooling plate has a liquid cooling channel for the flow of liquid medium. The side of the liquid cooling plate has an inlet and an outlet that connect to the liquid cooling channel. The inlet and outlet are respectively connected to the pump body. The liquid medium circulates in the inlet and outlet under the action of the pump body.

[0004] The liquid cooling plate includes a heat source area and a cooling area extending from the heat source area. A heat-conducting block that contacts the heat source is fixed on the surface of the heat source area of ​​the liquid cooling plate. The liquid cooling channel runs through the heat source area and the cooling area, and the cooling area is equipped with an air-cooling component to cool the liquid cooling channel.

[0005] Furthermore, the liquid cooling plate includes a lower plate and an upper cover disposed above the lower plate, a heat-conducting block disposed at the bottom of the lower plate, a liquid cooling channel disposed on the surface of the lower plate, and the upper cover covering the surface of the liquid cooling channel.

[0006] Furthermore, each of the air-cooling components includes a set of cooling fans and at least one set of first fin groups connected to the outlet of the cooling fans, wherein the first fin group consists of multiple sets of cooling fins arranged side by side.

[0007] Furthermore, the surface of the first fin assembly is provided with stepped grooves, and the liquid cooling plate is fitted into the stepped grooves.

[0008] Furthermore, a second fin group is provided in the liquid cooling channel, and the second fin group is located in the heat source area and between the liquid inlet and the air cooling component.

[0009] Furthermore, the liquid cooling channel is provided with at least one branch outlet and one combined outlet. The branch outlet is located in the direction of flow from the liquid inlet to the air-cooling component in the liquid cooling channel, and the combined outlet is located in the direction of flow from the air-cooling component to the liquid outlet in the liquid cooling channel. The liquid medium in the liquid cooling channel is divided into branch channels with different paths through the branch outlet and then merged into the main channel through the combined outlet.

[0010] Furthermore, the liquid cooling plate has multiple strip-shaped or block-shaped hollow structures on the side of the liquid cooling channel.

[0011] Furthermore, it also includes a three-dimensional flow channel structure, which includes an upper flow channel and a lower flow channel formed at the flow channel intersection, wherein the lower flow channel extends below the upper flow channel and the bottom of the upper flow channel serves as a separator.

[0012] Furthermore, the lower flow channel is located at the bottom of the lower plate, and a lower cover is provided on the lower plate corresponding to the position of the lower flow channel.

[0013] This invention further provides a laptop computer that includes the above-mentioned built-in integrated heat dissipation module, wherein the heat-conducting block is in contact with the surfaces of the CPU and GPU respectively.

[0014] This invention provides a built-in integrated heat dissipation module. A heat-conducting block is installed at the bottom of the liquid cooling plate, covering the surface of the heat source. The liquid cooling plate contains a liquid cooling channel for a flowing liquid medium. The liquid medium is driven by a pump to circulate between the inlet and outlet, thereby transferring heat from the heat source. An air-cooling component is installed on the surface of the liquid cooling plate away from the heat source to quickly cool the heat carried by the liquid medium.

[0015] This invention integrates a liquid-cooled plate onto the heat source surface using a single liquid-cooling structure, primarily relying on liquid cooling to transfer heat to the air-cooled components. No additional connecting or fixing components are needed to position the liquid-cooled plate, resulting in a smaller volume for the heat transfer section. Furthermore, the liquid-cooled plate offers good flexibility, eliminating concerns about internal channel blockage caused by bending or pressing heat pipes compared to conventional heat pipe heat transfer methods.

[0016] This utility model also provides a laptop computer that includes the above-mentioned heat dissipation module, which can achieve efficient heat dissipation for the main heat sources such as the GPU and CPU, and can make full use of the internal space of the laptop computer, reducing the space occupied and molding thickness of the heat dissipation module, thus meeting the needs of thin and light laptop computers, and is especially suitable for thin and light laptop computers. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the built-in integrated heat dissipation module of this utility model;

[0018] Figure 2This is an exploded schematic diagram of Example 1;

[0019] Figure 3 This is a bottom view of the integrated heat dissipation module built into Embodiment 1;

[0020] Figure 4 This is a front view of the integrated heat dissipation module built into Embodiment 1;

[0021] Figure 5 This is a schematic diagram of the flow direction of one of the branch channels in the liquid cooling channel of Example 1;

[0022] Figure 6 This is a schematic diagram of a three-dimensional flow channel structure;

[0023] Figure 7 This is a three-dimensional structural schematic diagram of Example 2;

[0024] Figure 8 This is a schematic diagram of the surface of the liquid cooling plate in Example 2.

[0025] Figure descriptions: 1. Liquid cooling plate; 2. Liquid cooling channel; 3. Liquid inlet; 4. Liquid outlet; 5. Pump body; 6. Heat source area; 7. Cooling area; 8. Heat-conducting block; 9. Lower plate; 10. Upper cover; 11. Lower cover; 12. First fin group; 13. Cooling fan; 14. Second fin group; 15. Stepped groove; 16. Hollow structure; 17. Connecting hole; 18. Three-dimensional flow channel structure.

[0026] Main channel A, branch channel B, branch outlet C, merging outlet D, upper channel E, lower channel F. Detailed Implementation

[0027] Example 1: As Figures 1 to 4 The built-in integrated heat dissipation module shown includes a liquid cooling plate 1 covering the surface of the heat source. The liquid cooling plate 1 has a through-flow liquid cooling channel 2, within which a liquid medium circulates. Heat from the heat source is carried away from its surface as the liquid medium flows. The side of the liquid cooling plate 1 has an inlet 3 and an outlet 4 connecting to the liquid cooling channel 2. The inlet 3 and outlet 4 are respectively connected to a pump body 5. The liquid medium within the liquid cooling channel 2 circulates between the inlet 3 and outlet 4 under the pressure of the pump body 5.

[0028] The liquid cooling plate 1 is divided into a heat source area 6 and a cooling area 7 based on its distance from the heat source. The liquid cooling channel 2 connects the heat source area 6 and the cooling area 7. The heat source area 6 has a plate-like structure, which can effectively cover the heat source. A heat-conducting block 8 is fixed on the surface of the heat source area 6 to contact the heat-generating components, transferring the heat from the heat source to the liquid medium inside the liquid cooling plate 1. The side of the liquid cooling plate 1 has a connection hole 17. A connector is inserted into the connection hole 17 to fix the liquid cooling plate 1 to the computer motherboard and position the various heat-generating components. The heat-conducting block 8 protrudes from the surface of the liquid cooling plate 1 and is in direct contact with the main heat-generating components such as the CPU and GPU on the motherboard. An air-cooling component is connected to the cooling area 7 of the liquid cooling plate 1. The liquid medium enters the heat source area 6 through the inlet 3, carrying the heat away from the liquid cooling plate 1 and conducting it to the air-cooling component through the flow of the liquid medium. After cooling, it circulates back to the inlet 3 through the outlet 4, thus completing the entire liquid cooling heat dissipation cycle.

[0029] In this embodiment, the liquid medium is water. Since water has a large specific heat capacity, the required cross-sectional space of the liquid cooling channel 2 is small while meeting the heat dissipation requirements of the laptop, which greatly reduces the thickness of the liquid cooling plate 1 formed.

[0030] The heat dissipation module of this utility model fixes the heat conduction block 8 on the liquid cooling plate 1, and the liquid cooling channel 2 is set inside the liquid cooling plate 1. The liquid cooling plate 1 is fixed to the motherboard by the connector. Compared with the heat pipe heat dissipation solution in conventional technology, it can greatly reduce the space occupied by the heat dissipation device, and is especially suitable for the needs of thin and light electronic components such as laptops.

[0031] Specifically, such as Figure 2 and Figure 4 As shown, the liquid cooling plate 1 includes a lower plate 9 and an upper cover 10 disposed above the lower plate 9. A heat-conducting block 8 is disposed at the bottom of the lower plate 9, and a liquid cooling channel 2 is disposed on the upper surface of the lower plate 9. The upper cover 10 covers the surface of the liquid cooling channel 2. Both the lower plate 9 and the upper cover 10 are made of aluminum alloy, which is simple to form, lightweight, and has excellent thermal conductivity, enabling it to quickly transfer the heat of the liquid medium to the air-cooled components.

[0032] In this embodiment, there are two sets of air-cooling components, which are placed on both sides of the heat source area 6. Each set of air-cooling components includes a set of cooling fans 13 and a first fin group 12 connected to the outlet of the cooling fan 13. The first fin group 12 is composed of multiple sets of heat dissipation fins arranged side by side. The surface of the liquid cooling plate 1 is in contact with the first fin group 12 to quickly transfer heat in the liquid cooling channel 2.

[0033] In this embodiment, the surface of the first fin group 12 is provided with a stepped groove 15, and the liquid cooling plate 1 is fitted into the stepped groove 15, which quickly positions the contact position between the liquid cooling plate 1 and the heat dissipation fins, ensuring good contact between the heat dissipation fins and the surface of the liquid cooling plate 1. Furthermore, each air-cooled assembly has multiple first fin groups 12, arranged around different sides of the cooling fan 13, with the liquid cooling plate 1 contacting the heat dissipation fins at different positions. This not only strengthens the positioning of the liquid cooling plate 1, but also, the cooling zone 7 and the liquid cooling channel 2 form a strip-shaped structure around the cooling fan 13, increasing the heat conduction area of ​​the liquid cooling channel 2 without changing the surface area of ​​the liquid cooling plate 1.

[0034] Due to the inherent characteristics of heat dissipation fins, the higher the surface temperature of the heat dissipation fins, the higher the heat dissipation efficiency. In order to improve the heat dissipation efficiency of the first fin group 12, the heat loss transferred from the liquid medium to the first fin group 12 should be reduced. Therefore, multiple strip-shaped or block-shaped hollow structures 16 are set on the side of the liquid cooling channel 2 on the liquid cooling plate 1 to guide heat to concentrate near the liquid cooling channel 2. Under the premise of ensuring the basic support strength of the liquid cooling plate 1, the heat transferred from the liquid medium to the first fin group 12 is increased.

[0035] Furthermore, the liquid cooling plate 1 is also provided with a second fin group 14 in the heat source area 6. The second fin group 14 is arranged along the extension direction of the liquid cooling channel 2 and blocks the liquid cooling channel 2. By placing the second fin group 14 near the heat source, the heat of the heat-generating components is concentrated in the second fin group 14. The liquid medium passes through the inlet of the second fin group 14 and exchanges heat between the heat dissipation fins to achieve cooling of the second fin group 14 and maintain the continuous heat conduction of the second fin group 14 to each heat-generating component.

[0036] As described above, the liquid medium flows from the inlet 3, through the second fin group 14 in the heat source area 6 for heat dissipation, to the first fin group 12 in the cooling area 7, and then back to the inlet 3 through the outlet 4. The liquid cooling channel 2 can be configured as a single flow channel from the inlet 3 to the outlet 4, passing through multiple first fin groups 12 for air cooling, thereby increasing the cooling length of the liquid medium. However, due to the different positions of the air cooling components, the heat dissipation efficiency of a single flow channel through different air cooling components varies, resulting in a decrease in the overall air cooling efficiency of the heat dissipation module.

[0037] To fully utilize the heat dissipation efficiency of the air-cooled components, the liquid cooling channel 2 in this embodiment is provided between the first fin group 12 and the second fin group 14 as follows: Figure 4 The two branch channels B shown are obtained by splitting the main channel A through the branch port C. In this embodiment, the branch port C is located on the liquid outlet side of the second fin group 14. The liquid medium moves along the two branch channels B towards a set of air-cooling components, and is cooled by a set of air-cooling components, thereby improving the heat dissipation efficiency of the two sets of air-cooling components.

[0038] Corresponding to the branch port C located on the liquid outlet side of the second fin group 14, the liquid cooling channel 2 is also provided with a confluence port D in the heat source area 6 that connects to the liquid outlet 4. After the two branch channels B exchange heat through the air-cooled components, they return to the heat source area 6 and merge into the main channel A at the confluence port D.

[0039] Combined with appendix Figure 4 and Figure 5 The flow process of the liquid medium in the liquid cooling channel 2 is described. According to the flow direction of the liquid medium, the liquid cooling channel 2 is divided into an inlet section, a branch section, a return section, and an outlet section connected in sequence. The inlet section is located between the inlet 3 of the liquid cooling plate 1 and the second fin group 14. The pump body 5 delivers the liquid medium into the liquid cooling plate 1 through the main channel A. The branch section is located between the second fin group 14 and the first fin group 12. The liquid medium is guided to the first fin group 12 for air-cooled heat exchange along the two branch channels B. The return section is located between the first fin group 12 and the confluence port D. The beginning of the return section bends from the end of the first fin group 12 and returns to the heat source area 6, which can make full use of the heat dissipation space of the first fin group 12. The two branch channels B merge at the confluence port D. The outlet section is located between the confluence port D and the outlet 4. The liquid medium after merging flows to the pump body 5 through the same main channel A.

[0040] As can be seen from the accompanying drawings, the liquid cooling channel 2 in this embodiment contains multiple flow paths with different directions. Inevitably, these flow paths will intersect and overlap. Figure 5 and Figure 6 At this point, the main flow channel A of the liquid outlet section intersects with the branch section of one of the branch channels B. To ensure the thickness of the entire heat dissipation module, conventional heat pipe cooling may use a method of pressing two sets of heat pipes together vertically to reduce the cross-sectional space of the heat pipes. However, this approach will lead to a decrease in the thermal conductivity of the heat pipes.

[0041] In this embodiment, a three-dimensional flow channel structure 18 is provided at the intersection of the flow channels based on the water-cooling structure design. The intersecting flow channels are divided into an upper flow channel E and a lower flow channel F arranged vertically. The lower flow channel F is guided to the lower part of the upper flow channel E through its own flow channel. The bottom plate of the upper flow channel E serves as an isolation component for the lower flow channel F. Further, as described above, the liquid cooling plate 1 is divided into a lower plate body 9 and an upper cover body 10 disposed above the lower plate body 9. The upper flow channels E are arranged on the upper surface of the lower plate body 9, and the upper cover body 10 covers the surface of the upper flow channel E. Similarly, the lower flow channel F is disposed on the lower surface of the lower plate body 9, and the lower plate body 9 is covered with a lower cover body 11 at the position corresponding to the lower flow channel F to seal the lower flow channel F and prevent the liquid medium in the lower flow channel F from leaking.

[0042] Example 2: Figure 7 and Figure 8The built-in integrated heat dissipation module shown is roughly the same in structure and working principle as Embodiment 1. It uses a liquid cooling plate 1 with built-in liquid cooling channel 2 and heat conduction block 8 for heating. The difference is that this embodiment includes four sets of air-cooling components consisting of cooling fans 13 and first heat dissipation fin groups. The four sets of air-cooling components are placed on both sides of the heat source area 6, and the number of heat dissipation fins and the working efficiency of the cooling fans 13 are set according to the distance from the heat source area 6. After the liquid medium of the main channel A passes through the second fin group 14, it forms four branch channels B that guide the air-cooling components through the branch port C. One of the branch ports C-1 is located at the liquid outlet of the second fin group 14. The main channel A is split into two branch channels B at the branch port C-1. A branch port C-2 and C-3 are respectively provided on the two sides where the heat source area 6 is connected to the cooling area 7. The two branch channels B continue to split into B-1, B-3, B-2, and B-4 at the corresponding branch ports C-2 and C-3. After being cooled by the air-cooling components, each branch channel B is then merged into the main channel A of the liquid outlet section through the merging port D. One of the merging ports D-1 is located at the beginning of the liquid outlet section, just like in the previous embodiment. The other two merging ports D-2 and D-3 are located near the liquid outlet 4.

[0043] In this embodiment, two sets of three-dimensional flow channel structures 18 are provided. One set of three-dimensional flow channel structures 18-1 is in the same position as in embodiment 1. The other set of three-dimensional flow channel structures 18-2 is located at the end of the confluence section of one set of first fin groups 12. The first fin group 12 is located on one side of the main flow channel A of the liquid inlet section. Therefore, it is connected to the main flow channel A of the liquid outlet section by passing through the bottom of the main flow channel A of the liquid inlet section.

[0044] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A built-in integrated heat dissipation module, characterized in that: The liquid cooling plate (1) is covered by a heat source surface. The liquid cooling plate (1) is provided with a liquid cooling channel (2) for the flow of liquid medium. The side of the liquid cooling plate (1) is provided with an inlet (3) and an outlet (4) that connect to the liquid cooling channel (2). The inlet (3) and the outlet (4) are respectively connected to a pump body (5). The liquid medium circulates between the inlet (3) and the outlet (4) under the action of the pump body (5). The liquid cooling plate (1) includes a heat source area (6) and a cooling area (7) extending from the heat source area (6). The liquid cooling plate (1) has a heat-conducting block (8) fixed on the surface of the heat source area (6) that is in contact with the heat source. The liquid cooling channel (2) runs through the heat source area (6) and the cooling area (7). The cooling area (7) is provided with an air-cooling component to cool the liquid cooling channel (2). The liquid cooling channel (2) is provided with at least one branch outlet and one combined outlet. The branch outlet is located in the direction of flow from the liquid inlet (3) to the air-cooled component in the liquid cooling channel (2), and the combined outlet is located in the direction of flow from the air-cooled component to the liquid outlet (4) in the liquid cooling channel (2). The liquid medium in the liquid cooling channel (2) is divided into branch channels with different paths through the branch outlet and then merged into the main channel through the combined outlet.

2. The built-in integrated heat dissipation module as described in claim 1, characterized in that: The liquid cooling plate (1) includes a lower plate (9) and an upper cover (10) located above the lower plate (9). A heat-conducting block (8) is located at the bottom of the lower plate (9), and a liquid cooling channel (2) is located on the surface of the lower plate (9). The upper cover (10) covers the surface of the liquid cooling channel (2).

3. The built-in integrated heat dissipation module as described in claim 1, characterized in that: Each of the air-cooled components includes a set of cooling fans (13) and at least one set of first fin groups (12) connected to the outlet of the cooling fans (13). The first fin group (12) is composed of multiple sets of cooling fins arranged side by side.

4. The built-in integrated heat dissipation module as described in claim 3, characterized in that: The surface of the first fin group (12) is provided with a stepped groove (15), and the liquid cooling plate (1) is fitted into the stepped groove (15).

5. The built-in integrated heat dissipation module as described in claim 1, characterized in that: The liquid cooling channel (2) is provided with a second fin group (14), which is located in the heat source area (6) and between the liquid inlet (3) and the air cooling component.

6. The built-in integrated heat dissipation module as described in claim 1, characterized in that: The liquid cooling plate (1) has multiple strip-shaped or block-shaped hollow structures (16) on the side of the liquid cooling channel (2).

7. The built-in integrated heat dissipation module as described in claim 1, characterized in that: It also includes a three-dimensional flow channel structure (18), which includes an upper flow channel and a lower flow channel formed at the flow channel intersection, wherein the lower flow channel extends below the upper flow channel and the bottom of the upper flow channel serves as a barrier.

8. The built-in integrated heat dissipation module as described in claim 7, characterized in that: The lower flow channel is located at the bottom of the lower plate (9), and the lower plate (9) is covered with a lower cover (11) corresponding to the position of the lower flow channel.

9. A laptop computer, characterized in that: It includes a built-in integrated heat dissipation module as described in any one of claims 1 to 8, wherein the heat-conducting block (8) is in contact with the surfaces of the CPU and GPU, respectively.

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