Communication module and terminal device

Abstract

The utility model discloses a communication module and terminal equipment, and belongs to the technical field of communication. The communication module includes: a circuit board; one end of the shielding unit is grounded, and the other end of the shielding unit is electrically connected with a conductive connection point on the circuit board; the monitoring circuit is arranged on the circuit board, the first end of the monitoring circuit is electrically connected with the conductive connection point, and the second end of the monitoring circuit is connected with power supply voltage; and the processing unit is electrically connected with the third end of the monitoring circuit, receives the monitoring signal from the monitoring circuit, and determines the electrical connection state between the shielding unit and the circuit board according to the monitoring signal. The monitoring circuit is additionally arranged between the shielding unit and the processing unit, so that the processing unit can accurately and timely acquire the electrical connection state between the shielding unit and the circuit board, and the effects of monitoring abnormal conditions in real time and preventing information leakage are achieved.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a communication module and terminal device. Background Technology

[0002] Communication modules are generally used to implement data transmission. In order to protect the information assets in the communication module from unauthorized access, use, disclosure, damage, modification or destruction, and thus ensure the availability, integrity and confidentiality of information, it is necessary to configure appropriate monitoring and prevention mechanisms for the communication module.

[0003] However, most general monitoring and prevention solutions in related technologies have drawbacks such as cumbersome logic, delayed protection, high cost, and easy detection or circumvention. Therefore, there is an urgent need to configure monitoring and prevention solutions for communication modules that can overcome the above-mentioned drawbacks. Utility Model Content

[0004] The main purpose of this application is to provide a communication module and terminal device, which aims to provide a monitoring and prevention scheme for the communication module that is simple in logic, timely in protection, low in cost, and not easy to be detected or circumvented.

[0005] To achieve the above objectives, this application provides a communication module, the communication module comprising:

[0006] Circuit board;

[0007] A shielding unit, one end of which is grounded and the other end of which is electrically connected to a conductive connection point on the circuit board;

[0008] A monitoring circuit is mounted on the circuit board. The first terminal of the monitoring circuit is electrically connected to the conductive connection point, and the second terminal of the monitoring circuit is connected to a power supply voltage.

[0009] The processing unit is electrically connected to the third terminal of the monitoring circuit. The processing unit receives monitoring signals from the monitoring circuit and determines the electrical connection status between the shielding unit and the circuit board based on the monitoring signals.

[0010] In one embodiment, when the electrical connection between the shielding unit and the circuit board is closed, the monitoring signal is a first-level signal.

[0011] In one embodiment, when the electrical connection between the shielding unit and the circuit board is disconnected, the monitoring signal is a second-level signal, wherein the logic state of the second-level signal is opposite to that of the first-level signal.

[0012] In one embodiment, the first level signal is a low level and the second level signal is a high level.

[0013] In one embodiment, the monitoring circuit includes:

[0014] A diode, wherein the cathode of the diode is electrically connected to the conductive connection point, and the anode of the diode is electrically connected to the processing unit, and the monitoring signal is the voltage level of the anode of the diode;

[0015] A pull-up resistor is provided, one end of which is electrically connected to the anode of the diode and the processing unit, and the other end of which is connected to the power supply voltage.

[0016] In one embodiment, when the electrical connection between the shielding unit and the circuit board is closed, the diode is turned on and the monitoring signal is low.

[0017] In one embodiment, when the electrical connection between the shielding unit and the circuit board is disconnected, the diode is turned off, and the monitoring signal is high.

[0018] In one embodiment, the shielding unit includes:

[0019] A shielding component, one end of which is grounded;

[0020] The conductive foam has one end electrically connected to the other end of the shielding component, and the other end electrically connected to a conductive connection point on the circuit board.

[0021] In one embodiment, the shielding element is a shielding cover placed on the circuit board, and the processing unit is disposed in a sealed space formed by the shielding cover and the circuit board.

[0022] In addition, to achieve the above objectives, this application also provides a terminal device, which includes the communication module described above.

[0023] This application discloses a communication module and terminal device. The communication module includes: a circuit board; a shielding unit, one end of which is grounded and the other end of which is electrically connected to a conductive connection point on the circuit board; a monitoring circuit disposed on the circuit board, a first end of which is electrically connected to the conductive connection point and a second end of which is connected to a power supply voltage; and a processing unit electrically connected to a third end of the monitoring circuit, which receives a monitoring signal from the monitoring circuit and determines the electrical connection state between the shielding unit and the circuit board based on the monitoring signal.

[0024] This application adds a monitoring circuit between the shielding unit and the processing unit, enabling the processing unit to accurately and promptly obtain the electrical connection status between the shielding unit and the circuit board simply by receiving monitoring signals. The logic is simple, and it also serves to monitor abnormal situations in real time, allowing for timely implementation of corresponding protective measures to prevent damage to the communication module or information leakage when abnormal situations occur. The monitoring circuit is simple in construction, requires no excessive cost, and is not easily detected or evaded because it is located on the circuit board. Therefore, this application overcomes the shortcomings of general monitoring and prevention schemes in related technologies, such as cumbersome logic, delayed protection, high cost, and easy detection or evasion. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a communication module provided in an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of another state of a communication module provided in an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the structure of a communication module after the monitoring circuit has been refined, as provided in an embodiment of this application.

[0029] Figure 4 This application provides a schematic diagram of another state of a communication module after the monitoring circuit has been refined.

[0030] Figure 5 This is a schematic diagram of the structure of a communication module after the shielding unit has been refined, as provided in an embodiment of this application.

[0031] Explanation of icon numbers:

[0032] PCB, circuit board; 100, shielding unit; 200, monitoring circuit; VCC, power supply voltage; 300, processing unit; D, diode; R, pull-up resistor; 101, shielding component; 102, conductive foam.

[0033] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0035] Communication modules are generally used for data transmission. To protect the information assets within these modules from unauthorized access, use, disclosure, damage, modification, or destruction, thereby ensuring the availability, integrity, and confidentiality of information, appropriate monitoring and prevention mechanisms need to be configured. Taking industrial communication modules as an example, due to their integration of components such as CPUs (Central Processing Units), FLASH memory, and RFFEs (RF Front-Ends), they are highly complex and technically demanding. In certain application scenarios and usage requirements, a certain level of protection is required for these modules. This protection may include safeguarding their integrity and confidentiality, enabling them to be aware of abnormal operating conditions, or protecting the entire electronic system equipped with such modules, such as triggering a self-locking state in the event of an anomaly.

[0036] However, most general monitoring and prevention solutions in related technologies suffer from drawbacks such as cumbersome logic (leading to complex solutions, increasing implementation difficulty and stability), delayed protection (preventive measures or performance have a certain lag, and can only be reported after an abnormal event occurs, often after a certain impact or loss has already occurred), high cost (the hardware components of the entire solution are expensive and not cost-competitive), and easy to be discovered or circumvented (the entire monitoring and prevention solution is too obvious, often very easy to be discovered and identified, and thus easy to be bypassed or circumvented). Therefore, it is urgent to configure monitoring and prevention solutions for communication modules that can overcome the above-mentioned drawbacks.

[0037] Based on this, this application proposes a communication module and terminal device. By adding a monitoring circuit between the shielding unit and the processing unit, the processing unit can accurately and promptly obtain the electrical connection status between the shielding unit and the circuit board simply by receiving the monitoring signal. The logic is simple, and it also plays a role in real-time monitoring of abnormal situations, enabling timely implementation of corresponding protective measures when abnormal situations occur to prevent damage to the communication module or information leakage. The monitoring circuit is simple in construction and does not require excessive costs. Moreover, since the monitoring circuit is set on the circuit board, it is not easy to be detected or evaded. Thus, this application overcomes the shortcomings of general monitoring and prevention schemes in related technologies, such as cumbersome logic, delayed protection, high cost, and easy detection or evasion.

[0038] The communication module and terminal device provided in this application are specifically described through the following embodiments, starting with the communication module.

[0039] This application provides a communication module, referring to... Figure 1 , Figure 1 This application provides a schematic diagram of the structure of a communication module according to an embodiment of the present application. The communication module includes:

[0040] Circuit board (PCB);

[0041] The shielding unit 100 has one end grounded and the other end electrically connected to a conductive connection point on the circuit board PCB.

[0042] The monitoring circuit 200 is mounted on the circuit board PCB. The first end of the monitoring circuit 200 is electrically connected to a conductive connection point, and the second end of the monitoring circuit 200 is connected to the power supply voltage VCC.

[0043] The processing unit 300 is electrically connected to the third terminal of the monitoring circuit 200. The processing unit 300 receives the monitoring signal from the monitoring circuit 200 and determines the electrical connection status between the shielding unit 100 and the circuit board PCB based on the monitoring signal.

[0044] It should be noted that the communication module provided in this embodiment is designed based on the combined characteristics of both mechanical and electronic features. The mechanical features are related to the shielding unit 100 typically found in communication modules. The primary function of the shielding unit 100 is to shield wireless radio frequency signals, preventing external signals from interfering with the internal radio frequency signals to ensure optimal radio frequency performance. Simultaneously, it effectively shields the internal radio frequency signals from external radiation, allowing the communication module's EMC (Electromagnetic Compatibility) function to adapt to various regulations and requirements in different application scenarios. Therefore, the shielding unit 100 must possess good conductivity and be grounded. The electronic features are related to the processing unit 300 in the communication module, utilizing the GPIO (General-Purpose I / O) of the processing unit 300. The input / output (general-purpose input / output) interrupt feature enables the reporting of abnormal events. Based on this, by adding a monitoring circuit 200 between the shielding unit 100 and the processing unit 300, the processing unit 300 can monitor in real time whether the shielding unit 100 is properly installed on the circuit board PCB and is playing its due shielding role, or whether it has been disconnected from the circuit board PCB due to some abnormal situation (such as human removal), resulting in the communication module no longer being protected.

[0045] In this embodiment, both the power supply voltage VCC and the ground terminal can be provided by the printed circuit board (PCB).

[0046] As an example, the processing unit 300 may be a CPU (Central Processing Unit), an MCU (Microcontroller Unit), or other processors suitable for the communication module. This embodiment does not limit this.

[0047] In some feasible embodiments, when the electrical connection between the shielding unit 100 and the circuit board PCB is closed, the monitoring signal is a first level signal.

[0048] It is understandable that, such as Figure 1 As shown, the electrical connection between the shielding unit 100 and the circuit board PCB is a closed connection, which can be understood as a path between the monitoring circuit 200, the conductive connection point, and the shielding unit 100. At this time, the monitoring signal received by the processing unit 300 is a first-level signal, which means that the first-level signal represents the normal state, that is, the shielding unit 100 has not been removed from the circuit board PCB.

[0049] In some feasible embodiments, when the electrical connection between the shielding unit 100 and the circuit board PCB is disconnected, the monitoring signal is a second-level signal, wherein the logic state of the second-level signal is opposite to that of the first-level signal.

[0050] Reference Figure 2 In this embodiment, the electrical connection between the shielding unit 100 and the circuit board PCB is disconnected, which can be understood as the absence of a path between the monitoring circuit 200, the conductive connection point, and the shielding unit 100. At this time, the monitoring signal received by the processing unit 300 is a second-level signal, which means that the second-level signal represents that the communication module is in an abnormal state, that is, the shielding unit 100 has been removed from the circuit board PCB.

[0051] As an example, the first level signal is low and the second level signal is high.

[0052] In this embodiment, when there is a path between the monitoring circuit 200, the conductive connection point, and the shielding unit 100, it can be assumed that the pin of the processing unit 300 used to receive the monitoring signal is pulled low by the grounded shielding unit 100, and therefore, the first level signal is low. When there is no path between the monitoring circuit 200, the conductive connection point, and the shielding unit 100, it can be assumed that the pin of the processing unit 300 used to receive the monitoring signal is pulled high by the monitoring circuit 200 connected to the power supply voltage VCC, and therefore, the second level signal is high.

[0053] Reference Figure 3 In some feasible embodiments, the monitoring circuit 200 may include:

[0054] Diode D, the cathode of diode D is electrically connected to the conductive connection point, the anode of diode D is electrically connected to the processing unit 300, and the monitoring signal is the level state of the anode of diode D;

[0055] Pull-up resistor R, one end of which is electrically connected to the anode of diode D and processing unit 300, and the other end of pull-up resistor R is connected to power supply voltage VCC.

[0056] In this embodiment, an implementation method for a monitoring circuit 200 is provided, combined with... Figure 3 and Figure 1 It can be seen that the cathode of diode D is equivalent to the first terminal of monitoring circuit 200, the other end of pull-up resistor R is equivalent to the second terminal of monitoring circuit 200, and the anode of diode D and one end of pull-up resistor R are connected together to the third terminal of monitoring circuit 300.

[0057] It is understandable that if the circuit board PCB is designed with pull-up resistors, then in this embodiment, only a low-cost diode D needs to be added to form a monitoring circuit 200 that helps the processing unit 300 to know the connection status between the shielding unit 100 and the circuit board PCB. If there is no pull-up resistor on the circuit board PCB, then in addition to adding diode D, a pull-up resistor R connected to the power supply voltage VCC on the circuit board PCB can be added, which will not lead to excessive cost. However, compared with the monitoring and prevention solutions in related technologies, the advantages are significant.

[0058] In some feasible embodiments, when the electrical connection between the shielding unit 100 and the circuit board PCB is closed, the diode D is turned on, and the monitoring signal is low.

[0059] It is understandable that, such as Figure 3 As shown, the electrical connection between the shielding unit 100 and the circuit board PCB is a closed connection, which can be understood as a path between the pull-up resistor R, the diode D, the conductive connection point, and the shielding unit 100. At this time, the diode D is conducting, so that the end of the processing unit 300 connected to the anode of the diode D is pulled low by the grounded shielding unit 100, which is equivalent to the monitoring signal received by the processing unit 300 being at a low level.

[0060] In some feasible embodiments, when the electrical connection between the shielding unit 100 and the circuit board PCB is disconnected, the diode D is turned off and the monitoring signal is high.

[0061] Reference Figure 4 In this embodiment, the electrical connection between the shielding unit 100 and the circuit board PCB is disconnected, which can be understood as the absence of a path between the pull-up resistor R, the diode D, the conductive connection point, and the shielding unit. At this time, the diode D is cut off, causing the end of the processing unit 300 connected to the pull-up resistor R to be pulled high by the pull-up resistor R connected to the power supply voltage VCC, which is equivalent to the monitoring signal received by the processing unit 300 being at a high level.

[0062] Reference Figure 5 In some feasible embodiments, the shielding unit 100 may include:

[0063] Shielding component 101, one end of which is grounded;

[0064] Conductive foam 102, one end of which is electrically connected to the other end of shield 101, and the other end of conductive foam 102 is electrically connected to a conductive connection point on the circuit board PCB.

[0065] In this embodiment, the shield 101 is usually made of metal (such as tinplate, white copper, etc.) and is placed above the protected circuit or device. It is soldered to the GND (grounding terminal of the wire) of the circuit board PCB on all sides to form a sealed space to prevent EMC interference. The conductive foam 102 is a conductive and compressible material that is often used in hardware circuits to conduct electricity.

[0066] In some feasible embodiments, the shield 101 is a shield covering the circuit board PCB, and the processing unit 300 is disposed in a closed space formed by the shield and the circuit board PCB.

[0067] Understandably, in practical applications, the shielding component 101 can be implemented in the form of a shielding cover. The shielding component 101 is placed on the circuit board PCB, which can cover the processing unit 300 and the monitoring circuit 200 inside the sealed space formed by the shielding cover and the circuit board PCB, thus playing a role in shielding and protection.

[0068] This embodiment provides a communication module. By adding a simple and easy-to-implement monitoring circuit between the shielding unit and the processing unit, the processing unit can accurately and promptly obtain the electrical connection status between the shielding unit and the circuit board simply by receiving monitoring signals. This greatly reduces logical complexity, ensures stability and reliability, and also serves to monitor abnormal situations in real time, enabling timely implementation of corresponding protective measures when abnormal situations occur. Since hardware circuitry is used for detection, the system can identify, monitor, and detect any removal of the shielding component, preventing damage to the communication module or information leakage. The solution is low-cost, as the conductive foam and diodes are inexpensive and have a minimal impact on the overall cost of the communication module. It also has good concealment, as the monitoring circuit is located on the circuit board and is relatively concealed and difficult to detect or evade due to the use of shielding components and conductive foam. Therefore, this application overcomes the shortcomings of general monitoring and prevention solutions in related technologies, such as cumbersome logic, delayed protection, high cost, and ease of detection or evasion.

[0069] In addition, this application also provides a terminal device, which includes the communication module provided in the above embodiments.

[0070] Since the terminal device proposed in this embodiment includes the communication module proposed in the above embodiments, it has the beneficial effects of the above embodiments. For details on the specific working process and principle of the communication module, please refer to the communication modules provided in the above embodiments. They will not be described in detail here, and all are within the protection scope of this embodiment.

[0071] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0072] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B.

[0073] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0074] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0075] It should be noted that the technical solutions of the various embodiments of this application can be combined with each other, but only if they are implemented by those skilled in the art. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this application.

[0076] The above are merely optional embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A communication module, characterized in that, The communication module includes: Circuit board; A shielding unit, one end of which is grounded and the other end of which is electrically connected to a conductive connection point on the circuit board; A monitoring circuit is mounted on the circuit board. The first terminal of the monitoring circuit is electrically connected to the conductive connection point, and the second terminal of the monitoring circuit is connected to a power supply voltage. The processing unit is electrically connected to the third terminal of the monitoring circuit. The processing unit receives monitoring signals from the monitoring circuit and determines the electrical connection status between the shielding unit and the circuit board based on the monitoring signals.

2. The communication module as described in claim 1, characterized in that, When the electrical connection between the shielding unit and the circuit board is closed, the monitoring signal is a first-level signal.

3. The communication module as described in claim 2, characterized in that, When the electrical connection between the shielding unit and the circuit board is disconnected, the monitoring signal is a second-level signal, wherein the logic state of the second-level signal is opposite to that of the first-level signal.

4. The communication module as described in claim 3, characterized in that, The first level signal is low level, and the second level signal is high level.

5. The communication module as described in claim 1, characterized in that, The monitoring circuit includes: A diode, wherein the cathode of the diode is electrically connected to the conductive connection point, and the anode of the diode is electrically connected to the processing unit, and the monitoring signal is the voltage level of the anode of the diode; A pull-up resistor is provided, one end of which is electrically connected to the anode of the diode and the processing unit, and the other end of which is connected to the power supply voltage.

6. The communication module as described in claim 5, characterized in that, When the electrical connection between the shielding unit and the circuit board is closed, the diode is turned on, and the monitoring signal is at a low level.

7. The communication module as described in claim 5, characterized in that, When the electrical connection between the shielding unit and the circuit board is disconnected, the diode is turned off, and the monitoring signal is at a high level.

8. The communication module as described in claim 1, characterized in that, The shielding unit includes: A shielding component, one end of which is grounded; The conductive foam has one end electrically connected to the other end of the shielding component, and the other end electrically connected to a conductive connection point on the circuit board.

9. The communication module as described in claim 8, characterized in that, The shielding component is a shielding cover placed on the circuit board, and the processing unit is disposed in a sealed space formed by the shielding cover and the circuit board.

10. A terminal device, characterized in that, The terminal device includes a communication module as described in any one of claims 1 to 9.

Images