Cutter pressure detection structure of wafer splitting machine

Abstract

The utility model discloses a cutter pressure detection structure of a wafer splitting machine, which comprises a side plate, a positioning column arranged on the front side of the side plate, a sector gear sleeved on the outer side of the positioning column, a top rod connected with the bottom of the sector gear, and a bottom rod connected with the bottom end of the top rod, the wafer splitting cutter is installed at the bottom end of the bottom rod and used for wafer splitting, and the pressure sensors are installed on the outer side of the bottom of the wafer splitting cutter. According to the utility model, the plurality of pressure sensors are arranged side by side at the bottom of the splitting knife, so that when the splitting knife inclines, the splitting knife can rotate and reset by observing numerical values of the pressure sensors under the action of the adjusting assembly, the splitting knife is always kept balanced during use, the pressure at the bottom of the splitting knife is uniformly distributed, and the working efficiency is improved. Therefore, the pressure can be accurately applied to the gaps of the wafer, the pressure applying quality is ensured, the phenomena of disordered cracking and leakage cracking of the wafer are avoided, and the wafer cracking efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates specifically to a wafer dicing machine cutter pressure detection structure. BACKGROUND

[0002] The wafer dicing machine is a kind of equipment that divides wafer into single chip, it is a kind of high-precision, high degree of automation equipment, is widely used in semiconductor, LED manufacturing etc., when it works, first laser dicing is carried out on the surface of wafer, so that the cutting line appears on the surface of wafer, that is, after laser operation, crack appears on the surface of wafer, subsequently, dicing blade is aligned to cutting line and downward pressure is applied, wafer can be divided into two along cutting line, the wafer dicing process is completed, so that large-size wafer is cut into two or more small-size wafers, so as to facilitate subsequent packaging and testing, meet different use demands;

[0003] However, the existing dicing blade is affected by the film when it is used, the film has certain ductility, the angle of dicing blade is inclined in the process of cyclic rising reset or descending pressure, when dicing blade descends and presses again, pressure distribution is uneven, wafer gap is broken and even missed, greatly influence wafer dicing efficiency.

[0004] Therefore, it is necessary to invent a wafer dicing machine cutter pressure detection structure to solve the above problems. CONTENT OF UTILITY MODEL

[0005] (One) utility model purpose

[0006] To solve the technical problems in the background art, the utility model provides a wafer dicing machine cutter pressure detection structure, by installing multiple pressure sensors side by side on the bottom of dicing blade, when the angle of dicing blade is inclined, under the action of adjusting assembly, by observing the value of pressure sensor, dicing blade can be reset, so that dicing blade always keeps balance when it is used, bottom pressure distribution is uniform, so that the gap of wafer can be accurately pressed, ensure the quality of pressure, avoid wafer broken and missed, greatly improve wafer dicing efficiency.

[0007] (Two) technical scheme

[0008] In order to achieve the above object, the utility model provides the following technical scheme: a wafer dicing machine cutter pressure detection structure, including the side plate, install the positioning column of side plate front side, the fan shape gear of outside set of positioning column, with the top rod connected with the fan shape gear bottom, with the bottom rod connected with top rod bottom end, install the dicing blade of bottom end for wafer dicing of bottom rod, and a plurality of pressure sensors are installed on the outside of the bottom of the dicing blade, which are used to detect the pressure of the bottom of the dicing blade, further including setting in side plate front side, the adjusting assembly for adjusting the angle of dicing blade.

[0009] Preferably, the dicing blade is provided as a triangular prism, and the plurality of pressure sensors are arranged side by side on both sides of the bottom of the dicing blade.

[0010] Preferably, the adjusting assembly comprises a positioning ring mounted on the front side of the side plate, a push rod arranged inside the positioning ring, and a plurality of teeth mounted on the bottom of the push rod along the length direction of the push rod, the teeth being engaged with the fan-shaped gear.

[0011] Preferably, the number of positioning rings is two, and the two positioning rings are symmetrically distributed about the center of the side plate.

[0012] Preferably, the top of the side plate is connected with a top plate, the bottom of one side of the top plate is mounted with an air cylinder, and the output end of the air cylinder is connected with the end of the push rod.

[0013] Preferably, the side plate is provided as a T shape, the positioning column is arranged on the vertical edge of the side plate, and the positioning column is connected with the fan-shaped gear through a bearing.

[0014] Preferably, two stop rings are connected outside the positioning column, and the two stop rings are respectively located on the front and rear sides of the fan-shaped gear.

[0015] Compared with the prior art, the above technical scheme of the utility model has the beneficial effects that:

[0016] The utility model discloses a plurality of pressure sensors are installed side by side on the bottom of the dicing blade, so that the pressure of each part of the bottom of the dicing blade is detected in real time when the dicing blade is used, if the left and right pressure values are not equal, that is, when the angle of the dicing blade is inclined, under the action of the adjusting assembly, by observing the values of the pressure sensors, the dicing blade can be rotated and reset, so that the dicing blade can be detected in real time, and the dicing blade can always keep balance when used, the bottom pressure is uniformly distributed, so that the wafer gap can be accurately pressed, the pressure quality is guaranteed, the wafer cracking and missing phenomenon are avoided, and the wafer dicing efficiency is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to make the technical personnel in the art better understand the technical scheme of the present application, the following will be further described in detail with reference to the drawings.

[0018] Figure 1 It is the whole structure schematic view of the present application;

[0019] Figure 2 It is the exploded view of the present application;

[0020] Figure 3 It is the perspective view of the present application;

[0021] Figure 4 It is the perspective view of the present application from another angle.

[0022] Mark explanation of drawing:

[0023] 1 side plate, 2 positioning column, 3 sector gear, 4 ejector rod, 5 bottom rod, 6 split blade, 7 pressure sensor, 8 adjusting assembly, 81 positioning ring, 82 push rod, 83 tooth, 9 top plate, 10 air cylinder, 11 blocking ring. Specific implementation

[0024] In order to make the technical personnel in the art better understand the technical scheme of the present application, the following will be further described in detail with reference to the drawings.

[0025] The present application provides a wafer splitting machine cutter pressure detection structure as shown in Figures 1-4 The present application provides a wafer splitting machine cutter pressure detection structure as shown in

[0026] The adjusting assembly 8 includes the positioning ring 81 installed on the front side of the side plate 1, the push rod 82 arranged inside the positioning ring 81, and a plurality of tooth 83 installed on the bottom of the push rod 82 along the length direction of the push rod 82, wherein the tooth 83 is engaged with the sector gear 3.

[0027] In one embodiment, the split blade 6 is provided in a triangular prism shape, and the plurality of pressure sensors 7 are arranged side by side on the two sides of the bottom of the split blade 6, so as to avoid exposed parts on the bottom of the split blade 6, and thus the bottom of the split blade 6 can be detected by the pressure sensors 7.

[0028] In one embodiment, the number of the positioning rings 81 is two, and the two positioning rings 81 are symmetrically distributed about the center of the side plate 1, so as to ensure that the push rod 82 can move horizontally. The top plate 9 is connected to the top of the side plate 1, and the knife pressure detection structure can be assembled with the external wafer splitting machine through the top plate 9. The air cylinder 10 is installed on one side of the bottom of the top plate 9, and the output end of the air cylinder 10 is connected to the end of the push rod 82, so as to drive the push rod 82 to move horizontally, and thus the angle of the split blade 6 can be adjusted.

[0029] In one embodiment, the side plate 1 is provided in a T shape, and the positioning column 2 is arranged on the vertical edge of the side plate 1. The positioning column 2 is connected to the sector gear 3 through a bearing, so that the sector gear 3 can rotate stably and smoothly. The two stop rings 11 are connected to the outer side of the positioning column 2, and the two stop rings 11 are respectively located on the front and rear sides of the sector gear 3, so as to avoid the sector gear 3 from shaking in the front and rear directions, and thus the stability of the sector gear 3 during rotation is ensured again.

[0030] In one embodiment, the top plate 9 is connected to the driving assembly of the external wafer splitting machine, so that the wafer splitting machine knife pressure detection structure can move up and down reciprocally, the wafer is split, and the pressing pressure of the split blade 6 can be adjusted according to the thickness of the wafer to be split. The pressure sensor 7 can be used to detect whether the pressure of the split blade 6 reaches the required pressure, and the wafer splitting operation of wafers with different thicknesses is realized.

[0031] In one embodiment, the pressure sensor 7 is provided as a flexible thin film pressure sensor with a model of SPF05-10, so that the pressure sensor 7 can be attached to the bottom of the split blade 6. In use, the wafer that has been laser split by the wafer splitting machine is placed below the split blade 6, and the crack at the wafer splitting position is aligned with the bottom of the split blade 6. The bottom of the wafer is hollow except for the two sides. Then, the split blade 6 moves downward under the driving of the driving assembly, and presses the crack of the wafer, so that the wafer is split into two pieces. When the split blade 6 presses the wafer, the split blade 6 does not directly contact the wafer, but indirectly contacts the wafer through the pressure sensor 7 at the bottom of the split blade 6. Thus, in use, the pressure received by each part of the bottom of the split blade 6 is detected by the pressure sensor 7 and displayed on the display screen of the wafer splitting machine, so that the user can know the situation.

[0032] Meanwhile, during the use of the splitting blade 6, if the left side pressure is less than the right side pressure, it indicates that the left side of the splitting blade 6 is upwarping, that is, the whole splitting blade 6 is inclined clockwise to the right, at this time, the output end of the air cylinder 10 is extended, the push rod 82 is pushed to move left, the tooth 83 at the bottom of the push rod 82 is moved left, and the sector gear 3 is driven to rotate counterclockwise with the positioning column 2 as the center, so that the top rod 4 drives the bottom rod 5 to rotate counterclockwise, and further drives the splitting blade 6 to rotate counterclockwise with the positioning column 2 as the center, that is, the whole splitting blade 6 rotates left, until the pressure values detected by the two side pressure sensors 7 are equal, which indicates that the splitting blade 6 is reset to the horizontal state, and the wafer splitting process can be continued;

[0033] Similarly, if the right side pressure is less than the left side pressure, it indicates that the right side of the splitting blade 6 is upwarping, that is, the whole splitting blade 6 is inclined counterclockwise to the left, at this time, the pressure value is transmitted to the processor on the wafer splitting machine by the pressure sensor 7, the output end of the air cylinder 10 is retracted, and the splitting blade 6 is driven to rotate right by the transmission of the push rod 82, the tooth 83, the sector gear 3, the top rod 4 and the bottom rod 5, until the pressure values detected by the two side pressure sensors 7 are equal, which indicates that the splitting blade 6 is reset to the horizontal state;

[0034] In summary, by installing multiple pressure sensors 7 side by side at the bottom of the splitting blade 6, the pressure at each part of the bottom of the splitting blade 6 can be detected in real time during the use of the splitting blade 6, if the left and right pressure values are not equal, that is, the angle of the splitting blade 6 is inclined, under the action of the adjusting assembly 8, by observing the values of the pressure sensors 7, the splitting blade 6 can be reset to rotate, so that the splitting blade 6 can be detected in real time, and the bottom pressure distribution is uniform during use, so that the wafer gap can be accurately pressed, the pressure quality is guaranteed, the wafer cracking efficiency is greatly improved, and the wafer cracking efficiency is greatly improved.

[0035] The embodiment specifically solves the problem that the existing splitting blade 6 in the prior art is affected by the film remaining at the wafer crack, which has a certain ductility, and the angle of the splitting blade 6 is inevitably inclined during the cyclic rising and resetting or descending and pressing process, so that the pressure distribution is uneven when the splitting blade 6 descends and presses again, the wafer gap is cracked or even missed, and the wafer cracking efficiency is greatly affected.

[0036] The above only describes certain exemplary embodiments of the present application by way of illustration, without doubt, for ordinary skilled in the art, without departing from the spirit and scope of the present application, the described embodiments can be modified in various ways. Therefore, the above description and drawings are illustrative in nature, and should not be construed as limiting the scope of protection of the claims of the present application.

Claims

1. A wafer dicing blade pressure detection structure, characterized by: The utility model relates to a wafer breaking device, including side plate (1), the positioning column (2) of installing in side plate (1) front side, the sector gear (3) of setting in positioning column (2) outside, with the top rod (4) of connecting with sector gear (3) bottom, with the bottom rod (5) of connecting with top rod (4) bottom end, install in bottom rod (5) bottom end for wafer breaking piece breaking piece sword (6), and install a plurality of pressure sensor (7) outside the bottom of breaking piece sword (6) for detecting the pressure of breaking piece sword (6) bottom, still include the adjusting assembly (8) of setting in side plate (1) front side for adjusting the angle of breaking piece sword (6).

2. The blade pressure detection structure of a wafer breaking machine according to claim 1, characterized in that: The breaking piece sword (6) is provided as a triangular prism, and a plurality of the pressure sensor (7) is arranged side by side and closely on both sides of the bottom of the breaking piece sword (6).

3. The blade pressure detection structure of a wafer breaking machine according to claim 1, characterized in that: The adjusting assembly (8) includes a positioning ring (81) mounted on the front side of the side plate (1), a push rod (82) arranged inside the positioning ring (81), a plurality of teeth (83) mounted on the bottom of the push rod (82) along the length direction of the push rod (82), and the teeth (83) are engaged with the sector gear (3).

4. The blade pressure detection structure of a wafer breaking machine according to claim 3, characterized in that: The number of the positioning ring (81) is two, and the two positioning rings (81) are symmetrically distributed about the center of the side plate (1).

5. The blade pressure detection structure of a wafer breaking machine according to claim 3, characterized in that: The top plate (9) is connected to the top of the side plate (1), one side of the bottom of the top plate (9) is provided with a gas cylinder (10), and the output end of the gas cylinder (10) is connected with the end of the push rod (82).

6. The blade pressure detection structure of a wafer breaking machine according to claim 1, characterized in that: The side plate (1) is provided as a T shape, the positioning column (2) is arranged on the vertical edge of the side plate (1), and the positioning column (2) is connected with the sector gear (3) through a bearing.

7. The blade pressure detection structure of a wafer breaking machine according to claim 6, characterized in that: The positioning column (2) is connected with two stop rings (11) outside, and the two stop rings (11) are respectively located on the front and back sides of the sector gear (3).

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