Optical transmission assembly

Abstract

An optical transmitting assembly comprises a rigid-flex board, a tube shell and an optical transmitting component set placed in the tube shell, the rigid-flex board comprises a DC flexible board comprising a DC interface, an RF flexible board comprising an RF interface and a rigid board, the tails of the DC flexible board and the RF flexible board are in press fit connection through the rigid board, and a rigid-flex board combination area is welded and fixed to the tube shell. The tail part of the rigid-flex board enters the tube shell, a gold thread binding area is arranged on the rigid-flex board entering the tube shell, the optical transmitting component group is in bonding connection with the gold thread binding area through gold wires, and an optical fiber via hole is formed in the rear part of the tube shell; the optical transmitting component group comprises a multi-channel radio frequency signal modulation assembly, a ceramic substrate, a TEC module and a thermistor. According to the utility model, the rigid-flex board is directly connected to the tube shell and participates in gold wire bonding, so that the requirement of the optical transmission assembly for multi-channel small size is ensured, and the problem of poor isolation between channels of the original transition substrate can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to quantum communication, quantum computing, laser radar technical field, concretely is a kind of optical transmitting assembly. BACKGROUND

[0002] The function of optical transmitting assembly (TOSA) in the existing optoelectronic module is to convert electrical signal into optical signal and input optical fiber for transmission, and the function of optical receiving assembly (ROSA) is to receive optical signal transmitted by optical fiber and convert it into electrical signal. Whether TOSA assembly or ROSA assembly, the packaging method is basically TO packaging, BOX packaging or butterfly packaging, and the three packaging forms are one end for electrical interface and one end for optical interface. In order to meet the requirement of higher transmission rate, the form of electrical interface is also constantly improved. However, the existing electrical interface is built-in to the tube shell, realizing the connection of tube shell airtightness and electrical signal.

[0003] In order to ensure high bandwidth and high isolation, the electrical interface is designed in one with the tube shell by adopting the way of radio frequency connector, but in the assembly scheme of multi-channel optoelectronic module, due to the size limitation of radio frequency connector, the overall size of optoelectronic module is difficult to be small. Therefore, in order to reduce the overall size, the existing scheme adopts the form of transition substrate to connect the electrical signal inside and outside the cavity in the application scene with low isolation requirement, as shown in Figure 1 and Figure 2 , to ensure the demand of multi-channel packaging and small size.

[0004] In order to meet the technical requirements of small size and transmission frequency at the same time, a transition substrate is made and sintered with the tube shell in the existing multi-channel optoelectronic module assembly packaging, and microstrip line interface is provided externally. The electrical signal connection between packaged optoelectronic module assembly and PCB is connected by FPC plate ( Figure 1 ) or gold wire bonding ( Figure 2 ) mode.

[0005] The transition substrate connection between the FPC plate and the shell and the connection between the FPC plate and the PCB plate will exist impedance discontinuity, which will cause the bandwidth to be reduced in the processing of high-frequency signals. And the connection of the two is basically realized by welding, which has reliability problems. In addition, in the two connection places, the conventional processing method cannot realize the complete isolation of each channel transmission line, so that the isolation degree is at most 30dB@10G bandwidth. Although the gold wire bonding method has only one connection point on the upper and lower surfaces, the reliability is poor in the actual application scene because the gold wire bonding is exposed outside the shell. Unless the whole is encapsulated, but the whole encapsulation will increase the complexity of the process. In addition, because of the need for gold wire bonding, the transmission lines on the PCB plate and the transition substrate of the shell need to be exposed, which also indirectly leads to the fact that the isolation degree of the optoelectronic module assembly cannot reach a high level. Practical new type content

[0006] The technical problem to be solved by the present application is how to improve the isolation degree between channels of a multi-channel optical transmitting assembly.

[0007] The present application solves the above technical problems by the following technical means: an optical transmitting assembly, comprising a soft and hard combination board (1), a shell (2), and an optical transmitting component group placed inside the shell (2), the soft and hard combination board (1) comprises a DC soft board (12) comprising a DC interface, an RF soft board (14) comprising an RF interface, and a hard board (16), the tail parts of the DC soft board (12) and the RF soft board (14) are connected by pressing and connecting the hard board (16), the soft and hard board combination area at the tail part of the soft and hard combination board (1) is welded and fixed with the shell (2), the tail part of the soft and hard combination board (1) enters the inside of the shell (2), a gold wire binding area (19) is arranged on the soft and hard combination board (1) entering the inside of the shell (2), the optical transmitting component group is connected with the gold wire binding area (19) by gold wire bonding, an optical fiber via hole (22) is opened at the rear part of the shell (2), the optical transmitting component group comprises a multi-channel radio frequency signal modulation assembly, a ceramic substrate (32), a TEC module (33), and a thermistor (34), wherein the multi-channel radio frequency signal modulation assembly, the ceramic substrate (32), and the thermistor (34) are all installed on the TEC module (33), and the TEC module (33) is installed at the bottom of the groove (21) of the shell (2).

[0008] As a further optimization technical solution, each channel radio frequency signal modulation component includes an independent DFB chip (312), a back light detector (314), a lens (316), an isolator (317), an FA optical fiber (318), and a transmission line of an independent channel, the lens (316), the isolator (317), and the FA optical fiber (318) are sequentially arranged at the rear end of the DFB chip (312) along the optical path, wherein the DFB chip (312), the back light detector (314), and the thermistor (34) are all mounted on the ceramic substrate (32), and the ceramic substrate (32), the lens (316), the isolator (317), and the FA optical fiber (318) are all mounted on the TEC module (33).

[0009] As a further optimization technical solution, the connection structure of the DC soft board (12) and the light transmitting component group is as follows:

[0010] 1) The DC soft board (12) and the back light detector (314) are connected through gold wire bonding;

[0011] 2) The DC soft board (12) and the positive and negative ends of the TEC module (33) are connected through gold wire bonding;

[0012] 3) The DC soft board (12) and the thermistor (34) are connected through gold wire bonding;

[0013] The connection structure of the RF soft board (14) and the light transmitting component group is as follows:

[0014] The RF soft board (14) and the ceramic substrate (32) are connected through gold wire bonding, and the ceramic substrate (32) and the DFB chip (312) are connected through gold wire bonding.

[0015] As a further optimization technical solution, the ceramic substrate (32) is close to the soft and hard combination board (1) and maintains horizontal with the RF soft board (14) of the soft and hard combination board (1).

[0016] As a further optimization technical solution, the top layer of the ceramic substrate (32) adopts the form of a coplanar waveguide GSG, the bottom layer is paved with a ground plane, and the ground planes of the top layer and the bottom layer are connected through a via, and the side surface of the ceramic substrate (32) is metallized for connecting the ground planes of the top layer and the bottom layer.

[0017] As a further optimization technical solution, the soft and hard board combination area at the tail of the soft and hard combination board (1) and the contact surface of the tube shell (2) are metallized to form a metallized area (18), and the soft and hard combination board (1) is welded with the tube shell (2) through the metallized area (18).

[0018] As a further optimization technical scheme, the DC soft board (12) and the RF soft board (14) are arranged in up and down, and the DC soft board (12) and the RF soft board (14) are suspended in the middle part except the tail compression area.

[0019] As a further optimization technical scheme, the gold wire binding area (19) is arranged in a stepped shape.

[0020] As a further optimization technical scheme, the signal wiring of the RF soft board (14) is arranged as a three-layer board, the upper and lower layers are ground planes, and the middle layer is arranged with signal lines; the middle layer signal is wired in a coplanar waveguide GSG mode, and the signal lines are shielded by vias;

[0021] In the RF soft board (14) and the DC soft board (12), the signal lines of the hot-pressing welding area (13) located at the front part are wired on the upper surface layer of the RF soft board (14) and the DC soft board (12), and the periphery of the welding pads on the upper surface layer of the RF soft board (14) and the DC soft board (12) is wrapped with a ground plane.

[0022] As a further optimization technical scheme, the length of the DC soft board (12) is inconsistent with the length of the RF soft board (14).

[0023] The utility model discloses the advantages are:

[0024] 1) the utility model discloses a soft and hard combination board transmission signal, and the soft and hard combination board is directly connected into the tube shell, participates gold wire bonding, guarantees the demand of the optical transmitting assembly multi -channel small -size, and can solve the problem of the poor isolation of the original transition substrate channel interval;

[0025] 2) in the utility model, the contact position of the soft and hard combination board and the tube shell adopts metallization treatment, and the air tightness of the optical transmitting assembly is guaranteed;

[0026] 3) the electric interface of the soft and hard combination board to the outside is designed as two layers of structure, is DC interface soft board and RF interface soft board respectively, and the lengths are inconsistent, facilitating external installation;

[0027] 4) the DC soft board and the RF soft board of the soft and hard combination board participate in the signal connection inside the tube shell, the ground plane is designed on the top layer and the bottom layer of the ceramic substrate, and the vias are connected, and the channel isolation of the optical transmitting assembly is further improved. DRAWINGS

[0028] Figure 1 is the structure diagram of the existing optoelectronic module assembly adopting a transition substrate packaging form and FPC board for electrical connection;

[0029] Figure 2 is the structure diagram of the existing optoelectronic module assembly adopting a transition substrate packaging form and gold wire bonding for electrical connection.

[0030] Figure 3 is the overall sectional view of the soft and hard combination board packaging form in the embodiment of the utility model;

[0031] Figure 4 is the structure view of the soft and hard combination board in the embodiment of the utility model;

[0032] Figure 5 is the structure view of the TOSA assembly in the embodiment of the utility model;

[0033] Figure 6 is the internal sectional view of the TOSA assembly in the embodiment of the utility model;

[0034] Figure 7 is the layout view of the parts in each passage of the TOSA assembly in the embodiment of the utility model;

[0035] Figure 8 is the connection view of the optical transmitting assembly and the PCB of the soft and hard combination board packaging form in the embodiment of the utility model. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0037] It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. The diagrams provided in the following embodiments only illustrate the basic concept of the utility model in a schematic manner, and only show the components related to the utility model in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be changed arbitrarily, and the component layout pattern can also be more complex.

[0038] It should be noted that the direction terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only the directions of the drawings, and are not used to limit the protection scope of the disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. When it may cause confusion to the understanding of the disclosure, the conventional structure or configuration will be omitted.

[0039] The use of ordinal numbers such as "first", "second", "third" and the like in the description and claims is used to modify a respective element and does not imply that the element so modified has any particular order or sequence with respect to another, or that a sequence or order is required in the manufacture or operation of the apparatus.

[0040] Embodiment one

[0041] The embodiment provides a multi-channel optoelectronic module assembly with FPC soft board and shell integrated packaging mode, which is suitable for packaging of multi-channel array optical transmitting assembly and optical receiving assembly. For high-speed transceiver assembly, external electrical interfaces are divided into DC interface and RF (radio frequency) interface. In the embodiment, the DC interface and the RF interface are respectively arranged on two FPC soft boards. The middle of the tail of the two FPC soft boards is pressed by a hard board (such as FR4, and the material of the hard board is not limited), as shown in Figure 3 and Figure 4 The soft and hard combination board 1 containing the DC interface and the RF interface is formed. The tail of the soft and hard combination board 1 is metallized to form a metallized area 18 at the contact surface of the soft and hard combination board 1 and the shell 2, so as to facilitate welding of the soft and hard combination board 1 and the shell 2 and ensure the air tightness. The tail of the soft and hard combination board 1 enters the inside of the shell 2, and the tail of the soft and hard combination board 1 entering the inside of the shell 2 participates in gold wire bonding. The shell 2 is provided with a mounting groove 21 for accommodating transceiver components. The shell 2 is provided with an optical fiber via hole 22 at the rear part, and the optical fiber connection is realized through the optical fiber via hole 22.

[0042] The soft and hard combination board 1 includes the DC soft board 12, the RF soft board 14 and the hard board 16 arranged in an up-down mode. The tail of the DC soft board 12 and the tail of the RF soft board 14 are pressed by the hard board 16 in the middle, and the other parts of the DC soft board 12 and the RF soft board 14 are suspended in the middle. The hard board 16 mainly provides support for the two soft boards and can participate in the packaging of the shell 2. The metallized area 18 is formed around the pressing area of the soft and hard combination board 1, so as to facilitate welding with the shell 2 and ensure the air tightness of the shell 2.

[0043] The tail of the rigid-flex board 1 entering the inside of the tube shell 2 is provided with a gold wire binding area 19, which is provided in a stepped shape. The upper layer of the stepped shape is a DC soft board 12 signal connection area, which realizes the signal connection of a direct current bias signal, a driving signal of a semiconductor refrigerator (TEC), a thermistor and a back light detector, and only needs to ensure the connectivity and current passing capacity. The lower layer of the stepped shape is an RF soft board 14 connection area for realizing the connection of a radio frequency signal. The signal wiring of the RF soft board 14 is provided in a three-layer board. The upper and lower two layers are ground planes, and the middle layer is provided with signal lines. The signal lines in the middle layer are routed in a coplanar waveguide GSG mode, and the signal lines are shielded by vias to ensure the isolation between the signals in the RF soft board 14. In the RF soft board 14 and the DC soft board 12, the signal lines of the hot-pressing welding area 13 at the front part are routed on the upper layers of the RF soft board 14 and the DC soft board 12. Therefore, in order to avoid the risk of signal leakage when connected with a user's PCB board, the upper layer pads of the RF soft board 14 and the DC soft board 12 are also wrapped with ground planes.

[0044] Embodiment two

[0045] The embodiment provides a TOSA assembly adopting the structure of the rigid-flex board 1 and the package structure of the rigid-flex board 1 and the tube shell 2 in the embodiment one, and can realize a modulation bandwidth of up to 10 GHz.

[0046] As shown in Figure 5 and Figure 6 , the TOSA assembly comprises the rigid-flex board 1, the tube shell 2 and an optical transmitting component group placed in the groove 21 of the tube shell 2. The optical transmitting component group is electrically connected with the gold wire binding area 19 at the tail of the rigid-flex board 1 through gold wire bonding, and the optical transmitting component group is optically connected with the optical fiber through the optical fiber via hole 22 provided at the rear of the tube shell 2.

[0047] The optical transmitting component group comprises a multi-channel radio frequency signal modulation assembly, a ceramic substrate 32, a TEC module 33 and a thermistor 34. Each channel of the multi-channel radio frequency signal modulation assembly can realize independent radio frequency signal modulation. Taking an 8-channel radio frequency signal modulation assembly as an example, each channel comprises an independent DFB (distributed feedback semiconductor laser) chip 312, a back light detector 314, a lens 316, an isolator 317, an FA optical fiber (optical array) 318 and a transmission line of the independent channel. The lens 316, the isolator 317 and the FA optical fiber 318 are sequentially arranged at the rear end of the DFB chip 312 along the optical path. The DFB chip 312, the back light detector 314 and the thermistor 34 are all mounted on the ceramic substrate 32, and the specific layout is as shown in Figure 7As shown, at the same time, the light emitting region of the DFB chip 312 is coaxial with the optical path of the rear end at the design time, ensuring the maximization of the optical coupling efficiency. In addition, the ceramic substrate 32, the lens 316, the isolator 317 and the FA optical fiber 318 are all mounted on the TEC module 33, and the TEC module 33 is mounted on the bottom of the groove 21 of the tube shell 2. The entire optical transmitting component group adopts a TEC module 33 and a thermistor 34 to realize the temperature control requirement inside the cavity.

[0048] The connection of the DC soft plate 12 and the RF soft plate 14 of the soft and hard combination plate 1 in the TOSA assembly with the optical transmitting component group inside the tube shell 2 is as follows:

[0049] The connection structure of the DC soft plate 12 with the optical transmitting component group:

[0050] 1) The DC soft plate 12 is connected with the back light detector 314 through gold wire bonding, and the detection current signal of the back light detector 314 is transmitted;

[0051] 2) The DC soft plate 12 is connected with the positive and negative ends of the TEC module 33 through gold wire bonding, and the driving current of the TEC module 33 is provided;

[0052] 3) The DC soft plate 12 is connected with the thermistor 34 through gold wire bonding, and the temperature detection inside the tube shell 2 is realized.

[0053] The connection structure of the RF soft plate 14 with the optical transmitting component group:

[0054] The RF soft plate 14 is connected with the ceramic substrate 32 through gold wire bonding, the ceramic substrate 32 is connected with the DFB chip 312, the radio frequency signal drives the DFB chip 312 through the RF soft plate 14 and the ceramic substrate 32, the DFB chip 312 converts the input radio frequency signal into an optical signal, and then the optical signal is output from the optical fiber via hole 22 through the lens 316, the isolator 317 and the FA optical fiber 318.

[0055] In the utility model, the ceramic substrate 32 is used as the carrier of the DFB chip 312 and the transmission device of the radio frequency signal, in order to reduce the crosstalk between the radio frequency signals of each channel, improve the stability of the ground plane of the ceramic substrate 32, and reduce the influence of the fluctuation of the ground plane on the transmission isolation degree of the radio frequency signal S, the TOP layer (top layer) is designed in the form of coplanar waveguide GSG, the ground plane G is paved on the BOTTOM layer (bottom layer), and the ground planes of the TOP layer and the BOTTOM layer are connected through the via hole, and the side surface of the ceramic substrate 32 is metallized and used for connecting the ground planes of the TOP layer and the BOTTOM layer, so that the isolation degree between the module channels is further improved.

[0056] Compared with the traditional scheme, the TOSA assembly provided by the utility model does not make the design of transition substrate on the tube shell, but directly connects the rigid-flex board 1 to the inside of the tube shell 2 to participate in gold wire bonding and hermetic packaging. In this way, the low transmission loss of the radio frequency signal can be guaranteed to the maximum extent, and the design of isolation degree is facilitated, and high isolation degree can be achieved.

[0057] The assembly method of the TOSA assembly comprises the following steps:

[0058] 1) the rigid-flex board 1 is connected with the tube shell 2 through welding;

[0059] 2) the bottom surface of the internal TEC module 33 is welded (or bonded, only the thermal conductivity needs to be ensured) with the tube shell 2;

[0060] 3) the ceramic substrate 32 is installed on the upper surface of the TEC module 33 and is close to the rigid-flex board 1, and the RF soft plate 14 of the rigid-flex board 1 is kept horizontal, so as to reduce the length of the gold wire bonding lead and ensure the radio frequency performance;

[0061] 4) the DFB chip 312 and the thermistor 34 are respectively installed on the ceramic substrate 32 (the conductive adhesive or eutectic welding method can be used);

[0062] 5) the corresponding signals are connected through the gold wire bonding method, including that the ceramic substrate 32 is connected with the RF soft plate 14 of the rigid-flex board 1, the DC soft plate 12 of the rigid-flex board 1 is connected with the TEC module 33 and the thermistor 34, and the ceramic substrate 32 is connected with the DFB chip 312;

[0063] 6) the DFB chip 312 is powered through the RF plate 14 of the rigid-flex board 1, so that the DFB chip 312 emits light, the light path coupling calibration of the rear-stage optical path is performed through the coupling alignment frame, the light power value after coupling is observed through the optical power meter, when the light power is maximum, the coupling is completed. Then the lens 316, the isolator 317 and the FA optical fiber 318 are fixed on the upper surface of the TEC module 33 through the glue, the FA optical fiber 318 extends to the outside of the cavity through the optical fiber via hole 22, and then the optical fiber via hole 22 is sealed by using the glue. In addition, if the FA optical fiber 318 used is metalized, the optical fiber via hole can also be sealed by soldering;

[0064] 7) the back light detector 314 is installed, and the electrical signal connection is completed through the gold wire bonding;

[0065] 8) the upper cover is installed, and the product assembly is completed.

[0066] Example three

[0067] The embodiment provides application of the optical transmitting assembly of the embodiment two, and an electrical interface of the optical transmitting assembly is designed according to a characteristic impedance corresponding microstrip radio frequency interface, as shown in Figure 8 It needs to be connected with a user PCB 100 by direct welding, for example, hot-press welding process, and the DC soft board 12 and the RF soft board 14 on the optical transmitting assembly are welded on the front and back of the PCB 100 respectively.

[0068] The DC soft board 12 and the RF soft board 14 of the soft and hard combination board 1 are designed with different lengths, so that the user can adopt a through-hole process in the welding area when designing the PCB 100, otherwise, because there are pads on the front and back of the PCB 100, a through-hole cannot be designed in high-density wiring, and a buried blind hole can only be used, which increases the manufacturing process of the PCB 100.

[0069] In addition, the signal line interface of the RF soft board 14 adopts a mode that the signal line is wrapped by an external ground plane, so that after the RF soft board 14 is welded with the PCB 100, the signal line is included in the ground plane, and effective signal isolation is formed.

[0070] The above embodiment is only used to illustrate the technical scheme of the utility model, and is not limited to it; although the utility model is described in detail with reference to the foregoing embodiment, those skilled in the art should understand that the technical scheme recorded in the foregoing embodiment can still be modified, or part of the technical features can be replaced equivalently; and the modification or replacement does not make the essence of the corresponding technical scheme deviate from the spirit and range of the technical scheme of the utility model embodiments.

Claims

1. An optical transmitting component, characterized in that: The system includes a rigid-flex PCB (1), a housing (2), and a group of optical transmitting components placed inside the housing (2). The rigid-flex PCB (1) includes a DC flexible board (12) with a DC interface, an RF flexible board (14) with an RF interface, and a rigid board (16). The tails of the DC flexible board (12) and the RF flexible board (14) are pressed together by the rigid board (16). The rigid-flex PCB joint area at the tail of the rigid-flex PCB (1) is welded and fixed to the housing (2). The tail of the rigid-flex PCB (1) enters the interior of the housing (2). 1) A gold wire bonding area (19) is set on the top, and the optical transmitting component group is connected to the gold wire bonding area (19) by gold wire bonding. An optical fiber via (22) is opened at the rear of the tube shell (2). The optical transmitting component group includes a multi-channel radio frequency signal modulation component, a ceramic substrate (32), a TEC module (33) and a thermistor (34). The multi-channel radio frequency signal modulation component, the ceramic substrate (32) and the thermistor (34) are all mounted on the TEC module (33). The TEC module (33) is mounted at the bottom of the groove (21) of the tube shell (2).

2. The optical transmission component as described in claim 1, characterized in that: Each channel RF signal modulation component includes an independent DFB chip (312), a backlight detector (314), a lens (316), an isolator (317), an FA fiber (318), and an independent channel transmission line. The lens (316), the isolator (317), and the FA fiber (318) are arranged sequentially at the rear end of the DFB chip (312) along the optical path. The DFB chip (312), the backlight detector (314), and the thermistor (34) are all mounted on a ceramic substrate (32). The ceramic substrate (32), the lens (316), the isolator (317), and the FA fiber (318) are all mounted on the TEC module (33).

3. The optical transmission component as described in claim 2, characterized in that: The connection structure between the DC flexible board (12) and the optical transmitting component group is as follows: 1) The DC flexible circuit board (12) and the backlight detector (314) are connected by gold wire bonding; 2) The DC flexible board (12) and the positive and negative terminals of the TEC module (33) are connected by gold wire bonding; 3) The DC flexible board (12) and the thermistor (34) are connected by gold wire bonding; The connection structure between the RF flexible board (14) and the optical transmitting component group is as follows: The RF flexible board (14) is connected to the ceramic substrate (32) by gold wire bonding, and the ceramic substrate (32) is connected to the DFB chip (312) by gold wire bonding.

4. The optical transmission component as described in claim 1, characterized in that: The ceramic substrate (32) is close to the rigid-flex plate (1) and is level with the RF flexible board (14) of the rigid-flex plate (1).

5. The optical transmission component as described in claim 1, characterized in that: The top layer of the ceramic substrate (32) is in the form of a coplanar waveguide GSG, the bottom layer is covered with a ground plane, and the ground planes of the top layer and the bottom layer are connected by vias. The sides of the ceramic substrate (32) are metallized to connect the ground planes of the top layer and the bottom layer.

6. The optical transmitting component as described in claim 1, characterized in that: The contact surface between the flexible and rigid plate bonding area at the tail of the flexible and rigid plate (1) and the shell (2) is metallized to form a metallized area (18), and the flexible and rigid plate (1) is welded to the shell (2) through the metallized area (18).

7. The optical transmitting component as described in claim 1, characterized in that: The DC flexible board (12) and the RF flexible board (14) are arranged vertically, and except for the tail pressing area, the other parts between the DC flexible board (12) and the RF flexible board (14) are suspended in the middle.

8. An optical transmitting component as described in claim 1, characterized in that: The gold wire binding area (19) is set in a stepped shape.

9. An optical transmitting component as described in claim 1, characterized in that: The signal routing of the RF flexible board (14) is configured as a three-layer board, with the top and bottom layers being ground planes and the middle layer containing signal lines. The signal lines in the middle layer are routed in the manner of coplanar waveguide GSG, and the signal lines are shielded around vias. In the RF flexible board (14) and DC flexible board (12), the signal lines of the front thermoforming area (13) are routed on the upper surface of the RF flexible board (14) and DC flexible board (12), and the pads on the upper surface of the RF flexible board (14) and DC flexible board (12) are surrounded by a ground plane.

10. An optical transmitting component as described in claim 1, characterized in that: The DC flexible board (12) and the RF flexible board (14) have different lengths.

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