Horizontal high-temperature furnace

Abstract

The horizontal high-temperature furnace comprises a furnace body and a furnace tube, the furnace body is provided with a first cavity, and the furnace tube is provided with a second cavity; the furnace tube is arranged in the first cavity along a preset first direction and can rotate around the first direction; the furnace tube is provided with a first opening and a second opening which are symmetrically designed in the first direction, the first opening and the second opening are both communicated with the second cavity, and the second opening is configured to be a standby opening of the first opening, so that when the furnace tube is about to deform, the furnace tube can be rotated by 180 degrees; therefore, the problem that the furnace tube deforms in a high-temperature state due to the gravity of the furnace tube is solved, the phenomenon that the wafer cannot be taken out of the second cavity after heat treatment can be avoided, the service life of the furnace tube is prolonged, and the production and manufacturing cost of the wafer is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a horizontal high-temperature furnace. Background Technology

[0002] Quartz tubes are a special industrial glass made of silicon dioxide. They have a series of excellent physical and chemical properties. Quartz tubes have excellent high-temperature resistance, with a softening point of 1730℃. They can be used for a long time at temperatures below 1100℃, and the maximum short-term operating temperature can reach 1450℃.

[0003] In related technologies, wafers need to be placed inside a quartz tube for heat treatment to perform alloying, diffusion, or annealing processes. In actual semiconductor manufacturing, the quartz tube needs to operate 24 hours a day and is typically heated continuously for several hours, often reaching temperatures above 1100°C. Prolonged high-temperature operation can cause deformation of the quartz tube, potentially preventing the wafer from being easily removed. Furthermore, the wafer may mechanically collide with the inner wall of the furnace tube during handling, increasing the risk of furnace tube breakage. Additionally, tube deformation can alter the wafer's position within the tube, affecting the consistency of the wafer's processing.

[0004] Therefore, how to ensure that the furnace tubes do not deform or deform minimally, and can operate for extended periods, is a technical problem that urgently needs to be solved. Utility Model Content

[0005] To address the shortcomings of existing technologies, this application provides a horizontal high-temperature furnace, aiming to solve the technical problem of furnace tube deformation in existing technologies.

[0006] To solve the above-mentioned technical problems, this application provides a horizontal high-temperature furnace, which includes:

[0007] The furnace body has a first cavity;

[0008] The furnace tube is provided with a second cavity, and the furnace tube is disposed in the first cavity along a preset first direction and can rotate around the first direction;

[0009] The furnace tube is provided with a first opening and a second opening symmetrically designed in the first direction; both the first opening and the second opening are in communication with the second cavity, and the second opening is configured as a backup opening for the first opening.

[0010] Furthermore, in the horizontal high-temperature furnace provided in this application, a first monitoring module is provided in the second cavity, and the first monitoring module is configured to monitor the temperature in the second cavity;

[0011] If the furnace tube does not rotate 180 degrees around the first direction, the first monitoring module is installed in the second cavity through the first opening;

[0012] If the furnace tube rotates 180 degrees around the first direction, the first monitoring module is installed in the second cavity through the second opening.

[0013] Furthermore, in the horizontal high-temperature furnace provided in this application, the first monitoring module is installed in the second cavity using a first support component.

[0014] Furthermore, in the horizontal high-temperature furnace provided in this application, if the furnace tube does not rotate 180 degrees around the first direction, the first support member extends into the second cavity through the first opening; if the furnace tube rotates 180 degrees around the first direction, the first support member extends into the second cavity through the second opening.

[0015] Furthermore, in the horizontal high-temperature furnace provided in this application, the first monitoring module includes multiple thermistors;

[0016] The first support member is provided with multiple support parts, and each thermistor is provided on one of the support parts to monitor the temperature of each area in the second cavity.

[0017] Furthermore, in the horizontal high-temperature furnace provided in this application, the furnace tube is also provided with a third opening, which communicates with the second cavity and is configured as a vent for protective gas in the second cavity.

[0018] Furthermore, in the horizontal high-temperature furnace provided in this application, the third opening is located between the first opening and the second opening.

[0019] Furthermore, in the horizontal high-temperature furnace provided in this application, a sealing member is provided at the first opening or the second opening, and the sealing member is configured to close the first opening or the second opening.

[0020] Furthermore, in the horizontal high-temperature furnace provided in this application, the furnace tube is a quartz tube, the furnace tube is configured to perform heat treatment on the wafer, and the wafer is suspended in the second cavity by a second support member.

[0021] Furthermore, in the horizontal high-temperature furnace provided in this application, the horizontal high-temperature furnace is also provided with a second monitoring module, which is configured to monitor whether the furnace tube is deformed at high temperature.

[0022] The horizontal high-temperature furnace provided in this application includes a furnace body and a furnace tube. The furnace body has a first cavity, and the furnace tube has a second cavity. The furnace tube is disposed in the first cavity along a preset first direction and can rotate around the first direction. The furnace tube has a first opening and a second opening symmetrically designed in the first direction. Both the first opening and the second opening are connected to the second cavity. The second opening is configured as a spare opening for the first opening. This allows the furnace tube to be rotated 180 degrees when it is about to deform, thereby offsetting the problem of deformation of the furnace tube due to its own gravity at high temperatures. It also prevents the wafer from being unable to be removed from the second cavity after heat treatment, extending the service life of the furnace tube and reducing the wafer manufacturing cost. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of a horizontal high-temperature furnace without being rotated 180 degrees, provided in an embodiment of this application.

[0025] Figure 2 This is a schematic diagram of the structure of the horizontal high-temperature furnace after it has been rotated 180 degrees, as provided in the embodiments of this application.

[0026] Figure label:

[0027] 100 is the furnace body, 101 is the first cavity, 200 is the furnace tube, 201 is the second cavity, 202 is the first opening, 203 is the second opening, 204 is the third opening, 300 is the wafer, 400 is the first support, 500 is the second support, and 600 is the thermistor. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0030] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0031] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0032] Furthermore, in this application, unless otherwise explicitly specified or limited in the embodiments, the terms "installation," "connection," "joining," and "fixing" appearing in the embodiments should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral part; it can also be a mechanical connection, an electrical connection, etc. Of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication between two components, or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific implementation.

[0033] It should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., that may be mentioned in the description of this application, indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product is usually placed in during use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] Please see Figure 1 and Figure 2 , Figure 1 A schematic diagram of a horizontal high-temperature furnace without being rotated 180 degrees, provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of the horizontal high-temperature furnace after it has been rotated 180 degrees, as provided in the embodiments of this application.

[0035] like Figure 1 and Figure 2 As shown, this application provides a horizontal high-temperature furnace, which includes:

[0036] The furnace body 100 is provided with a first cavity 101;

[0037] The furnace tube 200 is provided with a second cavity 201. The furnace tube 200 is disposed in the first cavity 101 along a preset first direction and can rotate around the first direction.

[0038] The furnace tube 200 is provided with a first opening 202 and a second opening 203 symmetrically designed in the first direction; the first opening 202 and the second opening 203 are both connected to the second cavity 201, and the second opening 203 is configured as a spare opening for the first opening 202.

[0039] In this embodiment, the furnace tube 200 is placed horizontally on the furnace body 100 to form a horizontal furnace. Horizontal furnaces are used for heat treatment, sintering and annealing, which are crucial for the development and testing of new materials. The electronics manufacturing industry can use horizontal furnaces to perform processes such as carburizing, carbonitriding and cleaning to ensure precise heat treatment.

[0040] Specifically, the second opening 203 can serve as a backup opening for the first opening 202. The sensor (thermometer 600) monitoring the wafer 300 can be placed within the second cavity 201 through the first opening 202, or the wafer 300 can be placed within the second cavity 201 through the first opening 202. Preferably, the sensor (thermometer 600) monitoring the wafer 300 can be placed within the second cavity 201 through the first opening 202.

[0041] The first opening 202 and the second opening 203 are symmetrical in a first direction, which can be a horizontal direction (x). The first opening 202 and the second opening 203 can be arranged sequentially from top to bottom in a second direction (vertical direction (y), or sequentially from bottom to top in the second direction (vertical direction (y)). Preferably, the first opening 202 and the second opening 203 are arranged sequentially from bottom to top in the second direction (vertical direction (y)).

[0042] Meanwhile, the first opening 202 and the second opening 203 can be located on the same side of the furnace tube 200 or on different sides of the furnace tube 200.

[0043] Additionally, it should be noted that the second opening 203 serves as a backup opening for the first opening 202. This can be understood as follows: when the furnace tube 200 is about to deform due to high temperature and the deformation exceeds the safety line, the furnace tube 200 needs to be rotated 180 degrees around the first direction, and the second opening 203 is located below the first opening 202. In this case, the second opening 203 needs to replace the first opening 202. However, when the furnace tube 200 has not undergone high-temperature deformation, the furnace tube 200 has not been rotated 180 degrees around the first direction, and the first opening 202 is located below the second opening 203. In this case, it is not necessary to replace the first opening 202 with the second opening 203.

[0044] In other words, the horizontal high-temperature furnace provided in this application does not need to replace the first opening 202 with the second opening 203 during the first time period. During the second time period, which is adjacent to the first time period, the horizontal high-temperature furnace needs to replace the first opening 202 with the second opening 203. That is, the first opening 202 and the second opening 203 are used alternately to offset the problem of the furnace tube 200 deforming due to its own weight under high temperature. This can solve the problem of the furnace tube 200 becoming unusable due to deformation during long-term high-temperature operation, reduce the amount of deformation of the furnace tube 200, and thus extend the service life of the furnace tube 200.

[0045] The horizontal high-temperature furnace provided in this application includes a furnace body 100 and a furnace tube 200. The furnace body 100 is provided with a first cavity 101, and the furnace tube 200 is provided with a second cavity 201. The furnace tube 200 is disposed in the first cavity 101 along a preset first direction and can rotate around the first direction. The furnace tube 200 is provided with a first opening 202 and a second opening 203 symmetrically designed in the first direction. The first opening 202 and the second opening 203 are both connected to the second cavity 201. The second opening 203 is configured as a spare opening for the first opening 202. Thus, when the furnace tube 200 is about to deform, it can be rotated 180 degrees to counteract the problem of the furnace tube 200 deforming due to its own gravity at high temperature. At the same time, it can also prevent the wafer 300 from being unable to be removed from the second cavity 201 after heat treatment, thus extending the service life of the furnace tube 200 and reducing the production cost of the wafer 300.

[0046] In some embodiments, such as Figure 1 and Figure 2 As shown, the first monitoring module is provided in the second cavity 201. The first monitoring module is configured to monitor the temperature in the second cavity 201. If the furnace tube 200 has not rotated 180 degrees around the first direction, the first monitoring module is installed in the second cavity 201 through the first opening 202. If the furnace tube 200 has rotated 180 degrees around the first direction, the first monitoring module is installed in the second cavity 201 through the second opening 203.

[0047] In this embodiment, the first monitoring module can be placed in the second cavity 201 either through the first opening 202 or through the second opening 203. Specifically, if the furnace tube 200 has not rotated 180 degrees around the first direction, the second opening 203 is located above the first opening 202, and the first monitoring module is installed in the second cavity 201 through the first opening 202; if the furnace tube 200 has rotated 180 degrees around the first direction, the first opening 202 is located above the second opening 203, and the first monitoring module is installed in the second cavity 201 through the second opening 203.

[0048] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, the first monitoring module is installed in the second cavity 201 using a first carrier 400.

[0049] In this embodiment, when the first monitoring module is placed inside the second cavity 201, it is necessary to ensure that the first monitoring module does not contact the inner wall of the second cavity 201. Simultaneously, the first monitoring module needs to be close to the horizontal center line of the inner cavity to ensure accurate monitoring of the temperature of the wafer 300 during heat treatment. Since the wafer 300 is placed inside the second cavity 201, the first monitoring module is relatively close to the inner wall of the second cavity 201. To prevent the first monitoring module from falling, it needs to be placed directly on the first support member 400, which supports the first monitoring module. Therefore, this application replaces the first opening 202 with the second opening 203 after the furnace tube 200 is rotated 180 degrees. The first support member 400 can be fixedly connected to the furnace tube 200.

[0050] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, if the furnace tube 200 does not rotate 180 degrees around the first direction, the first support member 400 extends into the second cavity 201 through the first opening 202; if the furnace tube 200 rotates 180 degrees around the first direction, the first support member 400 extends into the second cavity 201 through the second opening 203.

[0051] In this embodiment, if the furnace tube 200 does not rotate 180 degrees around the first direction, the second opening 203 is located above the first opening 202, the first support member 400 carries the first monitoring module, and the first support member 400 extends into the second cavity 201 through the first opening 202; if the furnace tube 200 rotates 180 degrees around the first direction, the first opening 202 is located above the second opening 203, the first support member 400 carries the first monitoring module, and the first support member 400 extends into the second cavity 201 through the second opening 203.

[0052] In some embodiments, such as Figure 1 and Figure 2 As shown, the first monitoring module includes multiple thermistors 600; wherein, the first carrier 400 is provided with multiple carrier parts, and each thermistor 600 is disposed on one of the carrier parts to monitor the temperature of each area in the second cavity 201.

[0053] In this embodiment, the portion of the first support member 400 extending into the second cavity 201 is divided into multiple regions, each region serving as a support part. A thermistor 600 can be placed on each support part to monitor the temperature at different locations within the second cavity 201.

[0054] In some embodiments, such as Figure 1 and Figure 2 As shown, the furnace tube 200 is also provided with a third opening 204, which communicates with the second cavity 201. The third opening 204 is configured as a vent for the protective gas in the second cavity 201. In this embodiment, when the wafer 300 is subjected to heat treatment, protective gas needs to be introduced into the second cavity 201, and the introduction of protective gas can be achieved through the third opening 204.

[0055] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, the third opening 204 is located between the first opening 202 and the second opening 203.

[0056] In some embodiments, a closure is provided at the first opening 202 or the second opening 203, the closure being configured to close the first opening 202 or the second opening 203.

[0057] In this embodiment, the shape of the first opening 202 is the same as the shape of the second opening 203, that is, the inner diameter of the first opening 202 is the same as the inner diameter of the second opening 203. When the first opening 202 is not used, the closure member can close the first opening 202; when the second opening 203 is not used, the closure member can close the second opening 203. The closure member can be a quartz cap, and its shape is the same as the shape of the first opening 202 and the second opening 203.

[0058] In some embodiments, the horizontal high-temperature furnace is further provided with a second monitoring module, which is configured to monitor whether the furnace tube 200 is deformed at high temperature.

[0059] In this embodiment, the horizontal high-temperature furnace is also equipped with a second monitoring module. The second monitoring module is configured to monitor the deformation of the furnace tube 200 of the horizontal high-temperature furnace, so as to ensure that when the deformation of the furnace tube 200 exceeds the safety line, the furnace tube 200 can be rotated 180 degrees around the horizontal direction in time to counteract the problem of the furnace tube 200 deforming due to its own weight under high temperature. This can solve the problem of the furnace tube 200 becoming unusable due to deformation during long-term high-temperature operation, reduce the deformation of the furnace tube 200, and thus extend the service life of the furnace tube 200.

[0060] Meanwhile, the horizontal high-temperature furnace can also be equipped with an alarm module. When the second monitoring module detects that the deformation of the furnace tube 200 exceeds the safety line, an alarm signal can be issued through the alarm module to notify the operator to rotate the furnace tube 200 180 degrees around the horizontal direction in time. This can solve the problem of the furnace tube 200 becoming unusable due to deformation during long-term high-temperature operation, reduce the amount of deformation of the furnace tube 200, and thus extend the service life of the furnace tube 200.

[0061] In some embodiments, such as Figure 1 and Figure 2 As shown, the furnace tube 200 can be a quartz tube. The furnace tube 200 can be configured to perform heat treatment on the wafer 300. The wafer 300 and the furnace tube 200 are suspended in the second cavity 201 by a second support member 500 to avoid the wafer 300 directly contacting the inner wall of the furnace tube 200, thus avoiding pressure on the inner wall of the furnace tube 200 and reducing deformation of the furnace tube 200. The second support member 500 can be fixedly connected to the furnace tube 200.

[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A horizontal high temperature furnace, characterized by, The utility model relates to a horizontal high-temperature furnace, comprising: a furnace body provided with a first cavity; a furnace tube provided with a second cavity, the furnace tube is arranged in the first cavity along a preset first direction and can rotate around the first direction; wherein the furnace tube is provided with a first opening and a second opening symmetrically designed in the first direction; the first opening and the second opening are in communication with the second cavity, and the second opening is configured as a backup opening of the first opening.

2. The horizontal high-temperature furnace according to claim 1, characterized by A first monitoring module is arranged in the second cavity, and the first monitoring module is configured to monitor the temperature in the second cavity; if the furnace tube does not rotate 180 degrees around the first direction, the first monitoring module is installed in the second cavity through the first opening; if the furnace tube rotates 180 degrees around the first direction, the first monitoring module is installed in the second cavity through the second opening.

3. The horizontal high-temperature furnace according to claim 2, characterized by The first monitoring module is installed in the second cavity by a first bearing.

4. The horizontal high-temperature furnace according to claim 3, characterized by If the furnace tube does not rotate 180 degrees around the first direction, the first bearing extends into the second cavity through the first opening; if the furnace tube rotates 180 degrees around the first direction, the first bearing extends into the second cavity through the second opening.

5. The horizontal high-temperature furnace according to claim 3, characterized by The first monitoring module comprises a plurality of thermistors; wherein the first bearing is provided with a plurality of bearing parts, and each thermistor is arranged on a bearing part to monitor the temperature of each area in the second cavity.

6. The horizontal high-temperature furnace according to claim 1, wherein The furnace tube is also provided with a third opening in communication with the second cavity, and the third opening is configured as an air hole for protective gas in the second cavity.

7. The horizontal high-temperature furnace according to claim 6, characterized by The third opening is arranged between the first opening and the second opening.

8. The horizontal high-temperature furnace according to claim 1, characterized by A closure is arranged at the first opening or the second opening, and the closure is configured to close the first opening or the second opening.

9. The horizontal high-temperature furnace according to claim 1, characterized by The furnace tube is a quartz tube, and the furnace tube is configured to heat treat a wafer, and the wafer is suspended in the second cavity by a second bearing.

10. The horizontal high-temperature furnace according to claim 1, characterized by The horizontal high-temperature furnace is also provided with a second monitoring module configured to monitor whether the furnace tube is deformed at high temperature.

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