Wafer cutting equipment

Abstract

The utility model discloses wafer cutting equipment, which relates to the technical field of wafer cutting and comprises a frame. The XZ-axis driving mechanism is used for driving the blade to move in the up-down direction and the front-back direction; a positioning disc and a fixing mechanism, wherein the fixing mechanism is used for fixing the wafer on the positioning disc; the Y-axis driving mechanism is used for driving the positioning disc to move in the left-right direction; the angle adjusting mechanism is used for driving the positioning disc to rotate; the rotary driving mechanism is used for driving the blade to rotate; the damage detection mechanism is used for detecting the damaged blade, and the controller is used for controlling the rotation driving mechanism and the warning lamp to be started and stopped. When the damage detection mechanism detects that the blade is damaged, the controller can control the rotation driving mechanism to be closed, the situation that the cutting quality of the wafer is reduced due to the fact that the blade continues is avoided, and the yield of chips can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cutting technical field, especially a wafer cutting equipment. BACKGROUND

[0002] Wafer cutting equipment is a key machine for cutting silicon wafers or other semiconductor materials into individual chips. Wafer cutting equipment uses high-precision diamond blades or other hard material blades to accurately cut wafers into chips that meet design requirements. In actual processing, the blades may be damaged, and damaged blades can cause the cutting quality of the wafers to decrease, resulting in size inconsistencies, rough surfaces, or uneven edges in the cut chips, which in turn reduces the yield of the chips. SUMMARY

[0003] The utility model discloses at least solve one of the prior art technical problems. Therefore, the utility model provides a wafer cutting equipment, which is beneficial to improve the yield of the chip.

[0004] The wafer cutting equipment according to the utility model embodiment comprises:

[0005] A rack;

[0006] An XZ-axis drive mechanism and a blade, the XZ-axis drive mechanism is arranged on the rack, the XZ-axis drive mechanism is used for driving the blade to move in the up-down direction and the front-back direction, and the blade is used for cutting wafers;

[0007] A positioning disc and a fixing mechanism, the positioning disc is used for positioning the wafer, so that the upper surface of the wafer is perpendicular to the up-down direction, and the fixing mechanism is arranged on the positioning disc, and the fixing mechanism is used for fixing the wafer on the positioning disc;

[0008] A Y-axis drive mechanism, the Y-axis drive mechanism is arranged on the rack, and the Y-axis drive mechanism is used for driving the positioning disc to move in the left-right direction, so that the wafer on the positioning disc can move below the blade;

[0009] An angle adjusting mechanism, the angle adjusting mechanism is used for driving the positioning disc to rotate, so that the wafer on the positioning disc can rotate;

[0010] A rotary drive mechanism, the rotary drive mechanism is used for driving the blade to rotate, so that the blade can cut the wafer on the positioning disc;

[0011] The broken detection mechanism is used for detecting the broken blade, and the warning light is used for emitting light flickering.

[0012] At least the following benefits are owned:

[0013] When cutting a wafer, the wafer to be cut is placed on the positioning disc, the positioning disc can position the wafer, so that the upper surface of the wafer is perpendicular to the up-down direction. The fixing mechanism on the positioning disc can fix the wafer on the positioning disc to avoid movement of the wafer relative to the positioning disc during cutting and movement. The Y-axis driving mechanism can drive the positioning disc to move in the left-right direction, so that the wafer on the positioning disc can move to the lower side of the blade. The XZ-axis driving mechanism can drive the blade to move in the up-down direction and the front-back direction. The rotary driving mechanism drives the blade to rotate, so that the blade can cut the wafer from different angles. The angle adjusting mechanism can drive the positioning disc to rotate, thereby driving the wafer on the positioning disc to rotate, so that the blade can cut the wafer on the positioning disc into multiple chips. The broken detection mechanism is used for detecting the broken blade. When the broken detection mechanism detects that the blade is broken, the broken detection mechanism generates a signal and transmits the signal to the controller. After the controller receives the signal, the rotary driving mechanism is controlled to be closed, so as to avoid the cutting quality of the wafer from being reduced due to the continuous operation of the blade, thereby improving the yield of the chips. On the other hand, after the controller receives the signal, the warning light is controlled to be started, and the warning light can emit light flickering to remind the operator that the current blade is broken and needs to be handled in time, effectively avoiding the wafer cutting equipment from being in a shutdown state for a long time, and improving the cutting efficiency of the wafer.

[0014] According to the wafer cutting equipment, the broken detection mechanism includes an infrared emitter and an infrared receiver, the infrared emitter and the infrared receiver are connected with the output end of the XZ-axis driving mechanism, the infrared emitter is used for emitting infrared rays, the infrared receiver is used for receiving infrared rays, the emitting end of the infrared emitter is arranged opposite to the receiving end of the infrared receiver, and the gap between the emitting end of the infrared emitter and the receiving end of the infrared receiver is used for the blade edge to pass through. The infrared receiver is electrically connected with the controller. When the infrared receiver receives the infrared rays emitted by the infrared emitter, the controller controls the rotary driving mechanism to be closed and controls the warning light to be started.

[0015] The wafer cutting equipment according to the embodiment of the present application further comprises a player, the player is used for playing prompt voice, and the controller can control the player to start.

[0016] The wafer cutting equipment according to the embodiment of the present application further comprises a liquid spraying mechanism, the liquid spraying mechanism is used for spraying cooling liquid towards the blade, so as to reduce the temperature of the blade.

[0017] The wafer cutting equipment according to the embodiment of the present application further comprises a defect detection mechanism, the defect detection mechanism is arranged on one side of the blade, the defect detection mechanism is arranged above the moving path of the positioning disc, and the defect detection mechanism is used for detecting defects on the surface of the wafer.

[0018] The wafer cutting equipment according to the embodiment of the present application further comprises a liquid blocking shell, the liquid blocking shell is arranged between the blade and the defect detection mechanism, and the liquid blocking shell is used for blocking the cooling liquid from splashing to the defect detection mechanism.

[0019] The wafer cutting equipment according to the embodiment of the present application further comprises a feeding device, the feeding device is arranged on the rack, and the feeding device is used for placing the wafer on the positioning disc.

[0020] The wafer cutting equipment according to the embodiment of the present application, the feeding device comprises a first XYZ-axis driving mechanism, a first adsorption mechanism and a containing bin, the containing bin is used for containing a plurality of wafers, the first adsorption mechanism is used for adsorbing or releasing the wafer, and the first XYZ-axis driving mechanism is used for driving the first adsorption mechanism to move in the up-down direction, the left-right direction and the front-rear direction, so that the first adsorption mechanism can adsorb the wafer in the containing bin, and the first adsorption mechanism can release the adsorbed wafer on the positioning disc.

[0021] The wafer cutting equipment according to the embodiment of the present application further comprises a discharging device, the discharging device is arranged on the rack, and the discharging device is used for taking away the chip cut on the positioning disc from the positioning disc.

[0022] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0023] The present application will be further described below in combination with the drawings and embodiments, in which:

[0024] Figure 1 It is a structural schematic view of the wafer cutting equipment according to the embodiment of the present application.

[0025] Figure 2 For Figure 1 Local enlarged structure schematic view at A in figure 1;

[0026] Figure 3 For structure schematic view of blade, infrared emitter and infrared receiver in wafer cutting equipment of embodiment of the utility model;

[0027] Reference signs:

[0028] Frame 100, warning light 110, liquid blocking shell 120;

[0029] XZ axis drive mechanism 200, rotary drive mechanism 210, blade 220;

[0030] Y axis drive mechanism 300, angle adjusting mechanism 310, fixing mechanism 320, positioning disc 330;

[0031] Damage detection mechanism 400, infrared emitter 410, infrared receiver 420;

[0032] Liquid spraying mechanism 500, defect detection mechanism 600, feeding device 700. DETAILED DESCRIPTION

[0033] The embodiments of the utility model are described in detail below, examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and cannot be understood as limiting the utility model.

[0034] In the description of the utility model, it is understood that the orientation description, such as up, down, front, back, left, right and the like, is based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as limiting the utility model.

[0035] In the description of the utility model, more refers to two or more. If there is a description of first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0036] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0037] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be learned by the practice of the present application.

[0038] Reference Figure 1 and Figure 2 The wafer cutting device of the present application comprises:

[0039] A rack 100;

[0040] An XZ-axis driving mechanism 200 and a blade 220, the XZ-axis driving mechanism 200 is arranged on the rack 100, the XZ-axis driving mechanism 200 is used to drive the blade 220 to move in the up-down direction and the front-back direction, and the blade 220 is used to cut the wafer;

[0041] A positioning disc 330 and a fixing mechanism 320, the positioning disc 330 is used to position the wafer, so that the upper surface of the wafer is perpendicular to the up-down direction, and the fixing mechanism 320 is arranged on the positioning disc 330, and the fixing mechanism 320 is used to fix the wafer on the positioning disc 330;

[0042] A Y-axis driving mechanism 300, the Y-axis driving mechanism 300 is arranged on the rack 100, and the Y-axis driving mechanism 300 is used to drive the positioning disc 330 to move in the left-right direction, so that the wafer on the positioning disc 330 can move to the lower side of the blade 220;

[0043] An angle adjusting mechanism 310, the angle adjusting mechanism 310 is used to drive the positioning disc 330 to rotate, so that the wafer on the positioning disc 330 can rotate;

[0044] A rotary driving mechanism 210, the rotary driving mechanism 210 is used to drive the blade 220 to rotate, so that the blade 220 can cut the wafer on the positioning disc 330;

[0045] A damage detection mechanism 400, a controller and a warning light 110, the damage detection mechanism 400 is used to detect the damaged blade 220, the warning light 110 is used to emit light and flash, the controller is used to control the rotary driving mechanism 210 and the warning light 110 to start and stop, the controller is electrically connected with the damage detection mechanism 400, so that when the damage detection mechanism 400 detects that the blade 220 is damaged, the controller controls the rotary driving mechanism 210 to be closed and controls the warning light 110 to be started.

[0046] It can be understood that when the wafer needs to be cut, the wafer to be cut is placed on the positioning disc 330, the positioning disc 330 can position the wafer so that the upper surface of the wafer is perpendicular to the up-down direction. The fixing mechanism 320 on the positioning disc 330 can fix the wafer on the positioning disc 330, so as to avoid the movement of the wafer relative to the positioning disc 330 during cutting and moving. The Y-axis driving mechanism 300 can drive the positioning disc 330 to move in the left-right direction, so that the wafer on the positioning disc 330 can move to the lower side of the blade 220, the XZ-axis driving mechanism 200 can drive the blade 220 to move in the up-down direction and the front-back direction, the rotary driving mechanism drives the blade 220 to rotate, so that the blade 220 can cut the wafer, and the angle adjusting mechanism 310 can drive the positioning disc 330 to rotate, thereby driving the wafer on the positioning disc 330 to rotate, so that the blade 220 can cut the wafer from different angles. Under the mutual coordination of the XZ-axis driving mechanism 200, the Y-axis driving mechanism 300 and the angle adjusting mechanism 310, the blade 220 can cut the wafer on the positioning disc 330 into a plurality of chips. The damage detection mechanism 400 is used for detecting the damaged blade 220. When the damage detection mechanism 400 detects that the blade 220 is damaged, the damage detection mechanism 400 will generate a signal and transmit the signal to the controller. After the controller receives the signal, the rotary driving mechanism 210 will be controlled to be closed, so as to avoid the continuous cutting of the blade 220, which leads to the decline of the cutting quality of the wafer, thereby facilitating the improvement of the yield of the chip. On the other hand, after the controller receives the signal, the warning light 110 will be started, and the warning light 110 can emit light and flash, so as to remind the operator that the current blade 220 is damaged and needs to be handled in time, which effectively avoids the wafer cutting equipment being in a shutdown state for a long time, and is beneficial to improve the cutting efficiency of the wafer.

[0047] It should be explained that in the utility model, the X-axis is parallel to the front-back direction, the Y-axis is parallel to the left-right direction, and the Z-axis is parallel to the up-down direction. In the utility model, the blade 220 is a disc blade 220, and the edge of the blade 220 is the cutting edge of the blade 220.

[0048] In the utility model, XZ axle drive mechanism 200 is established on frame 100, the output of XZ axle drive mechanism 200 is connected with rotary drive mechanism 210, and the output of rotary drive mechanism 210 is connected with blade 220. The output of Y axle drive mechanism 300 is connected with angle adjusting mechanism 310, and the output of angle adjusting mechanism 310 is connected with positioning disc 330. Angle adjusting mechanism 310 can be motor. Fixed mechanism 320 can be vacuum generating assembly, and a plurality of air holes are uniformly distributed on positioning disc 330, and vacuum generating assembly is used to generate vacuum in a plurality of air holes, so that the wafer can be adsorbed on positioning disc 330, to realize the effect that the wafer is fixed on positioning disc 330. As another embodiment of the utility model, fixed mechanism 320 can also be mucosa, and the mucosa is arranged on positioning disc 330, and positioning disc 330 can be adhered to the mucosa, to realize the effect that the wafer is fixed on positioning disc 330.

[0049] Reference Figure 3 , breakage detection mechanism 400 includes infrared emitter 410 and infrared receiver 420, and infrared emitter 410 and infrared receiver 420 are connected with the output of XZ axle drive mechanism 200, infrared emitter 410 is used to emit infrared rays, infrared receiver 420 is used to receive infrared rays, the emitting end of infrared emitter 410 is arranged opposite the receiving end of infrared receiver 420, and the gap between the emitting end of infrared emitter 410 and the receiving end of infrared receiver 420 is used to pass the blade edge of blade 220, and infrared receiver 420 is electrically connected with the controller. When infrared receiver 420 receives the infrared rays emitted by infrared emitter 410, the controller controls rotary drive mechanism 210 to be closed and controls warning lamp 110 to be started. It can be understood that the gap between the emitting end of infrared emitter 410 and the receiving end of infrared receiver 420 is used to pass the blade edge of blade 220, when the blade edge of blade 220 is not damaged, the infrared rays emitted by infrared emitter 410 are blocked by the blade edge of blade 220, at this time, infrared receiver 420 cannot receive the infrared rays emitted by infrared emitter 410, and infrared receiver 420 cannot be triggered when not receiving infrared rays, that is, the blade 220 at this time is in good condition. When the blade edge of blade 220 is damaged, a gap will appear on the blade edge of blade 220, and the infrared rays emitted by infrared emitter 410 can pass through the gap on the blade edge of blade 220, at this time, infrared receiver 420 can receive the infrared rays emitted by infrared emitter 410, and infrared receiver 420 triggers a signal when receiving the infrared rays and transmits the signal to the controller, and the controller controls rotary drive mechanism 210 to be closed and controls warning lamp 110 to be started after receiving the signal.

[0050] As an embodiment of the utility model, the wafer cutting device further comprises a player, the player is used for playing prompt voice, and the controller can control the player to start. It can be understood that when the blade 220 is damaged, the player can play voice for reminding the operator to check the condition of the blade 220, effectively avoiding that the wafer cutting device is in a shutdown state for a long time, and being favorable for improving the cutting efficiency of the wafer.

[0051] Reference Figure 1 And Figure 2 The wafer cutting device further comprises a liquid spraying mechanism 500, the liquid spraying mechanism 500 is used for spraying cooling liquid towards the blade 220 to reduce the temperature of the blade 220. It can be understood that the liquid spraying mechanism 500 can spray cooling liquid towards the blade 220, which helps to improve the cutting quality of the blade 220, prolong the service life of the blade 220, reduce the influence of heat generated in the cutting process on the wafer, and ensure that the wafer can be stably cut. In the utility model, the liquid spraying mechanism 500 comprises a liquid collecting tank, a cooling liquid storage container, a circulating pump, a filter and a liquid spraying head, the liquid spraying head is connected with the output end of the XZ-axis driving mechanism 200, the liquid spraying head is used for spraying cooling liquid towards the lower end of the blade 220, the liquid collecting tank is arranged below the blade 220, the liquid collecting tank is communicated with the cooling liquid storage container through a liquid pipe, the cooling liquid storage container is communicated with the liquid spraying head through a liquid pipe, a filter is arranged between the liquid collecting tank and the cooling liquid storage container, and the circulating pump is used for flowing the cooling liquid in the liquid collecting tank, the cooling liquid storage container, the circulating pump, the filter, the liquid spraying head and the liquid pipe. The cooling liquid sprayed from the liquid spraying head can flow into the liquid collecting tank, under the action of the circulating pump, the cooling liquid in the liquid collecting tank flows into the cooling liquid storage container after filtering impurities by the filter, and then the cooling liquid in the cooling liquid storage container is sprayed from the liquid spraying head.

[0052] Reference Figure 1 The wafer cutting device further comprises a defect detection mechanism 600, the defect detection mechanism 600 is arranged on one side of the blade 220, the defect detection mechanism 600 is arranged above the moving path of the positioning disc 330, and the defect detection mechanism 600 is used for detecting the surface defects of the wafer. It can be understood that the defect detection mechanism 600 can detect defects such as cracks or impurities on the surface of the wafer, so as to avoid quality defects or damage in the cutting process. On the other hand, the defect detection mechanism 600 can also be used for detecting. As an embodiment of the utility model, the defect detection mechanism 600 comprises a camera and an image recognition component, the camera can shoot the chips cut from the wafer from top to bottom, and transmit the image information of the wafer or the chips to the image recognition component, the image recognition component can identify the defects on the wafer and the chips according to the image information, and then can help the operator to find and handle the problems on the surface of the wafer in time, so as to avoid quality defects or damage in the cutting process.

[0053] Reference Figure 1 The wafer cutting device further comprises a liquid blocking shell 120 arranged between the blade 220 and the defect detection mechanism 600, and the liquid blocking shell 120 is used to block the cooling liquid from splashing to the defect detection mechanism 600. It can be understood that the liquid blocking shell 120 can block the cooling liquid from splashing to the defect detection mechanism 600, so as to avoid damage to the defect detection mechanism 600 caused by the cooling liquid.

[0054] Reference Figure 1 The wafer cutting device further comprises a feeding device 700 arranged on the rack 100, and the feeding device 700 is used to place the wafer on the positioning disc 330. It can be understood that the feeding device 700 can ensure the continuity of the cutting process, and is beneficial to improve the cutting efficiency of the wafer cutting device. As an embodiment of the utility model, the feeding device 700 comprises a first XYZ-axis driving mechanism, a first adsorption mechanism and a containing bin, the containing bin is used to contain the wafer, the first adsorption mechanism is used to adsorb or release the wafer, and the first XYZ-axis driving mechanism is used to drive the first adsorption mechanism to move in the up-down direction, the left-right direction and the front-rear direction, so that the first adsorption mechanism can adsorb the wafer in the containing bin, and the first adsorption mechanism can release the adsorbed wafer on the positioning disc 330. The first adsorption mechanism comprises a first suction disc assembly, and the first suction disc assembly is used to adsorb the wafer.

[0055] As an embodiment of the utility model, the wafer cutting device further comprises a discharging device arranged on the rack 100, and the discharging device is used to take away the chips on the positioning disc 330 after cutting. It can be understood that after the wafer on the positioning disc 330 is cut, a plurality of chips will be obtained, and the discharging device can take away the plurality of chips on the positioning disc 330. The discharging device can ensure the continuity of the cutting process, and is beneficial to improve the cutting efficiency of the wafer cutting device. As an embodiment of the utility model, the feeding device 700 comprises a second XYZ-axis driving mechanism, a second adsorption mechanism and a finished product bin, the finished product bin is used to contain the chips, the second adsorption mechanism is used to adsorb or release the chips, and the second XYZ-axis driving mechanism is used to drive the second adsorption mechanism to move in the up-down direction, the left-right direction and the front-rear direction, so that the second adsorption mechanism can adsorb the chips on the positioning disc 330, and the second adsorption mechanism can release the adsorbed chips into the finished product bin. The second adsorption mechanism comprises a second suction disc assembly, and the second suction disc assembly is used to adsorb the plurality of chips.

[0056] In the embodiment of the utility model, the wafer cutting device further comprises a transparent cover that can rotate, and the transparent cover is used to shield the cooling liquid splashed in the cutting process.

[0057] Any technical features in the above-described embodiments can be combined, and for the sake of brevity, not all possible combinations are described, however, any combination of the technical features is considered to be within the scope of the present specification.

[0058] Of course, the present application is not limited to the above-described embodiments, and those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A wafer dicing device, characterized in that, include: Rack (100); XZ axis drive mechanism (200) and blade (220), the XZ axis drive mechanism (200) is mounted on the frame (100), the XZ axis drive mechanism (200) is used to drive the blade (220) to move in the up and down direction and the back and forth direction, the blade (220) is used to cut wafers; The positioning disk (330) and the fixing mechanism (320) are provided on the positioning disk (330) to position the wafer so that the upper surface of the wafer is perpendicular to the vertical direction. The fixing mechanism (320) is provided on the positioning disk (330) and is used to fix the wafer on the positioning disk (330). Y-axis drive mechanism (300), the Y-axis drive mechanism (300) is disposed on the frame (100), the Y-axis drive mechanism (300) is used to drive the positioning disk (330) to move in the left and right direction so that the wafer on the positioning disk (330) can move to below the blade (220); An angle adjustment mechanism (310) is used to drive the positioning disk (330) to rotate so that the wafer on the positioning disk (330) can rotate; A rotary drive mechanism (210) is provided to drive the blade (220) to rotate so that the blade (220) can cut the wafer on the positioning disk (330); The device includes a damage detection mechanism (400), a controller, and a warning light (110). The damage detection mechanism (400) is used to detect the damaged blade (220). The warning light (110) is used to flash light. The controller is used to control the start and stop of the rotary drive mechanism (210) and the warning light (110). The controller is electrically connected to the damage detection mechanism (400) so that when the damage detection mechanism (400) detects that the blade (220) is damaged, the controller controls the rotary drive mechanism (210) to shut down and controls the warning light (110) to start.

2. The wafer dicing equipment according to claim 1, characterized in that: The damage detection mechanism (400) includes an infrared transmitter (410) and an infrared receiver (420). Both the infrared transmitter (410) and the infrared receiver (420) are connected to the output end of the XZ axis drive mechanism (200). The infrared transmitter (410) is used to emit infrared rays, and the infrared receiver (420) is used to receive infrared rays. The emitting end of the infrared transmitter (410) and the receiving end of the infrared receiver (420) are arranged opposite to each other. The gap between the emitting end of the infrared transmitter (410) and the receiving end of the infrared receiver (420) is used for the blade (220) to pass through. The infrared receiver (420) is electrically connected to the controller. When the infrared receiver (420) receives the infrared rays emitted by the infrared transmitter (410), the controller controls the rotary drive mechanism (210) to close and controls the warning light (110) to start.

3. The wafer dicing equipment according to claim 1, characterized in that: It also includes a player for playing prompt voice messages, and the controller is capable of controlling the player to start.

4. The wafer dicing equipment according to claim 1, characterized in that: It also includes a spray mechanism (500) for spraying coolant toward the blade (220) to reduce the temperature of the blade (220).

5. The wafer dicing equipment according to claim 4, characterized in that: It also includes a defect detection mechanism (600), which is located on one side of the blade (220) and above the moving path of the positioning disk (330). The defect detection mechanism (600) is used to detect defects on the surface of the wafer.

6. The wafer dicing equipment according to claim 5, characterized in that: It also includes a liquid blocking shell (120), which is disposed between the blade (220) and the defect detection mechanism (600), and the liquid blocking shell (120) is used to prevent the coolant from splashing onto the defect detection mechanism (600).

7. The wafer dicing equipment according to claim 1, characterized in that: It also includes a loading device (700), which is mounted on the frame (100) and is used to place the wafer onto the positioning disk (330).

8. The wafer dicing equipment according to claim 7, characterized in that: The feeding device (700) includes a first XYZ axis driving mechanism, a first adsorption mechanism, and a receiving chamber. The receiving chamber is used to hold a plurality of wafers. The first adsorption mechanism is used to adsorb or release the wafers. The first XYZ axis driving mechanism is used to drive the first adsorption mechanism to move in the up-down direction, the left-right direction, and the front-back direction, so that the first adsorption mechanism can adsorb the wafers in the receiving chamber and release the adsorbed wafers onto the positioning disk (330).

9. The wafer dicing equipment according to claim 1, characterized in that: It also includes a feeding device, which is mounted on the frame (100) and is used to remove the cut chip from the positioning disk (330).

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