Device for overturning packaging piece

Abstract

The utility model discloses a device for turning over a packaging piece, which comprises a mounting bottom plate and a cover plate, a plurality of first openings arranged in an array are arranged on the mounting bottom plate corresponding to the packaging piece, a plurality of limiting convex pins are uniformly arranged on the peripheral side of each first opening, and a mounting position of the packaging piece is enclosed by the plurality of limiting convex pins. A plurality of height limiting convex needles are further arranged on the mounting bottom plate, the height of the height limiting convex needles is larger than the thickness of the packaging part, and the height of the limiting convex needles is larger than that of the height limiting convex needles; a plurality of second openings are correspondingly formed in the cover plate, a plurality of butt-joint holes are formed in the peripheral side of each second opening, and the limiting convex needles are connected with the butt-joint holes in a matched mode after the packaging part is embedded in the mounting position, so that the cover plate is in lap joint with the height limiting convex needles. According to the utility model, the mounting bottom plate and the cover plate are arranged, and the limiting convex pins and the height limiting convex pins are arranged on the mounting bottom plate, so that all the packaging parts on the mounting bottom plate can be conveniently turned over integrally to detect the welding spherical surfaces of the packaging parts, and the production efficiency is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor packaging especially relates to a device is turned over with packaging piece. BACKGROUND

[0002] The existing packaging piece, for example FCBGA packaging product, its solder ball surface faces down, when visually inspecting the solder ball surface, needs to manually turn over the product 180 DEG, the single product manual turning over operation process has the risk of falling and damaging the substrate, in addition, the whole ship product quantity is different according to product size, and the quantity is 15-32, the single product turns over one by one and consumes time, and, after visually inspecting the product solder ball surface, needs to manually turn over 180 DEG again one by one to reset, therefore, the efficiency is very low. SUMMARY

[0003] The utility model discloses a device is turned over with packaging piece to solve the problem of low efficiency of manual turning over each packaging piece in prior art.

[0004] In order to realize the above-mentioned purpose, the utility model provides a device is turned over with packaging piece, including installation bottom plate and cover plate, the installation bottom plate is equipped with the first opening of a plurality of array arrangement on corresponding the packaging piece, the periphery of each first opening is equipped with a plurality of limiting convex needles that are uniformly arranged, a plurality of limiting convex needles enclose the installation site of the packaging piece, still be equipped with a plurality of height limiting convex needles on the installation bottom plate, the height of height limiting convex needle is greater than the thickness of the packaging piece, the height of limiting convex needle is greater than the height of height limiting convex needle, the cover plate is equipped with the second opening of a plurality of array arrangement on corresponding a plurality of first openings, the periphery of each second opening is equipped with a plurality of butt joint holes, the butt joint hole is set up one to one with limiting convex needle, limiting convex needle is connected with butt joint hole after embedding the packaging piece in the installation site and makes the cover plate overlap a plurality of height limiting convex needles.

[0005] Preferably, the first opening is rectangular and the first opening is surrounded by a first inner wall, a second inner wall, a third inner wall and a fourth inner wall arranged in sequence, the first inner wall is connected with the second inner wall through a first step portion, the second inner wall is connected with the third inner wall through a second step portion, the third inner wall is connected with the fourth inner wall through a third step portion, the fourth inner wall is connected with the first inner wall through a fourth step portion, the first step portion, the second step portion, the third step portion and the fourth step portion all extend to the inside of the first opening, and the size of the first opening is smaller than the size of the packaging piece.

[0006] Preferably, the first opening is arranged on the first surface of the mounting base, and the first opening is arranged on the second surface of the mounting base.

[0007] Preferably, a plurality of first through holes are uniformly arranged on the circumference of each first opening.

[0008] Preferably, two first openings adjacent in the same row and two first openings adjacent in adjacent rows form an installation group, and a second through hole is arranged in the middle of the installation group.

[0009] Preferably, the second opening is rectangular, and the second opening is surrounded by a fifth inner wall, a sixth inner wall, a seventh inner wall and an eighth inner wall arranged in sequence, the fifth inner wall is connected with the sixth inner wall through a fifth step portion, the sixth inner wall is connected with the seventh inner wall through a sixth step portion, the seventh inner wall is connected with the eighth inner wall through a seventh step portion, and the eighth inner wall is connected with the fifth inner wall through an eighth step portion, the fifth step portion, the sixth step portion, the seventh step portion and the eighth step portion all extend to the inside of the second opening, and the size of the second opening is smaller than the size of the packaging piece.

[0010] Preferably, the mounting base has a first surface on which a plurality of limiting protrusions are arranged and a second surface opposite to the first surface, the first surface is used for mounting the packaging piece, and the solder balls of the packaging piece are exposed from the first opening.

[0011] Preferably, the difference between the height limiting protrusion and the thickness of the packaging piece is greater than or equal to 0.5mm and less than or equal to 1mm.

[0012] Preferably, the mounting base and the cover plate are both rectangular.

[0013] Preferably, the height limiting protrusions are distributed at both ends and the middle of the length direction of the mounting base.

[0014] Compared with the prior art, the mounting base and the cover plate are arranged, the limiting protrusions and the height limiting protrusions are arranged on the mounting base, the mounting position of the packaging piece is formed by the limiting protrusions, and the limiting protrusions and the height limiting protrusions are connected with the cover plate to limit the packaging piece, so that the mounting base and the cover plate are connected with each other to limit the packaging piece, all the packaging pieces on the mounting base are conveniently flipped as a whole to detect the solder ball surface of the packaging piece, the detection time of the packaging piece is greatly saved, and the production efficiency is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural diagram of the mounting base in the embodiment of the utility model.

[0016] Figure 2 For Figure 1 Enlarged view at A in the middle.

[0017] Figure 3 For the structure diagram of the cover plate in the embodiment of the utility model.

[0018] Figure 4 For Figure 3 Enlarged view at B in the middle.

[0019] Figure 5 For the structure diagram of the packaging piece in the embodiment of the utility model.

[0020] Figure 6 For the structure diagram of the packaging piece in the embodiment of the utility model.

[0021] Figure 7 For the structure diagram of the packaging piece in the embodiment of the utility model.

[0022] Figure 8 For the structure diagram of the packaging piece in the embodiment of the utility model.

[0023] Figure 9 For the structure diagram of the packaging piece in the embodiment of the utility model.

[0024] Figure 10 For the structure diagram of the packaging piece in the embodiment of the utility model.

[0025] Figure 11 For the structure diagram of the packaging piece in the embodiment of the utility model. Specific implementation

[0026] For the structure diagram of the packaging piece in the embodiment of the utility model.

[0027] As Figures 1 to 11As shown, the utility model embodiment provides a kind of device for turning over package, including installation base plate 1 and cover plate 2, corresponding package 10 is equipped with the array arrangement of several first openings 11 on installation base plate 1, the periphery of each first opening 11 is equipped with the evenly arranged several limit protruding needle 12, several limit protruding needle 12 is enclosed and is installed position 13 of package 10, installation base plate 1 is also equipped with multiple height limiting protruding needle 14, the height of height limiting protruding needle 14 is greater than the thickness of package 10, the height of limit protruding needle 12 is greater than the height of height limiting protruding needle 14;Corresponding several first openings 11 are equipped with the array arrangement of several second openings 21 on cover plate 2, the periphery of each second opening 21 is equipped with several butt joint holes 22, butt joint hole 22 is set one by one with limit protruding needle 12, limit protruding needle 12 is after embedding in installed position 13 with butt joint hole 22 cooperation connection and make cover plate 2 overlap on several height limiting protruding needle 14.Certainly, package 10 for example can be FCBGA package product, the material of installation base plate 1 and cover plate 2 can be steel, installation base plate 1 has the first surface of setting several limit protruding needle 12 and the second surface opposite to first surface, first surface is used to install package 10, package has solder ball surface 101 and the front 102 opposite to solder ball surface 101, as Figure 7 And Figure 9 As shown, after package 10 is installed on installation base plate 1, solder ball 1011 is towards second surface and exposes from first opening 11, limit protruding needle 12 and height limiting protruding needle 14 are set on installation base plate 1, limit protruding needle 12 is not only used to form the installation position 13 of package 10, still used to butt joint with butt joint hole 22 on cover plate 2 to connect installation base plate 1 and cover plate 2, height limiting protruding needle 14 is used to limit the distance between cover plate 2 and installation base plate 1, so that installation base plate 1 and cover plate 2 have gap, avoid cover plate 2 extrusion to package 10 and damage package 10, when using, when needing to carry out visual inspection to the solder ball surface 101 of package 10 with solder ball 1011, just hold installation base plate 1 and cover plate 2 with hand and turn over integrally to make the solder ball surface 101 of all package 10 on installation base plate 1 towards upper, it is very convenient to use, after solder ball surface 101 visual inspection is completed, hold installation base plate 1 and cover plate 2 with hand and turn over integrally to restore the initial orientation of solder ball surface 101 of package 10 towards lower, to facilitate subsequent process operation.

[0028] The utility model discloses an installation base plate and a cover plate are set up, and the limiting convex needle 12 and the height limiting convex needle 14 are set up on the installation base plate 1, and the limiting convex needle 12 forms the installation position 13 of the packaging piece 10, and the limiting convex needle 12 and the height limiting convex needle 14 are connected with the cover plate 2 and are limited, so that the installation base plate 1 and the cover plate 2 are connected with each other to limit the packaging piece 10, and all the packaging piece 10 on the installation base plate 1 can be conveniently turned over as a whole to detect the solder ball surface 101 of the packaging piece 10, the detection time of the packaging piece 10 is greatly saved, and the production efficiency is effectively improved.

[0029] In the embodiment of the utility model, as shown in Figure 2 The first inner wall 111 is connected with the second inner wall 112 through the first step part 115, the second inner wall 112 is connected with the third inner wall 113 through the second step part 116, the third inner wall 113 is connected with the fourth inner wall 114 through the third step part 117, and the fourth inner wall 114 is connected with the first inner wall 111 through the fourth step part 118. The first step part 115, the second step part 116, the third step part 117 and the fourth step part 118 all extend to the inside of the first opening 11, and the size of the first opening 11 is smaller than the size of the packaging piece 10. Specifically, through the setting of the first step part 115, the second step part 116, the third step part 117 and the fourth step part 118, the packaging piece 10 is only four corner portions corresponding to lap on the first step part 115, the second step part 116, the third step part 117 and the fourth step part 118, so that the first opening 11 is large enough.

[0030] Further, as shown in Figures 1 to 2 Each limiting convex needle 12 on the periphery of each first opening 11 is eight, and the outer side of the first inner wall 111, the outer side of the second inner wall 112, the outer side of the third inner wall 113 and the outer side of the fourth inner wall 114 are respectively provided with two limiting convex needles 12.

[0031] Further, as shown in Figure 10 Each first opening 11 is also uniformly arranged with a plurality of first through holes 15 in the circumferential direction. Through the setting of the first through hole 15, the stress of the installation base plate 1 can be released, and in addition, air circulation can be ensured, and water vapor and other residues can be avoided.

[0032] In some other embodiments of the utility model, as shown in Figure 11As shown, two first openings 11 adjacent in the same row and two first openings 11 adjacent in adjacent rows form a mounting group, and a second through hole 16 is arranged in the middle of the mounting group. Specifically, the two first openings 11 adjacent in the same row are a first opening 1101 and a second opening 1102, and the first opening 1101 and the second opening 1102 are adjacent to a third opening 1103 and a fourth opening 1104 in adjacent rows, respectively. The first opening 1101, the second opening 1102, the third opening 1103, and the fourth opening 1104 form a mounting group, and a second through hole 16 is arranged in the middle of the mounting group. The second through hole 16 can be multiple. The arrangement of the second through hole 16 can release the stress of the mounting plate 1, and can also ensure the circulation of air and avoid the residue of water vapor.

[0033] In the embodiment of the utility model, as shown in Figure 4 As shown, the second opening 21 is rectangular and is surrounded by a fifth inner wall 211, a sixth inner wall 212, a seventh inner wall 213, and an eighth inner wall 214 arranged in sequence. The fifth inner wall 211 is connected to the sixth inner wall 212 through a fifth step portion 215, the sixth inner wall 212 is connected to the seventh inner wall 213 through a sixth step portion 216, the seventh inner wall 213 is connected to the eighth inner wall 214 through a seventh step portion 217, and the eighth inner wall 214 is connected to the fifth inner wall 211 through an eighth step portion 218. The fifth step portion 215, the sixth step portion 216, the seventh step portion 217, and the eighth step portion 218 all extend to the inside of the second opening 21, and the size of the second opening 21 is smaller than the size of the packaging piece 10. Specifically, the arrangement of the fifth step portion 215, the sixth step portion 216, the seventh step portion 217, and the eighth step portion 218 allows the packaging piece 10 to be overlapped on the fifth step portion 215, the sixth step portion 216, the seventh step portion 217, and the eighth step portion 218 only at the four corner portions, so that the second opening 21 is large enough.

[0034] In the embodiment of the utility model, the difference between the height-limiting protruding needle 14 and the thickness of the packaging piece 10 is greater than or equal to 0.5 millimeters and less than or equal to 1 millimeter. Thus, the cover plate 2 will not press on the packaging piece 10 and can limit the packaging piece 10.

[0035] In the embodiment of the utility model, as shown in Figure 1 and Figure 3 As shown, the mounting plate 1 and the cover plate 2 are both rectangular, and the height-limiting protruding needles 14 are distributed at both ends and the middle of the length direction of the mounting plate 1, so as to ensure that the cover plate 2 is stably connected to the height-limiting protruding needles 14. Of course, the shapes of the mounting plate 1 and the cover plate 2 are not limited, and can be designed according to actual needs.

[0036] The above disclosed is only a preferred embodiment of the present application, and of course cannot limit the scope of the present application, therefore equivalent changes made according to the patent application scope of the present application still belong to the scope covered by the present application.

Claims

1. An apparatus for turning over a package, characterized in that The mounting base is provided with a plurality of first openings arranged in an array corresponding to the packages, and a plurality of limiting convex pins are uniformly arranged on the periphery of each first opening, and a plurality of limiting convex pins surround the mounting position of the package, and the mounting base is further provided with a plurality of height limiting convex pins, the height of the height limiting convex pins is greater than the thickness of the package, and the height of the limiting convex pins is greater than the height of the height limiting convex pins; The cover plate is provided with a plurality of second openings arranged in an array corresponding to the first openings, and a plurality of butt joint holes are arranged on the periphery of each second opening, and the butt joint holes are arranged one by one corresponding to the limiting convex pins, and the limiting convex pins are connected with the butt joint holes after the package is embedded in the mounting position, and the cover plate is overlapped on the plurality of height limiting convex pins.

2. The package flipping apparatus of claim 1, wherein The first opening is rectangular, and the first opening is surrounded by a first inner wall, a second inner wall, a third inner wall and a fourth inner wall arranged in sequence, the first inner wall is connected with the second inner wall through a first step portion, the second inner wall is connected with the third inner wall through a second step portion, the third inner wall is connected with the fourth inner wall through a third step portion, and the fourth inner wall is connected with the first inner wall through a fourth step portion, the first step portion, the second step portion, the third step portion and the fourth step portion all extend to the inside of the first opening, and the size of the first opening is smaller than the size of the package.

3. The package flipping apparatus of claim 2, wherein There are eight limiting convex pins on the periphery of each first opening, and two limiting convex pins are arranged on the outer side of the first inner wall, the outer side of the second inner wall, the outer side of the third inner wall and the outer side of the fourth inner wall respectively.

4. The apparatus for turning over a package according to claim 3, wherein A plurality of first through holes are also uniformly arranged on the periphery of each first opening.

5. The apparatus for turning over a package according to claim 3, wherein Two first openings in the same row and two first openings in adjacent rows form a mounting group, and a second through hole is formed in the middle of the mounting group.

6. The package flipping apparatus of claim 2, wherein The second opening is rectangular, and the second opening is surrounded by a fifth inner wall, a sixth inner wall, a seventh inner wall and an eighth inner wall arranged in sequence, the fifth inner wall is connected with the sixth inner wall through a fifth step portion, the sixth inner wall is connected with the seventh inner wall through a sixth step portion, the seventh inner wall is connected with the eighth inner wall through a seventh step portion, and the eighth inner wall is connected with the fifth inner wall through an eighth step portion, the fifth step portion, the sixth step portion, the seventh step portion and the eighth step portion all extend to the inside of the second opening, and the size of the second opening is smaller than the size of the package.

7. The package flipping apparatus of claim 1, wherein The mounting base has a first surface provided with a plurality of limiting convex pins and a second surface opposite to the first surface, the first surface is used for mounting the package, and the solder ball of the package is exposed from the first opening.

8. The package flipping apparatus of claim 1, wherein The difference between the height of the height limiting convex pin and the thickness of the package is greater than or equal to 0.5mm and less than or equal to 1mm.

9. The package flipping apparatus of claim 1, wherein The mounting base and the cover plate are both rectangular.

10. The apparatus for turning over a package according to claim 9, wherein The height limiting convex pins are distributed at both ends and the middle part of the length direction of the mounting base.

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