Electrostatic probe system and plasma test system

Abstract

The utility model discloses an electrostatic probe system and a plasma test system.The electrostatic probe system comprises an electrostatic probe driving module and a detection signal acquisition module, and the electrostatic probe driving module comprises a driving signal generator, a driving signal conditioning circuit and a power circuit; the driving signal adjusting circuit is connected to the output end of the driving signal generator; the power supply circuit is in communication connection with the driving signal generator and is in power supply connection with the driving signal adjusting circuit, power is supplied to the driving signal generator and the driving signal adjusting circuit under the control of the driving signal generator, and the electrostatic probe is connected to the output end of the driving signal adjusting circuit; the detection signal acquisition module comprises a signal acquisition circuit, an acquisition signal isolation circuit and a signal processing module, and the signal acquisition circuit is connected with the electrostatic probe and is used for acquiring an electric signal on the electrostatic probe; and the acquisition signal isolation circuit is connected with the output end of the signal acquisition circuit and is used for isolating and transmitting the electric signal to the signal processing module.

Description

Technical Field

[0001] This application belongs to the field of power electronics technology, specifically relating to an electrostatic probe system and a plasma testing system. Background Technology

[0002] In plasma diagnostic technologies, electrostatic probes (also known as Langmuir probes) were among the earliest diagnostic tools used to determine plasma characteristics. Their working principle is as follows: one or more electrostatic probes are inserted into the plasma in the vacuum chamber of a nuclear fusion device, a certain voltage is applied, and the relationship between the current flowing through and the applied voltage is measured, yielding the voltage-current (VI) characteristic curve of the electrostatic probe. Furthermore, the VI characteristic curve of the electrostatic probe can be used to derive important plasma parameters such as plasma electron temperature, plasma electron density, and plasma potential.

[0003] In complex electromagnetic environments and with strong interference, such as those in nuclear fusion, how to build a complete electrostatic probe system to collect plasma information more flexibly and accurately has become an urgent technical problem to be solved. Utility Model Content

[0004] This application provides an electrostatic probe driving device and a plasma diagnostic system to solve the technical problem of how to build a complete electrostatic probe system to collect plasma information more flexibly and accurately.

[0005] The technical solution adopted in this application is as follows:

[0006] According to a first aspect, embodiments of this application provide an electrostatic probe system, comprising: an electrostatic probe driving module and a detection signal acquisition module, wherein the electrostatic probe is connected between the electrostatic probe driving module and the detection signal acquisition module; the electrostatic probe driving module includes a driving signal generator, a driving signal conditioning circuit, and a power supply circuit; wherein the driving signal conditioning circuit is connected to the output terminal of the driving signal generator; the power supply circuit is communicatively connected to the driving signal generator and powered by the driving signal conditioning circuit, and supplies power to the driving signal generator and the driving signal conditioning circuit under the control of the driving signal generator; the electrostatic probe is connected to the output terminal of the driving signal conditioning circuit; the detection signal acquisition module includes a signal acquisition circuit, a signal acquisition isolation circuit, and a signal processing module; wherein the signal acquisition circuit is connected to the electrostatic probe and is used to acquire electrical signals on the electrostatic probe; the signal acquisition isolation circuit is connected to the output terminal of the signal acquisition circuit and is used to isolate the transmission of the electrical signals to the signal processing module.

[0007] In one embodiment, the drive signal conditioning circuit includes a differential amplifier circuit and a high-voltage amplifier circuit; the high-voltage amplifier circuit includes two amplifiers with identical structure and component parameters, the input terminals of the two amplifiers are respectively connected to the two output terminals of the differential amplifier circuit; the output terminals of the two amplifiers are connected to the electrostatic probe.

[0008] In one embodiment, each of the amplifiers includes: an operational amplifier, a voltage amplifier circuit, and a current amplifier circuit cascaded sequentially at the output of the differential amplifier circuit; an RC series circuit is connected between the output of the voltage amplifier circuit and ground to replace the high-frequency negative feedback capacitor in the voltage amplifier circuit.

[0009] In one embodiment, the power supply circuit includes: a plurality of DC / DC converters with parallel inputs and series outputs, connected between an external power supply and an electrostatic probe driving module; and a plurality of delay circuits, each corresponding to one of the plurality of DC / DC converters, with their input terminals connected to the power supply and their output terminals respectively connected to the delay enable terminals of the DC / DC converters, for staggered start-up of the plurality of DC / DC converters.

[0010] In one embodiment, the plurality of DC / DC converters are divided into two groups of DC / DC converters, wherein the number of DC / DC converters in the first group is the same as the number of DC / DC converters in the second group, the first group of DC / DC converters outputs a positive voltage, and the second group of DC / DC converters outputs a negative voltage; the output power of the first group of DC / DC converters and the second group of DC / DC converters are different.

[0011] In one embodiment, the signal acquisition circuit includes a voltage acquisition circuit and a current acquisition circuit. The voltage acquisition circuit includes a voltage divider circuit and a first operational amplifier. The input terminal of the voltage divider circuit is connected to the voltage acquisition point, and the voltage divider output is connected to the non-inverting input terminal of the first operational amplifier. The output terminal of the first operational amplifier is connected to the acquisition signal isolation circuit. The current acquisition circuit includes a sampling resistor and a second operational amplifier. The sampling resistor is connected in series in the circuit to be acquired and in parallel with the input terminal of the second operational amplifier. The output terminal of the second operational amplifier is connected to the acquisition signal isolation circuit.

[0012] In one embodiment, the drive signal generator includes an MCU, the MCU having a drive signal output terminal and a power control signal output terminal, the drive signal output terminal being connected to the input terminal of the drive signal adjustment circuit, and the power control signal output terminal being connected to the control terminal of the power supply circuit.

[0013] According to a second aspect, embodiments of this application provide a plasma testing system, including a host computer, an isolated communication circuit, and multiple electrostatic probe systems; the host computer is connected to drive signal generators in the multiple electrostatic probe systems respectively through the isolated communication circuit, and is used to output control signals to control the drive signal generators to output drive signals.

[0014] In one embodiment, the isolated communication circuit includes isolated communication interfaces corresponding one-to-one with the electrostatic probe system. The isolated communication interface includes a first isolated communication chip, an isolation device, and a second isolated communication chip. The first isolated communication chip is connected to the host computer, and the second isolated communication chip is connected to the drive signal generator. The first isolated communication chip and the second isolated communication chip are connected through the isolation device.

[0015] In one embodiment, the isolation device may include a network port transformer; the first isolation chip and the second isolation chip include SPI communication interface chips.

[0016] The embodiments of this application have at least the following beneficial effects: The drive signal generator in the electrostatic probe drive module receives control commands, which may include control commands such as setting drive signal waveform parameters and control signal acquisition. After receiving the control commands, the power supply circuit supplies power to the drive signal adjustment circuit. Simultaneously, the drive signal generator outputs a low-voltage, waveform-adjustable drive signal. The drive signal adjustment circuit adjusts the drive signal to a stable, precise, high-voltage drive signal required by the electrostatic probe to drive the electrostatic probe. After the electrostatic probe comes into contact with plasma, the waveform of the drive signal changes due to the influence of the plasma. The voltage and current signals on the electrostatic probe are acquired by the signal acquisition circuit. The acquired electrical signals are output to the signal processing module through the acquisition signal isolation circuit. The signal processing module can receive, process, and store the acquired electrical signals. Furthermore, it can analyze the acquired electrical signals or upload them to a host computer for further analysis or report generation. The entire process begins with a command issued by the host computer. The drive signal generator outputs a drive signal, which is then generated and amplified by the control power circuit. The probe interacts with the plasma, and the data is transmitted to the signal processing module through the signal acquisition circuit and the acquisition signal isolation circuit of the probe signal acquisition module. This completes the data collection and processing, forming an electrostatic probe system that determines the physical properties of the plasma, provides detailed information about plasma behavior, and helps users better understand and control the plasma. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 This is a schematic diagram of an electrostatic probe system according to an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of a drive signal adjustment circuit according to an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of a power supply circuit in an electrostatic probe system according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of a plasma testing system according to an embodiment of this application. Detailed Implementation

[0022] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below. It should be noted that, unless otherwise specified, the embodiments of this application and the features thereof can be combined with each other.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0026] This application provides an electrostatic probe system, such as Figure 1 As shown, the system includes: an electrostatic probe driving module 10 and a detection signal acquisition module 30, with an electrostatic probe 20 connected between the electrostatic probe driving module 10 and the detection signal acquisition module 30. The electrostatic probe driving module 10 includes a drive signal generator 11 and a drive signal adjustment circuit 12 connected to the output of the drive signal generator 11; the electrostatic probe 20 is connected to the output of the drive signal adjustment circuit 12; a power supply circuit 13 is communicatively connected to the drive signal generator 11 and powered by the drive signal adjustment circuit 12, supplying power to the drive signal generator 11 and the drive signal adjustment circuit 12 under the control of the drive signal generator 11; the detection signal acquisition module 30 includes a signal acquisition circuit 31, a signal isolation circuit 32, and a signal processing module 33. The signal acquisition circuit 31 is connected to the electrostatic probe 20 and is used to acquire electrical signals from the electrostatic probe 20; the signal isolation circuit 32 is connected to the output of the signal acquisition circuit 31 and is used to isolate the electrical signals transmitted to the signal processing module 33.

[0027] The drive signal generator 11 in the electrostatic probe drive module 10 receives, for example, the drive signal generator 11 receives, the drive signal generator 11 in the electrostatic probe drive module 10 ... Figure 4 The control instructions of the host computer 100 shown can include control instructions such as setting drive signal waveform parameters and control signal acquisition. After receiving the control instructions, the drive signal generator 11 outputs a control signal to the power supply circuit 13 to start working. The power supply circuit 13 supplies power to the drive signal adjustment circuit 12. At the same time, the drive signal generator 11 outputs a low-voltage, waveform-adjustable drive signal. The drive signal adjustment circuit 12 adjusts the drive signal to a stable and precise high-voltage drive signal required by the electrostatic probe 20 to drive the electrostatic probe 20.

[0028] A high-voltage drive signal is output to the electrostatic probe 20. Upon contact with the plasma, the waveform of the drive signal changes due to the plasma's influence. The voltage and current signals on the electrostatic probe 20 are acquired by the signal acquisition circuit 31. The acquired electrical signals are then output to the signal processing module 33 via the acquisition signal isolation circuit 32. The signal processing module 33 can receive, process, and store the acquired electrical signals. Furthermore, it can analyze the acquired electrical signals or upload them to the host computer 100 for further analysis or report generation, such as displaying the data intuitively on a monitor. The entire process begins with a command from the host computer 100, which outputs a drive signal through the drive signal generator 11. The signal is then generated and amplified by the control power supply circuit 13. The probe interacts with the plasma, and finally, the data is transmitted to the signal processing module via the signal acquisition circuit 31 and the acquisition signal isolation circuit 32 of the detection signal acquisition module 30, completing the data collection and processing.

[0029] In one embodiment, the drive signal conditioning circuit 12 includes a differential amplifier circuit 121 and a high-voltage amplifier circuit. The high-voltage amplifier circuit includes two amplifiers 122 with identical structure and component parameters. The input terminals of the two amplifiers 122 are respectively connected to the two output terminals of the differential amplifier circuit 121. The output terminals of the two amplifiers 122 are connected to the electrostatic probe 20.

[0030] The high-voltage amplifier circuit can amplify the low-voltage drive signal into the positive and negative high-voltage signals required by the electrostatic probe 20. Based on this, the drive signal generator 11 can output a drive signal, which is then converted into two signals of equal magnitude and opposite phase by the differential amplifier circuit 121. These signals are then input into the two amplifiers 122 of the high-voltage amplifier circuit, which have the same structure and component parameters, and output two high-voltage drive signals of equal magnitude and opposite phase.

[0031] In an optional embodiment, each of the amplifiers 122 includes: an operational amplifier IC, a voltage amplifier circuit 1221, and a current amplifier circuit 1222 cascaded sequentially at the output of the differential amplifier circuit 121; an RC series circuit 123 is connected between the output of the voltage amplifier circuit 1221 and ground to replace the high-frequency negative feedback capacitor in the voltage amplifier circuit 1221. Figure 2 The schematic diagram shows one of the amplifiers and its connections; the other amplifier is connected to... Figure 2 The amplifiers shown in the diagram have the same structure and component parameters and are connected to the other output terminal of the differential amplifier circuit 121.

[0032] To facilitate the determination of the amplification factor of the high-voltage amplifier, a two-stage amplification method is adopted in this embodiment. First, the voltage of the signal output by the differential amplifier circuit 121 is amplified by the operational amplifier, and then the voltage is amplified by the voltage amplifier circuit 1221 cascaded at the output of the operational amplifier IC. However, when the operational amplifier IC and voltage amplifier circuit 1221 amplify a voltage signal, a phase shift occurs in the amplified signal. Under the influence of this phenomenon, high-frequency self-oscillation will occur in the high-voltage amplifier. If a high-frequency negative feedback capacitor is used to suppress this high-frequency self-oscillation, the slew rate and transient response performance of the high-voltage high-frequency signal will be significantly reduced. Therefore, in this embodiment, an RC series circuit 123 is connected between the output terminal of the voltage amplifier circuit 1221 and ground to replace the high-frequency negative feedback capacitor in the voltage amplifier circuit 1221. The RC series circuit 123 acts as a high-frequency attenuation circuit. The higher its frequency, the smaller the impedance of the RC series circuit 123 to the high-frequency signal, the smaller the voltage of the high-frequency signal input to the current amplifier, and the lower the high-frequency gain of the high-voltage amplifier. The RC series circuit 123 also has a phase lag effect on the high-frequency signal. Improving the high-frequency phase margin of the high-voltage amplifier can prevent the amplifier from generating high-frequency self-oscillation and can effectively avoid the problem of reduced slew rate and transient response performance of the high-voltage amplifier caused by increasing the high-frequency negative feedback capacitor, thereby improving the high-frequency performance of the high-voltage amplifier.

[0033] In one embodiment, to meet the high-voltage output requirement, a BTL-connected voltage amplifier circuit is used for voltage amplification, resulting in an output voltage twice that of a conventional single-ended amplifier circuit. Therefore, in this embodiment, a high-voltage transistor can be used to construct the voltage amplifier circuit 1221. To meet the voltage withstand requirement and achieve good linear output in high-voltage amplification scenarios, a high-voltage transistor with good frequency characteristics is used as the linear amplification device to construct the BTL-connected voltage amplifier circuit. The RC series circuit 123 connecting the output terminal of the voltage amplifier circuit 1221 and ground replaces the high-frequency negative feedback capacitor in the voltage amplifier circuit 1221, reducing the high-frequency gain of the amplifier and providing phase lag for high-frequency signals. This can, to some extent, compensate for the high-frequency characteristics of the high-voltage transistor. This allows the high-voltage amplifier built with the high-voltage transistor to better match the application scenario in this application. Simultaneously, the RC series circuit 123 prevents the amplifier from generating high-frequency self-oscillation and effectively avoids the problem of reduced slew rate and transient response performance caused by increasing the high-frequency negative feedback capacitor.

[0034] In one embodiment, such as Figure 3As shown, the power supply circuit 13 includes multiple DC / DC converters 131 with parallel input and series output, connected between the external power supply and the electrostatic probe drive module 10; converting the input voltage into the power supply voltage for the electrostatic probe drive module. Parallel input meets higher input current requirements, while series output achieves low-voltage input and high-voltage output to meet the high-voltage requirements of the electrostatic probe system.

[0035] The power supply circuit 13 also includes multiple delay circuits 132, each corresponding to one of the multiple DC / DC converters 131. The input terminals of the multiple delay circuits 132 are connected to the power supply, and their output terminals are respectively connected to the delay enable terminals of the DC / DC converters 131, used for staggered startup of the multiple DC / DC converters 131. The delay circuits 132 can be RC delay circuits, or timer-based delay circuits, such as a 555 timer-based delay circuit, or even controllers, which control the startup time of each DC / DC converter 131 through a program.

[0036] In one embodiment, the plurality of DC / DC converters 131 may include two groups of DC / DC converters to output positive and negative voltages respectively. The number of DC / DC converters in the first group is the same as the number in the second group. The first group outputs positive voltage, and the second group outputs negative voltage, to meet the positive and negative high-voltage power supply requirements of the electrostatic probe drive module. The selection of the DC / DC converters in each group can be determined based on actual needs.

[0037] To facilitate measurement by the electrostatic probe 20, in one embodiment, the output power of the first group of DC / DC converters and the second group of DC / DC converters are different; in another embodiment, the output power of the first group of DC / DC converters is greater than that of the second group of DC / DC converters. For example, the output power of the first group of DC / DC converters is 200W, and the output power of the second group of DC / DC converters is 40W. The above output power is only an exemplary example, and the actual output power can be adjusted according to the actual application.

[0038] In one embodiment, the number of DC / DC converters in each group can be determined based on the power supply voltage and the output voltage. In this embodiment, taking a power supply voltage of 48V and the voltage required by the electrostatic probe drive module 10 as 192V as an example, each group can use 4 DC / DC converters. In this embodiment, a DC / DC isolated converter with 48V input and 48V output is used as an example for illustration:

[0039] The input terminals of the four DC / DC converters in each group are connected in parallel, and the output terminals are connected in series to achieve an output voltage of 192V. In order to ensure the stable startup of the power supply circuit 13 and avoid the large current surge during parallel input startup, in this embodiment, a delay circuit 132 is used to set the peak-shifting startup of the four power modules in each group.

[0040] In one embodiment, the signal acquisition circuit 31 includes a voltage acquisition circuit and a current acquisition circuit. The voltage acquisition circuit includes a voltage divider circuit and a first operational amplifier. The input terminal of the voltage divider circuit is connected to the voltage acquisition point, the voltage divider output of the voltage divider circuit is connected to the non-inverting input terminal of the first operational amplifier, and the output terminal of the first operational amplifier is connected to the acquisition signal isolation circuit 32.

[0041] The current acquisition circuit includes a sampling resistor and a second operational amplifier. The sampling resistor is connected in series in the circuit to be acquired and in parallel with the input terminal of the second operational amplifier. The output terminal of the second operational amplifier is connected to the acquisition signal isolation circuit 32.

[0042] The current signal is measured by a sampling resistor, while the voltage signal is measured simultaneously by a voltage divider circuit. The sampling resistor converts the current signal into a voltage signal, and the voltage signals obtained from the current and voltage acquisition circuits are then amplified by operational amplifiers for subsequent processing. Precisely designed sampling resistors ensure the accuracy and linearity of signal acquisition. These signal data are then passed to subsequent processing units for monitoring, analyzing, or controlling various electrical parameters in the application.

[0043] The drive signal generator 11 includes an MCU, which has a drive signal output terminal and a power control signal output terminal. The drive signal output terminal is connected to the input terminal of the drive signal adjustment circuit 12, and the power control signal output terminal is connected to the control terminal of the power supply circuit 13. The MCU is responsible for generating and adjusting various parameters of the output drive signal, such as frequency, amplitude, and waveform shape. The drive signal can be used to drive the power supply circuit 13 to output a high-voltage drive signal to drive the electrostatic probe 20, or other circuits that require precise signals.

[0044] In this embodiment, the power control signal output by the MCU can control whether the power circuit 13 is started. In one embodiment, the power circuit 13 and the external power supply can be connected by a control switch, such as a relay or transistor switch. Under the control of the power control signal, the power circuit 13 is started to amplify the drive signal. At the same time, controlling the start of the power circuit 13 can solve the problem of severe overheating of high-voltage operational amplifiers in high-voltage power supply projects.

[0045] This application also provides a plasma testing system, such as... Figure 4 As shown, the plasma testing system includes a host computer 100, an isolation communication circuit 200, and multiple electrostatic probe systems 300. The host computer 100 communicates with the drive signal generator 11 in each of the electrostatic probe systems 300 via the isolation communication circuit 200. The isolation communication circuit 200 prevents high voltage or noise interference from affecting the control signal, ensuring stable and reliable communication between the drive signal generator 11 and external circuits. This function is crucial for protecting the drive signal generator 11 and other low-voltage components from high-voltage surges.

[0046] In one embodiment, the isolation communication circuit 200 includes isolated communication interfaces corresponding one-to-one with multiple electrostatic probe systems 300. Each isolated communication interface includes a first isolation communication chip, an isolation device, and a second isolation communication chip. The first isolation communication chip is connected to the host computer 100, and the second isolation communication chip is connected to the drive signal generator 11. The first and second isolation communication chips are connected via the isolation device. This connection between the first isolation communication chip, the isolation device, and the second isolation communication chip achieves signal isolation between the host computer 100 and the drive signal generator 11.

[0047] For example, the isolation device may include a network port transformer, and the first isolation chip and the second isolation chip include SPI communication interface chips. Isolating communication improves system stability, reliability, and security. Isolation prevents interference or fault propagation from affecting other parts, avoids electrical interconnections between different locations, maintains signal purity, and reduces potential hazards to operators or other circuits. Furthermore, isolation helps ensure independent operation and interconnection between different parts, guarantees compatibility between system components, and thus maintains the stable operation of the entire system.

[0048] The host computer can control multiple drive signal generators simultaneously, making the system more flexible. Different drive signal generators can be used to form a scanning network of electrostatic probes, which can more clearly collect information about the plasma.

[0049] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by a program instructing the hardware related to the terminal device. The program can be stored in a computer-readable storage medium, which may include: flash drive, ROM, RAM, disk or optical disk, etc.

[0050] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0051] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0052] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. An electrostatic probe system, characterized in that, include: The system includes an electrostatic probe driving module and a detection signal acquisition module, wherein the electrostatic probe is connected between the electrostatic probe driving module and the detection signal acquisition module. The electrostatic probe driving module includes a driving signal generator, a driving signal conditioning circuit, and a power supply circuit. The driving signal conditioning circuit is connected to the output terminal of the driving signal generator. The power supply circuit is communicatively connected to the driving signal generator and powered by the driving signal conditioning circuit. Under the control of the driving signal generator, the power supply circuit powers the driving signal generator and the driving signal conditioning circuit. The electrostatic probe is connected to the output terminal of the driving signal conditioning circuit. The detection signal acquisition module includes a signal acquisition circuit, a signal isolation circuit, and a signal processing module. The signal acquisition circuit is connected to the electrostatic probe and is used to acquire electrical signals on the electrostatic probe. The signal isolation circuit is connected to the output terminal of the signal acquisition circuit and is used to isolate the transmission of the electrical signals to the signal processing module.

2. The electrostatic probe system as described in claim 1, characterized in that, The drive signal conditioning circuit includes a differential amplifier circuit and a high-voltage amplifier circuit; The high-voltage amplifier circuit includes two amplifiers with identical structure and component parameters. The input terminals of the two amplifiers are respectively connected to the two output terminals of the differential amplifier circuit; the output terminals of the two amplifiers are connected to the electrostatic probe.

3. The electrostatic probe system as described in claim 2, characterized in that, Each of the amplifiers includes: an operational amplifier, a voltage amplifier, and a current amplifier, which are cascaded sequentially at the output of the differential amplifier circuit; An RC series circuit is connected between the output terminal of the voltage amplifier circuit and ground to replace the high-frequency negative feedback capacitor in the voltage amplifier circuit.

4. The electrostatic probe system as described in claim 1, characterized in that, The power supply circuit includes: Multiple DC / DC converters with parallel input and series output are connected between an external power supply and an electrostatic probe drive module. Multiple delay circuits, each corresponding to one of the multiple DC / DC converters, have their input terminals connected to the power supply and their output terminals connected to the delay enable terminals of the DC / DC converters, for staggered startup of the multiple DC / DC converters.

5. The electrostatic probe system as described in claim 4, characterized in that, The multiple DC / DC converters are divided into two groups of DC / DC converters, wherein the number of DC / DC converters in the first group is the same as the number of DC / DC converters in the second group, the first group of DC / DC converters outputs a positive voltage, and the second group of DC / DC converters outputs a negative voltage; The first group of DC / DC converters has a different output power than the second group of DC / DC converters.

6. The electrostatic probe system as described in claim 1, characterized in that, The signal acquisition circuit includes a voltage acquisition circuit and a current acquisition circuit, wherein... The voltage acquisition circuit includes a voltage divider circuit and a first operational amplifier. The input terminal of the voltage divider circuit is connected to the voltage acquisition point, the voltage divider output of the voltage divider circuit is connected to the non-inverting input terminal of the first operational amplifier, and the output terminal of the first operational amplifier is connected to the acquisition signal isolation circuit. The current acquisition circuit includes a sampling resistor and a second operational amplifier. The sampling resistor is connected in series in the circuit to be acquired and in parallel with the input terminal of the second operational amplifier. The output terminal of the second operational amplifier is connected to the acquisition signal isolation circuit.

7. The electrostatic probe system as described in claim 1, characterized in that, The drive signal generator includes an MCU, which has a drive signal output terminal and a power control signal output terminal. The drive signal output terminal is connected to the input terminal of the drive signal adjustment circuit, and the power control signal output terminal is connected to the control terminal of the power circuit.

8. A plasma testing system, characterized in that, Includes a host computer, an isolated communication circuit, and multiple electrostatic probe systems as described in claims 1 to 7; The host computer is connected to the drive signal generators in the multiple electrostatic probe systems through the isolation communication circuit, and is used to output control signals to control the drive signal generators to output drive signals.

9. The plasma testing system as described in claim 8, characterized in that, The isolated communication circuit includes isolated communication interfaces that correspond one-to-one with the electrostatic probe system. The isolated communication interface includes a first isolated communication chip, an isolation device, and a second isolated communication chip. The first isolation communication chip is connected to the host computer, and the second isolation communication chip is connected to the drive signal generator. The first isolation communication chip and the second isolation communication chip are connected through the isolation device.

10. The plasma testing system as described in claim 9, characterized in that, The isolation device includes a network port transformer; the first isolation communication chip and the second isolation communication chip include SPI communication interface chips.

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