Laser grinding device
By improving the clamping module and moving parts of the laser grinding device, the processing problem of thin workpieces has been solved, achieving efficient and low-cost processing results and expanding the application range of laser grinding devices.
Patent Information
- Application Number
- CN202423189275.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-23
AI Technical Summary
Existing laser grinding equipment has difficulty effectively processing thin sheet workpieces, especially PDC sheet workpieces with diameters between 0.5 inches and 6 inches and thicknesses between 0.5 mm and 3 mm.
By employing an improved clamping module and moving parts, combined with a laser generator and sensors, the thin workpiece is fixed by the clamping module, and the surface is ablated by the laser generator. Precision grinding is achieved by moving in the X/Y/Z directions.
It enables efficient processing of thin sheet workpieces, reduces manual intervention and processing costs, and expands the application fields of laser grinding equipment.
Smart Images
Figure CN223572205U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of laser processing, in particular to a laser grinding device for PDC wafer workpiece processing. BACKGROUND
[0002] Traditional planar processing technology is mostly milling or grinding using tools with higher hardness relative to the hardness of the workpiece being processed. Recently, there have been laser ablation devices. Since most of these devices process block-shaped or thick workpieces, there is no effective solution for processing wafer-shaped workpieces.
[0003] Therefore, it is necessary to improve the existing laser grinding device. CONTENT OF THE INVENTION
[0004] To overcome the above-mentioned shortcomings, the purpose of the present application is to provide a new laser grinding device which improves efficiency, reduces manual participation and processing cost during operation.
[0005] In order to achieve the above purpose, the present application adopts the following technical solutions:
[0006] A laser grinding device, characterized in that it comprises a body, a grinding module arranged in the body, the grinding module comprising:
[0007] A gantry fixed to a base,
[0008] A moving part fixed to the base by an intermediate part,
[0009] A clamping module fixed to the moving part by a connecting part, the clamping module comprising a columnar base, a mounting part is arranged on one side end of the base, a clamping part is arranged on each mounting part, the clamping parts are respectively connected to driving parts in the base, the clamping parts are synchronously moved based on the driving of the driving parts, and a support body is clamped, one side end of the support body is placed with a wafer workpiece to be processed.
[0010] In an embodiment, the end of the clamping part towards the side of the support body has a recess.
[0011] In an embodiment, the support body is columnar, and the curvature of the recess is the same as the curvature of the columnar support body.
[0012] In an embodiment, a buffer layer is arranged on the recess.
[0013] In an embodiment, the buffer layer comprises a rubber layer.
[0014] In an embodiment, three mounting portions are arranged on one side end of the base at equal intervals, and each mounting portion is matched with a clamping portion, and the clamping portion is connected to a driving portion in the base.
[0015] In an embodiment, the sheet workpiece is in a disc shape, and has a diameter of 0.5-6 inches and a thickness of 0.5-3 mm.
[0016] In an embodiment, the diameter of the support body is the same as the diameter of the sheet workpiece.
[0017] In an embodiment, the sheet workpiece is fixed to the end of the support body by an adhesive,
[0018] The end of the base has a bearing area coaxially arranged thereon, and the bearing area is used to place the support body,
[0019] The bearing area is provided with a magnetic component to attract the placed support body.
[0020] In an embodiment, a driving portion is arranged on one side of the top of the gantry, and the driving portion includes a driving motor fixed to a support fixed to one side of the top of the gantry,
[0021] The surface of the support is provided with a guide rail,
[0022] The output end of the driving motor is connected to a lead screw, the lead screw is sleeved with a shaft sleeve, the shaft sleeve is fixed to a side plate, and the same side of the shaft sleeve of the side plate is further provided with a sliding block, and the sliding block is slidably fixed to the matched guide rail,
[0023] The side plate is provided with a laser generator and a sensor,
[0024] The laser generator is used to ablate the surface of the sheet workpiece, and the sensor is used to sense the light and / or sound generated by the light beam at the cutting point.
[0025] Advantages:
[0026] The laser grinding device provided in the application can fix the support body through improvement of the mechanism of the clamping module, and the sheet workpiece is installed / pasted on the end of the support body by an adhesive, so that the sheet workpiece with a diameter of 0.5-6 inches and a thickness of 0.5-3 mm can be processed, and the processable field is expanded. BRIEF DESCRIPTION OF DRAWINGS
[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:
[0028] Figure 1 This is a schematic diagram of the structure of the grinding module of the laser grinding apparatus according to an embodiment of this application;
[0029] Figure 2 This is a schematic diagram of the grinding module from one perspective of an embodiment of this application;
[0030] Figure 3 This is a schematic diagram of the structure of the thin sheet workpiece placed on the stage according to an embodiment of this application;
[0031] Figure 4 This is a schematic diagram of a thin sheet workpiece placed on a support portion according to an embodiment of this application. Detailed Implementation
[0032] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.
[0033] This application discloses a laser grinding device that can process thin sheet workpieces (polycrystalline diamond composite sheets) with a diameter between 0.5 inches and 6 inches and a thickness between 0.5 mm and 3 mm.
[0034] Next, we will combine the appendix Figures 1-4 The laser polishing apparatus of the present application embodiments will be described in detail.
[0035] The laser polishing device includes a body, in which a polishing module is disposed.
[0036] The grinding module includes:
[0037] The gantry frame 110 is fixed to the base 120 and is fixed to the body through the base 120.
[0038] The movable component 130 is fixed to the base 120 via an intermediate component 133. The movable component 130 includes a stacked X-displacement module 132 and a Y-displacement module 131. The X-displacement module 132 is fixed to the Y-displacement module 131 via the intermediate component 132, and the Y-displacement module 131 is fixed to the base 120 via the intermediate component 133.
[0039] The clamping module 150 is fixed to the moving part 130 through the connecting part 140,
[0040] The clamping module 150 clamps the put-in support body 160, one side end of which is placed with the to-be-processed wafer workpiece 200. The wafer workpiece 200 is a PDC (poly crystalline diamond compact) wafer, which is in a disc shape.
[0041] Preferably, the diameter of the wafer workpiece 200 is between 0.5 inch and 6 inch, and the thickness of the wafer workpiece 200 is less than 3 mm, such as between 0.5 mm and 3 mm. It is used for batch laser lapping processing. In this way, clamping of the wafer workpiece which is not easy to clamp is realized, and batch laser lapping processing is realized.
[0042] The X displacement module 132 and the Y displacement module 131 are respectively provided with linear motors, which are electrically connected to a control module (not shown in the figure), and are controlled to move the object table to the target position in the X / Y direction based on the control of the control module.
[0043] The clamping module 150 includes a columnar base 151, and a mounting part 152 (such as three mounting parts 152 arranged at equal intervals) is arranged at the circumferential side end of the base 151 at intervals (such as at equal intervals). Each mounting part 152 is matched with a clamping part 153, and the clamping part 153 is connected to a driving part in the base 151, which is a pneumatic driving type. Preferably, the driving part is connected to an air source (not shown in the figure) through a connecting end 154 on the base 151. The driving of the driving part causes the clamping part 153 to move inward synchronously to fix the put-in columnar support body 160. Preferably, the end of the clamping part 153 towards the support body 160 side has a recess 153a, and the curvature of the recess 153a is the same as or approximately the same as the curvature of the columnar support body 160. Preferably, a buffer layer is mounted on the recess, which is a rubber layer, and the buffer layer has an anti-skid effect.
[0044] The support body 160 is provided with the to-be-processed wafer workpiece 200. Preferably, the wafer workpiece 200 is attached to the end of the support body 160 by an adhesive 161 (such as glue or double-sided tape, preferably the thickness of the double-sided tape is less than 0.2 mm and greater than 0.02 mm). Preferably, the diameter of the support body 160 is the same as or approximately the same as the diameter of the to-be-processed wafer workpiece 200. After the processing / lapping is completed, the workpiece is taken off from the support body 160. In this embodiment, the thinner the thickness of the adhesive is, the better, so as to avoid the influence of the thickness of the adhesive on the wafer workpiece. The flatness of the end surface of the support body 160 is less than 0.05 mm (such as between 0.01 and 0.05), so as to avoid the influence of the flatness on the processing accuracy of the wafer workpiece.
[0045] The top of the gantry 110 is provided with a drive part 180, which includes a drive motor 182 fixed to a support 170, and the support 170 is fixed to the top of the gantry 110 by a fixing part 171.
[0046] The support 170 is provided with a guide rail 172, and the output end 183 of the drive motor is connected to a lead screw 181, and the other end of the lead screw 181 is fixed to the base 120 through a bearing assembly (not shown in the figure). The lead screw 181 is provided with a thread 181a.
[0047] The lead screw 181 is sleeved with a shaft sleeve (not shown in the figure), and the shaft sleeve is fixed to the side plate 190, and the shaft sleeve is provided with a thread matched with the thread 181a.
[0048] The same side of the shaft sleeve is provided with a sliding block 191, which is slidably fixed to the guide rail 172,
[0049] The drive motor drives the rotation of the lead screw, and the rotation of the lead screw drives the movement of the side plate 190 (i.e. movement in the Z direction).
[0050] The side plate 190 is provided with a laser generator (not shown in the figure), and the focal point of the laser emitted by the laser generator falls on the surface of the wafer workpiece to be processed, so as to ablate the surface of the workpiece (grinding),
[0051] and the entire surface of the workpiece is ground based on the movement of the X displacement module 132 and the Y displacement module 131, and the grinding of a certain thickness of the workpiece is realized by moving in the Z direction based on the driving of the drive motor 882.
[0052] Preferably, the support body 160 is made of metal.
[0053] In an embodiment, the end of the base 151 is provided with a bearing area 151a for placing the support body 160. The bearing area 151a is coaxial with the base 151. The bearing area 151a is provided with a magnetic component which attracts the placed support body 160 (temporarily fixes it), and then fixes the support body 160 through the clamping part 153.
[0054] The laser grinding device is also provided with a control module electrically connected to the moving part 130, the drive part 180 and the laser, which controls the operation of the laser grinding device.
[0055] In an embodiment, the side plate 190 further includes a measuring mechanism for measuring the processing size. Preferably, the measuring mechanism includes an optical distance meter which scans the surface height of the workpiece based on instructions and feeds back the scanning information to the control module. Preferably, the optical distance meter includes a 0.1 micron grating ruler.
[0056] In an embodiment, the laser polishing device has a display module electrically connected to the control module for displaying operation information.
[0057] In an embodiment, the laser polishing device has a sensor for sensing light and / or sound generated by the light beam at the cutting point. The sensor is mounted on the side plate.
[0058] In the present application, the terms "upper", "lower", "inner", "middle" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.
[0059] The above embodiments are only for illustrating the technical concepts and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent transformation or modification made in the spirit and essence of the present application should be covered within the protection scope of the present application.
Claims
1. A laser polishing apparatus, characterized in that, include: The main body contains a grinding module. The grinding module includes: The gantry frame is fixed to the base. The movable component is fixed to the base via an intermediate component. A clamping module, fixed to the moving component by a connector, includes a columnar base. Mounting portions are spaced apart on one end of the base, and each mounting portion is fitted with a clamping portion. The clamping portions are connected to a drive unit within the base. Driven by the drive unit, the clamping unit moves synchronously to clamp the inserted support body, on one side of which a thin sheet workpiece to be processed is placed.
2. The laser polishing apparatus as described in claim 1, characterized in that, The end of the clamping part facing the support body has a recess.
3. The laser polishing apparatus as described in claim 2, characterized in that, The support is columnar, and the curvature of the concave section is the same as the curvature or radius of curvature of the columnar support. The flatness of the end face of the support for attaching the thin workpiece is between 0.01 and 0.05 mm.
4. The laser polishing apparatus as described in claim 2 or 3, characterized in that, A buffer layer is installed on the recess.
5. The laser polishing apparatus as described in claim 4, characterized in that, The buffer layer includes a rubber layer.
6. The laser polishing apparatus as described in claim 1, characterized in that, Three mounting portions are equally spaced on one side of the base, and each mounting portion is matched with a clamping portion, which is connected to the driving portion inside the base.
7. The laser polishing apparatus as described in claim 1, characterized in that, The thin sheet workpiece is disc-shaped, with a diameter between 0.5 inches and 6 inches and a thickness between 0.5 mm and 3 mm.
8. The laser polishing apparatus as described in claim 7, characterized in that, The diameter of the support is the same as the diameter of the sheet workpiece.
9. The laser polishing apparatus as described in claim 7 or 8, characterized in that, The thin sheet workpiece is fixed to the end of the support body by an adhesive. The base has a bearing area coaxially arranged at its end, and the bearing area is used to place the support. The bearing area is provided with a magnetic component to attract the inserted support.
10. The laser polishing apparatus as described in claim 1, characterized in that, A drive unit, including a drive motor, is provided on one side of the top of the gantry frame. The drive unit is fixed to a bracket, which is also fixed to one side of the top of the gantry frame. The surface of the bracket is provided with guide rails. The output end of the drive motor is connected to a lead screw, and a bushing is fitted onto the lead screw. The bushing is fixed to a side plate, and a slider is also provided on the same side of the side plate as the bushing. The slider is slidably fixed to the matching guide rail. A laser generator and a sensor are installed on the side plate. The laser generator is used to ablate the surface of the thin sheet workpiece, and the sensor is used to sense the light and / or sound generated by the beam at the cutting point.