Gland device of wafer laminator

Abstract

The utility model discloses a gland device of a wafer laminator, which comprises a gland, the bottom end of the gland is rotatably connected with a fixed plate through a shaft, the fixed plate is arranged at the top of a wafer bearing table, a balance rod is arranged between the fixed plate and the gland, the bottom end of the balance rod is rotatably arranged on the side wall of the fixed plate through a shaft, and the bottom end of the balance rod is fixedly connected with the gland. The top end of the balance rod is hinged to the inner top wall of a gland, and a cutting piece is rotationally arranged at the top of the gland. The utility model belongs to the technical field of cover pressing devices, and particularly relates to a cover pressing device of a wafer film sticking machine.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of capping device, specifically point to wafer film laminating machine's capping device. BACKGROUND

[0002] In the semiconductor manufacturing industry, wafer film laminating machine plays a very key role, the traditional wafer film laminating machine usually mainly by film laminating mechanism, wafer carrier, set up on the wafer carrier cap, control system etc. parts are composed, film laminating mechanism is responsible for the accurate delivery and covers the wafer surface with protective film, wafer carrier provides stable platform for wafer and has accurate positioning function, control system then to the various parameters and actions in the whole film laminating process are coordinated and controlled, ensure that film laminating operation can be carried out according to the preset procedure smoothly.

[0003] The capping part in the traditional wafer film laminating machine needs to be operated by the operator with more effort when opening and closing the capping, and in the film cutting aspect, an external independent cutting device is usually needed, which will occupy more production space. UTILITY MODEL CONTENTS

[0004] The utility model solves the technical problem that the capping part in the wafer film laminating machine needs to be operated with more effort when opening and closing the capping, and in the film cutting aspect, an external independent cutting device is usually needed, which will occupy more production space.

[0005] In order to realize the above function, the technical scheme adopted by the utility model is as follows: the capping device of the wafer film laminating machine, including the capping, the bottom end of the capping is rotatably connected with the fixed plate through the shaft, the fixed plate is arranged on the top of the wafer carrier, a balance bar is arranged between the fixed plate and the capping, the bottom end of the balance bar is rotatably arranged on the side wall of the fixed plate, the top end of the balance bar is hingedly connected to the inner top wall of the capping, and a cutting piece is rotatably arranged on the top of the capping.

[0006] Preferably, the cutting piece comprises a rotating shaft, a connecting seat and a cutting disc, the rotating shaft is rotatably arranged on the top of the capping and extends out at both ends, the connecting seat is detachably arranged on the rotating shaft, an adjusting piece is arranged on the connecting seat, and the cutting disc is detachably arranged on the adjusting piece.

[0007] Preferably, the adjusting piece comprises a double-end screw and a sliding block, the bottom wall of the connecting seat is provided with a sliding groove, the two ends of the double-end screw are rotatably arranged on the sliding groove, the sliding block is threadedly connected with the double-end screw and slidably arranged in the sliding groove, a plug post is arranged on the sliding block, the cutting disc is rotatably arranged on the end of the plug post through a bearing, the other end of the plug post is threadedly connected with a nut, a handle is arranged on the side wall of the connecting seat, and the end of the handle is rotatably penetrated through the connecting seat and connected to the double-end screw.

[0008] Preferably, the bottom wall of the rotating shaft is provided with a clamping seat, and the middle part of the connecting seat is arranged on the clamping seat through bolts.

[0009] Preferably, the top end of the rotating shaft is fixedly connected with a handle.

[0010] Preferably, the front end of the gland is provided with an inclined surface, and the inclined surface is provided with a handle.

[0011] The beneficial effects of the above structure of the utility model are as follows: 1. The cutting part in the device can accurately adjust the position of the cutting disc according to the diameter of the wafer through the adjusting part, so that the wafer circumference can be closely attached during cutting of the film, thereby avoiding problems of irregular cutting of the film or damage to the wafer;

[0012] 2. The cutting function is integrated on the gland of the wafer film sticking machine, the occupied space of the additional equipment is reduced, the overall integration of the film sticking machine is improved, the design of the balance bar enables the gland to remain stable after being opened to a certain angle, reliable support is provided for the placement of the wafer and the cutting operation of the film, and the operator can open and close the gland more easily.

[0013] 3. The connecting seat of the cutting part is connected with the rotating shaft through the clamping seat and the bolts, and the detachable connection mode facilitates quick disassembly and replacement when the cutting disc is worn or fails. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is an overall structure diagram of the utility model embodiment Figure 1 ;

[0015] Figure 2 It is an overall structure diagram of the utility model embodiment Figure 2 ;

[0016] Figure 3 It is an overall structure diagram of the utility model embodiment Figure 2 ;

[0017] Figure 4 It is an overall structure diagram of the utility model embodiment Figure 3 ;

[0018] Figure 5 It is an overall structure diagram of the utility model embodiment Figure 4 .

[0019] 1, gland, 2, fixed plate, 3, balance bar, 4, cutting part, 5, rotating shaft, 6, connecting seat, 7, cutting disc, 8, adjusting part, 9, double-headed screw, 10, sliding block, 11, sliding slot, 12, insertion column, 13, nut, 14, handle, 15, clamping seat, 16, handle, 17, handle. DETAILED DESCRIPTION

[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0022] like Figures 1-5 As shown, the wafer laminating machine of this utility model has a cover device including a cover 1. The front end of the cover 1 is provided with an inclined surface, and a handle 17 is provided on the inclined surface. Holding the handle 17 makes it easy to open and close the cover 1. The bottom end of the cover 1 is rotatably connected to a fixing plate 2 via a shaft. The fixing plate 2 is set on the top of the wafer carrier. A balance bar 3 is provided between the fixing plate 2 and the cover 1. The bottom end of the balance bar 3 is rotatably set on the side wall of the fixing plate 2 via a shaft. The top end of the balance bar 3 is hinged to the inner top wall of the cover 1. The balance bar 3 can maintain the angle after the cover is opened to a certain angle. Since the cover 1 generates a certain force during opening and closing, the balance bar 3 can share these forces. A cutting element 4 is rotatably provided on the top of the cover 1. After the wafer is placed on the wafer carrier of the wafer laminating machine, the film covers the wafer. The cover 1 flips down so that the cutting element 4 presses on the film. The cutting element 4 rotates around the circumference of the wafer to cut the film.

[0023] like Figures 2-3 As shown, the cutting component 4 includes a rotating shaft 5, a connecting seat 6, and a cutting disk 7. The rotating shaft 5 is rotatably mounted on the top of the pressure cover 1 and extends out at both ends. The connecting seat 6 is detachably mounted on the rotating shaft 5. An adjusting component 8 is provided on the connecting seat 6. The cutting disk 7 is detachably mounted on the adjusting component 8. The adjusting component 8 adjusts the position of the cutting disk 7 according to the diameter of the wafer.

[0024] like Figures 2-3As shown, the adjusting member 8 comprises a double-end screw 9 and a sliding block 10, the bottom wall of the connecting seat 6 is provided with a sliding groove 11, both ends of the double-end screw 9 are rotatably arranged on the sliding groove 11, the sliding block 10 is threadedly connected with the double-end screw 9 and slidably arranged in the sliding groove 11, a plug column 12 is penetrated through the sliding block 10, the cutting disc 7 is rotatably arranged on the end of the plug column 12 through a bearing, the other end of the plug column 12 is threadedly connected with a nut 13, the side wall of the connecting seat 6 is provided with a handle 14, the end of the handle 14 is rotatably penetrated through the connecting seat 6 and connected with the double-end screw 9, rotating the handle 14 drives the double-end screw 9 to rotate, then the two opposite sliding blocks 10 are close to or away from each other, so as to cut the excess film according to the diameter of the wafer.

[0025] As shown in the figure, Figure 4 As shown, the bottom wall of the rotating shaft 5 is provided with a clamping seat 15, the middle part of the connecting seat 6 is arranged on the clamping seat 15 through a bolt, so as to facilitate disassembly and maintenance of the cutting disc 7 on the connecting seat 6.

[0026] As shown in the figure, Figure 5 As shown, the top end of the rotating shaft 5 is fixedly connected with a crank 16, rotating the crank 16 drives the rotating shaft 5 to rotate, the rotating shaft 5 drives the connecting seat 6 to rotate, and the cutting disc 7 on the connecting seat 6 cuts the film.

[0027] In specific use, the fixed plate 2 is arranged on the top of the wafer supporting table, the pressure cover 1 is connected with the film sticking machine, the operator holds the handle 17 on the inclined surface of the front end of the pressure cover 1, and turns the pressure cover 1 upward to open the pressure cover 1, the balance rod 3 can keep the angle of the cover unchanged, then the wafer to be stuck with film is placed on the placing table of the wafer film sticking machine, and the position of the wafer is ensured to be accurate, after the wafer is placed, the film is covered on the surface of the wafer, and the film is evenly spread on the wafer, and the cutting operation is prepared.

[0028] According to the diameter of the wafer, the handle 14 on the side wall of the connecting seat 6 is rotated, the handle 14 drives the double-end screw 9 to rotate, the two opposite sliding blocks 10 are close to or away from each other in the sliding groove 11, so as to adjust the position of the cutting disc 7, so that it is adapted to the circumference of the wafer, after the position of the cutting disc 7 is adjusted, the pressure cover 1 is turned downward to cover the wafer and the film, then the crank 16 at the top end of the rotating shaft 5 is rotated, the crank 16 drives the rotating shaft 5 to rotate, the rotating shaft 5 further drives the connecting seat 6 and the cutting disc 7 thereon to rotate around the circumference of the wafer, in the rotating process of the cutting disc 7, the cutting disc 7 cuts the film, the excess film covering on the wafer is cut off, the film is closely attached to the surface of the wafer, the film cutting process is completed, after the cutting is completed, the pressure cover 1 is turned upward again, and the wafer with the film is taken out.

[0029] The above has described the utility model and its implementation mode, which is not restrictive, and the drawings only show one of the implementation modes of the utility model, and the actual structure is not limited thereto. In summary, if a person skilled in the art is inspired thereby, without departing from the creative purpose of the utility model, similar structural modes and embodiments are not creatively designed, which should belong to the protection scope of the utility model.

Claims

1. A capping device of a wafer film sticking machine, characterized in that: The utility model provides a wafer cutting device, including gland (1), the bottom end of gland (1) is connected with fixed plate (2) through the shaft rotation, and fixed plate (2) is arranged on the top of wafer bearing platform, and the balance bar (3) is arranged between fixed plate (2) and gland (1), the bottom end of balance bar (3) is arranged on the side wall of fixed plate (2) through the shaft rotation, and the top end of balance bar (3) is hinged to the inner top wall of gland (1), and the top rotation of gland (1) is equipped with cutting part (4).

2. The gland device of the wafer film sticking machine according to claim 1, wherein: The cutting part (4) includes a rotating shaft (5), a connecting seat (6) and a cutting disc (7), the rotating shaft (5) is rotatably arranged on the top of the gland (1) and extends out at both ends, the connecting seat (6) is detachably arranged on the rotating shaft (5), the connecting seat (6) is provided with an adjusting part (8), and the cutting disc (7) is detachably arranged on the adjusting part (8).

3. The capping device of a wafer film laminating machine according to claim 2, wherein: The adjusting part (8) includes a double-headed screw (9) and a sliding block (10), the bottom wall of the connecting seat (6) is provided with a sliding groove (11), both ends of the double-headed screw (9) are rotatably arranged in the sliding groove (11), the sliding block (10) is threadedly connected with the double-headed screw (9) and slidably arranged in the sliding groove (11), the sliding block (10) is penetrated by a plug column (12), the cutting disc (7) is rotatably arranged on the end of the plug column (12) through a bearing, the other end of the plug column (12) is threadedly connected with a nut (13), the side wall of the connecting seat (6) is provided with a handle (14), and the end of the handle (14) is rotatably penetrated into the connecting seat (6) and connected to the double-headed screw (9).

4. The gland device of the wafer film sticking machine according to claim 2, characterized in that: The bottom wall of the rotating shaft (5) is provided with a clamping seat (15), and the middle part of the connecting seat (6) is arranged on the clamping seat (15) through bolts.

5. The capping device of a wafer film laminating machine according to claim 2, wherein: The top end of the rotating shaft (5) is fixedly connected with a crank handle (16).

6. The capping device of a wafer film laminating machine according to claim 1, wherein: The front end of the gland (1) is provided with an inclined surface, and the inclined surface is provided with a handle (17).

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