Die for processing circuit board

Abstract

The utility model belongs to the technical field of circuit board processing, and particularly relates to a circuit board processing die which comprises a die frame, a vertically downward hydraulic cylinder is fixedly installed at the bottom of the upper portion of the die frame, the output end of the hydraulic cylinder is fixedly connected with an upper die fixing seat, the upper die fixing seat is fixedly connected with an upper male die through a bolt, and the lower die fixing seat is fixedly connected with a lower male die through a bolt. A lower die base is further fixed to the die frame through bolts, a large sleeve is fixedly connected to the upper die fixing base, the large sleeve is slidably connected with a sleeve rod, and an electric push rod is further fixedly connected to one side of the die frame. According to the utility model, accurate forming and pressing of the circuit board can be realized, the processing quality is ensured, waste materials or finished products generated in the processing process can be conveniently collected through the arrangement of the sliding plate and the collecting box, the working efficiency is improved, and the working environment is kept clean and tidy; the lifting plate is connected with the die frame through the spring, discharging operation is facilitated, meanwhile, the production efficiency can be improved, and manual operation can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a mold for circuit board processing. Background Technology

[0002] Circuit board cutting is an important step in the electronics manufacturing process. It can be accomplished through various methods, such as mechanical cutting, laser cutting, and chemical etching.

[0003] Mechanical cutting is a common method for cutting circuit boards; it typically uses equipment such as milling machines, drilling machines, or cutting machines to cut circuit boards into the required shapes and sizes using mechanical force; this method is suitable for thicker circuit boards and mass production.

[0004] Die cutting is also a method of circuit board cutting; it uses pre-made molds to stamp or shear the circuit board to obtain a precise shape. This method is suitable for mass production and can provide high cutting accuracy and consistency. Current die-cutting processes suffer from issues related to mold replacement and high-precision mass production. Therefore, we propose a die for circuit board processing to address these problems. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this utility model provides a mold for circuit board processing, which solves the problems mentioned in the background section.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0009] A circuit board processing mold includes a mold frame. A vertically downward hydraulic cylinder is fixedly installed at the bottom of the mold frame. An upper mold fixing seat is fixedly connected to the output end of the hydraulic cylinder. An upper punch is fastened to the upper mold fixing seat by bolts. A lower mold base is also fixed to the mold frame by bolts. A large sleeve is fixedly connected to the upper mold fixing seat. A sleeve rod is slidably connected to the large sleeve. An electric push rod is fixedly connected to one side of the mold frame. A bracket is fixedly connected to the output end of the electric push rod. A push plate is connected to the front end of the bracket. An inclined sliding plate is provided on the other side of the mold frame. A collection box is connected to the lower opening of the sliding plate. A notch is provided at one point on both the lower mold base and the mold frame. A lifting plate is rotatably connected to the mold frame within the notch. The lifting plate is connected to the mold frame by a spring below.

[0010] Furthermore, the sleeve rod is fixedly connected to the mold frame, and one sleeve rod is provided on each side.

[0011] Furthermore, a cavity is formed between the mold frames, and the support and push plate move inside the cavity.

[0012] Furthermore, the push plate is shaped like a right triangle, with the right-angled sides of the triangle fitting inside the cavity.

[0013] Furthermore, the original state of the spring makes the lifting plate flush with the inner cavity of the lower mold base.

[0014] Furthermore, both ends of the spring are connected to the lifting plate and the mold frame via spring hooks.

[0015] (III) Beneficial Effects

[0016] Compared with the prior art, the present invention provides a mold for circuit board processing, which has the following advantages:

[0017] This invention enables precise forming and pressing of circuit boards, ensuring processing quality. The slide plate and collection box facilitate the collection of waste or finished products generated during processing, improving work efficiency and maintaining a clean working environment. The lifting plate is connected to the mold frame by a spring, which helps with the unloading operation, while also improving production efficiency and reducing manual operation. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a side view of the structure of this utility model;

[0020] Figure 3 This is a front view of the structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the bracket and push plate connection structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the notch structure of this utility model.

[0023] In the diagram: 1. Mold frame; 2. Hydraulic cylinder; 3. Upper mold fixing seat; 4. Upper punch; 5. Lower mold base; 6. Large sleeve; 7. Sleeve rod; 8. Electric push rod; 9. Bracket; 10. Push plate; 11. Slide plate; 12. Collection box; 13. Notch; 14. Lifting plate; 15. Spring. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example

[0026] like Figure 1-5 As shown in the figure, an embodiment of this utility model discloses a circuit board processing mold, including a mold frame 1. The mold frame 1 is the basic structure of the entire mold, providing support and fixing positions for other components. A vertically downward hydraulic cylinder 2 is fixedly installed at the bottom of the upper part of the mold frame 1. The output end of the hydraulic cylinder 2 is fixedly connected to an upper mold fixing seat 3. The hydraulic cylinder 2 can provide driving force to move the upper mold fixing seat 3 up and down. The upper mold fixing seat 3 is fastened to an upper punch 4 by bolts, which facilitates installation and replacement. The upper punch 4 is a key component for pressing circuit boards. A lower mold seat 5 is also fixed to the mold frame 1 by bolts. The lower mold seat 5 cooperates with the upper punch 4 to complete the circuit board processing process. A large sleeve 6 is fixedly connected to the upper mold fixing seat 3. The large sleeve 6 is slidably connected to a sleeve rod 7. The large sleeve 6 is fixedly connected to the upper mold fixing seat 3. It can also be slidably connected to the sleeve rod 7, which allows the large sleeve 6 to move within a certain range; an electric push rod 8 is also fixedly connected to one side of the mold frame 1, and a bracket 9 is fixedly connected to the output end of the electric push rod 8. A push plate 10 is connected to the front end of the bracket 9. An inclined slide plate 11 is provided on the other side of the mold frame 1. A collection box 12 is connected to the lower opening of the slide plate 11. The electric push rod 8 is fixedly connected to one side of the mold frame 1, and its output end is connected to the bracket 9. The push plate 10 on the bracket 9 may be used to push waste. The slide plate 11 is inclined, and its lower opening is connected to the collection box 12 for collecting waste generated during processing; a notch 13 is provided at one point on both the lower mold base 5 and the mold frame 1. A lifting plate 14 is rotatably connected to the mold frame 1 inside the notch 13. The lower part of the lifting plate 14 is connected to the mold frame 1 through a spring 15. By moving the lifting plate 14, the circuit board inside the lower mold base 5 can be lifted to facilitate unloading.

[0027] like Figure 1 As shown, in some embodiments, the sleeve rod 7 is fixedly connected to the mold frame 1, and there is one sleeve rod 7 on each side to maintain the stability of the push-press.

[0028] like Figure 4As shown, in some embodiments, a cavity is formed between the mold frame 1 and the mold frame 1, while the support 9 and the push plate 10 move inside the cavity; the movement of the support 9 and the push plate 10 inside the cavity can push out the waste inside the cavity.

[0029] like Figure 4 As shown, in some embodiments, the push plate 10 is shaped like a right triangle, with the right-angled sides of the triangle fitting inside the cavity; this facilitates the pushing of objects.

[0030] like Figure 5 As shown, in some embodiments, the original state of the spring 15 makes the lifting plate 14 flush with the inner cavity of the lower mold base 5; reaching a balanced and stable state, the lifting plate 14 is held in a specific position, and when the lifting plate 14 is rotated, the circuit board inside the lower mold base 5 can be lifted.

[0031] like Figure 5 As shown, in some embodiments, both ends of the spring 15 are connected to the lifting plate 14 and the mold frame 1 by spring hooks; wherein the spring hooks are fixed to the lifting plate 14 and the mold frame 1; the function of the spring hooks connecting the spring 15 is to enable subsequent installation and disassembly.

[0032] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A mold for processing circuit boards, comprising a mold frame (1), characterized in that: A vertically downward hydraulic cylinder (2) is fixedly installed at the bottom of the mold frame (1). The output end of the hydraulic cylinder (2) is fixedly connected to an upper mold fixing seat (3). The upper mold fixing seat (3) is fastened to an upper punch (4) by bolts. A lower mold seat (5) is also fixed to the mold frame (1) by bolts. A large sleeve (6) is fixedly connected to the upper mold fixing seat (3). The large sleeve (6) is slidably connected to a sleeve rod (7). An electric push rod (8) is also fixedly connected to one side of the mold frame (1). The output end of the push rod (8) is fixedly connected to a bracket (9). A push plate (10) is connected to the front end of the bracket (9). An inclined slide plate (11) is provided on the other side of the mold frame (1). A collection box (12) is connected to the lower opening of the slide plate (11). A notch (13) is provided at one point on both the lower mold base (5) and the mold frame (1). A lifting plate (14) is rotatably connected to the mold frame (1) inside the notch (13). The lifting plate (14) is connected to the mold frame (1) below by a spring (15).

2. The circuit board processing mold according to claim 1, characterized in that: The sleeve (7) is fixedly connected to the mold frame (1), and there is one sleeve (7) on each side.

3. The circuit board processing mold according to claim 1, characterized in that: A cavity is formed between the mold frame (1) and the mold frame (1), while the support (9) and the push plate (10) move inside the cavity.

4. The circuit board processing mold according to claim 3, characterized in that: The push plate (10) is shaped like a right triangle, with the right-angled side of the triangle fitting inside the cavity.

5. A mold for circuit board processing according to claim 1, characterized in that: The original state of the spring (15) makes the lifting plate (14) and the inner cavity of the lower mold base (5) level.

6. A mold for circuit board processing according to claim 5, characterized in that: Both ends of the spring (15) are connected to the lifting plate (14) and the mold frame (1) via spring hooks.

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