Full-automatic marking and tracing all-in-one machine for semiconductor components
By utilizing an integrated fully automated semiconductor component marking and traceability machine, which combines internal and external negative pressure differences and high-efficiency filters with aluminum alloy tooling fixtures and dust-free linear motors, the contamination problem of wafer storage racks during processing has been solved, achieving the maintenance of cleanliness and the improvement of rotational accuracy.
Patent Information
- Application Number
- CN202423102651.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-16
AI Technical Summary
During semiconductor manufacturing, wafer storage racks are prone to accumulating impurities and contaminants, affecting cleanliness and consequently impacting the quality of packaging and testing.
The fully automated semiconductor component engraving and traceability integrated machine utilizes the principle of internal and external negative pressure difference to draw in and filter air through the top fan filter unit. Combined with aluminum alloy tooling fixtures, PEEK material contact parts, and a dust-free linear motor conveying device, it achieves uniform distribution of clean air and effective removal of pollutants.
This ensures uniform air distribution within the work area, effectively removes contaminants, prevents damage to the outer wall of the wafer storage rack, improves rotational accuracy and positional consistency, and maintains the cleanliness of the wafer cassette.
Smart Images
Figure CN223566589U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor, especially relates to a full -automatic printing of semiconductor component traces back to all -in -one. BACKGROUND
[0002] In the prior art, in the process of semiconductor manufacturing and packaging, wafer box storage rack is the key equipment for carrying and protecting wafer and wafer box. After multiple uses, the surface of wafer box storage rack often accumulates various impurities, dust and oil stains. These pollutants not only may affect the cleanliness of the wafer in the wafer box, but also may cause adverse effects on subsequent packaging and testing links. Therefore, the cleanliness of wafer box storage rack is directly related to the quality of semiconductor products, and the key factor is to ensure the cleanliness in the process of semiconductor manufacturing. SUMMARY
[0003] The embodiment of the application provides a full-automatic printing of semiconductor component traces back to all-in-one machine, which solves the problem of maintaining purity during processing of the wafer box storage rack in the prior art.
[0004] The technical scheme adopted by the embodiment of the application is as follows.
[0005] A full-automatic printing of semiconductor component traces back to all-in-one machine, comprising a cabinet, an automatic door arranged on the cabinet, a tooling jig for limiting the position of a wafer box storage rack, a conveying device for conveying the tooling jig, a printing device for printing on the side wall of a product, a dust removal element for sucking dust generated during processing, and a rotating device for adjusting the direction of the tooling jig towards the printing device; a working area is arranged in the cabinet; the automatic door seals the working area; the two ends of the conveying device pass through the two sides of the working area respectively, and the conveying device is located in the working area; the rotating device is arranged at the acting end of the conveying device; the tooling jig is arranged at the acting end of the rotating device; the printing device is arranged in the working area; the dust removal element is arranged on one side of the printing device, and the dust removal element moves synchronously with the acting end of the printing device; the printing device is perpendicular to the conveying device.
[0006] As a further improvement of the above technical scheme: a fan filter unit is arranged on the top of the cabinet.
[0007] As a further improvement of the above technical scheme: the bottom plate of the tooling jig is made of aluminum alloy; the part of the tooling jig in contact with the product is made of semiconductor-grade non-metallic material.
[0008] As a further improvement of the above technical scheme: a moving device is arranged in the working area; the acting end of the moving device is connected to the printing device; the moving device drives the printing device to move up and down or to move towards or away from the conveying device.
[0009] The one or more technical solutions provided in the embodiments of the application have at least the following technical effects or advantages:
[0010] 1、Due to the principle of internal and external negative pressure difference, air is sucked into the top fan filter unit and filtered through a high-efficiency filter, and the filtered clean air is uniformly sent out at a speed of 0.45 m / s+20% on the entire air outlet surface, when the automatic doors on both sides of the equipment are closed, the airflow flows out from the reserved air outlet; through reasonable airflow organization and airflow speed control, the uniform distribution and effective removal of pollutants in the working area can be ensured; the tooling jig main body is made of aluminum alloy, which is firm, light and durable; the tooling is simple in overall design, stable in use, and the product is stable after being placed, and the position consistency is good; the contact part of the tooling and the product uses PEEK material, which is an excellent electrical insulating material and can prevent the external environment from causing adverse effects on the product; a rotating slip ring is arranged on the rotating device, so there is no need to worry about wire winding, and the rotating device is composed of a worm gear, which improves the rotation accuracy; the conveying device is a dust-free linear motor, which realizes good dust removal effect during processing and prevents damage to the outer wall of the wafer box storage rack. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 It is a structural schematic view of a semiconductor component full-automatic marking and tracing all-in-one machine.
[0012] Figure 2 It is an internal structure schematic view of a semiconductor component full-automatic marking and tracing all-in-one machine.
[0013] In the figure: 1, cabinet; 11, working area; 12, moving device; 13, fan filter unit; 2, automatic door; 3, tooling jig; 4, conveying device; 5, marking device; 6, dust removal part; 7, rotating device. DETAILED DESCRIPTION
[0014] The embodiments of the application provide a semiconductor component full-automatic marking and tracing all-in-one machine, which solves the problem of maintaining the purity of the wafer box storage rack during processing in the prior art.
[0015] The technical solutions in the embodiments of the application are used to solve the above problems, and the general idea is as follows
[0016] In order to better understand the above technical solutions, the above technical solutions will be described in detail in combination with the drawings of the specification and specific embodiments.
[0017] A kind of semiconductor component full-automatic printing traceability integrated machine, including cabinet 1, automatic door 2 being arranged on cabinet 1, limiting wafer box storage rack position tooling fixture 3, conveying tooling fixture 3 conveying device 4, the printing of product side wall is engraved engraving device 5, the dust generated by processing is sucked dust removal element 6, the rotating device 7 of adjusting tooling fixture 3 towards engraving device 5 direction;Cabinet 1 is provided with work area 11;Automatic door 2 seals work area 11;The two ends of conveying device 4 respectively pass through the two sides of work area 11 and conveying device 4 is located in work area 11;Rotating device 7 is arranged at the action end of conveying device 4;Tooling fixture 3 is arranged at the action end of rotating device 7;Engraving device 5 is arranged in work area 11;Dust removal element 6 is arranged at one side of engraving device 5 and dust removal element 6 and the action end of engraving device 5 are synchronously moved;Engraving device 5 and conveying device 4 are perpendicular.
[0018] Fan filter unit 13 is provided at the top of cabinet 1.
[0019] The bottom plate material of tooling fixture 3 is aluminum alloy;The part of tooling fixture 3 that contacts product uses semiconductor-grade non-metallic material.
[0020] Work area 11 is provided with moving device 12;The action end of moving device 12 is connected with engraving device 5;Moving device 12 drives engraving device 5 to move up and down or to move towards or away from conveying device 4.
[0021] The principle of internal and external negative pressure difference is that air is sucked into the top fan filter unit 13, filtered through a high-efficiency filter, and the filtered clean air is uniformly sent out at a speed of 0.45 m / s+20% on the entire air outlet surface. When the automatic door 2 on both sides of the equipment is closed, the airflow flows out from the reserved air outlet. Through reasonable airflow organization and airflow speed control, the uniform distribution of air in work area 11 and the effective removal of pollutants can be ensured. The main body of tooling fixture 3 is made of aluminum alloy, which is strong, light and durable. The overall design of the tooling is simple, stable and consistent in position. The contact part of the tooling and the product uses PEEK material, which is an excellent electrical insulating material that can prevent external environment from affecting the product. Rotating device 7 is provided with a rotating slip ring, so there is no need to worry about wire entanglement. Rotating device 7 is composed of a worm gear, which improves the rotation accuracy. Conveying device 4 is a dust-free linear motor.
[0022] Due to the adoption of the principle of internal and external negative pressure difference, air is sucked into the top fan filter unit 13, filtered through a high-efficiency filter, and the filtered clean air is uniformly sent out at a wind speed of 0.45 m / s+20% on the entire air outlet surface. When the automatic door 2 on both sides of the equipment is closed, the airflow flows out from the reserved air outlet; through reasonable airflow organization and airflow speed control, the uniform distribution and effective removal of pollutants in the work area 11 can be ensured; the main body of the tooling jig 3 is made of aluminum alloy, which is strong, light and durable; the overall design of the tooling is simple and stable, and the product is stable after being placed and does not shake, and has good position consistency; the contact part of the tooling and the product uses PEEK material, which is an excellent electrically insulating material that can prevent external environment from causing adverse effects on the product; the rotating device 7 is provided with a rotating slip ring, so there is no need to worry about wire entanglement, and the rotating device 7 is composed of a worm gear, which improves the rotation accuracy; the conveying device 4 is a dust-free linear motor, which realizes good dust removal effect during processing and prevents damage to the outer sidewall of the wafer box storage rack.
[0023] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to these embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including all the preferred embodiments and all changes and modifications falling within the scope of the present application.
[0024] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.
Claims
1. A fully automated semiconductor component marking and traceability integrated machine, characterized in that, The device includes a cabinet (1), an automatic door (2) mounted on the cabinet (1), a fixture (3) for limiting the position of the wafer storage rack, a conveying device (4) for conveying the fixture (3), an engraving device (5) for engraving the sidewalls of the product, a dust removal device (6) for sucking up the dust generated during processing, and a rotating device (7) for adjusting the fixture (3) toward the engraving device (5); a working area (11) is provided inside the cabinet (1); the automatic door (2) seals the working area (11); and the two ends of the conveying device (4) The conveying device (4) passes through both sides of the working area (11) and is located within the working area (11); the rotating device (7) is located at the working end of the conveying device (4); the tooling fixture (3) is located at the working end of the rotating device (7); the engraving device (5) is located within the working area (11); the dust removal component (6) is located on one side of the engraving device (5) and moves synchronously with the working end of the engraving device (5); the engraving device (5) is perpendicular to the conveying device (4).
2. The fully automatic semiconductor component marking and traceability integrated machine as described in claim 1, characterized in that, A fan filter unit (13) is installed on the top of the cabinet (1).
3. The fully automatic semiconductor component marking and traceability integrated machine as described in claim 1, characterized in that, The base plate of the tooling fixture (3) is made of aluminum alloy; the part of the tooling fixture (3) that comes into contact with the product is made of semiconductor-grade non-metallic material.
4. The fully automatic semiconductor component marking and traceability integrated machine as described in claim 1, characterized in that, The work area (11) is equipped with a moving device (12); the working end of the moving device (12) is connected to the engraving device (5); the moving device (12) drives the engraving device (5) to move up and down or toward the conveying device (4) or away from it.