Chip element testing equipment

Abstract

The embodiment of the utility model provides chip element testing equipment, and the equipment comprises a grabbing device which enables a no-load tray to be grabbed to a material shaking device, and enables a full-load tray loaded with a plurality of chip elements to be grabbed to a testing device; wherein the tray is provided with an accommodating part for accommodating a plurality of chip elements and a cover part with a plurality of holes; the feeding device is used for conveying a plurality of chip elements to the tray at the material shaking device; the material shaking device shakes the tray, so that the chip elements from the feeding device are loaded into the accommodating part through the hole; and the testing device is used for testing the chip elements in the trays transferred by the grabbing device, emptying the loaded chip elements and outputting the unloaded trays. According to the embodiment of the invention, the process of shaking the tray to take materials and placing and taking the tray can be automated, so that the manpower can be saved and the test efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to the technical field of electronics, in particular to a chip component testing device. BACKGROUND

[0002] The chip component testing device is mainly used in the production process of semiconductor chips to detect the performance and function of the chips to ensure the quality and reliability of the chips. Testing is an important link to ensure product yield and cost control. Through testing, it can be ensured that the chip can completely realize the function and performance index specified in the design specification under harsh environment.

[0003] Taking a chip component as a capacitor as an example, in the capacitor testing process, in order to improve the testing efficiency, the capacitor material needs to be placed in a tray first, and then the whole tray of capacitors is tested. At present, manual operation is needed to shake the capacitors into the tray for chip component testing, and then the full tray is placed on the testing machine for testing. After testing, the empty tray is taken off, and the above process is repeated by manually shaking the material again.

[0004] It should be noted that the above introduction to the technical background is only to facilitate the clear and complete description of the technical scheme of the present application, and to facilitate the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art only because it is described in the background section of the present application. CONTENT OF THE INVENTION

[0005] The inventor finds that in the existing production process, the manual operation time is relatively long, and each testing machine needs manual operation to repeat the same process, which greatly wastes manpower.

[0006] In order to solve at least one of the above problems or other similar problems, the embodiment of the present application provides a chip component testing device.

[0007] According to the embodiment of the present application, a chip component testing device is provided, which comprises:

[0008] A grabbing device grabs an empty tray for loading chip components to a material shaking device, and grabs a full tray loaded with a plurality of chip components to a testing device; wherein the tray has a containing part containing the plurality of chip components and a cover part with a plurality of holes;

[0009] A feeding device transmits the plurality of chip components to the tray at the material shaking device;

[0010] A material shaking device shakes the tray, so that the chip components from the feeding device are loaded into the containing part through the holes;

[0011] A testing device tests the chip elements in the tray loaded with the chip elements and outputs the tray after the loaded chip elements are emptied.

[0012] In some embodiments, the tray shaker shakes the tray in horizontal and vertical directions.

[0013] In some embodiments, the apparatus further comprises:

[0014] A storage device stores the plurality of chip elements; a bottom of the storage device is provided with a vibration mechanism that controls the speed and / or quantity of the chip elements from the storage device into the feeding device.

[0015] In some embodiments, when the tray shaker is empty, the grabbing device grabs the empty tray from the testing device and places the empty tray in the tray shaker for shaking.

[0016] When the testing device is empty and the tray shaker has finished shaking the tray, the grabbing device grabs the full tray from the tray shaker and places the full tray in the testing device for testing the chip elements in the tray.

[0017] In some embodiments, the apparatus further comprises:

[0018] A transfer device that can accommodate at least two trays including a first tray and a second tray.

[0019] In some embodiments, when the tray shaker is empty, the grabbing device grabs the empty first tray from the transfer device and places the empty first tray in the tray shaker for shaking.

[0020] When the testing device is empty and the tray shaker has finished shaking the first tray, the grabbing device grabs the full first tray from the tray shaker and places the full first tray in the testing device for testing the chip elements in the first tray.

[0021] In some embodiments, when the testing device outputs the empty first tray, the grabbing device grabs the empty first tray from the testing device and places the first tray in the transfer device, which waits to be grabbed for shaking.

[0022] In some embodiments, in a case that the full loaded first tray is transported from the shaker to the testing device, the grabbing device grabs an empty second tray from the transfer device and places the empty second tray in the shaker for shaking.

[0023] In some embodiments, in a case that the testing device has no tray and the shaking of the second tray by the shaker is completed, the grabbing device grabs a full loaded second tray from the shaker and places the full loaded second tray in the testing device for testing the chip elements in the second tray.

[0024] In some embodiments, in a case that the testing device outputs an empty second tray, the grabbing device grabs the empty second tray from the testing device and places the second tray in the transfer device, which waits to be grabbed for shaking.

[0025] One of the beneficial effects of the embodiments of the present application includes that, by means of the chip element testing device including at least the grabbing device, the feeding device, the shaker and the testing device, the process of taking, placing and grabbing the tray can be automated, so as to save manpower and improve the efficiency of chip element testing.

[0026] Specific implementations of the present application are disclosed in detail in the following description and claims, indicating the ways in which the principles of the present application can be employed. It should be understood that the present application is not limited in scope to the specific implementations described herein. In the claims, means-plus-function or step-plus-function clauses can be used for material and / or acts which can not exist now or which exist as of the filing date of this application but which the applicants anticipate will or can exist at some point in the future. Such clauses should be construed to cover the same element or act no matter when its formulation might occur.

[0027] Features described and / or illustrated with respect to one implementation can be used in the same or similar manner in one or more other implementations, in combination with or in place of features in other implementations. It should be emphasized that, when the term "comprises / comprising" is used in the detailed description, claims and / or drawings, it is intended to mean that the features so described and / or illustrated can be included in, but not limited to, the present application. It is also intended that the term "comprises / comprising" encompass the presence of one or more additional features, integers, steps, operations, elements, and / or components. BRIEF DESCRIPTION OF DRAWINGS

[0028] Elements and features described with respect to one drawing or implementation of the present application can be combined with elements and features illustrated in one or more other drawings or implementations of the present application. Also, in the drawings, like reference numerals designate corresponding parts throughout the several views, and can be used to designate corresponding parts in more than one implementation.

[0029] The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:

[0030] Figure 1 is a schematic view of a chip component testing device according to an embodiment of the application;

[0031] Figure 2 is a schematic view of a tray according to an embodiment of the application;

[0032] Figure 3 is a schematic view of a shaking device according to an embodiment of the application;

[0033] Figure 4 is a schematic view of a process according to an embodiment of the application;

[0034] Figure 5 is a schematic view of a chip component testing device according to another embodiment of the application;

[0035] Figure 6 is a schematic view of another process according to an embodiment of the application. DETAILED DESCRIPTION

[0036] The foregoing and other features of the present application will become more apparent from the following description and accompanying drawings. In the description and drawings, like numbers in different drawings represent the same or similar elements. The examples of the present application will be described with reference to the accompanying drawings, in which:

[0037] In the embodiments of the present application, the terms "first", "second", "upper", "lower", and the like are used to distinguish different elements from each other, but do not indicate spatial arrangement or time sequence of the elements, and the elements should not be limited by these terms. The term "and / or" includes any one and all combinations of the associated listed terms. The terms "comprise", "include", "have", and the like, refer to the presence of the stated features, elements, elements, or components, but do not exclude the presence or addition of one or more other features, elements, elements, or components.

[0038] In the embodiments of the present application, the singular form "a", "an", "the" and the like include the plural form, should be broadly understood as "one" or "a kind of", and not limited to the meaning of "one"; in addition, the term "said" should be understood as including both the singular form and the plural form, unless the context clearly indicates otherwise. In addition, the term "according to" should be understood as "at least partially according to", and the term "based on" should be understood as "at least partially based on", unless the context clearly indicates otherwise.

[0039] The embodiments of the present application provide a chip component testing device. In the present application, the chip component can be a capacitor, for example, a multilayer ceramic capacitor (MLCC), but the present application is not limited thereto, for example, it can also be other types of capacitors, or other electronic components with chips. The chip component is, for example, in the form of a strip, a particle, etc., and the specific shape or structure of the chip component can be referred to related art.

[0040] Figure 1 is a schematic diagram of a chip component testing device according to an embodiment of the present application. As shown in Figure 1 , the chip component testing device 10 includes a grabbing device 101, a feeding device 102, a shaking device 103, and a testing device 104. The grabbing device 101 can grab a tray 100, for example, Figure 1 shows the case where the tray 100 is initially located on the grabbing device 101.

[0041] Figure 2 is a schematic diagram of a tray 100 according to an embodiment of the present application, which schematically shows part of the tray 100 as viewed from above. For example, the tray 100 has a containing portion 201 (not shown) containing a plurality of chip components (not shown) and a cover portion 202 with a plurality of holes 2021. The chip components can be loaded into the containing portion 201 via the holes 2021. Figure 2 Figure 2 is only schematically marked because it is blocked.

[0042] Figure 2 Only one example of the tray is schematically shown, and the present application is not limited thereto, for example, the edge of the tray can also have a protruding portion to prevent the chip components from falling off, or the shape of the tray can be circular or elliptical or polygonal, etc. The content of the tray and the chip component can also be referred to related art; for example, the tray can also be a test board or other container, which is not limited by the present application.

[0043] ​In this embodiment, the gripping device 101 can grip an empty tray 100 for loading chip components onto the shaking device 103, and grip a fully loaded tray 100 containing multiple chip components onto the testing device 104. The feeding device 102 transfers multiple chip components onto the tray 100 at the shaking device 103. The shaking device 103 can shake the tray 100, causing the chip components from the feeding device 102 to be loaded into the receiving portion 201 through the hole 2021 of the tray 100.

[0044] Both the material handling device 103 and the testing device 104 have positions for placing the tray 100. The testing device 104 can test the chip components in the tray 100 loaded with multiple chip components transferred by the gripping device 101, and output a tray without chip components after emptying the loaded chip components. For details on how to test the chip components, please refer to relevant technologies; in addition, the emptying of the tray can be done by a tester or by the testing device 104 automatically opening the cover of the tray, and this application does not limit this.

[0045] like Figure 1 As shown, the gripping device 101, the shaking device 103, and the testing device 104 can all be placed individually, while the feeding device 102 and the shaking device 103 can be placed together. The shaking device 103 and the testing device 104 are located within the gripping range of the gripping device 101. This application is not limited to this; for example, the installation positions of each device can be adjusted, as long as each device is within a range where it can work together.

[0046] Therefore, chip component testing equipment, which includes at least a gripping device, a feeding device, a shaking device, and a testing device, can automate the process of shaking the tray to pick up materials and placing and picking up the tray, thereby saving manpower and improving the efficiency of chip component testing.

[0047] It is worth noting that the above appendix Figure 1 The embodiments described herein are merely illustrative and are not limited thereto. For example, some devices or components may be appropriately added, and some devices or components may be removed. Those skilled in the art can make appropriate modifications based on the above description, and are not limited to the above-described embodiments. Figure 1 The records.

[0048] The following will further describe the material shaking device and related feeding device of the embodiments of this application.

[0049] Figure 3 This is a schematic diagram of a material shaking device according to an embodiment of this application, schematically showing part of the material shaking device 103 and the connected feeding device 102 and storage device 105.

[0050] In some embodiments, as shown in Figure 3 Chip component testing device 10 can further include:

[0051] A storage device 105 capable of storing a plurality of chip components; the bottom of the storage device 105 can be provided with a vibration mechanism 1051, which controls the speed and / or quantity of the chip components entering the feeding device 102 from the storage device 105.

[0052] For example, the switch and vibration frequency of the vibration mechanism 1051 can be controlled by setting parameters to control the discharge speed and / or quantity of the chip components. The specific structure of the vibration mechanism 1051 can include a vibration spring and / or a vibration body, or a cam / rotor vibration generator, and the present application is not limited thereto.

[0053] In this way, the storage device 105 can store a plurality of chip components, so as to improve the degree of automation without multiple discharges. As shown in Figure 1 and Figure 3 The storage device 105 can be funnel-shaped, and the chip components can move downward by gravity, and the present application is not limited thereto.

[0054] As shown in Figure 3 The feeding device 102 is located downstream of the storage device 105 in the vertical direction, and the shaking device 103 is located downstream of the feeding device 102 in the vertical direction, so that the chip components can enter the shaking device 103 from the storage device 105 through the feeding device 102 by gravity. Figure 3 Only one example of the feeding device 102 and the storage device 105 is shown, and the present application is not limited thereto, for example, feeding can also be performed by a conveyor belt or the like.

[0055] In the embodiments of the present application, for the convenience of description, as shown in Figure 3 The x-axis direction can be defined as the horizontal direction, and the y-axis direction can be defined as the vertical direction. It should be noted that the definition of each direction in the present specification is only for the convenience of describing the embodiments of the present application, and does not limit the direction of each device in use and manufacture.

[0056] In the embodiments of the present application, the shaking device 103 can shake the tray in the x-axis direction and the y-axis direction. As shown in Figure 3 The shaking device 103 can have a first transmission mechanism 1031 generating x-axis direction movement and a second transmission mechanism 1032 generating y-axis direction movement.

[0057] In the prior art, the movement is generally in the horizontal direction, so that the long strip-shaped material is sometimes difficult to fall into the tray through the hole, thereby increasing the shaking time. In the embodiment of the present application, the shaking device 103 not only shakes the tray in the x-axis direction, but also shakes the tray in the y-axis direction. Thus, not only the flat material can be shaken into the tray through the hole, but also the long strip-shaped material can be shaken into the tray through the hole.

[0058] In some embodiments, the shaking device 103 can uniformly shake the tray in the x-axis direction and the y-axis direction, for example, alternately shaking the tray in the x-axis direction and the y-axis direction respectively. The shaking device 103 can also non-uniformly shake the tray in the x-axis direction and the y-axis direction, for example, shaking the tray in the x-axis direction for N times, and then shaking the tray in the y-axis direction for M times, M is not equal to N. The shaking device 103 can also randomly shake the tray in the x-axis direction and the y-axis direction. The specific way of shaking is not limited in the present application.

[0059] The above describes the various devices of the embodiment of the present application, and the following describes how to grab (transport) the tray.

[0060] In some embodiments, the transfer area (transfer device) can not be provided, that is, the grabbing device 101 transports the tray 100 between the testing device 104 and the shaking device 103.

[0061] For example, when the shaking device 103 does not have the tray 100, the grabbing device 101 grabs the empty tray from the testing device 104 and places the empty tray in the shaking device 103 for shaking;

[0062] When the testing device 104 does not have the tray and the shaking device 103 has finished shaking the tray, the grabbing device 101 grabs the full tray from the shaking device 103 and places the full tray in the testing device 104 for testing the chip elements in the tray.

[0063] Figure 4 is a process schematic diagram of the embodiment of the present application, which exemplarily illustrates the case without a transfer area. For example, when the system contains one tray 100, as shown in Figure 4 The working process includes:

[0064] 401: The empty tray 100 is placed in the shaking device 103 by the grabbing device 101.

[0065] For example, the empty tray 100 is initially located in the grabbing device 101, and the empty tray 100 is placed in the shaking device 103 by the grabbing device 101.

[0066] 402: The material shaking is complete, and the fully loaded pallet is placed into the test device 104.

[0067] For example, when the testing device 104 is without a tray, the gripping device 101 grips the tray 100 from the material handling device 103 and places the tray 100 on the testing device 104, whereby the chip components on the tray 100 are tested.

[0068] 403: Test complete. The test device outputs an empty pallet to be placed into the material shaking device 103.

[0069] For example, when the material shaking device 103 is without a tray, the gripping device 101 grips the empty tray 100 from the testing device 104 and places it in the material shaking device 103 to shake the material again.

[0070] Then repeat steps 402 and 403 to complete the continuous operation of the system.

[0071] It is worth noting that the above appendix Figure 4 The embodiments described herein are merely illustrative and are not limited thereto. For example, the execution order of various operations can be appropriately adjusted, and additional operations can be added or some operations can be removed. Those skilled in the art can make appropriate modifications based on the above description, and are not limited to the above-described embodiments. Figure 4 The records.

[0072] In some embodiments, a transfer area (transfer device) may be provided. The chip component testing equipment may also include a transfer device capable of accommodating at least two trays, including a first tray and a second tray.

[0073] Figure 5 This is another schematic diagram of a chip component testing device according to an embodiment of this application. For example... Figure 5 As shown, the chip component testing equipment 10 may also include a transfer device 106 capable of accommodating at least two trays.

[0074] For example, the transfer device 106 can store two trays, namely the first tray 01 ( Figure 5 This shows the first tray 01 being gripped by the gripping device 101 and the second tray 02. Figure 5 The illustration shows the second pallet 02 currently placed in the transfer device 106. The following description uses two pallets as an example, but this application is not limited to this; for example, more than two pallets can be used.

[0075] like Figure 5As shown, the transfer device 106 can be placed separately from the grabbing device 101, the shaking device 103 and the testing device 104, and the transfer device 106 is located within the grabbing range of the grabbing device 101. In addition, the transfer device of the embodiments of the present application is, for example, a bracket for placing the tray, and the present application is not limited thereto, and the transfer device can also be, for example, a platform for placing the tray.

[0076] In some embodiments, in the case that the shaking device 103 does not have a tray, the grabbing device 101 grabs the empty first tray 01 from the transfer device 106 and places the empty first tray 01 on the shaking device 103 for shaking;

[0077] In the case that the testing device 104 does not have a tray and the shaking device 103 has finished shaking the first tray 01, the grabbing device 101 grabs the full first tray 01 from the shaking device 103 and places the full first tray 01 on the testing device 104 for testing the chip elements in the first tray 01.

[0078] In some embodiments, in the case that the testing device 104 outputs an empty first tray 01, the grabbing device 101 grabs the empty first tray 01 from the testing device and places the first tray 01 on the transfer device 106, and the first tray 01 waits to be grabbed for shaking.

[0079] In some embodiments, in the case that the full first tray 01 is transferred from the shaking device 103 to the testing device 104, the grabbing device 101 grabs an empty second tray 02 from the transfer device 106 and places the empty second tray 02 on the shaking device 103 for shaking.

[0080] In some embodiments, in the case that the testing device 104 does not have a tray and the shaking device 103 has finished shaking the second tray 02, the grabbing device 101 grabs the full second tray 02 from the shaking device 103 and places the full second tray 02 on the testing device 104 for testing the chip elements in the second tray 02.

[0081] In some embodiments, in the case that the testing device 104 outputs an empty second tray 02, the grabbing device 101 grabs the empty second tray 02 from the testing device 104 and places the second tray 02 on the transfer device 106, and the second tray 02 waits to be grabbed for shaking.

[0082] Figure 6is another process flow diagram of the present application, which exemplarily illustrates the case with a transfer area. For example, when the system contains at least two trays, as shown in Figure 6 the workflow includes:

[0083] 601: The first tray 01 and the second tray 02 are located in the transfer device 106.

[0084] 602: The empty first tray 01 is put into the shaking device 103.

[0085] For example, the grabbing device 101 grabs the empty first tray 01 from the transfer device 106 and places the first tray 01 in the shaking device 103 for shaking.

[0086] 603: The shaking of the first tray 01 is completed and the first tray 01 is put into the testing device.

[0087] For example, when the testing device 104 is empty, the grabbing device 101 grabs the full first tray 01 from the shaking device 103 and places the full first tray 01 in the testing device 104 for testing.

[0088] 604: The empty second tray 02 is put into the shaking device.

[0089] For example, when the shaking device 103 is empty, the grabbing device 101 grabs the empty second tray 02 from the transfer device 106 and places the second tray 02 in the shaking device 103 for shaking.

[0090] 605: The testing of the first tray 01 is completed and the first tray 01 is put into the transfer device.

[0091] For example, the grabbing device 101 grabs the empty first tray 01 from the testing device 104 and places it in the transfer device 106 for waiting for shaking again.

[0092] 606: The shaking of the second tray 02 is completed and the second tray 02 is put into the testing device.

[0093] For example, the grabbing device 101 grabs the full second tray 02 from the shaking device 103 and places it in the testing device 104 for testing.

[0094] 607: The testing of the second tray 02 is completed and the second tray 02 is put into the transfer device.

[0095] For example, the grabbing device 101 grabs the second tray 02 from the testing device 104 and places it in the transfer device 106, which waits for shaking again.

[0096] The above steps are repeated in order from step 602, and the continuous operation of the system is completed.

[0097] It is worth noting that the above appendix Figure 6 The embodiments described herein are merely illustrative and are not limited thereto. For example, the execution order of various operations can be appropriately adjusted, and additional operations can be added or some operations can be removed. Those skilled in the art can make appropriate modifications based on the above description, and are not limited to the above-described embodiments. Figure 6 The records.

[0098] In some embodiments, when a transfer device (transfer area) is added to the system, trays awaiting material handling and / or testing can be placed at the transfer device 106. By adding the transfer device, the efficiency of material handling and testing in the system is improved, enabling parallel processing and avoiding unnecessary waiting.

[0099] In this embodiment of the application, the chip component testing system may further include a control device 107.

[0100] For example, such as Figure 1 and Figure 5 As shown, the operation of each device in the equipment is controlled by the control device 107. Each device in the chip component testing equipment 10 can be controlled individually or as a whole. The control device 107 has a display, facilitating manual operation. The control device 107 may also have a processor and memory, enabling it to control the operation of each device according to a set program and pre-defined control parameters.

[0101] The above embodiments are merely illustrative examples of embodiments of this application, but this application is not limited thereto, and appropriate modifications can be made based on the above embodiments. For example, the above embodiments can be used alone, or one or more of the above embodiments can be combined.

[0102] The present application has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present application. Those skilled in the art can make various modifications and variations to the present application based on its spirit and principles, and these modifications and variations are also within the scope of the present application. As used herein, the term "exemplary" means used as a non-limiting example, instance, or illustration. As used herein, the term "for example" refers to a list of one or more non-limiting examples, instances, or illustrations.

[0103] The preferred embodiments of the application have been described above with reference to the accompanying drawings. Many features and advantages of the embodiments are apparent from the detailed specification, and it is therefore intended by the appended claims to cover all such features and advantages of the embodiments within their true spirit and scope. Further, since numerous modifications and variations will readily occur to those skilled in the art, it is not desired to limit the embodiments of the application to the exact construction and operation illustrated and described, and accordingly, all suitable modifications and variations that can be resorted to are intended to be covered within the scope and range of equivalents of the claims.

Claims

1. A chip component testing apparatus characterized by comprising: The chip component testing device comprises: a grabbing device which grabs an empty tray for loading chip components to the shaking device and grabs a full tray loaded with a plurality of chip components from the shaking device to the testing device; wherein the tray has a containing part containing the plurality of chip components and a cover part with a plurality of holes; a feeding device which delivers the plurality of chip components to the tray at the shaking device; a shaking device which shakes the tray so that the plurality of chip components from the feeding device are loaded into the containing part of the tray via the holes; a testing device which tests the chip components in the tray loaded with a plurality of chip components transferred by the grabbing device and outputs the empty tray after the loaded chip components are emptied.

2. The apparatus of claim 1, wherein, The shaking device shakes the tray in horizontal and vertical directions.

3. The apparatus of claim 1, wherein, The device further comprises: a storing device which stores a plurality of chip components; the bottom of the storing device is provided with a vibration mechanism which controls the speed and / or quantity of the chip components from the storing device into the feeding device.

4. The apparatus of claim 1, wherein, In the case that the shaking device has no tray, the grabbing device grabs an empty tray from the testing device and places the empty tray at the shaking device for shaking; In the case that the testing device has no tray and the shaking device has finished shaking the tray, the grabbing device grabs a full tray from the shaking device and places the full tray at the testing device for testing the chip components in the tray.

5. The apparatus of claim 1, wherein, The device further comprises: a transfer device which can accommodate at least two trays including a first tray and a second tray.

6. The apparatus of claim 5, wherein, In the case that the shaking device has no tray, the grabbing device grabs an empty first tray from the transfer device and places the empty first tray at the shaking device for shaking; In the case that the testing device has no tray and the shaking device has finished shaking the first tray, the grabbing device grabs a full first tray from the shaking device and places the full first tray at the testing device for testing the chip components in the first tray.

7. The apparatus of claim 6, wherein, In the case that the testing device outputs an empty first tray, the grabbing device grabs the empty first tray from the testing device and places the first tray at the transfer device, which waits to be grabbed.

8. The apparatus of claim 6, wherein, In the case that the full first tray is transferred from the shaking device to the testing device, the grabbing device grabs an empty second tray from the transfer device and places the empty second tray at the shaking device for shaking.

9. The apparatus of claim 8, wherein, In the case that the testing device has no tray and the shaking device has finished shaking the second tray, the grabbing device grabs a full second tray from the shaking device and places the full second tray at the testing device for testing the chip components in the second tray.

10. The apparatus of claim 9, wherein, In the case that the testing device outputs an empty second tray, the grabbing device grabs the empty second tray from the testing device and places the second tray on the transfer device, the second tray waiting to be grabbed.

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