Three-board multi-channel power amplifier circuit system

Abstract

The utility model belongs to the field of electronic information, and discloses a three-board multi-channel power amplifier circuit system, which comprises a main board, a power amplifier circuit board, a plurality of groups of power amplifier circuits arranged on the main board and the power amplifier circuit board, and an auxiliary board carrying a DSP (Digital Signal Processor) chip. The auxiliary board is fixed on the main board and located on the edge of the main board. The auxiliary board is arranged relative to the power supply and is close to the power amplifier circuit board. According to the system, the position and the structure of a power amplifier circuit board are optimized, an auxiliary board is additionally arranged to carry a DSP chip, the DSP chip is creatively carried on the auxiliary board, the auxiliary board is smoothly arranged by utilizing a narrow space between the power amplifier circuit board and the edge of a main board, and the DSP chip is carried while the arrangement of multiple power amplifier circuits is realized.

Description

Technical Field

[0001] This utility model relates to the field of electronic information, specifically a three-board, multi-channel power amplifier circuit system. Background Technology

[0002] The applicant has previously filed three patent applications:

[0003] CN115276627A discloses a gallium nitride MOSFET conduction loss power limiting circuit, including a signal input terminal, a first MOSFET and a second MOSFET, a first sampling circuit connected to the first MOSFET for real-time sampling of its operating voltage, a second sampling circuit connected to the second MOSFET for real-time sampling of its operating voltage, a feedback processing module connected to both the first and second sampling circuits for processing the sampled signals into a production limit feedback signal according to a set setting, and a driving module for driving the first and second MOSFETs to switch on and off according to the signals. The feedback processing module and the signal input terminal are respectively connected to a control signal processing module for generating control signals that are input to the driving module to control the on and off states of the first and second MOSFETs, thereby forming an automatic power loss limiting structure. This solution can effectively protect the MOSFETs and improve their operational stability and efficiency.

[0004] 2. CN220673924U A power amplifier system;

[0005] 3. CN220359428U A single-board gallium nitride power amplifier circuit board and power amplifier circuit system.

[0006] The above three solutions constitute the applicant's old power amplifier equipment.

[0007] When multiple power amplifier circuits are arranged on a limited motherboard, especially with increased power, the first consequence is a significant increase in power supply size, which can occupy more than 70% of the motherboard area. Compared to the approximately 50% footprint of older designs, it is much more difficult to arrange multiple power amplifier circuits without increasing the motherboard area.

[0008] When customers request the addition of a DSP chip for further processing of digital signals, implementing the above solution becomes even more difficult.

[0009] The technical problem addressed in this case is: how to optimize the existing power amplifier system to enable multiple power amplifier circuits to be arranged on the motherboard simultaneously, and to enable the system to perform digital signal processing with a DSP chip. Utility Model Content

[0010] The purpose of this utility model is to provide a three-board, multi-channel power amplifier circuit system. This system optimizes the position and structure of the power amplifier circuit board and adds an additional sub-board to carry a DSP chip. The DSP chip is creatively mounted on the sub-board. The sub-board is successfully arranged in the narrow space between the power amplifier circuit board and the edge of the main board, realizing the arrangement of the multi-channel power amplifier circuit while simultaneously mounting the DSP chip.

[0011] To achieve the above objectives, this utility model provides the following technical solution: a three-board, multi-channel power amplifier circuit system, including a main board and a power amplifier circuit board, and further including multiple sets of power amplifier circuits arranged on the main board and the power amplifier circuit board, and a sub-board equipped with a DSP chip; one side of the main board is a power supply; the other side of the main board is suspended and fixed to the power amplifier circuit board; the DSP chip is used to process the digital signals transmitted in the power amplifier circuit; the power supply provides power to the power amplifier circuit and the DSP chip;

[0012] The sub-board is fixed on the main board and located at the edge of the main board; the sub-board is arranged relative to the power supply and close to the power amplifier circuit board.

[0013] In the aforementioned three-board, multi-channel power amplifier circuit system, the power supply includes a rectifier module, an active power factor corrector, a DC-DC circuit, and a transformer connected in sequence; the active power factor corrector is multiple and connected in parallel; the main board is also equipped with a low-voltage power supply module; the output terminal of the transformer is electrically connected to the low-voltage power supply module; the low-voltage power supply module supplies power to the DSP chip and the power amplifier circuit.

[0014] In the aforementioned three-board, multi-channel power amplifier circuit system, a first heat sink is suspended on the main board. The first heat sink is located above the active power factor corrector and is used to dissipate heat from the active power factor corrector.

[0015] In the aforementioned three-board, multi-channel power amplifier circuit system, the power supply occupies 50-70% of the motherboard area.

[0016] In the aforementioned three-board, multi-channel power amplifier circuit system, there are two DC-DC circuits and two transformers. One DC-DC circuit and one transformer constitute a transformer circuit, and the two transformer circuits are connected in parallel. The output terminals of the two transformer circuits are connected to a low-voltage power supply, and the input terminals of the two transformer circuits are connected to the output terminals of four parallel active power factor correctors.

[0017] In the above-mentioned three-board, multi-channel power amplifier circuit system, the power amplifier circuit includes an analog signal input terminal, an analog signal amplification circuit, a PWM modulation circuit, a digital signal output terminal, a sampling circuit, a feedback processing module, a first MOSFET, a second MOSFET, a MOSFET driver chip, a signal input terminal, a signal output terminal, an inductor, and an analog signal output terminal.

[0018] The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, DSP chip, digital signal output terminal, signal input terminal, and MOSFET driver chip are electrically connected in sequence.

[0019] In the above-mentioned three-board, multi-channel power amplifier circuit system, the first MOSFET and the second MOSFET are both used to receive and amplify the signal input from the MOSFET driver chip, and send the amplified signal to the signal output terminal. The signal output terminal, the inductor, and the analog signal output terminal are connected in sequence.

[0020] The sampling circuit is used to sample the operating voltage of the first MOSFET and the second MOSFET in real time to obtain the sampling signal. The feedback processing module is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip, which controls the on / off state of the first MOSFET and the second MOSFET.

[0021] In the above-mentioned three-board, multi-channel power amplifier circuit system, the power amplifier circuit consists of 2 to 4 groups; the power amplifier circuit board is located directly above the PWM modulation circuit and the feedback processing module.

[0022] In the aforementioned three-board, multi-channel power amplifier circuit system, a heat dissipation device is arranged on the upper surface of the power amplifier circuit board, and the first MOSFET and the second MOSFET are arranged on the lower surface of the power amplifier circuit board; the heat dissipation device is used to absorb, store, and dissipate the heat generated by the first MOSFET and the second MOSFET.

[0023] In the aforementioned three-board, multi-channel power amplifier circuit system, the sampling circuit and MOSFET driver chip are arranged on the lower surface of the power amplifier circuit board. There is one heat dissipation device, which covers the area where the first MOSFET and the second MOSFET are located. The heat dissipation device is a finned heat sink.

[0024] Compared with the prior art, the beneficial effects of this utility model are:

[0025] This invention optimizes the position and structure of the power amplifier circuit board by adding an additional sub-board to house the DSP chip. By creatively mounting the DSP chip on the sub-board, the sub-board is successfully arranged using the narrow space between the power amplifier circuit board and the main board edge, thus realizing the arrangement of multi-channel power amplifier circuits while simultaneously mounting the DSP chip. Attached Figure Description

[0026] Figure 1 This is a top view of the motherboard in Embodiment 1;

[0027] Figure 2 This is a bottom view of the power amplifier circuit board of Embodiment 1;

[0028] Figure 3 This is a schematic diagram of the power amplifier circuit board and the main board in Embodiment 1.

[0029] Figure 4 This is the circuit diagram of the power supply. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Example 1

[0032] refer to Figure 1-3 A three-board, multi-channel power amplifier circuit system includes a main board 1 and a power amplifier circuit board 2, and further includes four sets of power amplifier circuits arranged on the main board 1 and the power amplifier circuit board 2, and a sub-board 19 equipped with a DSP chip 20; one side of the main board 1 is a power supply 3; the other side of the main board 1 is suspended and fixed to the power amplifier circuit board 2; the DSP chip 20 is used to process the digital signals transmitted in the power amplifier circuit; the power supply 3 supplies power to the power amplifier circuit and the DSP chip 20.

[0033] The sub-board 19 is fixed on the main board 1 and located at the edge of the main board 1; the sub-board 19 is arranged relative to the power supply 3 and close to the power amplifier circuit board 2.

[0034] The system operates as follows: an analog signal is input from the power amplifier circuit, converted into a digital signal, processed by the DSP chip, and then sent back to the power amplifier circuit for further processing and conversion back into an analog output. This embodiment optimizes the position and structure of the power amplifier circuit board by adding an additional sub-board to house the DSP chip. This innovative approach utilizes the limited space between the power amplifier circuit board and the main board to successfully accommodate the sub-board, achieving both multi-channel power amplifier circuitry and the integration of the DSP chip.

[0035] Preferably, the power amplifier circuit includes an analog signal input terminal 4, an analog signal amplification circuit 5, a PWM modulation circuit 6, a digital signal output terminal 7, a sampling circuit 8, a feedback processing module 9, a first MOSFET 10, a second MOSFET 11, a MOSFET driver chip 12, a signal input terminal 13, a signal output terminal 14, an inductor 15, and an analog signal output terminal 16.

[0036] The analog signal input terminal 4, analog signal amplification circuit 5, PWM modulation circuit 6, digital signal output terminal 7, feedback processing module 9, analog signal output terminal 16, and inductor 15 are mounted on the motherboard 1.

[0037] The sampling circuit 8, the first MOSFET 10, the second MOSFET 11, the MOSFET driver chip 12, the signal input terminal 13, and the signal output terminal 14 are disposed on the power amplifier circuit board 2; the power amplifier circuit board 2 is located directly above the PWM modulation circuit 6 and the feedback processing module 9; the above lists 4 sets of power amplifier circuits, which is the most difficult implementation case, and 2 sets and 3 sets of power amplifier circuits can be implemented according to this mode;

[0038] In practical applications, it may be possible to arrange 5 or more power amplifier circuits according to the design of this embodiment, but further optimization is required, which is often accompanied by miniaturization of electronic components.

[0039] Preferably, the analog signal input terminal 4, the analog signal amplification circuit 5, the PWM modulation circuit 6, the DSP chip 20, the digital signal output terminal 7, the signal input terminal 13, and the MOSFET driver chip 12 are electrically connected in sequence.

[0040] The first MOSFET 10 and the second MOSFET 11 are both used to receive and amplify the signal input from the MOSFET driver chip 12, and send the amplified signal to the signal output terminal 14. The signal output terminal 14, the inductor 15 and the analog signal output terminal 16 are connected in sequence.

[0041] The sampling circuit 8 is used to sample the working voltage of the first MOSFET 10 and the second MOSFET 11 in real time to obtain the sampling signal. The feedback processing module 9 is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip 12, and the MOSFET driver chip 12 controls the on / off state of the first MOSFET 10 and the second MOSFET 11.

[0042] The working principle of the power amplifier circuit can be found in CN220673924U, a power amplifier system, and CN220359428U, a single-board gallium nitride power amplifier circuit board 2, which are power amplifier circuit systems, and there are no changes to them.

[0043] The following is a brief description of the power amplifier circuit's operation, based on the components mentioned above:

[0044] Analog signal input terminal 4 inputs an analog signal to analog signal amplification circuit 5. Analog signal amplification circuit 5 amplifies the analog signal. The amplified analog signal is then processed by PWM modulation circuit 6 for pulse width modulation and analog-to-digital conversion to obtain a digital signal. This digital signal is then sent to DSP chip 20 for processing. The functions of DSP chip 20 include, but are not limited to, filtering, enhancement, noise reduction, reverberation, and pitch shifting of digital signals. The digital signal processed by DSP chip 20 is sent to digital signal output terminal 7. Digital signal output terminal 7 is connected to signal input terminal 13 via a pin header. The digital signal is then sent to MOSFET driver chip 12. MOSFET driver chip 12 sends the digital signal to the first MOSFET 10 and the second MOSFET 11. The SFET 11 amplifies the signal. The sampling circuit 8 samples the operating voltage of the first MOSFET 10 and the second MOSFET 11 in real time to obtain the sampling signal. The feedback processing module 9 processes the sampling signal according to the settings to obtain the production limit feedback signal. The feedback signal is sent to the MOSFET driver chip 12, which controls the on / off state of the first MOSFET 10 and the second MOSFET 11. The first MOSFET 10 and the second MOSFET 11 amplify the digital signal and output it to the inductor 15 through the signal output terminal 14. The inductor 15 converts the signal output from the signal output terminal 14 into an analog signal. The analog signal output terminal 16 outputs the analog signal.

[0045] CN115276627A discloses the control process between the sampling circuit 8, the feedback processing module 9, and the driving module (i.e., the MOSFET driving chip 12 of this application), which will not be described in detail here.

[0046] The functions and working principles of the DSP chip 20 are also conventional technologies in this field, and are not the focus of protection in this embodiment.

[0047] The core innovation of this embodiment is not directly related to the working process and processing mode of the power amplifier circuit described above. The main innovation of this embodiment is focused on the mounting method of the DSP chip, the position of the power amplifier circuit board 2, the shape of the power amplifier circuit board 2, the arrangement of the power amplifier circuit on the motherboard 1 and the power amplifier circuit board 2, and the design of the position of the sampling circuit 8.

[0048] More preferably, in the case of four power amplifier circuits, the power amplifier circuit board 2 is rectangular; the short side of the power amplifier circuit board 2 is adjacent to the analog signal input terminal 4; the four power amplifier circuits are arranged sequentially on the main board 1 and the power amplifier circuit board 2 along the direction of the long side of the power amplifier circuit board 2.

[0049] By arranging the sub-board 19 along the long side of the power amplifier circuit board 2, the limited space of the power amplifier is utilized to the fullest extent.

[0050] In this embodiment, the sampling circuit 8, originally designed on the motherboard 1, is moved to the power amplifier circuit board 2 for two purposes: 1. to provide the space required for the increased size of the electronic components related to the power amplifier circuit on the motherboard 1; 2. to provide the space required for the increased size of the power supply 3.

[0051] To accommodate four power amplifier circuits within a limited space, the power amplifier circuit board 2 was changed from a near-square structure to a rectangular structure, achieving an aspect ratio of 239:122. Generally, an aspect ratio between 1.8 and 2.2 is recommended. This aspect ratio of the power amplifier circuit board 2 allows for...

[0052] While utilizing the spare area of ​​sampling circuit 8, space can be reserved for electronic components with larger dimensions on motherboard 1. Figure 1 In the diagram, box A marks the mounting location of the power amplifier circuit board 2, which is suspended and fixed above the main board 1 by a fixing post.

[0053] In this embodiment, the power amplifier circuit board 2 is moved above the PWM modulation circuit 6 and feedback processing module 9 of the motherboard 1. This increases the area of ​​the power amplifier circuit board 2, allowing for the installation of a larger heat dissipation device 18. This faster heat dissipation method avoids the impact of residual heat on the electronic components on the motherboard 1. At the same time, moving the power amplifier circuit board 2 allows for more space for other electronic components on the motherboard 1, such as the power supply 3.

[0054] Preferably, this embodiment also includes a low-voltage power supply 17 located on the motherboard 1, the low-voltage power supply 17 being electrically connected to the power supply 3; the power supply 3 is used to convert mains power into low-voltage power, and the low-voltage power supply 17 is used to supply power to the power amplifier circuit;

[0055] Preferably, a heat dissipation device 18 is arranged on the upper surface of the power amplifier circuit board 2, and the first MOSFET 10 and the second MOSFET 11 are arranged on the lower surface of the power amplifier circuit board 2; the heat dissipation device 18 is used to absorb, store and dissipate the heat generated by the first MOSFET 10 and the second MOSFET 11.

[0056] In some implementation cases, the heat dissipation device 18 may be a first heat dissipation device 18 and a second heat dissipation device 18 in a power amplifier system (CN220673924U).

[0057] In practical applications, we found that designing the heat dissipation device 18 as a single finned heatsink is more effective because the change in the position of the power amplifier circuit board 2 necessitates faster heat dissipation. An integrated finned heatsink not only facilitates installation but also allows for the mounting of more fins for even faster heat dissipation. Furthermore, the change in the position of the power amplifier circuit board 2 results in a larger area; combined with the integrated finned heatsink, its heat dissipation performance is superior, reducing the impact on the electronic components below the power amplifier circuit board 2.

[0058] The thermal connection method of heat dissipation device 18 and first MOSFET 10 and second MOSFET 11 refers to CN220673924U A power amplifier system and CN220359428U A single-board gallium nitride power amplifier circuit board 2, power amplifier circuit system.

[0059] Preferably, the sampling circuit 8 and the MOSFET driver chip 12 are arranged on the lower surface of the power amplifier circuit board 2. The heat dissipation device 18 is a single device that covers the area where the first MOSFET 10 and the second MOSFET 11 are located. The heat dissipation device 18 is a finned heat sink.

[0060] In some preferred embodiments of this invention, the power supply 3 includes a rectifier module 31, an active power factor corrector 32, a DC-DC circuit 33, and a transformer 34 connected in sequence; there are four active power factor correctors 32 connected in parallel.

[0061] In the original design, two or more power amplifier circuits already made the area of ​​power supply 3 quite large. In this embodiment, when four power amplifier circuits are added, without increasing the area of ​​the motherboard 1 (the casing, etc., have already been molded, and customers are not very accepting of power amplifiers that are too large), it means that the area of ​​power supply 3 needs to be further increased to reduce the area occupied by the power amplifier circuits. Reducing the area occupied by the power amplifier circuits is another inventive point of this embodiment; appropriately increasing the area of ​​power supply 3 while ensuring a stable current supply is a key issue that needs to be considered in this embodiment.

[0062] In power supply section 3, the mains power enters the rectifier module 31 for rectification, and then enters from the input terminals of four sets of parallel active power factor correctors 32. After processing by the active power factor correctors 32, the input power factor is improved, and the switching devices are controlled to make the input current waveform follow the input voltage waveform. Then, the voltage is adjusted from ()V to ()V by the DC-DC circuit 33; and then transformed by the transformer 34 before being used by the power amplifier circuit. Through the above optimization, the area of ​​power supply 3 can be increased without significantly increasing the load on power supply 3, while ensuring a relatively stable power supply quality.

[0063] Preferably, a first heat sink is suspended on the motherboard 1, and the first heat sink is located above the active power factor corrector 32 and is used to dissipate heat from the active power factor corrector 32. The first heat sink is generally preferably a finned heat sink or a tube heat sink, etc.

[0064] Preferably, the motherboard 1 is further provided with a low-voltage power supply 3, and the output terminal of the transformer 34 is connected to the low-voltage power supply 3; the low-voltage power supply 3 is used to supply power to the power amplifier circuit. The low-voltage power supply 3 is located near the power amplifier circuit.

[0065] Preferably, the power supply 3 occupies 150-70% of the area of ​​the motherboard; in this embodiment, it occupies approximately 50-60% of the area.

[0066] Preferably, there are two DC-DC circuits 33 and two transformers 34. One DC-DC circuit 33 and one transformer 34 constitute a transformer circuit, and the two transformer circuits are connected in parallel. The output terminals of the two transformer circuits are connected to the low-voltage power supply 3, and the input terminals of the two transformer circuits are connected to the output terminals of four parallel active power factor correctors 32.

[0067] In a conventional design, if there are four active power factor correctors 32, each active power factor corrector 32 is connected to an independent DC-DC circuit 33 and transformer 34. In this embodiment, it is preferable to reduce the DC-DC circuit 33 and transformer 34 to two and connect them in parallel. This can meet the transformation operation of the output current of the four active power factor correctors 32 connected in parallel, and at the same time reduce the area occupied by these components.

Claims

1. A three-board, multi-channel power amplifier circuit system, comprising a main board and a power amplifier circuit board, characterized in that, It also includes multiple power amplifier circuits arranged on the motherboard and power amplifier circuit board, and a sub-board equipped with a DSP chip; one side of the motherboard is a power supply; the other side of the motherboard is suspended and fixed to the power amplifier circuit board; the DSP chip is used to process the digital signals transmitted in the power amplifier circuit; the power supply provides power to the power amplifier circuit and the DSP chip. The sub-board is fixed on the main board and located at the edge of the main board; the sub-board is arranged relative to the power supply and close to the power amplifier circuit board.

2. The three-board, multi-channel power amplifier circuit system according to claim 1, characterized in that, The power supply includes a rectifier module, an active power factor corrector, a DC-DC circuit, and a transformer connected in sequence; there are multiple active power factor correctors connected in parallel; the main board also has a low-voltage power supply module; the output terminal of the transformer is electrically connected to the low-voltage power supply module; the low-voltage power supply module supplies power to the DSP chip and the power amplifier circuit.

3. The three-board, multi-channel power amplifier circuit system according to claim 1, characterized in that, A first heat sink is suspended on the motherboard. The first heat sink is located above the active power factor corrector and is used to dissipate heat from the active power factor corrector.

4. The three-board, multi-channel power amplifier circuit system according to claim 1, characterized in that, The power supply occupies 50-70% of the motherboard area.

5. The three-board, multi-channel power amplifier circuit system according to claim 2, characterized in that, The DC-DC circuit and the transformer are two in total. One DC-DC circuit and one transformer constitute a transformer circuit. The two transformer circuits are connected in parallel. The output terminals of the two transformer circuits are connected to the low-voltage power supply, and the input terminals of the two transformer circuits are connected to the output terminals of four parallel active power factor correctors.

6. The three-board, multi-channel power amplifier circuit system according to claim 1, characterized in that, The power amplifier circuit includes an analog signal input terminal, an analog signal amplification circuit, a PWM modulation circuit, a digital signal output terminal, a sampling circuit, a feedback processing module, a first MOSFET, a second MOSFET, a MOSFET driver chip, a signal input terminal, a signal output terminal, an inductor, and an analog signal output terminal. The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, DSP chip, digital signal output terminal, signal input terminal, and MOSFET driver chip are electrically connected in sequence.

7. The three-board, multi-channel power amplifier circuit system according to claim 6, characterized in that, Both the first MOSFET and the second MOSFET are used to receive and amplify the signals input from the MOSFET driver chip, and send the amplified signals to the signal output terminal. The signal output terminal, the inductor, and the analog signal output terminal are connected in sequence. The sampling circuit is used to sample the operating voltage of the first MOSFET and the second MOSFET in real time to obtain the sampling signal. The feedback processing module is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip, which controls the on / off state of the first MOSFET and the second MOSFET.

8. The three-board, multi-channel power amplifier circuit system according to claim 1, characterized in that, The power amplifier circuit consists of 2 to 4 groups; the power amplifier circuit board is located directly above the PWM modulation circuit and the feedback processing module.

9. The three-board, multi-channel power amplifier circuit system according to claim 6, characterized in that, The upper surface of the power amplifier circuit board is provided with a heat dissipation device, and the first MOSFET and the second MOSFET are arranged on the lower surface of the power amplifier circuit board; the heat dissipation device is used to absorb, store and dissipate the heat generated by the first MOSFET and the second MOSFET.

10. The three-board, multi-channel power amplifier circuit system according to claim 9, characterized in that, The sampling circuit and MOSFET driver chip are arranged on the lower surface of the power amplifier circuit board. There is one heat dissipation device, which covers the area where the first MOSFET and the second MOSFET are located. The heat dissipation device is a finned heat sink.

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