Heat dissipation mechanism used after reflow soldering of PCBA circuit board

Abstract

The utility model relates to a heat dissipation mechanism used after reflow soldering of a PCBA circuit board, which comprises a heat dissipation box with a material opening formed in one side wall, a sealing door used for sealing the material opening is hinged to the heat dissipation box, an exhaust hole is further formed in the bottom wall of the heat dissipation box, and the heat dissipation box is hinged to the sealing door. A cooling cylinder of an annular structure is fixedly connected to the top wall of an inner cavity of the sealing door, a water storage bin is arranged in the side wall of the cooling cylinder, circulating water is injected into the water storage bin through a circulating water pipe during use, a first motor is started to drive fan blades to rotate to suck air into the cooling cylinder, and the air exchanges heat with cold water in the water storage bin through fins after entering the cooling cylinder; after the temperature is reduced, the circuit board is discharged into the heat dissipation box along the bottom end of the cooling cylinder, at the moment, a user can clamp the circuit board on the overturning frame through cooperation of a clamping plate and a spring, and finally a second motor is started to drive the overturning frame to rotate, so that cold airflow can blow all positions of the circuit board, rapid heat dissipation of the circuit board is achieved, and the processing efficiency of the circuit board is greatly improved.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology of circuit boards, specifically relating to a heat dissipation mechanism used after reflow soldering of PCBA circuit boards. Background Technology

[0002] Reflow soldering is a surface mount technology primarily used to mount electronic components onto printed circuit boards. Its working principle involves melting solder into a fluid state and applying it to the surface pads using pneumatic or gravitational force, connecting it to the component leads. Through a pre-programmed control system, reflow soldering melts the solder (usually a lead-tin alloy, silver, etc.) under appropriate gas pressure and transports it to the component contact points, applying suitable heat until it solidifies, thus establishing a strong connection.

[0003] After reflow soldering, the PCBA circuit board has a high temperature and needs to be cooled before subsequent processing. The current method is to dissipate heat from the PCBA circuit board by letting it cool naturally after soldering. Natural cooling takes a long time and will greatly affect the processing progress of the circuit board. Utility Model Content

[0004] The purpose of this utility model is to provide a heat dissipation mechanism for PCBA circuit boards after reflow soldering, which is simple in structure and reasonably designed, in order to solve the above problems.

[0005] This utility model achieves the above objectives through the following technical solutions:

[0006] A heat dissipation mechanism for PCBA circuit boards after reflow soldering includes a heat dissipation box with a material inlet on one side wall, a sealing door hinged to the heat dissipation box for sealing the material inlet, an exhaust hole on the bottom wall of the heat dissipation box, a ring-shaped cooling cylinder fixedly connected to the top wall of the inner cavity of the sealing door, a water storage tank provided in the side wall of the cooling cylinder, a circulating water pipe fixedly connected to the outer wall of the heat dissipation box with one end communicating with the water storage tank, a plurality of ring-shaped fins fixedly connected to the inner wall of the top of the cooling cylinder, a first motor installed in the inner cavity of the cooling cylinder below the fins, and fan blades fixedly connected to the output end of the first motor.

[0007] A flipping frame is rotatably connected inside the heat dissipation box below the cooling cylinder. A second motor for driving the flipping frame to rotate is installed on one outer wall of the heat dissipation box. Two symmetrically arranged clamping plates are slidably connected in the inner cavity of the flipping frame. Each of the two clamping plates has a clamping groove on an adjacent side. An elastic support is installed between the side of the two clamping plates that is far apart and the inner wall of the flipping frame.

[0008] As a further optimization of this utility model, the circulating water pipe is divided into an inlet pipe and a drain pipe, which are respectively installed on both sides of the cooling cylinder, and the inner diameter of the inlet pipe is larger than the inner diameter of the drain pipe.

[0009] As a further optimization of this utility model, the fins are U-shaped, and a gap for air circulation is formed between the inner walls on both sides of the fins. Both ends of the fins penetrate the inner wall of the cooling cylinder and extend into the water storage tank.

[0010] As a further optimization of this utility model, a channel for air circulation is provided between the periphery of the first motor and the inner wall of the cooling cylinder. Multiple connecting rods with one end fixedly connected to the first motor are distributed in a ring on the outer wall of the first motor, and the other end of the connecting rods is fixed to the inner wall of the cooling cylinder.

[0011] As a further optimization of this utility model, a filter cover is installed on the top of the heat dissipation box and placed on the top of the cooling cylinder.

[0012] As a further optimization of this utility model, the elastic support includes a slide tube fixedly connected to the inner walls of the left and right ends of the flipping frame. A slide rod is slidably connected to the end of the slide tube away from the flipping frame. The end of the slide rod located outside the slide tube is fixed to the clamping plate. A spring is fixedly connected to the end of the slide rod located in the inner cavity of the slide tube.

[0013] The beneficial effects of this utility model are as follows: When in use, circulating water is injected into the water storage tank through the circulating water pipe, and the first motor is started to drive the fan blades to rotate and draw air into the cooling cylinder. After the air enters the cooling cylinder, it exchanges heat with the cold water in the water storage tank through the fins, and after the temperature is reduced, it is discharged into the heat dissipation box along the bottom of the cooling cylinder. At this time, the user can clamp the circuit board on the flipping frame with the clamping plate and spring. Finally, the second motor is started to drive the flipping frame to rotate, so that the cold air can blow on all parts of the circuit board, realize the rapid heat dissipation of the circuit board, and greatly improve the processing efficiency of the circuit board. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the overall cross-sectional structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the fin installation structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the installation structure of the flipping frame of this utility model;

[0018] Figure 5This is a cross-sectional structural diagram of the elastic support component of this utility model.

[0019] In the diagram: 1. Heat dissipation box; 2. Material inlet; 3. Sealing door; 4. Cooling cylinder; 5. Water storage tank; 6. Circulating water pipe; 7. Fins; 8. First motor; 9. Fan blade; 10. Filter cover; 11. Tilting frame; 12. Second motor; 13. Clamping plate; 14. Clamping groove; 15. Slide tube; 16. Slide rod; 17. Spring. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0021] Example

[0022] like Figure 1 - Figure 5 As shown, a heat dissipation mechanism for PCBA circuit boards after reflow soldering includes a heat dissipation box 1 with a material inlet 2 on one side wall. A sealing door 3 is hinged on the heat dissipation box 1 to seal the material inlet 2. When the circuit board is placed into the heat dissipation box 1 through the material inlet 2, the sealing door 3 can be rotated to seal the material inlet 2, so as to prevent cold air from leaking out of the material inlet 2 of the heat dissipation box 1 and affecting the heat dissipation efficiency of the circuit board. An exhaust hole is also provided on the bottom wall of the heat dissipation box 1 to balance the air pressure inside the heat dissipation box 1.

[0023] A ring-shaped cooling cylinder 4 is fixedly connected to the top wall of the inner cavity of the sealed door 3. A water storage tank 5 is provided inside the side wall of the cooling cylinder 4. A circulating water pipe 6 is fixedly connected to the outer wall of the heat dissipation box 1, with one end connected to the inside of the water storage tank 5. The circulating water pipe 6 is divided into an inlet pipe and a drain pipe. The inlet pipe and the drain pipe are installed on both sides of the cooling cylinder 4, and the inner diameter of the inlet pipe is larger than the inner diameter of the drain pipe. When in use, cold water is delivered to the water storage tank 5 through the inlet pipe, and the cold water is discharged through the drain pipe to form circulating water. The inner diameter of the inlet pipe is larger than the inner diameter of the drain pipe, which can ensure that the water storage tank 5 is always full of cooling water.

[0024] Multiple annularly distributed fins 7 are fixedly connected to the inner wall of the top of the cooling cylinder 4. The fins 7 have a U-shaped structure, and a gap for air circulation is formed between the inner walls on both sides of the fins 7. Both ends of the fins 7 penetrate the inner wall of the cooling cylinder 4 and extend into the water storage tank 5. The fins 7 are set to increase the contact surface between the inner wall of the cooling cylinder 4 and the air. When the air comes into contact with the fins 7, it can exchange heat with the cold water in the water storage tank 5 through the fins 7 to reduce the air temperature and improve the heat dissipation efficiency.

[0025] A first motor 8 is installed in the inner cavity of the cooling cylinder 4 below the fin 7. A channel for air circulation is left between the periphery of the first motor 8 and the inner wall of the cooling cylinder 4. Multiple connecting rods with one end fixedly connected to the first motor 8 are distributed in a ring on the outer wall of the first motor 8. The other end of the connecting rod is fixed to the inner wall of the cooling cylinder 4, so that the first motor 8 is fixedly installed in the cooling cylinder 4.

[0026] A fan blade 9 is fixedly connected to the output end of the first motor 8. When the first motor 8 is started, the first motor 8 can drive the fan blade 9 to rotate at high speed, drawing air from the external environment into the cooling cylinder 4. After the air enters the cooling cylinder 4, it exchanges heat with the cold water in the water storage tank 5 through the fins 7 and the temperature is reduced. Then, it is transported to the heat dissipation box 1 along the cooling cylinder 4 by the fan blade 9 to dissipate heat from the circuit board in the heat dissipation box 1.

[0027] A filter cover 10 is installed on the top of the heat sink 1 and is placed on the top of the cooling cylinder 4. It is used to filter the air entering the cooling cylinder 4 and remove fine dust and impurities from the air.

[0028] A flip frame 11 is rotatably connected inside the heat sink 1 below the cooling cylinder 4. A second motor 12 for driving the flip frame 11 to rotate is installed on one outer wall of the heat sink 1. Two symmetrically arranged clamping plates 13 are slidably connected inside the flip frame 11. Each of the two clamping plates 13 has a clamping groove 14 on its adjacent side for clamping and fixing the side wall of the circuit board. An elastic support is installed between the side of the two clamping plates 13 that is far apart from the inner side wall of the flip frame 11. The elastic support includes a component fixedly connected to the left side of the flip frame 11. The slide tubes 15 on the inner walls of both ends of the right side have a slide rod 16 slidably connected to the end of the slide tube 15 away from the flip frame 11. The end of the slide rod 16 located outside the slide tube 15 is fixed to the clamping plate 13. The end of the slide rod 16 located inside the cavity of the slide tube 15 is fixedly connected to a spring 17. When the spring 17 is in the extended state, the distance between the two clamping plates 13 is less than the width of the circuit board, so that the user can squeeze the two clamping plates 13 from both sides through the spring 17 and clamp the circuit board through the clamping grooves 14 provided on the adjacent sides of the two clamping plates 13.

[0029] It should be noted that this heat dissipation mechanism for PCBA circuit boards after reflow soldering works by injecting circulating cold water into the cooling cylinder 4 through the circulating water pipe 6. Then, the first motor 8 is started, which drives the fan blades 9 to rotate at high speed, drawing in air from the external environment that has been filtered by the filter cover 10 into the cooling cylinder 4. After entering the cooling cylinder 4, the air exchanges heat with the cooling water in the water storage tank 5 through the fins 7 to reduce the air temperature. Then, the air is transported to the heat dissipation box 1 through the bottom of the cooling cylinder 4. At this time, the user can open the sealing door 3 and put the reflow soldered circuit board into the heat dissipation box 1 through the material inlet 2. At the same time, the two clamps slide in opposite directions on both sides. Holding plate 13 pushes slide rod 16 into slide tube 15, thereby compressing spring 17 and increasing the distance between the two holding plates 13. The user can then align the two sides of the circuit board with the clamping slots 14 opened on the two holding plates 13 respectively. After releasing the holding plates 13, the two holding plates 13 move towards the circuit board under the elastic force of spring 17, clamping the circuit board with the clamping slots 14. Finally, the user starts the second motor 12 to drive the flipping frame 11 to rotate in the heat dissipation box 1, so that the cold air discharged from the bottom of the cooling cylinder 4 can be evenly blown to all parts of the circuit board, thereby achieving rapid heat dissipation of the circuit board and greatly improving the processing efficiency of the circuit board.

[0030] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A heat dissipation mechanism for PCBA circuit boards after reflow soldering, comprising a heat dissipation box (1) with a material inlet (2) on one side wall, a sealing door (3) hinged to the heat dissipation box (1) for sealing the material inlet (2), and an exhaust hole on the bottom wall of the heat dissipation box (1), characterized in that: A ring-shaped cooling cylinder (4) is fixedly connected to the top wall of the inner cavity of the sealing door (3). A water storage tank (5) is provided inside the side wall of the cooling cylinder (4). A circulating water pipe (6) with one end connected to the water storage tank (5) is fixedly connected to the outer wall of the heat dissipation box (1). Multiple ring-shaped fins (7) are fixedly connected to the inner wall of the top of the cooling cylinder (4). A first motor (8) is installed in the inner cavity of the cooling cylinder (4) below the fins (7). A fan blade (9) is fixedly connected to the output end of the first motor (8). A flipping frame (11) is rotatably connected inside the heat dissipation box (1) below the cooling cylinder (4). A second motor (12) for driving the flipping frame (11) to rotate is installed on one side of the outer wall of the heat dissipation box (1). Two symmetrically arranged clamping plates (13) are slidably connected in the inner cavity of the flipping frame (11). Clamping grooves (14) are opened on the adjacent side of the two clamping plates (13). An elastic support is installed between the side of the two clamping plates (13) that is far away from each other and the inner side wall of the flipping frame (11).

2. The heat dissipation mechanism for PCBA circuit boards after reflow soldering according to claim 1, characterized in that: The circulating water pipe (6) is divided into an inlet pipe and a drain pipe. The inlet pipe and the drain pipe are installed on both sides of the cooling cylinder (4), and the inner diameter of the inlet pipe is larger than that of the drain pipe.

3. The heat dissipation mechanism for PCBA circuit boards after reflow soldering according to claim 1, characterized in that: The fins (7) have a U-shaped structure, and a gap for air circulation is formed between the inner walls on both sides of the fins (7). Both ends of the fins (7) penetrate the inner wall of the cooling cylinder (4) and extend into the water storage tank (5).

4. The heat dissipation mechanism for PCBA circuit boards after reflow soldering according to claim 1, characterized in that: A channel for air circulation is provided between the periphery of the first motor (8) and the inner wall of the cooling cylinder (4). Multiple connecting rods with one end fixedly connected to the first motor (8) are distributed in a ring on the outer wall of the first motor (8), and the other end of the connecting rod is fixed to the inner wall of the cooling cylinder (4).

5. A heat dissipation mechanism for PCBA circuit boards after reflow soldering according to claim 1, characterized in that: The top of the heat sink (1) is fitted with a filter cover (10) that covers the top of the cooling cylinder (4).

6. The heat dissipation mechanism for PCBA circuit boards after reflow soldering according to claim 1, characterized in that: The elastic support includes a slide tube (15) fixedly connected to the inner walls of the left and right ends of the flipping frame (11). A slide rod (16) is slidably connected to one end of the slide tube (15) away from the flipping frame (11). One end of the slide rod (16) located outside the slide tube (15) is fixed to the clamping plate (13). A spring (17) is fixedly connected to one end of the slide rod (16) located inside the slide tube (15).

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