High-speed bonding head driving device

By designing a high-speed drive device for the swivel motor and a linear motor, the problems of low efficiency and poor coordination in the swivel motor drive are solved, achieving high packaging quality and efficiency.

CN223566580UActive Publication Date: 2025-11-18JIANGSU XINZHIDA NEW ENERGY EQUIP CO LTD
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Patent Information

Application Number
CN202422696732.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-05
Publication Date
2025-11-18
Estimated Expiration
2034-11-05

AI Technical Summary

Technical Problem

In the existing technology, the efficiency of the bonding head drive is low and the coordination between oscillation and jogging is poor, resulting in low packaging quality and efficiency.

Method used

The device employs a high-speed drive mechanism for the bearing head, which uses a swing motor to drive the bearing head to swing in a circular direction, and combines this with a linear motor to drive the bearing head to reciprocate in a vertical direction, thus achieving a composite motion of the bearing head.

Benefits of technology

It improves packaging quality and efficiency, ensures the coordination and precision of the connector movement, and enhances the overall performance of the packaged device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a bonding head high-speed driving device which is characterized in that a bonding head is mounted on a mounting seat, a fixing frame is arranged on the mounting seat, a swing motor is vertically and fixedly arranged on the fixing frame, an inching mechanism is arranged on an output shaft of the swing motor, and the swing motor drives the inching mechanism to swing in the circumferential direction. The bonding head is arranged on the inching mechanism, the inching mechanism drives the bonding head to do reciprocating inching in the vertical direction, the bonding head can efficiently coordinate driven movement by arranging a composite rotation driving mode of swinging and inching of the bonding head, and the inching contact speed, pressure and the like can be accurately adjusted and designed through a linear motor. And the packaging quality and the packaging efficiency are relatively high.
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Description

TECHNICAL FIELD

[0001] The utility model relates to discrete device packaging field especially relates to a bonding head high speed driving device. BACKGROUND

[0002] DieBond process is a common packaging form in semiconductor packaging, mainly after wafer slicing process, the chip on wafer blue film is peeled off through bonding head (also called welding head), and is pasted in the mounting area on the frame, the sheet or other packaging body under the action of adhesive such as silver paste, tin paste etc. The contact pressure, movement speed, pick-and-place precision etc. of DieBond process bonding head picking and die bonding work directly affect the quality and packaging efficiency of the whole packaging device. SUMMARY

[0003] The technical problem to be solved by the utility model is: in the prior art, the bonding head driving efficiency is low, and the coordination of swing and point motion is poor, resulting in low packaging quality and packaging efficiency, the utility model provides a bonding head high speed driving device to solve the above problems.

[0004] The technical scheme adopted by the utility model to solve its technical problem is: a bonding head high speed driving device, the bonding head is installed on the mounting seat, the mounting seat is provided with a fixing frame, a swing motor is vertically fixed on the fixing frame, a point motion mechanism is arranged on the output shaft of the swing motor, the swing motor drives the point motion mechanism to swing in the circumferential direction, the point motion mechanism is provided with the bonding head, and the point motion mechanism drives the bonding head to reciprocate in the vertical direction.

[0005] Further, a first sliding rail is arranged on the output shaft of the swing motor in the vertical direction, a first sliding block is slidably installed on the first sliding rail, the point motion mechanism comprises a point motion turntable, a point motion sliding seat, a second sliding rail and a second sliding block, the point motion turntable is installed on the first sliding block, and the bonding head and the point motion turntable are fixedly connected; the point motion sliding seat is installed at the bottom of the point motion turntable through a hinge joint point; the first sliding rail is vertically fixed on the fixing frame, the second sliding block is slidably installed on the first sliding rail, and the point motion sliding seat is fixedly installed on the second sliding block; the point motion mechanism further comprises a linear motor arranged on the fixing frame and driving the point motion sliding seat to move in the vertical direction.

[0006] Further, the number of the first sliding rail and the first sliding block is two respectively, and two first sliding rails are vertically installed on the two sides of the output shaft of the swing motor respectively.

[0007] Further, the second slide rails and the second sliding blocks are two in number respectively, the two second slide rails are arranged on the fixed frame in parallel and apart from each other, and the linear motor is arranged between the two second slide rails.

[0008] The utility model discloses a kind of bonding head high-speed driving devices, by setting the compound rotary drive mode of bonding head swing and point motion, make bonding head can be driven movement efficiently coordinated, and the contact speed, pressure etc. BRIEF DESCRIPTION OF DRAWINGS

[0009] The utility model is further illustrated below in combination with drawings and examples.

[0010] Figure 1 It is a kind of bonding head high-speed driving device structure schematic view of the utility model;

[0011] Figure 2 It is Figure 1 In the structure schematic view of mounting seat is omitted;

[0012] Figure 3 It is Figure 2 In the partial structure schematic view of point motion sliding seat and point motion turret installation.

[0013] In the figure 1, mounting seat, 2, bonding head, 3, fixed frame, 4, swing motor, 5, first slide rail, 6, first sliding block, 7, point motion turret, 8, point motion sliding seat, 9, second slide rail, 10, second sliding block, 11, hinge point, 12, linear motor. DETAILED DESCRIPTION

[0014] The embodiments of the utility model are described in detail below, the examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and can not be understood as the limitation of the utility model. On the contrary, the embodiments of the utility model include all changes, modifications and equivalents falling within the spirit and scope of the appended claims.

[0015] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0016] In addition, the terms "first", "second", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In the description of the utility model, it should be pointed out that, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances. In addition, in the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.

[0017] Any process or method descriptions in the flowchart or otherwise described herein, can be understood as representing code modules, segments, or portions of code that include one or more executable instructions for implementing specific logic functions or steps, and the scope of the preferred embodiments of the utility model includes additional implementation in which the functions described are performed in a different order, including substantially simultaneously, or in reverse order, as will be understood by those skilled in the art of the embodiments of the utility model.

[0018] As Figures 1 to 3 The utility model provides a kind of bonding head 2 high-speed driving device, bonding head 2 is installed on mounting seat 1, fixed frame 3 is provided on the mounting seat 1, swing motor 4 is vertically fixed and arranged on the fixed frame 3, point dynamic mechanism is provided on the output shaft of swing motor 4, swing motor 4 drives the point dynamic mechanism to swing along circumferential direction, the point dynamic mechanism is provided with the bonding head 2 on it, and the point dynamic mechanism drives the bonding head 2 to reciprocate point motion along vertical direction.

[0019] The output shaft of the swing motor 4 is provided with a first sliding rail 5 in the vertical direction, and the first sliding rail 5 is slidably provided with a first sliding block 6. The jog mechanism comprises a jog turret 7, a jog slide 8, a second sliding rail 9 and a second sliding block 10. The jog turret 7 is installed on the first sliding block 6, and the bonding head 2 and the jog turret 7 are fixedly connected. The jog slide 8 is installed on the bottom of the jog turret 7 through a hinge point 11. The first sliding rail 5 is vertically fixedly arranged on the fixed frame 3, and the second sliding block 10 is slidably arranged on the first sliding rail 5. The jog slide 8 is fixedly arranged on the second sliding block 10. The jog mechanism further comprises a linear motor 12 arranged on the fixed frame 3 and configured to drive the jog slide 8 to move in the vertical direction.

[0020] During the picking and bonding of the crystal, the bonding head 2 needs to swing back and forth between two or more positions. The end of the bonding head 2 is provided with a vacuum nozzle for adsorbing a chip or a die. Under the driving of the swing motor 4, the jog turret 7 swings back and forth in the circumferential direction. At the same time, due to the action of the first sliding rail 5 and the first sliding block 6, the jog turret 7 can move in the vertical direction while rotating.

[0021] The jog movement of the jog turret 7 is driven by the linear motor 12. Specifically, the linear motor 12 moves up and down to drive the jog slide 8 to move along the second sliding rail 9. When the jog slide 8 moves up and down, the hinge-connected jog turret 7 also moves up and down. Since the jog slide 8 and the jog turret 7 are connected through the hinge point 11, the rotation of the jog turret 7 will not affect the jog slide 8, and the jog slide 8 can also transmit the vertical movement to the jog turret 7.

[0022] The jog turret 7 has a combined movement state of swinging and jogging. The bonding head 2 is arranged on the jog turret 7. In this movement state, the picking and bonding of the chip or the die can be realized. The bonding head 2 is lowered, the vacuum nozzle adsorbs the chip or the die, and then the bonding head 2 is lifted to complete the picking operation. Then the bonding head 2 swings and rotates to another working position, the bonding head 2 is lowered to place the chip or the die on the vacuum nozzle to the specified position, and then the bonding head 2 is lifted to complete the bonding operation. Then the bonding head 2 performs the next picking and bonding cycle.

[0023] The linear motor 12 directly drives the up and down point motion of the point motion slide 8. Compared with the eccentric cam transmission mode in the prior art, the linear motor 12 and the swing motor 4 are highly controllable, which can improve the point motion efficiency of the up and down motion, and can improve the efficiency of the point motion and swing composite motion and the coordination of the composite motion. In addition, during the contact type chip taking and die bonding, the linear motor 12 can adjust the driving speed or state of the linear motor 12 according to the progress of the point motion, so as to realize high-speed transfer and slow end, thereby protecting the taken chip or die and improving the packaging quality.

[0024] The number of the first slide rails 5 and the first slide blocks 6 is two respectively, and the two first slide rails 5 are vertically arranged on the two sides of the output shaft of the swing motor 4 respectively. The number of the second slide rails 9 and the second slide blocks 10 is two respectively, and the two second slide rails 9 are arranged on the fixed frame 3 in parallel, and the linear motor 12 is arranged between the two second slide rails 9.

[0025] The two first slide rails 5 and the first slide blocks 6 are arranged on the two sides of the output shaft of the swing motor 4 in pairs, which is beneficial to the balanced installation of the point motion swing frame 7, and the point motion swing frame 7 can swing stably when being driven to rotate, thereby avoiding vibration or shaking. The two second slide rails 9 and the second slide blocks 10 are also arranged on the two sides of the linear motor 12 in pairs, which can stably guide the point motion slide 8 when the linear motor 12 drives the point motion slide 8 to move up and down, thereby ensuring the smoothness of the point motion, avoiding shaking, improving the maximum speed of the point motion, and improving the efficiency of the chip taking and die bonding.

[0026] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0027] Based on the above ideal embodiments according to the present application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the content in the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A high-speed driving device for a bonding head (2) for mounting on a mounting base (1), characterized in that: The mounting base (1) is provided with a fixing frame (3), the fixing frame (3) is vertically provided with a swing motor (4), the output shaft of the swing motor (4) is provided with a jog mechanism, the swing motor (4) drives the jog mechanism to swing in the circumferential direction, the jog mechanism is provided with the bonding head (2), and the jog mechanism drives the bonding head (2) to reciprocate in the vertical direction.

2. A high speed drive device for a bonding head as claimed in claim 1, characterized in that: The output shaft of the swing motor (4) is provided with a first sliding rail (5) in the vertical direction, the first sliding rail (5) is slidably provided with a first sliding block (6), the jog mechanism comprises a jog turret (7), a jog sliding seat (8), a second sliding rail (9) and a second sliding block (10), the jog turret (7) is installed on the first sliding block (6), and the bonding head (2) and the jog turret (7) are fixedly connected; the jog sliding seat (8) is installed on the bottom of the jog turret (7) through a hinge point (11); the first sliding rail (5) is vertically and fixedly arranged on the fixing frame (3), the second sliding block (10) is slidably arranged on the first sliding rail (5), and the jog sliding seat (8) is fixedly arranged on the second sliding block (10); the jog mechanism further comprises a linear motor (12) arranged on the fixing frame (3) and used for driving the jog sliding seat (8) to move in the vertical direction.

3. A nosepiece high speed drive as claimed in claim 2, characterized in that: The number of the first sliding rail (5) and the first sliding block (6) is two respectively, two first sliding rails (5) are vertically arranged on the two sides of the output shaft of the swing motor (4) respectively.

4. A nosepiece high speed drive as claimed in claim 3, characterized in that: The number of the second sliding rail (9) and the second sliding block (10) is two respectively, two second sliding rails (9) are arranged on the fixing frame (3) in parallel and apart from each other, and the linear motor (12) is arranged between the two second sliding rails (9).