Vehicle-mounted domain controller heat dissipation device and driving equipment

Abstract

The utility model discloses a vehicle-mounted area controller heat dissipation device and driving equipment, the vehicle-mounted area controller heat dissipation device comprises a water-cooling heat dissipation module and a device installation module, a heat dissipation flow channel is arranged in the water-cooling heat dissipation module, and the water-cooling heat dissipation module is provided with a liquid inlet and a liquid outlet which are communicated with the heat dissipation flow channel. A device containing cavity facing an opening of the water-cooling heat dissipation module is formed in the device installation module, the water-cooling heat dissipation module blocks the opening of the device installation module, the device containing cavity is used for containing a heating device, and the water-cooling heat dissipation module is detachably connected with the device installation module. According to the vehicle-mounted domain controller heat dissipation device, the heating device is installed in the device containing cavity of the device installation module, the opening of the device containing cavity is blocked through the water-cooling heat dissipation module, heat dissipation is conducted on the heating device through the water-cooling heat dissipation module, and therefore the heat dissipation efficiency of the vehicle-mounted domain controller heat dissipation device is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation equipment technology, and in particular to a heat dissipation device for a vehicle-mounted domain controller and a driving device. Background Technology

[0002] As vehicle safety requirements become increasingly stringent, the reliability requirements for in-vehicle domain controllers also become increasingly stringent. Typically, domain controllers integrate multiple high-power, high-computing-power chips.

[0003] When operating, automotive domain controllers generate a significant amount of heat within their internal enclosures, which can easily cause internal electronic components to fail due to the high-temperature environment. Traditional automotive domain controllers rely on natural air cooling for heat dissipation; however, natural air cooling is far from sufficient to meet the heat dissipation requirements of automotive domain controllers.

[0004] Therefore, how to improve the heat dissipation efficiency of the vehicle domain controller's heat dissipation device is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a vehicle-mounted domain controller cooling device that improves heat dissipation efficiency. Another purpose of this invention is to provide a driving device that includes the aforementioned vehicle-mounted domain controller cooling device.

[0006] The vehicle-mounted domain controller heat dissipation device provided in this application includes:

[0007] A water-cooled heat dissipation module, wherein the water-cooled heat dissipation module is provided with a heat dissipation channel, and the water-cooled heat dissipation module is provided with an inlet and an outlet communicating with the heat dissipation channel;

[0008] The device mounting module has a device receiving cavity that opens toward the water-cooled heat dissipation module. The water-cooled heat dissipation module blocks the opening of the device mounting module. The device receiving cavity is used to house a heat-generating device. The water-cooled heat dissipation module and the device mounting module are detachably connected.

[0009] Optionally, in the above-mentioned vehicle domain controller heat dissipation device, the heat dissipation channel is an S-shaped channel, and the water-cooled heat dissipation module further includes heat dissipation fins and heat dissipation pins. The heat dissipation pins are located at the bend of the heat dissipation channel, and a set of heat dissipation fins is provided between two adjacent sets of heat dissipation pins. A set of heat dissipation fins is provided between the heat dissipation pin and the liquid inlet and between the heat dissipation pin and the liquid outlet.

[0010] Optionally, in the above-mentioned vehicle domain controller heat dissipation device, the spacing between adjacent heat dissipation fins in the same group gradually increases along the coolant flow direction.

[0011] Optionally, in the above-mentioned vehicle domain controller heat dissipation device, the heat dissipation channel is disposed in the heat dissipation housing, and the end of the heat dissipation housing is provided with a heat dissipation protrusion. The end of the heat dissipation protrusion away from the heat dissipation housing is in contact with the heat-generating device through a heat conduction medium.

[0012] Optionally, in the above-mentioned vehicle-mounted domain controller heat dissipation device, the device mounting module includes:

[0013] The first cover plate is a hollow annular component, and the first surface of the first cover plate is connected to the water-cooled heat dissipation module through a sealing ring.

[0014] A second cover plate is mounted on the second surface of the first cover plate. The first surface and the second surface are two surfaces of the first cover plate that are arranged opposite to each other. The device receiving cavity is formed between the first cover plate and the second cover plate.

[0015] Optionally, in the above-mentioned vehicle domain controller heat dissipation device, the first cover plate and the second cover plate are detachably connected in the circumferential direction by fasteners.

[0016] Optionally, in the above-mentioned vehicle domain controller heat dissipation device, the first cover plate and / or the water-cooled heat dissipation module are provided with a groove for accommodating the sealing ring.

[0017] Optionally, the above-mentioned vehicle domain controller heat dissipation device further includes a plug interface for connecting to a heat-generating device. The plug interface is installed on the device mounting module, and the liquid inlet and the liquid outlet are located on the same side of the water-cooled heat dissipation module. Alternatively, the plug interface and the liquid inlet may be located on different sides.

[0018] Optionally, in the above-mentioned vehicle domain controller heat dissipation device, the water-cooled heat dissipation module is an integral cast structure.

[0019] A driving device includes an on-board domain controller cooling device and an on-board controller mounted on the on-board domain controller cooling device, wherein the on-board domain controller cooling device is any of the on-board domain controller cooling devices described above.

[0020] In the above technical solution, the vehicle-mounted domain controller heat dissipation device provided by this utility model includes a water-cooled heat dissipation module and a device mounting module. The water-cooled heat dissipation module has a heat dissipation channel and an inlet and an outlet communicating with the heat dissipation channel. The device mounting module has a device receiving cavity that opens towards the water-cooled heat dissipation module. The water-cooled heat dissipation module seals the opening of the device mounting module, and the device receiving cavity is used to house the heat-generating device. The water-cooled heat dissipation module and the device mounting module are detachably connected. In use, the heat-generating device is installed in the device receiving cavity. The water-cooled heat dissipation module is connected to an external coolant pipeline.

[0021] As can be seen from the above description, in the vehicle domain controller heat dissipation device provided in this application, the heat-generating device is installed in the device housing cavity of the device mounting module, and the opening of the device housing cavity is sealed by the water-cooling heat dissipation module. The heat-generating device is cooled by the water-cooling heat dissipation module, thereby improving the heat dissipation efficiency of the vehicle domain controller heat dissipation device provided in this application. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural schematic diagram of the vehicle-mounted domain controller heat dissipation device provided in an embodiment of the present utility model;

[0024] Figure 2 An exploded view of the heat dissipation device and heat-generating components of the vehicle domain controller provided in this embodiment of the present invention;

[0025] Figure 3 This is an exploded view of the vehicle-mounted domain controller heat dissipation device provided in an embodiment of the present invention;

[0026] Figure 4 A cross-sectional view of the heat dissipation device and heat-generating device of the vehicle domain controller provided in an embodiment of this utility model;

[0027] Figure 5 This is a schematic diagram of the internal structure of the water-cooled heat dissipation module provided in an embodiment of the present utility model;

[0028] Figure 6 This is a partially enlarged view of the internal structure of the water-cooled heat dissipation module provided in an embodiment of this utility model.

[0029] in Figure 1-6 middle:

[0030] 1-On-board domain controller cooling system;

[0031] 10-Water-cooled heat dissipation module, 1001-Heat dissipation pin, 1002-Heat dissipation fins, 1003-Liquid inlet, 1004-Liquid outlet, 1005-Heat dissipation channel;

[0032] 11-Heat transfer medium, 12-Mounting interface, 13-Plug interface, 14-First cover plate, 15-Sealing ring, 16-Second cover plate, 17-Second fixing screw, 18-First fixing screw, 19-Heat dissipation boss;

[0033] 2-PCBA. Detailed Implementation

[0034] The core of this invention is to provide a vehicle-mounted domain controller cooling device that improves heat dissipation efficiency. Another core aspect of this invention is to provide a driving device that includes the aforementioned vehicle-mounted domain controller cooling device.

[0035] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0036] Please refer to Figures 1 to 6 .

[0037] In one specific embodiment, the vehicle-mounted domain controller heat dissipation device provided by this utility model includes a water-cooled heat dissipation module 10 and a device mounting module. The water-cooled heat dissipation module 10 has a heat dissipation channel 1005 inside, and a liquid inlet 1003 and a liquid outlet 1004 communicating with the heat dissipation channel 1005. Specifically, the water-cooled heat dissipation module 10 can be formed by splicing two liquid cooling plates to form the heat dissipation channel 1005 in the inner cavity. Alternatively, the water-cooled heat dissipation module 10 can be integrally formed. The liquid inlet 1003 and the liquid outlet 1004 can be located on the same side or different sides of the water-cooled heat dissipation module 10.

[0038] The device mounting module has a device housing cavity that opens towards the water-cooling heat dissipation module 10. The water-cooling heat dissipation module 10 seals the opening of the device mounting module, and the device housing cavity is used to house heat-generating devices. Specifically, the heat-generating device can be PCBA2. Various electronic components and connectors are mounted on PCBA2 to ensure that the controller can achieve the expected functions. Among them, high-power and high-computing-power integrated chips need to be provided with effective heat dissipation.

[0039] The water-cooled heat dissipation module 10 is detachably connected to the device mounting module.

[0040] During use, the heat-generating device is installed in the device housing cavity. The water-cooled heat dissipation module 10 is connected to an external coolant pipeline.

[0041] As can be seen from the above description, in the vehicle domain controller heat dissipation device 1 provided in the specific embodiment of this application, the heat-generating device is installed in the device housing cavity of the device mounting module, and the opening of the device housing cavity is sealed by the water-cooled heat dissipation module 10. The heat-generating device is cooled by the water-cooled heat dissipation module 10, thereby improving the heat dissipation efficiency of the vehicle domain controller heat dissipation device 1 provided in this application, and at the same time meeting the higher heat dissipation requirements after the vehicle model is upgraded.

[0042] The water-cooled heat dissipation module 10 and the component mounting module of this application adopt a separate design, which not only facilitates the replacement of the water-cooled heat dissipation module 10, but also isolates it from the PCBA2, achieving a better sealing effect, improving the safety of the controller, and providing the controller with better waterproof and dustproof performance. At the same time, the separate design of the water-cooled heat dissipation module 10 and the component mounting module makes it easier to modify and update the component mounting module.

[0043] In addition, to save costs, the housing of the device mounting module and the water-cooled heat dissipation module 10 can be made of different materials, and the design can be optimized as requirements change.

[0044] In one specific implementation, such as Figure 5 and Figure 6 As shown, the heat dissipation channel 1005 is an S-shaped channel. The water-cooled heat dissipation module 10 also includes heat dissipation fins 1002. Specifically, the heat dissipation fins 1002 are installed in the heat dissipation channel 1005, and the length direction of the heat dissipation fins 1002 extends along the fluid flow direction within the heat dissipation channel 1005. By setting the heat dissipation channel 1005 to an S-shape, it is easier for the coolant to exchange heat with the heat-generating device in a timely manner. By setting the heat dissipation fins 1002, the heat exchange effect is further improved.

[0045] Considering the inconvenience of arranging the heat dissipation fins 1002 at the bend of the heat dissipation channel 1005, preferably, the water-cooled heat dissipation module 10 also includes heat dissipation pins 1001. The heat dissipation pins 1001 are located at the bend of the heat dissipation channel 1005, and a set of heat dissipation fins 1002 is provided in the channel between two adjacent sets of heat dissipation pins 1001. The number and size of each set of heat dissipation pins 1001 are determined according to actual needs. In order to facilitate fluid flow, preferably, the heat dissipation pins 1001 are cylindrical.

[0046] A set of heat dissipation fins 1002 is provided between the heat dissipation pin 1001 and the liquid inlet 1003, and another set of heat dissipation fins 1002 is provided between the heat dissipation pin 1001 and the liquid outlet 1004. The number and size of each set of heat dissipation fins 1002 are determined according to actual needs. The water-cooled heat dissipation module 10 has a variable number of heat dissipation fins 1002 and heat dissipation pins 1001 arranged in different areas of the flow channel, which can reduce the impact of cooling water on the inner wall of the heat dissipation flow channel 1005 and increase heat dissipation efficiency.

[0047] In the specific design, the cooling water flow rate and velocity of the inlet pipe can be adjusted according to the temperature control strategy and the water cooling heat dissipation requirements. The internal flow channel design of the cooling module can be changed according to different controller types. The number and position of the heat dissipation fins 1002 and heat dissipation pins 1001 in the flow channel can also be flexibly changed. The final flow channel structure parameters can be designed with reference to the icepak thermal simulation analysis to achieve the purpose of optimized design and improve heat exchange efficiency.

[0048] Since the water flow pressure at the inlet 1003 is often relatively high due to the heat dissipation principle, it is preferable that the spacing between adjacent heat dissipation fins 1002 in the same group gradually increases along the coolant flow direction. This design, by placing heat dissipation fins 1002 near the inlet, can slow down the coolant flow rate, allowing for sufficient heat exchange between the coolant and the housing of the water-cooled heat dissipation module 10. It also prevents the high water pressure from impacting and damaging the heat dissipation channel 1005 at the inlet 1003. Similarly, setting irregular heat dissipation pins 1001 at the bends of the heat dissipation channel 1005 can reduce the impact on the bends and increase heat dissipation efficiency. The heat dissipation channel 1005 is surrounded by large rounded corners to avoid excessive sharp edges that increase coolant flow resistance.

[0049] Specifically, the coolant in the heat dissipation channel 1005 of this application can be water.

[0050] In one specific embodiment, a heat dissipation channel 1005 is disposed on a heat dissipation housing, and a heat dissipation protrusion 19 is provided at the end of the heat dissipation housing. The end of the heat dissipation protrusion 19 away from the heat dissipation housing is in contact with the heat-generating device through a heat conduction medium 11. Specifically, multiple heat dissipation protrusions 19 are provided at the end of the heat dissipation housing, and a 1mm-2mm heat conduction medium 11 is provided between the heat dissipation protrusion 19 and the heat dissipation area of ​​the PCBA2. Typically, the thickness of the heat dissipation medium is about 1.6mm.

[0051] Specifically, the heat dissipation boss 19 is bonded to the heat dissipation housing. In order to improve assembly efficiency, it is preferable that the heat dissipation boss 19 and the heat dissipation housing are integrally formed, for example, the heat dissipation boss 19 and the heat dissipation housing are integrally cast.

[0052] The position and number of heat dissipation protrusions 19 are determined according to actual needs. Preferably, the heat dissipation protrusions 19 are directly opposite the heat dissipation position on the heat-generating device so as to facilitate timely heat dissipation.

[0053] In one specific embodiment, the device mounting module includes a first cover plate 14 and a second cover plate 16, wherein the first cover plate 14 and the second cover plate 16 form the housing of the device mounting module. The first cover plate 14 is a hollow annular component, and the first surface of the first cover plate 14 is connected to the heat dissipation module. In order to improve the sealing performance, the first surface of the first cover plate 14 is connected to the water-cooled heat dissipation module 10 through a sealing ring 15.

[0054] The second cover plate 16 is mounted on the second surface of the first cover plate 14. The first surface and the second surface are two surfaces of the first cover plate 14 that are arranged opposite to each other. A device accommodating cavity is formed between the first cover plate 14 and the second cover plate 16.

[0055] In actual processing, the first cover plate 14 and the second cover plate 16 can also be cast. The first cover plate 14 and the second cover plate 16 are fixedly connected at their outer periphery.

[0056] For ease of assembly, the first cover plate 14 is provided with a mounting interface 12 for installing the water-cooled heat dissipation module 10. Specifically, it has six mounting screw holes for fixing the water-cooled heat dissipation module 10. The first cover plate 14 and the water-cooled heat dissipation module 10 are fastened together by the first fixing screw 18.

[0057] For ease of assembly and disassembly, the first cover plate 14 and the second cover plate 16 are detachably connected circumferentially by the second fixing screw 17. Specifically, the first cover plate 14 has screw holes inside for fixing the PCBA2 and the second cover plate 16, providing protection and mounting for the PCBA2. For example, the PCBA2 is mounted on the first cover plate 14 by fasteners, or the PCBA2 is mounted on the second cover plate 16 by fasteners. Alternatively, the edge of the PCBA2 can be sandwiched between the first cover plate 14 and the second cover plate 16, and all three are then secured together by the second fixing screw 17.

[0058] To improve sealing, preferably, the first cover plate 14 has a groove for accommodating the sealing ring 15, or the water-cooled heat dissipation module 10 has a groove for accommodating the sealing ring 15, or both the first cover plate 14 and the water-cooled heat dissipation module 10 form grooves for mounting the sealing ring 15. By providing the sealing ring 15 and the groove, liquid and dust are prevented from entering the device housing cavity, thus providing better protection for the PCBA2.

[0059] In one specific embodiment, the vehicle-mounted domain controller heat dissipation device 1 further includes a plug interface 13 connected to a heat-generating device. The plug interface 13 is installed on the device mounting module, and the liquid inlet 1003 and the liquid outlet 1004 are located on the same side of the water-cooled heat dissipation module 10. Alternatively, the plug interface 13 and the liquid inlet 1003 may be located on different sides.

[0060] For example, when the liquid inlet 1003 and the liquid outlet 1004 are located on the front side of the water-cooled heat dissipation module 10, the plug interface 13 is located on the left, right or rear side of the water-cooled heat dissipation module 10, or at least two sides of the left, right or rear side of the water-cooled heat dissipation module 10 are provided with plug interfaces 13. This arrangement avoids interference between the plug interface 13 and the liquid inlet 1003 and the liquid outlet 1004, and facilitates the later layout.

[0061] Based on the above solutions, the water-cooled heat dissipation module 10 is a one-piece cast structure. As a one-piece cast structure, the water-cooled heat dissipation module 10 is highly efficient and easy to install and cast.

[0062] To facilitate understanding, a specific implementation method is described below. First, the water-cooled heat dissipation module 10 is installed and fixed on the first cover plate 14. The inlet 1003 and outlet 1004 are connected to the vehicle's main cooling water circuit. Coolant flows in from the inlet 1003. At this time, the water pressure at the inlet 1003 is relatively high. The flow rate of the cooling water is slowed down as it flows through the heat dissipation fins 1002, which allows the coolant to fully exchange heat with the shell and also prevents the large water pressure from impacting and damaging the flow channel at the inlet. Similarly, when flowing through the bend of the flow channel, the irregular heat dissipation pins 1001 reduce the impact on the bend of the flow channel and increase the heat dissipation efficiency. In addition, the large rounded corners around the flow channel reduce the flow resistance of the cooling water. At this time, heat is transferred to the coolant through the heat dissipation pins 1001 and the heat dissipation fins 1002. Finally, the coolant flows out from the outlet 1004, completing the entire heat exchange process. Then, the above cycle of heat exchange is repeated.

[0063] The driving equipment provided in this application includes an on-board domain controller heat dissipation device and an on-board controller installed on the on-board domain controller heat dissipation device, wherein the on-board domain controller heat dissipation device is any of the aforementioned on-board domain controller heat dissipation device 1. The specific structure of the on-board domain controller heat dissipation device 1 has been described above. This application includes the aforementioned on-board domain controller heat dissipation device 1 and also has the aforementioned technical effects.

[0064] Specifically, the driving device provided in this application can be an electric vehicle, for example, a pure electric vehicle.

[0065] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0066] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation device for an on-board domain controller, characterized in that, include: Water-cooled heat dissipation module (10), the water-cooled heat dissipation module (10) is provided with heat dissipation channel (1005), the water-cooled heat dissipation module (10) is provided with liquid inlet (1003) and liquid outlet (1004) connected to the heat dissipation channel (1005). The device mounting module has a device receiving cavity that opens toward the water-cooled heat dissipation module (10). The water-cooled heat dissipation module (10) blocks the opening of the device mounting module. The device receiving cavity is used to receive a heat-generating device. The water-cooled heat dissipation module (10) is detachably connected to the device mounting module.

2. The vehicle-mounted domain controller heat dissipation device according to claim 1, characterized in that, The heat dissipation channel (1005) is an S-shaped channel. The water-cooled heat dissipation module (10) also includes heat dissipation fins (1002) and heat dissipation pins (1001). The heat dissipation pins (1001) are located at the bend of the heat dissipation channel (1005). A set of heat dissipation fins (1002) is provided between two adjacent sets of heat dissipation pins (1001) in the heat dissipation channel (1005). A set of heat dissipation fins (1002) is provided between the heat dissipation pins (1001) and the liquid inlet (1003) and between the heat dissipation pins (1001) and the liquid outlet (1004).

3. The vehicle-mounted domain controller heat dissipation device according to claim 2, characterized in that, Along the direction of coolant flow, the spacing between adjacent heat dissipation fins (1002) in the same group gradually increases.

4. The vehicle-mounted domain controller heat dissipation device according to claim 1, characterized in that, The heat dissipation channel (1005) is provided on the heat dissipation housing, and the end of the heat dissipation housing is provided with a heat dissipation boss (19). The end of the heat dissipation boss (19) away from the heat dissipation housing is in contact with the heat-generating device through a heat conduction medium (11).

5. The vehicle-mounted domain controller heat dissipation device according to claim 1, characterized in that, The device mounting module includes: The first cover plate (14) is a hollow annular part, and the first surface of the first cover plate (14) is connected to the water-cooled heat dissipation module (10) through a sealing ring (15). The second cover plate (16) is mounted on the second surface of the first cover plate (14). The first surface and the second surface are two surfaces of the first cover plate (14) facing away from each other. The device receiving cavity is formed between the first cover plate (14) and the second cover plate (16).

6. The vehicle-mounted domain controller heat dissipation device according to claim 5, characterized in that, The first cover plate (14) and the second cover plate (16) are detachably connected in the circumferential direction by fasteners.

7. The vehicle-mounted domain controller heat dissipation device according to claim 5, characterized in that, The first cover plate (14) and / or the water-cooled heat dissipation module (10) are provided with a groove for accommodating the sealing ring (15).

8. The vehicle-mounted domain controller heat dissipation device according to claim 1, characterized in that, It also includes a connector (13) for connecting to a heat-generating device. The connector (13) is installed on the device mounting module. The liquid inlet (1003) and the liquid outlet (1004) are located on the same side of the water-cooled heat dissipation module (10). The connector (13) and the liquid inlet (1003) are not located on the same side.

9. The vehicle-mounted domain controller heat dissipation device according to any one of claims 1-8, characterized in that, The water-cooled heat dissipation module (10) is an integral cast structure.

10. A driving device, characterized in that, It includes a vehicle domain controller heat dissipation device and a vehicle controller installed on the vehicle domain controller heat dissipation device, wherein the vehicle domain controller heat dissipation device is the vehicle domain controller heat dissipation device (1) according to any one of claims 1-9.

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