Chip test probe
By using a mortise and tenon joint structure and a spring design, the chip test probe solves the problems of unstable connection and unreasonable space utilization of traditional probes, achieving efficient and low-cost chip testing and improving the stability and accuracy of signal transmission.
Patent Information
- Application Number
- CN202520452027.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2035-03-14
AI Technical Summary
Traditional chip test probes are cumbersome and unstable in terms of connection methods, make unreasonable use of space, are difficult to adapt to high-density chip testing, and lack an adaptive mechanism, resulting in unstable signal transmission, which affects the accuracy and efficiency of testing.
The device employs a mortise and tenon connection structure between the head and tail components, combined with a spring buffer design, to achieve rapid assembly and a stable connection. It adapts to positional deviations between the device under test and the PCB, thereby enhancing signal transmission stability.
It improved assembly efficiency and yield, reduced production costs, extended probe lifespan, and enhanced the accuracy and stability of signal transmission.
Smart Images

Figure CN223582021U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing technology, and in particular to chip testing probes. Background Technology
[0002] With the rapid development of the semiconductor industry, chip integration is constantly increasing, chip size is becoming smaller, and functions are becoming increasingly complex. This necessitates that chips undergo rigorous and precise testing before entering the market to ensure their performance meets standards and satisfies the needs of various electronic devices. Chip test probes, acting as a bridge between the chip and testing equipment, bear the crucial task of collecting chip signals and transmitting them to the testing equipment for analysis. Their performance directly affects the accuracy and efficiency of chip testing; traditional chip test probes have many shortcomings in terms of structural design and performance. In terms of connection methods, many probes employ complex dotting and riveting processes to achieve connections between components. This process is not only cumbersome, requiring specialized technicians and specific equipment, and consuming significant time and manpower, but it is also prone to problems such as insecure riveting and deviations during the riveting process, resulting in poor overall stability and reliability of the probes, which in turn affects the accuracy of chip test results. In terms of space utilization, the layout design of traditional probes is often inefficient, making flexible installation and operation difficult in limited test spaces. Especially when facing high-density chip testing needs, they cannot effectively adapt to compact test environments, limiting the improvement of test efficiency. Furthermore, traditional probes have limited ability to handle positional deviations between the device under test (DUT) and the PCB. Due to the inevitable errors in chip manufacturing and installation, the positions of the DUT and the PADs on the PCB may not correspond perfectly. Traditional probes lack effective adaptive mechanisms, making them prone to poor contact, affecting the stability of signal transmission, leading to inaccurate test data, and potentially damaging the chip or the probe itself due to excessive impact force at the moment of contact.
[0003] To overcome the drawbacks of these traditional chip test probes, meet the growing demand for chip testing, improve testing efficiency and accuracy, and reduce production costs, we propose a new chip test probe. Summary of the Invention
[0004] In view of the problems existing in the prior art, this utility model is proposed.
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a chip test probe, including...
[0006] A needle assembly, comprising a carrier body that contacts the device under test and a needle, wherein the needle is symmetrically mounted on the upper end of the carrier body, and the carrier body is further provided with an assembly part for assembling other structures.
[0007] The needle tail assembly includes an arc-shaped contact surface needle tail that contacts a PAD on a PCB, and an assembly part two is fixedly provided on the needle tail for mating with the needle head assembly.
[0008] spring.
[0009] As a preferred embodiment of the chip test probe of this utility model, the assembly part includes abutment blocks symmetrically arranged on both sides of the carrier, contact arms are symmetrically fixed at the bottom of the carrier, there is a mortise and tenon space between the two contact arms, and a locking slider for limiting the position is provided on the adjacent side of the two contact arms, and the cross section of the locking slider is arc-shaped.
[0010] As a preferred embodiment of the chip test probe of this utility model, the assembly part two includes abutment blocks two symmetrically arranged on both sides of the needle tail, and a carrier two is fixedly provided at the upper end of the needle tail. The carrier two has symmetrically opened sliding grooves on the front and rear sides, and the sliding grooves are used to accommodate the sliding of the locking slider.
[0011] As a preferred embodiment of the chip test probe of this utility model, the needle head assembly and the needle tail assembly are arranged at right angles in the combined installation state, the needle tail assembly is located in the mortise and tenon space of the needle head assembly, and the two locking sliders are slidably locked in the two sliding grooves. When combined, the needle head assembly and the needle tail assembly form a probe test body.
[0012] As a preferred embodiment of the chip test probe of this utility model, wherein: a spring is sleeved on the outer side of the probe test body to assist the needle tail assembly in resetting when sliding in the mortise space of the needle head assembly, the upper end of the spring abuts against two abutting blocks, and the lower end of the spring abuts against two abutting blocks.
[0013] The beneficial effects of this utility model are as follows: Assembly is simple. The needle tail assembly is placed into the mortise and tenon space of the needle head assembly, and the locking slider slides into place along the groove, eliminating the need for the complex dotting and riveting process of traditional probes. This not only improves assembly efficiency and reduces assembly time but also reduces human error and increases the yield rate. In terms of cost control, eliminating the dotting and riveting process reduces equipment investment and labor costs, lowers the defect rate, shortens the production cycle, accelerates capital turnover, effectively reduces overall production costs, and enhances market competitiveness. From a structural design perspective, the needle head and needle tail assemblies are arranged at right angles after assembly, saving space and facilitating flexible application in limited testing environments. The outer spring assists in the reset of the needle tail assembly and also acts as a buffer, protecting the assembly from excessive impact damage, extending the probe's lifespan, and improving the product's cost-effectiveness. Attached Figure Description
[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the overall assembly structure of this utility model.
[0016] Figure 2 This is a schematic diagram of the needle assembly.
[0017] Figure 3 This is a schematic diagram of the needle tail assembly mechanism.
[0018] Figure 4 This utility model Figure 1 A cross-sectional structural diagram.
[0019] Reference numerals: 100, needle assembly; 101, carrier one; 102, needle; 103, abutment block one; 104, contact arm; 105, locking slider; 200, needle tail assembly; 201, carrier two; 202, slide groove; 203, abutment block two; 204, needle tail; 300, spring. Detailed Implementation
[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0022] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.
[0023] Example 1
[0024] Reference Figures 1-4 This is the first embodiment of the present invention, which provides a chip test probe.
[0025] Specifically, to solve the above-mentioned technical problems, this utility model provides the following technical solution: a chip test probe, including...
[0026] The needle assembly 100 includes a carrier 101 that contacts the device under test and a needle 102. The needle 102 is symmetrically mounted on the upper end of the carrier 101. The carrier 101 is also provided with an assembly part for assembling other structures.
[0027] The needle tail assembly 200 includes an arc-shaped contact surface needle tail 204 that contacts a PAD on a PCB, and an assembly part 2 is fixedly provided on the needle tail 204 for mortise and tenon connection with the needle head assembly 100.
[0028] Spring 300.
[0029] The assembly part includes abutment blocks 103 symmetrically arranged on both sides of the carrier 101. The bottom of the carrier 101 is symmetrically fixed with contact arms 104. There is a mortise and tenon space between the two contact arms 104. The two contact arms 104 are provided with locking sliders 105 for limiting the position on the adjacent side. The cross section of the locking sliders 105 is arc-shaped.
[0030] The second assembly part includes abutment blocks 203 symmetrically arranged on both sides of the needle tail 204. The upper end of the needle tail 204 is also fixedly provided with a carrier body 201. The front and rear sides of the carrier body 201 are symmetrically provided with sliding grooves 202, which are used to accommodate the sliding of the snap-fit slider 105.
[0031] The needle tip assembly 100 and the needle tail assembly 200 are arranged at right angles when assembled together. The needle tail assembly 200 is located in the mortise and tenon space of the needle tip assembly 100, and the two locking sliders 105 are slidably locked in the two sliding grooves 202. When assembled together, the needle tip assembly 100 and the needle tail assembly 200 form a probe test body.
[0032] The probe test body is fitted with a spring 300 on its outer side to assist the needle tail assembly 200 in resetting when sliding within the mortise and tenon space of the needle head assembly 100. The upper end of the spring 300 abuts against two of the abutment blocks 103, and the lower end of the spring 300 abuts against two of the abutment blocks 203.
[0033] The core mechanical structure of the chip test probe lies in the mortise and tenon connection between the probe tip assembly 100 and the probe tail assembly 200. Symmetrically arranged contact arms 104 at the bottom of the support body 101 of the probe tip assembly 100 form a mortise and tenon space. The locking slider 105 on the adjacent side of the contact arm 104 matches the symmetrically opened grooves 202 on the front and rear sides of the support body 201 in the probe tail assembly 200. This design, similar to the mortise and tenon structure of traditional woodworking, achieves a precise connection between the two components through the sliding engagement of the locking slider 105 within the groove 202, ensuring the stability and reliability of the connection, while also providing a track for relative sliding.
[0034] The probe tip assembly 100 and the probe tail assembly 200 are arranged at right angles in the combined installation state. This layout not only makes ingenious use of space but also has unique mechanical advantages. The right-angle distribution allows the probe to withstand forces in different directions during operation. For example, when in contact with the device under test and PADs on the PCB, forces from different directions can be effectively dispersed and transmitted through this right-angle structure, avoiding damage or poor contact caused by uneven force.
[0035] The outer sleeved spring 300 is also an important mechanical component. The upper end of the spring 300 abuts against the abutment block 103 of the needle tip assembly 100, and the lower end abuts against the abutment block 203 of the needle tail assembly 200. The spring plays a dual role in the device: buffering and resetting. When the needle tail assembly 200 slides within the mortise and tenon space of the needle tip assembly 100, the spring provides a counter-force, helping the needle tail assembly 200 smoothly return to its initial position after sliding. Simultaneously, when the probe is subjected to external impact, the spring can compress and deform, absorbing part of the impact force and protecting the needle tip assembly 100 and the needle tail assembly 200 from damage caused by excessive external forces.
[0036] In summary, before chip testing, the chip test probes are first installed on the testing equipment. Using a mortise and tenon joint structure, the probe tip assembly 100 and the probe tail assembly 200 are quickly and securely assembled into the probe test body. At this time, the spring 300 is in its natural state, providing initial elastic potential energy for subsequent operations. When the testing equipment is started, the probe test body begins to move towards the device under test (DUT) and the PCB. The probe tip 102 of the probe tip assembly 100 first contacts the DUT. Because the probe tip 102 is symmetrically mounted on the upper end of the carrier 101, good contact with the DUT is ensured, enabling signal acquisition. Simultaneously, the arc-shaped contact surface of the probe tail assembly 200, the probe tail 204, contacts the PAD on the PCB. The arc-shaped contact surface design increases the contact area with the PAD, improving the stability of signal transmission. During the contact process, due to the possible deviation between the position of the device under test and the PCB, the needle tail assembly 200 will slide to a certain extent within the mortise space of the needle head assembly 100. The spring 300 will be compressed or stretched accordingly to adapt to this positional change and ensure that the needle head 102 and the arc-shaped contact surface needle tail 204 always maintain a good contact state.
[0037] Once the probe tip 102 makes good contact with the device under test (DUT) and the curved contact surface of the probe tail 204 makes good contact with the PAD on the PCB, signal transmission begins in the probe. The electrical signal acquired from the DUT is transmitted through the probe tip 102 to the carrier 101, then through the mortise and tenon connection structure to the probe tail assembly 200, and finally through the curved contact surface of the probe tail 204 to the PCB, completing the signal acquisition and transmission process. Throughout the signal transmission process, a stable mechanical connection structure and good contact are crucial to ensuring accurate and stable signal transmission. After the test is completed, the test equipment controls the probe test body to leave the DUT and the PCB. At this time, the spring 300 releases its stored elastic potential energy, pushing the probe tail assembly 200 to slide within the mortise and tenon space of the probe tip assembly 100, returning it to its initial position, ready for the next test.
[0038] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. A chip test probe, characterized in that: include The needle assembly (100) includes a carrier (101) that contacts the device under test and a needle (102). The needle (102) is symmetrically mounted on the upper end of the carrier (101). The carrier (101) is also provided with an assembly part for assembling other structures. The needle tail assembly (200) includes an arc-shaped contact surface needle tail (204) that contacts the PAD on the PCB, and the needle tail (204) is fixedly provided with an assembly part two for mating and connecting with the needle head assembly (100). Spring (300).
2. The chip test probe as described in claim 1, characterized in that: The assembly part includes abutment blocks (103) symmetrically arranged on both sides of the carrier (101). The bottom of the carrier (101) is symmetrically fixed with contact arms (104). There is a mortise and tenon space between the two contact arms (104). The two contact arms (104) are provided with locking sliders (105) for limiting the position on the adjacent side. The cross section of the locking sliders (105) is arc-shaped.
3. The chip test probe as described in claim 1, characterized in that: The assembly part two includes abutting blocks two (203) symmetrically arranged on both sides of the needle tail (204). The upper end of the needle tail (204) is also fixedly provided with a carrier two (201). The carrier two (201) has symmetrically opened sliding grooves (202) on the front and rear sides. The sliding grooves (202) are used to accommodate the sliding of the snap-fit slider (105).
4. The chip test probe as described in claim 3, characterized in that: The needle tip assembly (100) and the needle tail assembly (200) are arranged at right angles when assembled. The needle tail assembly (200) is located in the mortise and tenon space of the needle tip assembly (100), and the two locking sliders (105) are slidably locked in the two sliding grooves (202). When assembled, the needle tip assembly (100) and the needle tail assembly (200) form a probe test body.
5. The chip test probe as described in claim 4, characterized in that: The probe test body is fitted with a spring (300) on its outer side to assist the needle tail assembly (200) in resetting when sliding in the mortise and tenon space of the needle head assembly (100). The upper end of the spring (300) abuts against two abutment blocks (103), and the lower end of the spring (300) abuts against two abutment blocks (203).