Crimping and welding combined semiconductor module
By employing a press-fit welding module in semiconductor devices and using flexible copper busbars to connect the welding and press-fit modules, the problems of large space occupation, poor maintainability, and high maintenance costs caused by using them separately are solved, achieving greater adaptability and low-cost maintenance.
Patent Information
- Application Number
- CN202521829884.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-27
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2035-08-27
AI Technical Summary
In existing semiconductor devices, pressing and soldering, when used separately, result in problems such as large space occupation, limited usage conditions, poor maintainability, and high maintenance costs.
A semiconductor module is assembled by press-fit welding. The welding module and the press-fit module are connected by flexible copper busbars. The assembly includes a welding module and a press-fit module. The flexible copper busbars are used to achieve electrical connection, and the pressure is adjusted by bolts to adapt to different environments.
This results in greater modular adaptability, reduced space occupation, simplified maintenance process and lower maintenance costs, while also reducing internal stress caused by size differences.
Smart Images
Figure CN223552533U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of semiconductor devices, and specifically to a press-welded combined semiconductor module. Background Technology
[0002] In semiconductor packaging and manufacturing, crimping and soldering are two key material joining technologies used to achieve reliable electrical connections and mechanical fixation between devices and substrates, chips and lead frames / substrates, or different components.
[0003] Crimping utilizes a combination of disc springs, pressure plates, and bolts to clamp the chip, while soldering directly bonds the DBC board to the chip for fixation. Currently, semiconductor crimping and soldering are separate processes, resulting in large space requirements, limited operating conditions, poor maintainability, and high maintenance costs. Utility Model Content
[0004] To address the aforementioned issues, namely the large space required for crimping and welding when used separately, limited usage conditions, poor maintainability, and high maintenance costs, this utility model proposes a crimping and welding combined semiconductor module, which includes a base plate on which a welding module and a crimping module are mounted. The welding module and the crimping module are connected by a flexible copper busbar. One end of the flexible copper busbar (4) extends out to connect to the lower electrode.
[0005] A further feature of this invention is that the welding module includes a DBC board, the DBC board is welded to the base plate, a square chip is welded to one end of the DBC board away from the base plate, an upper electrode is welded to the square chip, one end of the flexible copper busbar is welded to the square chip, and one end of the flexible copper busbar welded to the square chip is electrically connected to the square chip.
[0006] A further feature of this invention is that the crimping module includes a crimping ceramic sheet, on which a circular chip is disposed, and an upper electrode is connected to the circular chip. A pressure plate is sleeved on the upper electrode, and a disc spring is disposed between the pressure plate and the circular chip. The disc spring is sleeved on the upper electrode, and its two ends abut against the circular chip and the pressure plate, respectively. Four bolts are threaded through the pressure plate and are connected to the base plate. The end of the flexible copper busbar facing away from the welding module is electrically connected to the circular chip.
[0007] A further feature of this invention is that an insulating sheet is also sleeved on the upper electrode, the insulating sheet is disposed between the disc spring and the circular chip, and the bottom end of the disc spring abuts against the insulating sheet.
[0008] The beneficial effects of this utility model are as follows:
[0009] 1. By using flexible copper busbars to connect the welding module and the crimping module, the crimping module and welding module can be used in combination. This allows the module to adapt to more different usage environments, making it more adaptable and avoiding limitations imposed by usage conditions. Furthermore, the simple structure facilitates maintenance and reduces maintenance costs. Using the two modules together eliminates the need for separate installation of the crimping and welding modules, further saving space.
[0010] 2. The connection through flexible copper busbars can also reduce the internal stress caused by the size difference between the welding module and the crimping module. Attached Figure Description
[0011] Figure 1 A schematic diagram of the structure of this utility model is shown.
[0012] Reference numerals: 1. Base plate; 2. Welding module; 21. DBC board; 22. Square chip; 3. Crimping module; 31. Crimping ceramic sheet; 32. Circular chip; 33. Disc spring; 34. Pressure plate; 35. Bolt; 36. Insulating sheet; 4. Flexible copper busbar; 5. Upper electrode. Detailed Implementation
[0013] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.
[0014] refer to Figure 1 This utility model proposes a press-weld combined semiconductor module, including a base plate 1, a welding module 2 and a press-weld module 3 connected on the base plate 1, and the welding module 2 and the press-weld module 3 are electrically connected by a flexible copper busbar 4.
[0015] The welding module 2 includes a DBC board 21, which is welded to the base plate 1. The DBC board 21 is square. A square chip 22 is welded to the surface of the DBC board 21 facing away from the base plate 1. An upper electrode 5 is welded to the square chip 22. One end of the flexible copper busbar 4 is hardened and fitted onto the upper electrode 5, but does not contact the upper electrode 5. One end of the hardened part of the flexible copper busbar 4 is welded to the square chip 22 to achieve electrical connection between the flexible copper busbar 4 and the square chip 22.
[0016] The crimping module 3 includes a crimping ceramic sheet 31, on which a circular chip 32 is disposed. An upper electrode 5 is fixedly connected to the circular chip 32. A pressure plate 34 is coaxially sleeved on the upper electrode 5. A disc spring 33 is disposed on the pressure plate 34 and the circular chip 32. The disc spring 33 is also coaxially sleeved on the upper electrode 5. The two ends of the disc spring 33 abut against the circular chip 32 and the pressure plate 34 respectively.
[0017] Four bolts 35 are threaded through the pressure plate 34. The four bolts 35 are arranged in a rectangular pattern and are threaded to the base plate 1. Rotating the bolts 35 can adjust the distance between the pressure plate 34 and the base plate 1, thereby changing the elastic force of the disc spring 33 and thus changing the pressure on the chip.
[0018] The flexible copper busbar 4 is electrically connected to the circular chip 32 at one end away from the welding module 2 and is pressed between the chip and the pressing ceramic sheet 31, thereby achieving the purpose of connecting the square chip 22 and the circular chip 32 through the flexible connection; the flexible copper busbar 4 is also extended at one end near the pressing module 3 for connecting the lower electrode.
[0019] An insulating sheet 36 is also provided on the circular chip 32. The insulating sheet 36 is also coaxially sleeved on the upper electrode 5. The insulating sheet 36 is located between the disc spring 33 and the circular chip 32. The bottom end of the disc spring 33 abuts against the insulating sheet 36. Thus, the disc spring 33 presses the circular chip 32 against the insulating sheet 36, preventing the disc spring 33 from directly contacting the circular chip 32.
[0020] In summary, this utility model, by utilizing the flexible copper busbar 4 to connect the welding module 2 and the crimping module 3, achieves the goal of combining the crimping module 3 and the welding module 2 for use. This further enables the module to adapt to a wider range of different usage environments, enhancing its adaptability and avoiding limitations imposed by usage conditions. Simultaneously, the structure is simple, easy to maintain, and has low maintenance costs. The combined use of the two modules eliminates the need for separate installation of the crimping module 3 and the welding module 2, further saving space. The connection via the flexible copper busbar 4 also reduces the internal stress problem caused by the size difference between the welding module 2 and the crimping module 3.
[0021] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0022] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0024] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.
[0025] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.
Claims
1. A press-fit semiconductor module, characterized in that: It includes a base plate (1), on which a welding module (2) and a crimping module (3) are provided. The welding module (2) and the crimping module (3) are connected by a flexible copper busbar (4). One end of the flexible copper busbar (4) is also extended to connect to the lower electrode.
2. The press-fit semiconductor module according to claim 1, characterized in that: The welding module (2) includes a DBC board (21), which is welded to the base plate (1). A square chip (22) is welded to one end of the DBC board (21) away from the base plate (1). An upper electrode (5) is welded to the square chip (22). One end of the flexible copper busbar (4) is welded to the square chip (22), and one end of the flexible copper busbar (4) is electrically connected to the square chip (22).
3. The press-fit semiconductor module according to claim 1, characterized in that: The crimping module (3) includes a crimping ceramic sheet (31), on which a circular chip (32) is disposed. An upper electrode (5) is connected to the circular chip (32). A pressure plate (34) is sleeved on the upper electrode (5). A disc spring (33) is disposed between the pressure plate (34) and the circular chip (32). The disc spring (33) is sleeved on the upper electrode (5), and both ends of the disc spring (33) abut against the circular chip (32) and the pressure plate (34) respectively. Four bolts (35) are threaded through the pressure plate (34), and the bolts (35) are threaded to the base plate (1). The flexible copper busbar (4) is electrically connected to the circular chip (32) at one end away from the welding module (2).
4. The press-fit semiconductor module according to claim 3, characterized in that: An insulating sheet (36) is also sleeved on the upper electrode (5). The insulating sheet (36) is disposed between the disc spring (33) and the circular chip (32). The bottom end of the disc spring (33) abuts against the insulating sheet (36).