Wafer measuring device

Abstract

The utility model discloses a wafer measuring device, which comprises a base, a bearing assembly and a detection assembly, the bearing assembly is arranged on the base and comprises a base, a bearing structure, a leveling structure and a first driving structure, the bearing structure is used for bearing and limiting a wafer, the bearing structure is rotatably arranged on the base through the leveling structure, and the detection assembly is arranged on the base. The leveling structure is used for adjusting the levelness of the bearing structure, the first driving structure is connected with the leveling structure and used for driving the leveling structure to drive the bearing structure to rotate around the vertical axis, and the detection assembly is arranged on the base and used for obtaining the size information of the outer contour of the wafer. Therefore, the levelness of the wafer placed on the bearing structure is better through the leveling structure, and the detection assembly can more accurately obtain the outer contour size information of the wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer measurement technology, and in particular to a wafer measurement device. Background Technology

[0002] With the rapid development of the global technology industry, the semiconductor materials market continues to grow, and the demand for semiconductor silicon wafers is also increasing. In the manufacturing process, the Czochralski method is widely used to grow single-crystal silicon ingots, which then undergo a series of fine processing steps and rigorous testing, including rounding, truncation, wire cutting, and polishing, to produce silicon wafers that meet the requirements. Given the extremely high dimensional standards for silicon wafers, the outer contour dimensions of the rounded wafer must be precisely controlled. However, after long-term use, rounding machines inevitably experience malfunctions, causing the outer contour dimensions of the wafer to exceed the specified range.

[0003] Therefore, in related technologies, the outer contour dimensions of the wafer after rounding are measured manually using measuring tools such as calipers. This results in discrepancies between the measured outer contour dimensions and the actual dimensions, leading to inaccurate measurements. Furthermore, the measurement results vary from person to person, thus affecting wafer production efficiency. At the same time, it is difficult to measure the outer contour dimensions of the wafer after processes such as cutting and wire cutting. Dimensional deviations are not detected until after the polishing process, resulting in a low wafer pass rate and significant economic losses during this period. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a wafer measuring device that, through a leveling structure, improves the horizontality of the wafer placed on the support structure, facilitating the detection components to more accurately obtain the outer contour dimension information of the wafer.

[0005] The wafer measuring device according to an embodiment of the present invention includes: a base, a support component, and a detection component. The support component is disposed on the base and includes a base, a support structure, a leveling structure, and a first driving structure. The support structure is used to support and limit the wafer, and the support structure is rotatably disposed on the base through the leveling structure. The leveling structure is used to adjust the levelness of the support structure. The first driving structure is connected to the leveling structure to drive the leveling structure to rotate the support structure around a vertical axis. The detection component is disposed on the base and is used to acquire the dimensional information of the outer contour of the wafer.

[0006] According to the wafer inspection device of this utility model embodiment, the support structure is used to support and limit the wafer, so that the wafer is placed more stably on the support structure. The leveling structure adjusts the levelness of the support structure, so that the wafer placed on the support structure can achieve a higher level accuracy. The first driving structure can drive the leveling structure to rotate the support structure around the vertical axis, so the wafer placed on the support structure can also rotate with the support structure around the vertical axis. During the rotation of the wafer, different parts of the outer contour of the wafer can pass through the detection component in sequence. With the wafer placed on the support structure with good levelness, the detection component can accurately obtain the size information of the outer contour of the wafer, which facilitates the enhancement of the accuracy of the data obtained by the detection component.

[0007] In some embodiments, the support structure includes a first support platform, the first support platform includes a support plate extending into a ring, and the leveling structure includes a support member and a plurality of leveling units. The support member is disposed below the first support platform and rotatably connected to the base. The plurality of leveling units are arranged at intervals along the circumference of the support plate. Each leveling unit connects the support member and the support plate to adjust the distance between the support member and the support plate in the vertical direction. At least three leveling units are provided.

[0008] In some embodiments, the leveling unit includes: a leveling bolt, a tightening element, and a locking nut. The leveling bolt is vertically inserted through the bearing plate and threadedly engaged with the bearing plate. The lower end of the leveling bolt abuts against the support component. The tightening element is vertically inserted through the leveling bolt and rotatably engaged with the leveling bolt. The tightening element is threadedly connected to the support component to adjust the clamping force applied to the leveling bolt by the tightening element and the support component. The locking nut is sleeved on the leveling bolt and threadedly engaged with the leveling bolt. The locking nut is adapted to abut against the bearing plate.

[0009] In some embodiments, the wafer inspection apparatus further includes a positioning component, which is disposed on a base and includes a second support stage and a first lifting drive structure. The second support stage is vertically opposite to the support structure. The first lifting drive structure is used to drive the second support stage to move up and down. The second support stage defines a positioning groove and extends along the outer periphery of the support structure as an open annular shape. The positioning groove is used to accommodate and position the wafer.

[0010] In some embodiments, the wafer measurement apparatus is configured to satisfy at least one of the following conditions: Condition A1: The positioning assembly further includes a plurality of limiting posts, which protrude from the upper side of the second support stage and are circumferentially spaced on the outer periphery of the positioning groove; Condition A2: The angle between the peripheral wall of the positioning groove and the horizontal plane is α, 30°≤α≤60°; Condition A3: A receiving groove is formed on the bottom wall of the positioning groove, and the positioning assembly further includes: a sensor, at least a portion of which is disposed in the receiving groove and communicates with the first lifting drive structure and the support structure, the sensor being configured to be triggered by contact with a wafer placed in the positioning groove; Condition A4: The width of the opening of the second support stage is equal to the diameter of the inner peripheral wall of the second support stage.

[0011] In some embodiments, the detection component includes a first detection structure disposed on the base and located on one side of the carrier component in a first horizontal direction, and is used to at least obtain the diameter of the outer contour of the wafer. The wafer measuring device further includes a second driving structure for driving the carrier component or the first detection structure to move along the first horizontal direction to change the distance between the carrier component and the first detection structure in the first horizontal direction.

[0012] In some embodiments, the detection component includes a first detection structure and a second detection structure disposed on the base and communicating with each other. The first detection structure is located on one side of the carrier component in a first horizontal direction and is used to at least obtain the position of the notch on the outer contour of the wafer. The second detection structure is used to obtain the size of the notch. The wafer measuring device further includes a second driving structure and a third driving structure. The second driving structure is used to drive the carrier component to move along the first horizontal direction, and the third driving structure is used to drive the carrier component to move along a second horizontal direction, which is perpendicular to the first horizontal direction.

[0013] In some embodiments, the second detection structure includes an imaging mechanism and a first measuring mechanism. The imaging mechanism is used to acquire an image of the wafer at the notch, and the first measuring mechanism communicates with the imaging mechanism and is used to obtain the size of the notch based on the image acquired by the imaging mechanism.

[0014] In some embodiments, the imaging mechanism has an imaging height position, at which the wafer is located directly below the imaging mechanism and the distance between the wafer and the imaging mechanism is the focal length of the imaging mechanism. The second detection structure further includes a second lifting drive structure, which is used to drive the imaging mechanism to lift or drive the leveling structure and the support structure to lift or drive them to lift, so that the wafer on the support structure is at the imaging height position.

[0015] In some embodiments, the second lifting drive structure includes: a fixed member, a movable member, a sliding block, and an adjusting member. The fixed member is fixedly mounted on the base. The movable member and the fixed member slide in a sliding fit, defining a mounting cavity between them. At least one of the two side walls of the mounting cavity in the vertical direction is inclined relative to a horizontal plane, and the two side walls of the mounting cavity in the vertical direction form a non-zero included angle. The sliding block is disposed in the mounting cavity, and the upper and lower ends of the sliding block abut against the upper and lower side walls of the mounting cavity, respectively. The adjusting member passes through the fixed member and is threadedly fitted with the sliding block. The adjusting member and the fixed member are rotatably fitted to drive the sliding block to move along the length direction of the adjusting member.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of a wafer measuring device according to some embodiments of the present invention;

[0019] Figure 2 yes Figure 1 Another schematic diagram of the wafer measurement device shown;

[0020] Figure 3 This is a schematic diagram of a wafer measuring device and a wafer assembly according to some embodiments of the present invention;

[0021] Figure 4 yes Figure 3 The diagram shows another assembly schematic of the wafer measuring device and the wafer.

[0022] Figure 5 yes Figure 1 A partial schematic diagram of the load-bearing component shown;

[0023] Figure 6 yes Figure 5 Another partial schematic diagram of the load-bearing component shown;

[0024] Figure 7 yes Figure 5 A schematic diagram of the load-bearing structure and leveling structure shown;

[0025] Figure 8 yes Figure 7 A schematic diagram of the leveling unit shown;

[0026] Figure 9 yes Figure 5 A schematic diagram of the adsorption stage shown;

[0027] Figure 10 yes Figure 9 A cross-sectional view of the adsorption stage shown;

[0028] Figure 11 yes Figure 1 A schematic diagram of the first driving structure shown;

[0029] Figure 12 yes Figure 11 Another schematic diagram of the first drive structure shown;

[0030] Figure 13 yes Figure 11 A schematic diagram of the adjustment and locking structure shown;

[0031] Figure 14 yes Figure 13 Another schematic diagram of the adjustment locking structure shown;

[0032] Figure 15 yes Figure 1 A schematic diagram of the positioning component shown;

[0033] Figure 16 yes Figure 3 The diagram shows the assembly of the positioning components and the wafer.

[0034] Figure 17 yes Figure 15 A schematic diagram of the second support platform shown;

[0035] Figure 18 This is a schematic diagram of a wafer measuring device according to some embodiments of the present invention;

[0036] Figure 19 yes Figure 1 A schematic diagram of the first detection structure shown;

[0037] Figure 20 yes Figure 3 The first detection structure and wafer assembly diagram shown;

[0038] Figure 21 yes Figure 19 A schematic diagram of the third, fourth, and fifth connecting plates shown;

[0039] Figure 22 yes Figure 1 The assembly diagram of the second and third drive structures shown in the figure;

[0040] Figure 23 yes Figure 22 Another assembly diagram of the second and third drive structures shown;

[0041] Figure 24 yes Figure 3 The second detection structure and wafer assembly diagram shown;

[0042] Figure 25 yes Figure 1 The diagram shows the second lifting drive structure.

[0043] Figure label:

[0044] Wafer measurement device 1, wafer 2, base 10, mounting plate 12

[0045] The components include: a support assembly 20, a base 22, a support structure 24, a first support platform 240, a support plate 2400, a support column 242, an adsorption platform 244, an adsorption port 2440, a channel 2441, a rotary joint 2442, a leveling structure 26, a support component 260, a first support member 2600, a shaft portion 2600a, a flange portion 2600b, a second support member 2602, a leveling unit 262, a leveling bolt 2620, a tightening component 2622, a locking nut 2624, a first drive structure 28, a driver 280, a transmission mechanism 282, a drive wheel 2820, a driven wheel 2822, a conveyor belt 2824, and an adjustment and locking structure 284.

[0046] Detection component 30, first detection structure 32, second detection structure 34, imaging mechanism 340, second lifting drive structure 342, fixing component 3420, moving component 3422, sliding block 3424, adjusting component 3426, mounting cavity 3428.

[0047] Positioning component 40, second support platform 42, positioning groove 420, receiving groove 422, first lifting drive structure 44, limiting post 46, sensor 47.

[0048] Cabinet 50, Detection Chamber 52, Electrical Chamber 54

[0049] Second drive structure 60, third drive structure 62

[0050] First connecting plate 70, second connecting plate 71, first mounting through hole 72, second mounting through hole 73, first fastener 74, transmitter 75, receiver 76, third connecting plate 77, fourth connecting plate 78, fifth connecting plate 79, reinforcing rib 80. Detailed Implementation

[0051] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0052] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0053] Hereinafter, with reference to the accompanying drawings, a wafer measuring device 1 according to an embodiment of the present invention will be described.

[0054] like Figures 1-4 As shown, the wafer measuring device 1 includes a base 10, a support component 20, and a detection component 30. The support component 20 is disposed on the base 10 and includes a base 22, a support structure 24, a leveling structure 26, and a first driving structure 28. The support structure 24 is used to support and limit the wafer 2, and the support structure 24 is rotatably disposed on the base 22 through the leveling structure 26. The leveling structure 26 is used to adjust the levelness of the support structure 24. The first driving structure 28 is connected to the leveling structure 26 to drive the leveling structure 26 to drive the support structure 24 to rotate around the vertical axis. The detection component 30 is disposed on the base 10 and is used to obtain the dimensional information of the outer contour of the wafer 2.

[0055] As can be seen, the support structure 24 is used to support and limit the wafer 2, making the wafer 2 more stable when placed on the support structure 24, and the wafer 2 is less likely to detach from the support structure 24, making it easier for the wafer 2 to rotate with the support structure 24; the leveling structure 26 is used to adjust the level of the support structure 24, so that after the wafer 2 is placed on the support structure 24, the level of the wafer 2 can be adjusted by the leveling structure 26, realizing the control and management of the level of the wafer 2, which facilitates the improvement of the accuracy and reliability of the subsequent measurement of the outer contour size of the wafer 2; the first driving structure 28 can drive the leveling structure 26 to drive the support structure 24 to rotate around the vertical axis. For example, if the support structure 24 and the leveling structure 26 are fixed, and the leveling structure 26 and the base 22 rotate together, then the wafer 2 placed on the support structure 24 can also rotate with the support structure 24 around the vertical axis. During the rotation, different parts of the outer contour of the wafer 2 can pass through the detection component 30 in sequence, so that the detection component 30 can obtain the outer contour size information of the wafer 2.

[0056] For example, the detection component 30 includes a transmitter 75, a receiver 76, and a detection mechanism. The transmitter 75 and the receiver 76 are spaced apart to define a detection space. The receiver 76 can receive parallel light emitted by the transmitter 75. When the wafer 2 placed on the carrier component 20 is at least partially located within the detection space, the wafer 2 can block a portion of the parallel light, thereby changing the amount of parallel light received by the receiver 76. Then, the first driving structure 28 drives the wafer 2 to rotate 360°, so that the receiver 76 can obtain different amounts of parallel light during the rotation of the wafer 2. The receiver 76 can transmit data to the detection mechanism (e.g., a computer). The detection mechanism can calculate the outer contour size information of the wafer 2 based on the obtained coordinate values ​​of the outer contour of the wafer 2, thereby enabling the detection component 30 to obtain the outer contour size information of the wafer 2.

[0057] Therefore, by adjusting the leveling structure 26, the wafer 2 placed on the support structure 24 is more level. When the first driving structure 28 indirectly drives the wafer 2 to rotate, the detection component 30 can obtain more accurate outer contour size information of the wafer 2, reducing the measurement error caused by unevenness of the support structure 24 and uneven placement of the wafer 2. This makes the outer contour size information of the wafer 2 measured by the detection component 30 more consistent with the actual size information, which is convenient for the subsequent processing of the wafer 2.

[0058] It can be understood that the bearing structure 24 has a vertically extending rotation axis L1. The direction of the extension of the rotation axis L is the axial direction of the bearing structure 24, the direction around the rotation axis L1 is the circumferential direction of the bearing structure 24, and the direction passing through the rotation axis L1 in the radial plane is the radial direction of the bearing structure 24. The radial plane is perpendicular to the rotation axis L1.

[0059] According to the wafer measuring device 1 of this application embodiment, the first driving structure 28 drives the leveling structure 26 to rotate the support structure 24 around the vertical axis, thereby realizing the rotation of the wafer 2 around the vertical axis. In conjunction with the detection component 30, the device measures the outer contour dimensions of the wafer 2, replacing manual measurement, reducing manual measurement errors, improving the accuracy of dimension measurement, and improving the timeliness and accuracy of judging whether the wafer is out of tolerance. At the same time, the leveling structure 26 adjusts the levelness of the support structure 24, which can control the levelness of the wafer 2 placed on the support structure 24, making the levelness of the wafer 2 on the support structure 24 better, which facilitates further improvement in the accuracy and reliability of measuring the outer contour dimension information of the wafer 2.

[0060] It is understood that when the wafer measuring device 1 of this application embodiment is used to measure the outer contour dimensions of the wafer 2 after rounding, it helps to improve the measurement accuracy of the wafer 2, provides reliable detection data for the staff, and enables the staff to promptly detect whether the wafer 2 dimensions are out of tolerance, quickly determine whether the rounding machine needs maintenance, and take timely action. For qualified wafers 2, subsequent processing can continue, and for unqualified wafers 2, appropriate processing can be carried out, effectively reducing the further processing of unqualified silicon wafers, facilitating the improvement of wafer production efficiency and product quality, and at the same time helping to improve the pass rate of wafer 2 and reduce economic losses.

[0061] Furthermore, in this embodiment of the application, the size information of the outer contour of the wafer 2 obtained by the detection component 30 may include at least one of the following: the diameter of the wafer 2, the shape of the notch (i.e., the notch port) of the wafer 2, the notch position, the notch angle, and the notch depth.

[0062] In some embodiments, the detection component 30 communicates with the first driving structure 28 so that when the first driving structure 28 drives the wafer 2 placed on the support structure 24 to rotate, the detection component 30 can know the state of the first driving structure 28, thereby knowing the current state of the wafer 2, such as the state of the wafer 2 currently passing through the detection component 30 in different parts of its outer contour. The detection component 30 can operate to completely obtain the size information of the outer contour of the wafer 2, reducing the possibility that the parts of the outer contour of the wafer 2 are not detected by the detection component 30, thereby improving the reliability of the operation of the wafer measurement device 1.

[0063] like Figures 1-7 As shown, in some embodiments, the supporting structure 24 includes a first supporting platform 240, which includes a supporting plate 2400 extending into a ring shape. The leveling structure 26 includes a supporting member 260 and a plurality of leveling units 262. The supporting member 260 is disposed below the first supporting platform 240 and is rotatably connected to the base 22. The plurality of leveling units 262 are spaced apart along the circumference of the supporting plate 2400 (i.e., the circumference of the supporting structure 24). Each leveling unit 262 connects the supporting member 260 and the supporting plate 2400 to adjust the supporting member 260 and the supporting plate 2400 in the vertical direction (e.g., vertically). Figure 1 The distance in the CC' direction, wherein at least three leveling units 262 are provided.

[0064] As can be seen, wafer 2 can be placed on the annular support plate 2400. The annular support plate 2400 provides a larger support surface, making wafer 2 more stable when placed on the support plate 2400. The support component 260 of the leveling structure 26 is rotatably connected to the base 22, and the leveling unit 262 connects the support component 260 and the support plate 2400, so that the first driving structure 28 can drive the support component 260 to drive the support plate 2400 to rotate.

[0065] Furthermore, the leveling unit 262 can adjust the distance between the support component 260 and the carrier plate 2400 in the vertical direction. Multiple leveling units 262 are arranged at intervals along the circumference of the carrier plate 2400. At least three leveling units 262 are provided. By using multiple leveling units 262, multi-point support and adjustment of the carrier plate 2400 can be achieved, which can effectively reduce the instability of the carrier plate 2400 caused by single-point support or double-point support, thereby improving the levelness and stability of wafer 2 placement. Moreover, the interval arrangement of the leveling units 262 facilitates daily inspection, maintenance and adjustment work. When a leveling unit 262 malfunctions or needs calibration, it can be handled individually without easily affecting the normal operation of other units, reducing downtime and maintenance costs. For example, when adjusting the level of the support plate 2400 using multiple leveling units 262, the operator can use a level to precisely adjust each leveling unit 262 until the support plate 2400 reaches the ideal level. Moreover, after the support plate 2400 has been in operation for a period of time, the operator can also use a level to detect whether there is a slight deviation in the support plate 2400, so that the operator can promptly detect and adjust the corresponding leveling unit 262, thereby reducing the detection error caused by the deviation of the support plate 2400.

[0066] For example, there are three leveling units 262. The three leveling units 262 are arranged at intervals along the circumference of the support plate 2400, and the projection points of the three leveling units 262 on the horizontal plane of the support plate 2400 form an equilateral triangle. The triangular support structure formed by the three leveling units 262 can support the support plate 2400 evenly and stably, making the wafer 2 more stable on the support plate 2400 and facilitating the improvement of the subsequent inspection accuracy of the wafer 2.

[0067] It should be noted that the term "ring" in this article is interpreted broadly, meaning it is not limited to "circular rings," but can also include "polygonal rings," etc. Furthermore, "ring" includes open rings (i.e., non-closed rings, such as C-shaped, U-shaped, Ω-shaped, etc.) and closed rings.

[0068] like Figures 5-8As shown, in some embodiments, the leveling unit 262 includes a leveling bolt 2620 and a tensioning member 2622. The leveling bolt 2620 is vertically inserted through the support plate 2400 and is threadedly engaged with the support plate 2400. The lower end of the leveling bolt 2620 abuts against the support member 260. The tensioning member 2622 is vertically inserted through the leveling bolt 2620 and is rotatably engaged with the leveling bolt 2620. The tensioning member 2622 is threadedly connected to the support member 260 to adjust the clamping force applied by the tensioning member 2622 and the support member 260 to the leveling bolt 2620. As can be seen, the two ends of the leveling bolt 2620 are respectively adapted to abut against the support component 260 and the tightening component 2622. The support component 260 and the tightening component 2622 can limit the displacement of the leveling bolt 2620 in the vertical direction. The leveling bolt 2620 can always abut against the support component 260 under its own weight, and at the same time, the clamping force of the leveling bolt 2620 in the axial direction can be adjusted. The leveling bolt 2620 is threadedly engaged with the bearing plate 2400. When the operator rotates the leveling bolt 2620, the bearing plate 2400 will move along the axial direction (i.e., vertical direction) of the leveling bolt 2620. Thus, by rotating the leveling bolt 2620, the distance between the bearing plate 2400 and the support component 260 in the vertical direction can be adjusted.

[0069] Furthermore, since the tensioning element 2622 is rotatably engaged with the leveling bolt 2620, the leveling bolt 2620 will not rotate together with the tensioning element 2622 when the tensioning element 2622 is rotated. The tensioning element 2622 is less likely to affect the vertical distance between the bearing plate 2400 and the support member 260. The tensioning element 2622 is threadedly connected to the support member 260 to adjust the clamping force applied by the tensioning element 2622 and the support member 260 to the leveling bolt 2620. When the applied clamping force is small, the leveling bolt 2620 can rotate freely to adjust the vertical distance between the bearing plate 2400 and the support member 260. After multiple leveling bolts 2620 have adjusted the bearing plate 2400 to the ideal horizontal state, the clamping force applied by the tensioning element 2622 and the support member 260 to the leveling bolt 2620 can be increased to prevent the leveling bolt 2620 from rotating and to keep the bearing plate 2400 in a stable horizontal state.

[0070] For example, when adjusting the level of the support plate 2400 using multiple leveling bolts 2620, the clamping force applied to the leveling bolt 2620 by the tensioning member 2622 and the support member 260 can be reduced by rotating the tensioning member 2622, allowing the leveling bolt 2620 to rotate freely. This allows the leveling bolt 2620 to adjust the distance between the support plate 2400 and the support member 260. When the support plate 2400 is adjusted to an ideal level by the combined action of multiple leveling bolts 2620, the clamping force applied to the leveling bolt 2620 by the tensioning member 2622 and the support member 260 can be increased, thus restricting the leveling bolt 2620 from rotating freely and facilitating the maintenance of a good level of the support plate 2400.

[0071] like Figures 5-8 As shown, in some embodiments, the leveling unit 262 further includes a locking nut 2624, which is sleeved on the leveling bolt 2620 and threadedly engaged with the leveling bolt 2620. The locking nut 2624 is adapted to abut against the bearing plate 2400.

[0072] As can be seen, the locking nut 2624 further enhances the stability and reliability of the bearing plate 2400. After the bearing plate 2400 is adjusted to a horizontal state by the leveling bolt 2620, the locking nut 2624 can be tightened to make close contact with the bearing plate 2400. Since the locking nut 2624 and the leveling bolt 2620 are threaded together, tightening the locking nut 2624 will effectively reduce the possibility of the bearing plate 2400 moving unexpectedly in the vertical direction, and can maintain a stable support state even under external environmental conditions such as vibration or load changes.

[0073] like Figures 5-8 As shown, in some embodiments, the leveling unit 262 protrudes from the upper side of the support plate 2400, and the first support platform 240 further includes a plurality of support pillars 242. The plurality of support pillars 242 protrude from the upper side of the support plate 2400 and are spaced apart circumferentially. The upper ends of the support pillars 242 are spaced above the upper end of the leveling unit 262. Thus, the plurality of support pillars 242 can be used to support the wafer 2, making it less likely for the wafer 2 to interfere with the leveling unit 262. At the same time, the plurality of support pillars 242 have a large support range, making the wafer 2 more stable when placed on the plurality of support pillars 242. Furthermore, the protruding leveling unit 262 makes it easier for operators to access and operate the leveling bolts 2620 and the tightening element 2622 for precise leveling and locking operations, facilitating leveling operations. Moreover, the leveling unit 262 and the support column 242 protruding on the upper side of the support plate 2400 allow operators to visually inspect their status, making it easier to promptly identify and address potential problems, reducing maintenance costs and downtime due to malfunctions.

[0074] like Figures 5-10 As shown, in some embodiments, the supporting structure 24 further includes an adsorption platform 244, which is spaced radially inside the supporting plate 2400 and has an adsorption port 2440 at its top. A channel 2441 communicating with the adsorption port 2440 is formed in the supporting member 260. A rotary joint 2442 is provided at the end of the channel 2441 away from the adsorption platform 244. The supporting member 260 includes a first support member 2600 and a second support member 2602. The channel 2441 is defined in the first support member 2600 and the first support member 2600 includes a shaft portion 2600a and a flange portion 2600b. The shaft portion 2600a cooperates with the first driving structure 28. The flange portion 2600b is located at the top of the shaft portion 2600a. The adsorption platform 244 is fixed to the flange portion 2600b. The second support member 2602 is sleeved outside the adsorption platform 244 and is fixed to the flange portion 2600b.

[0075] As can be seen, the adsorption stages 244 are spaced apart inside the support plate 2400, and the top of the adsorption stages 244 has an adsorption port 2440. When the wafer 2 is placed on the support plate 2400, the adsorption stages 244 can adsorb the wafer 2, making the wafer 2 more stable on the support plate 2400. This ensures that when the first driving structure 28 drives the wafer 2 to rotate, the wafer 2 is less likely to shift relative to the support plate 2400 or separate from the support plate 2400, thus improving the measurement stability of the wafer measurement device 1. A channel 2441 communicating with the adsorption port 2440 is formed in the support component 260, and the channel 2441 is far away from the support plate 2400. One end of the adsorption port 2440 is provided with a rotary joint 2442, which can be connected to a negative pressure device to form a negative pressure area in the adsorption port 2440, making the wafer 2 more stable on the support plate 2400. Moreover, the setting of the rotary joint 2442 allows the support component 260 to rotate under the drive of the first drive structure 28, and at the same time facilitates the connection between the negative pressure device and the channel 2441. That is, the rotary joint 2442 can form a fluid flow path between the fixed pipe and the rotating shaft, which facilitates the setting of the negative pressure device and makes fuller use of the space of the wafer measuring device 1.

[0076] Furthermore, the adsorption stage 244 is fixed to the flange portion 2600b, and the second support member 2602 is fixed to the flange portion 2600b. Thus, the adsorption stage 244, the second support member 2602, and the flange portion 2600b form an integral unit. The shaft portion 2600a cooperates with the first drive structure 28, and the flange portion 2600b is located at the top of the shaft portion 2600a. Thus, the first drive structure 28 can drive the adsorption stage 244, the second support member 2602, and the flange portion 2600b to rotate together by driving the shaft portion 2600a, thereby realizing the rotation of the wafer 2 and simplifying the drive mechanism for the rotation of the wafer 2.

[0077] like Figures 5-10 As shown, in some embodiments, the supporting structure 24 includes a first supporting platform 240 and an adsorption platform 244. The first supporting platform 240 includes a supporting plate 2400 extending into an annular shape. The first supporting platform 240 also includes a plurality of supporting columns 242. The plurality of supporting columns 242 protrude from the upper side of the supporting plate 2400 and are spaced apart circumferentially. The adsorption platforms 244 are spaced apart radially inside the supporting plate 2400 and have adsorption ports 2440 at their tops. The upper ends of the plurality of supporting columns 242 are at the same height as the adsorption ports 2440.

[0078] As can be seen, the adsorption stages 244 are spaced apart on the radial inner side of the multiple support columns 242. When the multiple support columns 242 support the wafer 2, the adsorption port 2440 can adsorb the wafer 2, making the wafer 2 more stable on the support columns 242. This effectively reduces the possibility of the wafer 2 slipping during rotation, thereby enhancing the stability of the wafer 2 during the measurement process. Moreover, the adsorption stages 244 are spaced apart on the radial inner side of the support plate 2400, and the adsorption port 2440 at its top is at the same height as the upper end of the multiple support columns 242. When the adsorption stages 244 generate adsorption force on the wafer 2 through the adsorption port 2440, the wafer 2 can be uniformly stressed, reducing the problem of local stress concentration or uneven adsorption caused by improper position of the adsorption port 2440, optimizing the adsorption effect, and making the wafer 2 more firmly attached to the support structure 24.

[0079] like Figures 11-14 As shown, in some embodiments, the first drive structure 28 includes a driver 280 and a transmission mechanism 282. The driver 280 is mounted on the base 22 via an adjusting locking structure 284, and the driver 280 is spaced apart from the base 10. Thus, the driver 280 is fixed to the base 22, and there is no direct connection between the driver 280 and the base 10, achieving reliable installation of the driver 280. Simultaneously, if the base 22 can move relative to the base 10, the above arrangement facilitates the driver 280 moving along with the base 22, for example, driving the carrier assembly 20 to move via the second drive structure 60 or the third drive structure 62 described later. The transmission mechanism 282 includes a driving wheel 2820, a driven wheel 2822, and a conveyor belt 2824. Wheel 2822 is fitted around the outer periphery of support component 260 of leveling structure 26, and conveyor belt 2824 is wrapped around drive wheel 2820 and driven wheel 2822. Driver 280 can transmit power to driven wheel 2822 through drive wheel 2820 and conveyor belt 2824. Driven wheel 2822 then drives support component 260 to rotate, thereby facilitating the rotation of wafer 2. Transmission mechanism 282 adopts a combination of drive wheel 2820, driven wheel 2822 and conveyor belt 2824. This transmission method has a simple structure, is easy to manufacture, and has high transmission efficiency and stability. Moreover, conveyor belt 2824 has good elasticity and wear resistance, can withstand large loads, and is easy to adapt to different working environments.

[0080] The adjusting locking structure 284 is used to adjust and lock the horizontal distance between the driver 280 and the base 22, so as to adjust the tension of the conveyor belt 2824 between the driving wheel 2820 and the driven wheel 2822. This allows the conveyor belt 2824 to transmit power smoothly and efficiently between the driving wheel 2820 and the driven wheel 2822, thereby improving the efficiency of the first drive structure 28. Moreover, when the conveyor belt 2824 needs to be replaced, cleaned or repaired, the adjusting locking structure 284 allows the tension of the conveyor belt 2824 to be easily adjusted without disassembling the entire first drive structure 28, which facilitates the disassembly of the conveyor belt 2824 and simplifies the maintenance operation of the conveyor belt 2824.

[0081] like Figures 11-14 As shown, in some embodiments, the adjusting locking structure 284 includes a first connecting plate 70 and a second connecting plate 71. The first connecting plate 70 is fixed to the base 22, and the second connecting plate 71 is fixed to the driver 280. The first connecting plate 70 has a plurality of first mounting through holes 72, and the second connecting plate 71 has a plurality of second mounting through holes 73. The second mounting through holes 73 are configured to be along a second horizontal direction (e.g., ...). Figure 14 The elongated slots extending in the BB' direction of the conveyor belt 2824 include a first mounting through hole 72 and a corresponding second mounting through hole 73. The adjusting locking structure 284 also includes a plurality of first fasteners 74, which pass through the first mounting through holes 72 and the second mounting through holes 73 to fix the first connecting plate 70 and the second connecting plate 71. The operator can adjust the position of the first fasteners 74 in the second horizontal direction of the second mounting through hole 73 to change the mating length of the first connecting plate 70 and the second connecting plate 71, thereby facilitating the adjustment of the tension of the conveyor belt 2824.

[0082] It is understood that, in the above configuration, the adjustment locking structure 284 can adjust and lock the distance between the driver 280 and the base 22 in the second horizontal direction; of course, the adjustment locking structure 284 can also adjust and lock the distance between the driver 280 and the base 22 in other horizontal directions (e.g., the first horizontal direction).

[0083] like Figures 15-17 As shown, in some embodiments, the wafer measuring device 1 further includes a positioning component 40, which is disposed on the base 10. The positioning component 40 includes a second support stage 42 and a first lifting drive structure 44. The second support stage 42 is vertically opposite to the support structure 24. The first lifting drive structure 44 is used to drive the second support stage 42 to move up and down. The second support stage 42 defines a positioning groove 420 and extends along the outer periphery of the support structure 24 to form an open annular shape. The positioning groove 420 is used to accommodate and position the wafer 2.

[0084] As can be seen, the support structure 24 is located radially inside the second support platform 42. Since the second support platform 42 and the support structure 24 are vertically opposite each other, the first lifting drive structure 44 is used to drive the second support platform 42 to rise and fall. The first lifting drive structure 44 can drive the second support platform 42 to be located above the support structure 24. The wafer 2 can be placed on the second support platform 42 first, and then the first lifting drive structure 44 drives the second support platform 42 to fall, so as to transfer the wafer 2 on the second support platform 42 to the support structure 24. At the same time, the second support platform 42 is an open ring, which reduces the possibility of interference between the second support platform 42 and the support structure 24 during the lifting process, so that the wafer 2 can be smoothly transferred from the second support platform 42 to the support structure 24.

[0085] Furthermore, the second support stage 42 defines a positioning groove 420 for accommodating and positioning the wafer 2. This allows for preliminary positioning of the wafer 2 on the second support stage 42, achieving coarse positioning of the wafer 2 before measurement. This facilitates more accurate placement of the wafer 2 by the operator and makes loading and unloading the wafer 2 more convenient, thereby improving the working efficiency of the wafer measurement device 1. It can be understood that a portion of the upper surface of the second support stage 42 is recessed to form the positioning groove 420, with the groove opening facing upwards.

[0086] It is understandable that since the second support stage 42 extends into an open annular shape, the opening of the second support stage 42 can provide a certain amount of clearance. For example, considering factors such as measuring wafers 2 of different specifications, there may be a need to adjust the distance between the support component 20 and the first detection structure 32. The opening of the second support stage 42 can allow for the adjustment of the distance between the support component 20 and the first detection structure 32, and the second support stage 42 will not interfere with the support component 20 or the first detection structure 32. Of course, in other embodiments of this application, the second support stage 42 can also be a closed annular shape, which has a simple structure and is convenient for processing.

[0087] like Figures 15-17 As shown, in some embodiments, the wafer measurement device 1 is configured to satisfy at least one of the following conditions A1 to A4:

[0088] In condition A1: the positioning component 40 also includes a plurality of limiting posts 46. The plurality of limiting posts 46 protrude from the upper side of the second support platform 42 and are spaced apart circumferentially on the outer periphery of the positioning groove 420. The plurality of limiting posts 46 spaced apart circumferentially on the outer periphery of the positioning groove 420 can effectively prevent the wafer 2 from being ejected from the positioning groove 420, thereby further improving the loading reliability of the wafer 2.

[0089] In condition A2: the angle between the peripheral wall of the positioning groove 420 and the horizontal plane is α, where 30°≤α≤60°. Therefore, the peripheral wall of the positioning groove 420 is an inclined surface. This inclined surface provides a natural guiding effect for the loading of wafer 2, allowing it to slide into the positioning groove 420 under gravity. This simplifies the loading process. By setting the angle between the peripheral wall and the horizontal plane within the range of 30° to 60°, wafer 2 can slide into the positioning groove 420 more smoothly, reducing friction and collision between wafer 2 and the peripheral wall during loading, thus helping to protect the surface of wafer 2 from damage. For example, α can be 30°, 35°, 40°, 46°, 50°, 53°, or 60°.

[0090] In condition A3: a receiving groove 422 is formed on the bottom wall of the positioning groove 420, and the positioning assembly 40 further includes a sensor 47. At least a portion of the sensor 47 is disposed in the receiving groove 422 and the sensor 47 communicates with the first lifting drive structure 44 and the bearing structure 24. The sensor 47 is configured to be triggered by contact with the wafer 2 placed in the positioning groove 420.

[0091] As can be seen, sensor 47 is located on the bottom wall of positioning slot 420, and sensor 47 can be triggered by contact with wafer 2 placed in positioning slot 420. Sensor 47 communicates with first lifting drive structure 44 and bearing structure 24 respectively. When wafer 2 falls completely into positioning slot 420 and contacts sensor 47, sensor 47 transmits signal to first lifting drive structure 44 and bearing structure 24. First lifting drive structure 44 drives second bearing platform 42 to descend, and bearing structure 24 is prepared to limit wafer 2 so as to transfer wafer 2 from positioning slot 420 to bearing structure 24 for timely limiting. This reduces the risk of wafer 2 falling when second bearing platform 42 lifts and lowers if wafer 2 does not fall completely, making wafer measurement device 1 more stable in operation.

[0092] For example, the support structure 24 also includes an adsorption stage 244. The sensor 47 communicates with the support structure 24. When the wafer 2 falls completely into the positioning groove 420 and comes into contact with the sensor 47, the sensor 47 transmits a signal to the support structure 24. The adsorption stage 244 generates suction based on the signal, making the wafer 2 more stable when it is transferred from the second support stage 42 to the support structure 24, and further reducing the risk of the wafer 2 falling during the transfer process.

[0093] In condition A4: the width of the opening at the second support platform 42 (e.g. Figure 17 L3 in the figure) and the diameter of the inner peripheral wall of the second bearing platform 42 (e.g. Figure 17If L2) is equal to the second support platform 42, the second support platform 42 defines the positioning groove 420 and extends along the outer periphery of the support structure 24 as an open annular shape. Then the width of the opening of the second support platform 42 is greater than or equal to the width at the maximum position on the outer periphery of the support structure 24, so that the support structure 24 can move freely toward the opening direction of the second support platform 42, which makes it easier to reduce the requirements for the setting position of the detection component 30.

[0094] like Figure 18 As shown, in some embodiments, the base 10 includes a mounting plate 12, and the wafer measuring device 1 further includes a cabinet 50. The base 10 is disposed within the cabinet 50 and divides the internal space of the cabinet 50 into a detection chamber 52 and an electrical chamber 54 arranged sequentially from top to bottom. The carrier assembly 20 and the detection assembly 30 are both disposed in the detection chamber 52. Thus, the carrier assembly 20 and the detection assembly 30 can be installed in the detection chamber 52 through the mounting plate 12, providing a relatively sealed environment for detecting the outer contour dimensions of the wafer 2, thereby reducing the problem of impurities intruding and affecting the quality of the wafer 2 during the detection process. Moreover, the detection chamber 52 is located above the electrical chamber 54, so that the operator can better observe and operate the operation of the carrier assembly 20 and the detection assembly 30.

[0095] like Figures 1-4 , Figure 22 , Figure 23 As shown, in some embodiments, the detection component 30 includes a first detection structure 32, which is disposed on the base 10 and located on the support component 20 in a first horizontal direction (e.g., Figure 1 On one side of the AA' direction in the wafer, the first detection structure 32 is used to obtain at least the diameter of the outer contour of the wafer 2. The wafer measuring device 1 also includes a second driving structure 60, which is used to drive the carrier component 20 or the first detection structure 32 to move along the first horizontal direction to change the distance between the carrier component 20 and the first detection structure 32 in the first horizontal direction.

[0096] As can be seen, the first detection structure 32 is disposed on the base 10 and located on one side of the support component 20 in the first horizontal direction. Therefore, there is a certain distance between the first detection structure 32 and the support component 20 in the first horizontal direction, reducing the possibility of interference between the wafer 2 and the first detection structure 32 when the wafer 2 is loaded or unloaded from the support component 20. Furthermore, the arrangement of the second driving structure 60 allows for a more suitable adjustment of the distance between the wafer 2 placed on the support component 2 and the first detection structure 32 in the first horizontal direction, facilitating the first detection structure 32's detection of the wafer 2. For example, the first detection structure 32 can detect wafers 2 of different specifications. Since the first detection structure 32 is used to at least obtain the diameter of the outer contour of the wafer 2, the detection of the wafer 2 placed on the support component 20 by the first detection structure 32 ensures that the wafer 2 has a good horizontal placement posture, enabling more accurate acquisition of the outer contour diameter of the wafer 2.

[0097] It is understood that in the above scheme, the first detection structure 32 can be used to obtain only the diameter of the outer contour of the wafer 2; or, the first detection structure 32 can not only detect the diameter of the outer contour of the wafer 2, but also obtain the position of the notch on the outer contour of the wafer 2.

[0098] like Figures 1-4 , Figure 22 , Figure 23 As shown, in some embodiments, the detection component 30 includes a first detection structure 32 and a second detection structure 34 disposed on the base 10 and communicating with each other. The first detection structure 32 and the second detection structure 34 are both disposed on the base 10 and communicate with each other. The first detection structure 32 is located on one side of the carrier component 20 in the first horizontal direction, and the first detection structure 32 is used to at least obtain the position of the notch on the outer contour of the wafer 2. The second detection structure 34 is used to obtain the size of the notch. The wafer measuring device 1 also includes a second driving structure 60 and a third driving structure 62. The second driving structure 60 is used to drive the carrier component 20 to move along the first horizontal direction, and the third driving structure 62 is used to drive the carrier component 20 to move along the second horizontal direction, which is perpendicular to the first horizontal direction.

[0099] As can be seen, the detection component 30 includes a first detection structure 32 and a second detection structure 34 for communication. The first detection structure 32 is located on one side of the carrier component 20 in the first horizontal direction. The second driving structure 60 drives the carrier component 20 to move along the first horizontal direction. This movement of the carrier component 20 along the first horizontal direction by the second driving structure 60 makes the distance between the wafer 2 placed on the carrier component 2 and the first detection structure 32 in the first horizontal direction more suitable, so that the first detection structure 32 can better detect the wafer 2. The first detection structure 32 can obtain the position of the notch on the outer contour of the wafer 2 and transmit the detection data to the second detection structure 34. Then, the first driving structure 28, the second driving structure 60 and the third driving structure 62 move the notch of the wafer 2 to the detection position of the second detection structure 34, so that the second detection structure 34 can obtain the size of the notch.

[0100] It is understood that in the above scheme, the setting position of the second detection structure 34 is not specifically limited. For example, the second detection structure 34 is located on one side of the carrier component 20 in the second horizontal direction. In addition, in the above scheme, the first detection structure 32 can be used to obtain only the position of the notch on the outer contour of the wafer 2; or, the first detection structure 32 can not only obtain the position of the notch on the outer contour of the wafer 2, but also detect the outer contour diameter of the wafer 2.

[0101] like Figures 19-21 As shown, in some embodiments, the first detection structure 32 includes a transmitter 75, a receiver 76, a third connecting plate 77, a fourth connecting plate 78, and a fifth connecting plate 79. The third connecting plate 77 extends vertically. The transmitter 75 and the receiver 76 are fixed on the third connecting plate 77, and the transmitter and receiver 76 are spaced vertically apart, thus creating a detection space between them. When the second driving structure 60 drives the carrier assembly 20 to move along the first horizontal direction, the wafer 2 placed on the carrier assembly 20 is at least partially located within the detection space. The transmitter 75 emits parallel light towards the receiver 76, and the receiver 76 is able to... The parallel light rays are received and the data is transmitted to the detection mechanism (e.g., a computer). The detection mechanism can calculate the diameter of the wafer 2 and determine the center and notch position of the wafer 2 based on the coordinate values ​​of the outer contour of the wafer 2. When the wafer 2 is at least partially located in the detection space, the wafer 2 can block part of the parallel light rays, so that the amount of parallel light rays received by the receiving end 76 changes. Then, the first driving structure 28 drives the wafer 2 to rotate 360°, so that the receiving end 76 can obtain different amounts of parallel light rays during the rotation of the wafer 2. Thus, the first detection structure 32 can fully obtain the outer contour size information of the wafer 2.

[0102] The third connecting plate 77 is bent at one end and connected to the fourth connecting plate 78. The third connecting plate 77 and the fourth connecting plate 78 are located in the same plane. The fifth connecting plate 79 is fixed on the base 10, and one end of the fifth connecting plate 79 is connected to the fourth connecting plate 78. The included angle between the fourth connecting plate 78 and the fifth connecting plate 79 is 90°. Thus, the third connecting plate 77, the fourth connecting plate 78 and the fifth connecting plate 79 form a whole, making the generating end and the receiving end 76 more stable on the third connecting plate 77, which helps to improve the working stability of the first detection structure 32. There is a reinforcing rib 80 between the fourth connecting plate 78 and the fifth connecting plate 79. The setting of the reinforcing rib 80 further enhances the structural strength between the fourth connecting plate 78 and the fifth connecting plate 79, which helps to reduce the detection error caused by vibration or external interference.

[0103] like Figures 1-4 , Figure 24 As shown, in some embodiments, the second detection structure 34 includes an imaging mechanism 340 and a first measuring mechanism. The imaging mechanism 340 is used to acquire an image of the wafer 2 at the notch. The first measuring mechanism communicates with the imaging mechanism 340 and is used to obtain the size of the notch based on the image acquired by the imaging mechanism 340. Therefore, the notch image of the wafer 2 acquired by the imaging mechanism 340 can be transmitted to the first measuring mechanism, enabling the first measuring mechanism to accurately obtain the size of the notch on the outer contour of the wafer 2, which helps to improve the detection efficiency of the notch on the outer contour of the wafer 2.

[0104] For example, the first measuring mechanism is a computer. The imaging mechanism 340 transmits the acquired image to the computer. The computer measurement software fits the shape of the notch based on the photo pixels of the notch contour and then enlarges and measures it to obtain the size of the notch (such as the angle and depth of the notch), which improves the detection efficiency of the notch on the outer contour of the wafer 2.

[0105] like Figures 1-4 , Figure 24 As shown, in some embodiments, the imaging mechanism 340 has an imaging height position. At the imaging height position, the wafer 2 is located directly below the imaging mechanism 340 and the distance between the wafer 2 and the imaging mechanism 340 is the focal length of the imaging mechanism 340. The second detection structure 34 further includes a second lifting drive structure 342, which is used to drive the imaging mechanism 340 to lift or lower, or the second lifting drive structure 342 is used to drive the leveling structure 26 and the support structure 24 to lift or lower, so that the wafer 2 on the support structure 24 is at the imaging height position.

[0106] As can be seen, the shooting mechanism 340 has a shooting height position. Since the shooting height position matches the focal length of the shooting mechanism 340, when the shooting mechanism 340 is placed in this position, the shooting mechanism 340 can capture the clearest and most accurately focused image, providing a reliable basis for subsequent size measurement.

[0107] Furthermore, the second lifting drive structure 342 can drive the imaging mechanism 340 to lift or lower, or drive the leveling structure 26 and the supporting structure 24 to lift or lower, so that the imaging mechanism 340 is always at the imaging height position. This helps to reduce measurement errors caused by inaccurate height position, improves the accuracy and reliability of measurement results, and the distance between the imaging mechanism 340 and the wafer 2 can be adjusted by the second lifting drive structure 342, which is convenient to adapt to the measurement of wafers 2 with different thicknesses, thus improving the practicality of the wafer measurement device 1.

[0108] Optionally, the imaging mechanism 340 is an industrial camera. Industrial cameras have advantages such as high resolution and fast response, which enable the imaging mechanism 340 to capture clear and accurately focused images, making it easier for the first measuring mechanism to obtain the size of the notch based on the images acquired by the imaging mechanism 340.

[0109] like Figure 25 As shown, in some embodiments, the second lifting drive structure 342 includes: a fixing member 3420, a moving member 3422, a sliding block 3424, and an adjusting member 3426. The fixing member 3420 is fixedly mounted on the base 10. The moving member 3422 and the fixing member 3420 slide in an upward and downward sliding engagement, defining a mounting cavity 3428 between them. At least one of the two side walls of the mounting cavity 3428 is inclined relative to a horizontal plane in the vertical direction, and the two side walls of the mounting cavity 3428 form a non-zero included angle. The sliding block 3424 is disposed in the mounting cavity 3428, and the upper and lower ends of the sliding block 3424 abut against the upper and lower side walls of the mounting cavity 3428, respectively. The adjusting member 3426 passes through the fixing member 3420 and is threadedly engaged with the sliding block 3424. The adjusting member 3426 and the fixing member 3420 are rotatably engaged, so as to drive the sliding block 3424 to move along the length direction of the adjusting member 3426.

[0110] As can be seen, by rotating the adjusting member 3426, the sliding block 3424 can be moved along the length direction of the adjusting member 3426. When the sliding block 3424 moves along the upper and lower side walls of the mounting cavity 3428, the position of the sliding block 3424 in the vertical direction can be changed, thereby changing the distance between the fixing member 3420 and the moving member 3422 in the vertical direction, so as to achieve the purpose of matching and adjusting the wafer 2 on the bearing structure 24 with the shooting height position.

[0111] For example, the second lifting drive structure 342 is used to drive the shooting mechanism 340 to lift. The upper side wall of the mounting cavity 3428 is a horizontal plane, and the lower side wall is an inclined plane that is relatively inclined to the horizontal plane. The upper and lower ends of the sliding block 3424 abut against the upper and lower side walls of the mounting cavity 3428, respectively. By rotating the adjusting member 3426, the sliding block 3424 can be driven to move along the upper and lower side walls of the mounting cavity 3428 to change the distance between the fixing member 3420 and the moving member 3422 in the vertical direction. The fixing member 3420 can be directly or indirectly fixed to the base 10, and the moving member 3422 can be directly or indirectly fixed to the shooting mechanism 340.

[0112] like Figures 1-4 As shown, in some embodiments, the second detection structure 34 is located on one side of the support component 20 in the second horizontal direction. The wafer measuring device 1 also includes a positioning component 40, which is disposed on the base 10. The positioning component 40 includes a second support stage 42 and a first lifting drive structure 44. The second support stage 42 is vertically opposite to the support structure 24. The first lifting drive structure 44 is used to drive the second support stage 42 to rise and fall. The second support stage 42 defines a positioning groove 420, which is used to accommodate and position the wafer 2. A portion of the edge of the positioning groove 420 is located directly below the imaging mechanism 340. Therefore, a portion of the edge of the positioning groove 420 on one side in the second horizontal direction is located directly below the imaging mechanism 340.

[0113] As can be seen, the positioning component 40 enables the wafer 2 to be initially positioned on the second carrier stage 42, achieving coarse positioning of the wafer 2 before measurement, which makes it easier for operators to place the wafer 2 more accurately. Obviously, the positioning component 40 determines the initial position of the wafer 2 on the wafer measuring device 1. Subsequently, the wafer 2 is driven down to be transferred to the support structure 24. Then, the support structure 24 drives the wafer 2 to move along the first horizontal direction to cooperate with the first detection structure 32. Finally, the wafer 2 is driven to move to cooperate with the second detection structure 34. Before the wafer 2 is driven to move to cooperate with the second detection structure 34, the position of the wafer 2 in the second horizontal direction is basically unchanged. Therefore, the position of the wafer 2 relative to the positioning groove 420 in the second horizontal direction is also basically unchanged. Since part of the edge of the positioning groove 420 is located directly below the imaging mechanism 340, the position of the wafer 2 after being detected by the first detection structure 32 is very close to the imaging mechanism 340 in the second horizontal direction. When the notch of the wafer 2 moves to directly below the imaging mechanism 340, the displacement in the second horizontal direction is very small. This helps to reduce the possibility of interference between the support structure 24 and the second support stage 42 when the support structure 24 is displaced in the second horizontal direction, which helps to improve the reliability of the wafer measuring device 1.

[0114] For example, when it is necessary to measure the notch size on the outer contour of wafer 2, the second driving structure 60 first drives the support structure 24 to move along the first horizontal direction so that the distance between the first detection structure 32 and the wafer 2 placed on the support structure 24 is more suitable, so that the first detection structure 32 can obtain the position of the notch on the outer contour of wafer 2. After the detection is completed, the second driving structure 60 drives the support structure 24 to move along the first horizontal direction so that the distance between the imaging mechanism 340 and the wafer 2 placed on the support structure 24 is more suitable in the first horizontal direction. The third driving structure 62 then drives the wafer 2 placed on the support structure 24 to move along the second horizontal direction so that the notch of wafer 2 moves to directly below the imaging mechanism 340, so that the imaging mechanism 340 can acquire a clear image of the notch on the outer contour of wafer 2. Since the second driving structure 60 only drives the support structure 24 to move along the first horizontal direction without changing the distance between the wafer 2 and the imaging mechanism 340 in the second horizontal direction, the distance between the imaging mechanism 340 and the wafer 2 in the second horizontal direction is always kept very close. When the third driving structure 62 drives the wafer 2 placed on the support structure 24 to move along the second horizontal direction, the displacement of the support structure 24 in the second horizontal direction is very small, making it less likely for the support structure 24 to interfere with the second support stage 42, which helps to improve the reliability of the wafer inspection device 1.

[0115] Please refer to this again. Figures 1-25 This application describes a wafer measurement device 1 according to a specific embodiment. The wafer measurement device 1 includes: a base 10, a support component 20, a detection component 30, a positioning component 40, a second driving structure 60, and a third driving structure 62.

[0116] The support assembly 20 is disposed on the base 10, and includes a base 22, a support structure 24, a leveling structure 26, and a first driving structure 28. The support structure 24 is used to support and limit the wafer 2, and is rotatably disposed on the base 22 via the leveling structure 26. The leveling structure 26 is used to adjust the levelness of the support structure 24. The first driving structure 28 is connected to the leveling structure 26 to drive the leveling structure 26 to rotate the support structure 24 around the vertical axis. The support structure 24 includes a first support platform 240, which includes a support plate 2400 extending into a ring. The leveling structure 26 includes a support member 260 and three leveling units 262. The support member 260 is disposed on the base 10. Below the first support platform 240 and rotatably connected to the base 22, three leveling units 262 are spaced apart circumferentially along the support plate 2400. Each leveling unit 262 connects the support component 260 and the support plate 2400 to adjust the vertical distance between the support component 260 and the support plate 2400. Each leveling unit 262 includes a leveling bolt 2620, a tightening element 2622, and a locking nut 2624. The leveling bolt 2620 is vertically inserted through the support plate 2400 and threadedly engaged with it. The lower end of the leveling bolt 2620 abuts against the support component 260. The tightening element 2622 is vertically inserted through the leveling bolt 2620 and rotatably engaged with it. 2. Threaded connection with support component 260 to adjust the clamping force applied by tensioner 2622 and support component 260 to leveling bolt 2620. Locking nut 2624 is sleeved on the outside of leveling bolt 2620 and threadedly engaged with leveling bolt 2620. Locking nut 2624 is adapted to abut against bearing plate 2400. Leveling unit 262 protrudes from the upper side of bearing plate 2400. First bearing platform 240 also includes multiple bearing columns 242, which protrude from the upper side of bearing plate 2400 and are spaced circumferentially. The upper ends of bearing columns 242 are spaced above the upper end of leveling unit 262. Bearing structure 24 also includes adsorption platforms 244, which are spaced circumferentially above bearing plate 2400. The support member 260 has an adsorption port 2440 on the inner side and top. A channel 2441 communicating with the adsorption port 2440 is formed inside the support member 260. A rotary joint 2442 is provided at the end of the channel 2441 away from the adsorption table 244. The support member 260 includes a first support member 2600 and a second support member 2602. The first support member 2600 defines the channel 2441 and includes a shaft part 2600a and a flange part 2600b. The shaft part 2600a cooperates with the first drive structure 28. The flange part 2600b is located at the top of the shaft part 2600a. The adsorption table 244 is fixed to the flange part 2600b. The second support member 2602 is sleeved outside the adsorption table 244 and fixed to the flange part 2600b.

[0117] The first drive structure 28 includes a driver 280, a transmission mechanism 282, and an adjusting lock. The driver 280 is mounted on the base 22 via the adjusting lock structure 284 and is spaced apart from the base 10. The transmission mechanism 282 includes a drive wheel 2820, a driven wheel 2822, and a conveyor belt 2824. The driven wheel 2822 is sleeved on the outer periphery of the support member 260 of the leveling structure 26. The conveyor belt 2824 is wound around the drive wheel 2820 and the driven wheel 2822. The adjusting lock structure 284 is used to adjust and lock the horizontal distance between the driver 280 and the base 22.

[0118] The detection component 30 is disposed on the base 10 and communicates with the first driving structure 28. The detection component 30 is used to acquire the size information of the outer contour of the wafer 2. The detection component 30 includes a first detection structure 32 and a second detection structure 34 disposed on the base 10 and communicating with it. The first detection structure 32 is located on one side of the support component 20 in the first horizontal direction and is used to acquire the diameter and the position of the notch on the outer contour of the wafer 2. The second detection structure 34 is used to acquire the size of the notch. The second detection structure 34 includes an imaging mechanism 340 and a first measuring mechanism. The imaging mechanism 340 is used to acquire an image of the wafer 2 at the notch. The first measuring mechanism communicates with the imaging mechanism 340 and is used to acquire the size of the notch based on the image acquired by the imaging mechanism 340. The imaging mechanism 340 has an imaging height position. At the imaging height position, the wafer 2 is located directly below the imaging mechanism 340 and the distance between the wafer 2 and the imaging mechanism 340 is the focal length of the imaging mechanism 340. The second detection structure 34 also includes a second lifting driving structure. 342, the second lifting drive structure 342 is used to drive the shooting mechanism 340 to lift and lower, so that the wafer 2 on the support structure 24 is at the shooting height position. The second lifting drive structure 342 includes a fixing member 3420, a moving member 3422, a sliding block 3424, and an adjusting member 3426. The fixing member 3420 is fixed to the base 10. The moving member 3422 and the fixing member 3420 slide and cooperate vertically, and define a mounting cavity 3428 between them. The mounting cavity 3428 has two side walls in the vertical direction. At least one of the components is inclined relative to the horizontal plane, and the two side walls of the mounting cavity 3428 in the vertical direction form a non-zero included angle. The sliding block 3424 is disposed in the mounting cavity 3428, and the upper and lower ends of the sliding block 3424 abut against the upper and lower side walls of the mounting cavity 3428 respectively. The adjusting member 3426 passes through the fixing member 3420 and is threadedly engaged with the sliding block 3424. The adjusting member 3426 and the fixing member 3420 are rotatably engaged to drive the sliding block 3424 to move along the length direction of the adjusting member 3426.

[0119] The second drive structure 60 is used to drive the bearing assembly 20 or the first detection structure 32 to move along a first horizontal direction, thereby changing the distance between the bearing assembly 20 and the first detection structure 32 in the first horizontal direction. The third drive structure 62 is used to drive the bearing assembly 20 to move along a second horizontal direction, which is perpendicular to the first horizontal direction.

[0120] The positioning component 40 is disposed on the base 10 and includes a second support platform 42 and a first lifting drive structure 44. The second support platform 42 is vertically opposite to the support structure 24. The first lifting drive structure 44 is used to drive the second support platform 42 to move up and down. The second support platform 42 defines a positioning groove 420 and extends along the outer periphery of the support structure 24 in an open annular shape. The positioning groove 420 is used to accommodate and position the wafer 2. Part of the edge of the positioning groove 420 is located directly below the imaging mechanism 340. The positioning component 40 also includes a plurality of limiting posts 46, which protrude from the second support platform 420. The wafer 2 is positioned on the upper side and circumferentially spaced on the outer periphery of the positioning groove 420. The angle between the groove wall of the positioning groove 420 and the horizontal plane is α, 30°≤α≤60°. A receiving groove 422 is formed on the bottom wall of the positioning groove 420. The positioning assembly 40 also includes a sensor 47. At least a portion of the sensor 47 is disposed in the receiving groove 422 and communicates with the first lifting drive structure 44 and the bearing structure 24. The sensor 47 is configured to be triggered by contact with the wafer 2 placed in the positioning groove 420. The width of the opening of the second bearing stage 42 is equal to the diameter of the inner periphery of the second bearing stage 42.

[0121] When the wafer measurement device 1 is working normally, the wafer 2 to be measured is first placed on the second support stage 42. The wafer 2 will slide into the positioning groove 420 under the action of gravity. The sensor 47 in the receiving groove 422 is triggered by the contact of the wafer 2 in the positioning groove 420. The sensor 47 communicates with the first lifting drive structure 44 and the adsorption stage 244, so that the first lifting drive structure 44 drives the positioning groove 420 to descend and transfer the wafer 2 to multiple support columns 242. At the same time, the adsorption port 2440 adsorbs the wafer 2. Then, the second drive structure 60 drives the support structure 24 to approach the first detection structure 32 through the opening of the second support stage 42, so that at least a part of the outer contour of the wafer 2 is located in the first detection stage 32. Directly below the measuring structure 32, the first driving structure 28 drives the wafer 2 to rotate. During the rotation of the wafer 2, the first detection structure 32 detects the diameter of the outer contour and the position of the notch of the wafer 2. Then, the first driving structure 28, the second driving structure 60, and the third driving structure 62 drive the support structure 24 to transfer the notch position of the wafer 2 to directly below the imaging mechanism 340. The first measuring mechanism obtains the size based on the image acquired by the imaging mechanism 340. After the measurement of the wafer 2 is completed, the suction port 2440 stops suctioning the wafer 2. At the same time, the first lifting driving structure 44 drives the second support platform 42 to rise, so that the wafer 2 is transferred from the support structure 24 to the positioning slot 420, and then the wafer 2 is removed. This facilitates the automated measurement of the outer contour diameter and notch size of the wafer 2. Moreover, the support structure 24 has good levelness, so that the data measured by the wafer measuring device 1 is more consistent with the actual value, which helps to improve the product quality and production efficiency of the wafer 2.

[0122] Furthermore, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately. In addition, various different embodiments of this application can also be arbitrarily combined, as long as they do not violate the spirit of this application, they should also be regarded as the content disclosed in this application.

[0123] In the description of this application, it should be understood that the terms "center," "lateral," "length," "thickness," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "multiple" means two or more. In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0124] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on the upper side" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "on the lower side" of the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0125] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0126] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer measuring device, characterized in that, include: Base; A support assembly is disposed on the base and includes a base, a support structure, a leveling structure, and a first driving structure. The support structure is used to support and limit the wafer, and the support structure is rotatably disposed on the base via the leveling structure. The leveling structure is used to adjust the levelness of the support structure. The first driving structure is connected to the leveling structure to drive the leveling structure to rotate the support structure around a vertical axis. A detection component is disposed on the base and is used to acquire the dimensional information of the outer contour of the wafer.

2. The wafer measuring apparatus according to claim 1, characterized in that, The supporting structure includes a first supporting platform, the first supporting platform including a supporting plate extending into a ring shape. The leveling structure includes a support component and multiple leveling units. The support component is located below the first support platform and is rotatably connected to the base. The multiple leveling units are spaced apart along the circumference of the support plate. Each leveling unit connects the support component and the support plate to adjust the distance between the support component and the support plate in the vertical direction. At least three leveling units are provided.

3. The wafer measuring apparatus according to claim 2, characterized in that, The leveling unit includes: The leveling bolt is vertically inserted through the bearing plate and threaded into the bearing plate, and the lower end of the leveling bolt abuts against the support component. A tensioning element is vertically inserted through the leveling bolt and rotatably engaged with it. The tensioning element is threadedly connected to the support component to adjust the clamping force applied by the tensioning element and the support component to the leveling bolt. A locking nut is fitted over the leveling bolt and threadedly engages with it. The locking nut is adapted to abut against the bearing plate.

4. The wafer measuring apparatus according to claim 1, characterized in that, Also includes: A positioning component is disposed on the base and includes a second support platform and a first lifting drive structure. The second support platform is vertically opposite to the support structure. The first lifting drive structure is used to drive the second support platform to move up and down. The second support platform defines a positioning groove and extends along the outer periphery of the support structure as an open annular shape. The positioning groove is used to accommodate and position the wafer.

5. The wafer measuring apparatus according to claim 4, characterized in that, The wafer measurement apparatus is configured to satisfy at least one of the following conditions: Condition A1: The positioning component further includes a plurality of limiting posts, which protrude from the upper side of the second support platform and are spaced circumferentially on the outer periphery of the positioning groove; Condition A2: The angle between the peripheral wall of the positioning groove and the horizontal plane is α, 30°≤α≤60°; Condition A3: A receiving groove is formed on the bottom wall of the positioning groove, and the positioning component further includes: a sensor, at least a portion of which is disposed in the receiving groove and communicates with the first lifting drive structure and the bearing structure, and the sensor is configured to be triggered by the wafer placed in the positioning groove. Condition A4: The width of the opening of the second support platform is equal to the diameter of the inner peripheral wall of the second support platform.

6. The wafer measuring apparatus according to any one of claims 1-5, characterized in that, The detection component includes a first detection structure disposed on the base and located on one side of the support component in a first horizontal direction, and is used to at least obtain the diameter of the outer contour of the wafer. The wafer measurement device also includes: A second driving structure is used to drive the bearing component or the first detection structure to move along the first horizontal direction, so as to change the distance between the bearing component and the first detection structure in the first horizontal direction.

7. The wafer measuring apparatus according to any one of claims 1-5, characterized in that, The detection component includes a first detection structure and a second detection structure disposed on and in communication with the base. The first detection structure is located on one side of the support component in a first horizontal direction and is used to at least obtain the position of the notch on the outer contour of the wafer. The second detection structure is used to obtain the size of the notch. The wafer measurement device also includes: A second driving structure is used to drive the bearing component to move along the first horizontal direction; A third driving structure is used to drive the bearing component to move along a second horizontal direction, which is perpendicular to the first horizontal direction.

8. The wafer measuring apparatus according to claim 7, characterized in that, The second detection structure includes: The imaging mechanism is used to capture images of the wafer at the notch. A first measuring mechanism communicates with the shooting mechanism and is used to obtain the size of the notch based on the image acquired by the shooting mechanism.

9. The wafer measuring apparatus according to claim 8, characterized in that, The imaging mechanism has an imaging height position, at which the wafer is located directly below the imaging mechanism and the distance between the wafer and the imaging mechanism is the focal length of the imaging mechanism. The second detection structure further includes: The second lifting drive structure is used to drive the shooting mechanism to lift or lower, or drive the leveling structure and the support structure to lift or lower, so that the wafer on the support structure is at the shooting height position.

10. The wafer measuring apparatus according to claim 9, characterized in that, The second lifting drive structure includes: The fastener is fixedly disposed on the base; A movable component and a fixed component slide and cooperate vertically, defining a mounting cavity between them. At least one of the two side walls of the mounting cavity in the vertical direction is inclined relative to a horizontal plane, and the two side walls of the mounting cavity in the vertical direction form a non-zero included angle. A sliding block is disposed in the mounting cavity, and the upper and lower ends of the sliding block abut against the upper and lower side walls of the mounting cavity, respectively. An adjusting member is provided, which passes through the fixing member and is threadedly engaged with the sliding block. The adjusting member and the fixing member are rotatably engaged to drive the sliding block to move along the length direction of the adjusting member.

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