Treatment head circuit board detection device and system

Abstract

The utility model discloses a treatment head circuit board detection device and system, relates to the technical field of treatment equipment detection, and discloses a treatment head circuit board detection device, which comprises a control module, an expansion module and a detection module, the control module is connected with the detection module through the expansion module. The detection module is also connected with a plurality of treatment head circuit boards; the detection module is used for detecting the working states of the plurality of treatment head circuit boards, generating multiple paths of working signals based on the working states and transmitting the working signals to the expansion module; the expansion module is used for transmitting multiple paths of working signals to the control module respectively; and the control module is used for reporting an error to the treatment head circuit board of which the working signal is out of the preset working signal range when the working signal is out of the preset working signal range. And the working states of the plurality of treatment head circuit boards are simultaneously detected through the extension module, so that the target of large-scale detection is realized. Meanwhile, the detection accuracy is improved through real-time detection and analysis, and potential faults can be found in time.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of treatment device detection, in particular to a treatment head circuit board detection device and system. BACKGROUND

[0002] Currently, most treatment head circuit board manufacturers are relatively conservative in the incoming inspection link and have obvious deficiencies. The main problem is that they only rely on surface inspection methods such as visual appearance inspection or random sampling inspection to determine the overall qualification of the incoming batch. Although this approach seems to improve production efficiency in the short term by reducing the time and labor costs required for inspection, its potential negative effects cannot be ignored in the long run.

[0003] Firstly, the limitation of surface inspection is that it cannot detect internal defects of materials or components. Especially for flexible printed circuit boards (FPC) and software combined boards (PCBA) which are highly integrated and have relatively complex manufacturing processes, it is difficult to effectively identify potential problems such as line continuity, component welding defects, etc. by appearance or simple sampling. These problems often gradually appear after the product goes online, making it difficult to improve overall product quality and leading to a decline in yield.

[0004] Secondly, since it cannot be guaranteed that every incoming material is strictly and comprehensively inspected, the proportion of defective products will also increase as the production scale expands. This not only increases the cost of subsequent rework and maintenance, but also may cause more serious quality problems such as frequent equipment failures and poor user experience.

[0005] In today's consumer market, where consumers increasingly focus on product quality and after-sales service, these problems will undoubtedly cause great harm to consumers. CONTENT OF THE INVENTION

[0006] The main purpose of the present application is to provide a treatment head circuit board detection device and system, which aims to solve the technical problem of current difficulty in realizing large-scale detection of the quality of treatment head circuit boards.

[0007] To achieve the above-mentioned purpose, the present application provides a treatment head circuit board detection device, which comprises a control module, an expansion module and a detection module; the control module is connected to the detection module through the expansion module; the detection module is also connected to a plurality of treatment head circuit boards; the detection module is used to detect the working state of the plurality of treatment head circuit boards and generate a plurality of working signals based on each working state and transmit them to the expansion module; the expansion module is used to transmit the plurality of working signals to the control module respectively; and the control module is used to report an error when the working signal is outside the preset working signal range and the treatment head circuit board with the working signal outside the preset working signal range.

[0008] In an embodiment, the detection module comprises: a continuity detection submodule, a temperature detection submodule, and / or a radio frequency detection submodule; the continuity detection submodule is connected to the plurality of treatment head circuit boards and the expansion module respectively; the temperature detection submodule is connected to the plurality of treatment head circuit boards and the expansion module respectively; the radio frequency detection submodule is connected to the plurality of treatment head circuit boards and the expansion module respectively; the continuity detection submodule is used to detect the circuit continuity state of the plurality of treatment head circuit boards, and generate a conductive signal or a cutoff signal based on each circuit continuity state and transmit the signal to the expansion module; the temperature detection submodule is used to detect the test temperature of the plurality of treatment head circuit boards, generate a test temperature signal based on each test temperature, and transmit the signal to the expansion module; the radio frequency detection submodule is used to detect the radio frequency signal of the plurality of treatment head circuit boards, and transmit the radio frequency signal to the expansion module.

[0009] In an embodiment, the expansion module comprises: a first expansion submodule and a second expansion submodule; the first expansion submodule is connected to the control module and the continuity detection submodule respectively; the second expansion submodule is connected to the control module, the temperature detection submodule, and the radio frequency detection submodule respectively; the first expansion submodule is used to realize IO expansion between the control module and the continuity detection submodule, and transmit the received conductive signal or cutoff signal to the control module; the second expansion submodule is used to realize analog expansion between the control module and the temperature detection submodule, and transmit the received test temperature signal to the control module; the second expansion submodule is also used to realize analog expansion between the control module and the radio frequency detection submodule, and transmit the received radio frequency signal to the control module.

[0010] In an embodiment, the expansion module comprises: a second expansion submodule and a third expansion submodule; the second expansion submodule is connected to the control module, the temperature detection submodule, and the radio frequency detection submodule respectively; the third expansion submodule is connected to the control module and the continuity detection submodule respectively; the second expansion submodule is used to realize analog expansion between the control module and the temperature detection submodule, and transmit the received test temperature signal to the control module; the second expansion submodule is also used to realize analog expansion between the control module and the radio frequency detection submodule, and transmit the received radio frequency signal to the control module; the third expansion submodule is used to realize digital expansion between the control module and the continuity detection submodule, and transmit the received conductive signal or cutoff signal to the control module.

[0011] In an embodiment, the treatment head circuit board detection device comprises: an interaction module; the interaction module is connected to the control module; the control module is configured to control the interaction module to display the treatment head circuit board in a disconnected state and report an error when the cutoff signal is received; the control module is further configured to generate a temperature error based on the temperature signal and an ambient temperature after receiving the temperature signal, and control the interaction module to display the temperature error; the control module is further configured to control the interaction module to display the treatment head circuit board whose temperature error exceeds a preset temperature error and report an error when the temperature error exceeds the preset temperature error; and the control module is further configured to control the interaction module to display the treatment head circuit board whose radio frequency signal is outside a preset radio frequency signal range and report an error when the radio frequency signal is outside the preset radio frequency signal range.

[0012] In an embodiment, the interaction module comprises a display and a buzzer; the display and the buzzer are connected to the control module respectively; the display is configured to display the working states and temperature errors of a plurality of treatment head circuit boards; and the buzzer is configured to report errors for the treatment head circuit boards in a disconnected state, the treatment head circuit boards whose temperature errors exceed a preset temperature error, and the treatment head circuit boards whose radio frequency signals are outside a preset radio frequency signal range.

[0013] In an embodiment, the detection module is connected to a plurality of treatment head circuit boards through a plurality of FPC connectors.

[0014] In an embodiment, the control module comprises at least one of an MCU chip, a CPLD chip, an FPGA chip, a DSP chip, or an SOC chip.

[0015] In addition, to achieve the above-mentioned purposes, the present application further provides a treatment head circuit board detection system, which comprises the treatment head circuit board detection device and a plurality of treatment head circuit boards as described above; the treatment head circuit board comprises four temperature acquisition modules and four radio frequency modules; the temperature acquisition modules are configured to acquire the working temperature of the treatment head circuit board; and the radio frequency modules are configured to excite the treatment head to generate energy.

[0016] The one or more technical solutions provided by the present application have at least the following technical effects:

[0017] The working state of the treatment head circuit board is detected in real time by the detection module, and multiple working signals are generated. The multiple working signals are received by the expansion module, and necessary conditioning and distribution are performed to realize large-scale detection. The working signals from the expansion module are received by the control module, and analysis and range judgment are performed. The detection device can detect the working state of multiple treatment head circuit boards at the same time, realizing the goal of large-scale detection. The detection efficiency is improved, the detection cost is reduced, and powerful support is provided for quality monitoring of large-scale production lines. At the same time, through real-time detection and analysis, the accuracy of detection is also improved, potential faults can be found in time, and economic losses caused by equipment downtime or damage are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings incorporated into the specification and forming a part thereof, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required to be used in the embodiment or prior art description will be briefly introduced below. Obviously, for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0020] Figure 1 A structural block diagram is provided for the first embodiment of the treatment head circuit board detection device of the present application;

[0021] Figure 2 A structural block diagram is provided for the second embodiment of the treatment head circuit board detection device of the present application;

[0022] Figure 3 Another structural block diagram is provided for the second embodiment of the treatment head circuit board detection device of the present application;

[0023] Figure 4 An equipment selection schematic diagram is provided for the second embodiment of the treatment head circuit board detection device of the present application;

[0024] Figure 5 An equipment selection schematic diagram is provided for the treatment head circuit board detection system embodiment of the present application.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] Reference Signs Description Reference Signs Description 10 Control module 30 Detection module 20 Extension module 31 On-off detection submodule 21 First extension submodule 32 Temperature detection submodule 22 Second extension submodule 33 Radio frequency detection submodule 23 Third extension submodule 40 Interaction module

[0027] The purpose implementation, functional characteristics and advantages of the present application will be further described with reference to the embodiments and the drawings. DETAILED DESCRIPTION

[0028] It should be understood that the specific embodiments described herein are merely illustrative of the present application and do not limit the present application.

[0029] In order to better understand the technical solutions of the present application, the following will be described in detail in conjunction with the drawings and specific embodiments.

[0030] At present, most of the treatment head circuit board manufacturers are relatively conservative and have obvious deficiencies in the incoming inspection link, mainly reflected in that they only rely on surface inspection means, such as visual appearance inspection or random sampling detection, to determine the overall qualification of the incoming batch. Although this approach seems to improve production efficiency in the short term, as it reduces the time and labor costs required for inspection, its potential negative impact cannot be ignored in the long run.

[0031] Based on this, the embodiments of the present application provide a treatment head circuit board detection device, referring to Figure 1 , Figure 1 The structural block diagram provided for the first embodiment of the treatment head circuit board detection device of the present application.

[0032] In this embodiment, the treatment head circuit board detection device comprises a control module 10, an expansion module 20 and a detection module 30.

[0033] It should be noted that the control module 10 is connected to the detection module 30 through the expansion module 20; the detection module 30 is also connected to a plurality of treatment head circuit boards.

[0034] It can be understood that the control module 10 is the core of the entire detection device, responsible for receiving, processing and analyzing data information from the detection module 30, and making appropriate judgments and decisions according to the preset logic rules. The control module 10 usually contains high-performance processors and memories, etc., to ensure the rapid processing and transmission of data.

[0035] It can be understood that the expansion module 20 plays the role of a bridge and a link, connecting the control module 10 and the detection module 30, so that the two can communicate efficiently. The expansion module 20 usually contains signal amplifiers, signal distributors, multiplexers or necessary interface circuits, etc., to ensure that the multi-channel signals received from the detection module 30 can be accurately transmitted to the control module 10. Through the expansion module 20, the system can flexibly adapt to different numbers and types of treatment head circuit boards, improving the versatility and scalability of the device.

[0036] It can be understood that the detection module 30 is the front-end part of the treatment head circuit board detection device, which is directly connected to the treatment head circuit board and is responsible for real-time detection of the working state of these circuit boards. The detection module 30 usually contains various sensors and measurement circuits for measuring key parameters such as voltage, current, temperature, etc. on the circuit board, and converting these parameters into recognizable signals.

[0037] Specifically, the detection module 30 is used to detect the working state of multiple treatment head circuit boards, and generate multiple working signals based on each working state and transmit them to the expansion module 20.

[0038] It can be understood that the working state of the treatment head circuit board is a direct reflection of its performance and health status, which is crucial for ensuring the normal operation of medical equipment. Normal working state includes stable voltage, normal current, appropriate temperature and normal signal transmission. That is, the voltage on the treatment head circuit board should fluctuate within the normal range, without abnormal rise or fall. The current on the circuit board should meet the design specifications, without excessive or insufficient current fluctuations. The working temperature of the circuit board should be within the design specified range, avoiding overheating or overcooling. The signal transmission on the circuit board should be accurate and without interference or distortion.

[0039] It can be understood that the detection module 30 can obtain the working state of the treatment head circuit board by real-time detection of various parameters such as voltage, current, temperature and signal integrity on the treatment head circuit board through built-in sensors and measurement circuits.

[0040] It can be understood that each working signal corresponds to a specific treatment head circuit board or a certain key part on the circuit board, indicating its working state or performance parameter. These signals may exist in the form of analog signals or digital signals, depending on the design and detection requirements of the detection module.

[0041] It can be understood that various types of sensors are deployed at key positions on the treatment head circuit board to real-time detect and collect various parameters such as voltage, current, temperature, etc. on the circuit board. Through an analog-to-digital converter (ADC) or other data acquisition equipment, the analog signals detected by the sensors are converted into digital signals.

[0042] It can be understood that the collected data is pre-processed, including filtering, denoising, calibration and other steps, to improve the accuracy and reliability of the data. Using pre-set algorithms and models, the pre-processed data is analyzed for state. Key features are extracted from the analyzed data, which can reflect the working state and performance of the circuit board. These features may include voltage fluctuation range, current peak, temperature change rate, etc.

[0043] It is understood that the extracted features are encoded into multiple working signals. These signals can take the form of analog signals or digital signals. Analog signals can be generated through analog circuits, while digital signals can be generated through digital circuits or microcontrollers.

[0044] It is noted that the extension module 20 is used to transmit the multiple working signals to the control module 10 respectively. The extension module 20 is designed to contain signal distributors and routers, which are used to correctly distribute and route the received multiple working signals to the corresponding input terminals of the control module 10. This ensures that each signal can be accurately delivered to its intended destination.

[0045] It is noted that the control module 10 is used to report errors to the treatment head circuit board when the working signal is outside the preset working signal range. The control module 10 analyzes these signals and extracts key information such as voltage value, current value, temperature value, and any other parameters related to the working state of the circuit board.

[0046] It is understood that the control module 10 internally stores preset working signal ranges, which are set according to the normal working parameters of the treatment head circuit board. The control module 10 compares each received working signal with its corresponding preset range to determine whether the signal is within the normal range.

[0047] It is understood that when a working signal is found to be outside its preset range, the control module 10 will trigger an error reporting mechanism. The error reporting mechanism may include displaying error information, sending sound or light signal warnings to the operator, and recording error information to the system log file. Error information usually includes the identification of the treatment head circuit board, the type of working signal that exceeds the range and its current value, and possible fault types or recommended solutions.

[0048] In this embodiment, the working state of the treatment head circuit board is detected in real time by the detection module, and multiple working signals are generated. Through the extension module, these multiple working signals are received and necessary conditioning and distribution are performed to achieve large-scale detection. Through the control module, the working signals from the extension module are received and analyzed and range judgment is performed. This detection device can simultaneously detect the working state of multiple treatment head circuit boards, achieving the goal of large-scale detection. It improves the detection efficiency and reduces the detection cost, providing strong support for quality monitoring of large-scale production lines. At the same time, through real-time detection and analysis, the accuracy of detection is also improved, which can timely discover potential faults and avoid economic losses caused by equipment downtime or damage.

[0049] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as the above embodiment one can refer to the above introduction, and the following will not be described. On this basis, please refer to Figure 2 and Figure 3 , Figure 2 is a structural block diagram provided for the second embodiment of the treatment head circuit board detection device of the present application; Figure 3 is still another structural block diagram provided for the second embodiment of the treatment head circuit board detection device of the present application.

[0050] In this embodiment, the detection module 30 includes: on-off detection submodule 31, temperature detection submodule 32 and / or radio frequency detection submodule 33.

[0051] It should be noted that the on-off detection submodule 31 is connected to the plurality of treatment head circuit boards and the expansion module 20 respectively; the temperature detection submodule 32 is connected to the plurality of treatment head circuit boards and the expansion module 20 respectively; the radio frequency detection submodule 33 is connected to the plurality of treatment head circuit boards and the expansion module 20 respectively.

[0052] It should be noted that the on-off detection submodule 31 is used to detect the circuit on-off state of the plurality of treatment head circuit boards, and generate a pass signal or a stop signal based on each of the circuit on-off state and transmit it to the expansion module 20. The temperature detection submodule 32 is used to detect the test temperature of the plurality of treatment head circuit boards, and generate a test temperature signal based on each of the test temperature and transmit it to the expansion module 20. The radio frequency detection submodule 33 is used to detect the radio frequency signal of the plurality of treatment head circuit boards, and transmit the radio frequency signal to the expansion module 20.

[0053] It can be understood that the on-off detection submodule 31 is mainly responsible for detecting the circuit connection state on the treatment head circuit board, ensuring the normal communication and signal transmission between each circuit element. By detecting the current or voltage change in the circuit, this submodule can timely find the open circuit or short circuit problem in the circuit.

[0054] It can be understood that the temperature detection submodule 32 is responsible for detecting the temperature change of the treatment head circuit board during the working process, to ensure that the circuit board operates within the normal temperature range, and prevent performance degradation or damage due to overheating.

[0055] It can be understood that the radio frequency detection submodule 33 mainly focuses on the performance of the treatment head circuit board in the transmission and processing of radio frequency signals. By detecting the frequency, amplitude, phase and other parameters of the radio frequency signal, this submodule can evaluate the radio frequency performance of the circuit board and find potential radio frequency interference or signal distortion problems.

[0056] It should be noted that the relationship between the on-off detection submodule 31, the temperature detection submodule 32 and the radio frequency detection submodule 33 is an "and / or" relationship, which means that these submodules can exist and operate in different combinations to adapt to different detection needs and scenarios.

[0057] Specifically, the treatment head circuit board detection device can only contain the on-off detection submodule 31 for detecting the circuit connection state of the treatment head circuit board. Alternatively, the system can only contain the temperature detection submodule 32, focusing on the temperature change of the circuit board. Alternatively, the system focuses on radio frequency performance and only contains the radio frequency detection submodule 33.

[0058] Specifically, the treatment head circuit board detection device can contain the on-off detection submodule 31 and the temperature detection submodule 32 at the same time to detect the circuit connection state and the temperature change at the same time. Alternatively, the system can contain the on-off detection submodule 31 and the radio frequency detection submodule 33 for dual detection of circuit connection and radio frequency performance. Alternatively, the system contains the temperature detection submodule 32 and the radio frequency detection submodule 33, focusing on the detection of temperature and radio frequency performance.

[0059] Specifically, the treatment head circuit board detection device can contain the on-off detection submodule 31, the temperature detection submodule 32 and the radio frequency detection submodule 33 at the same time to provide the most comprehensive and detailed detection of the treatment head circuit board.

[0060] In this embodiment, the expansion module 20 includes a first expansion submodule 21 and a second expansion submodule 22; the first expansion submodule 21 is connected to the control module 10 and the on-off detection submodule 31 respectively; the second expansion submodule 22 is connected to the control module 10, the temperature detection submodule 32 and the radio frequency detection submodule 33 respectively.

[0061] It should be noted that the first expansion submodule 21 is used to realize the IO expansion between the control module 10 and the on-off detection submodule 31, and transmit the received on signal or off signal to the control module 10. The second expansion submodule 22 is used to realize the analog expansion between the control module 10 and the temperature detection submodule 32, and transmit the received test temperature signal to the control module 10. The second expansion submodule 22 is also used to realize the analog expansion between the control module 10 and the radio frequency detection submodule 33, and transmit the received radio frequency signal to the control module 10.

[0062] It can be understood that the first expansion submodule 21 is mainly responsible for realizing the IO (input / output) expansion between the control module 10 and the on-off detection submodule 31. It receives the on signal or off signal from the on-off detection submodule 31 and transmits these signals to the control module 10 for processing. Since on-off detection usually involves binary switch states (i.e. on or off), the signals processed by the first expansion submodule 21 are discrete digital signals.

[0063] In addition, IO (input / output) expansion supports multiple signal types, including analog input / output, digital input / output, and other special types of sensor signals (such as temperature sensors, pressure sensors, etc.). This diversity makes IO expansion applicable to a wider range of application scenarios and control requirements.

[0064] It can be understood that the second expansion submodule 22 is responsible for realizing the analog expansion between the control module 10 and the temperature detection submodule 32 and the radio frequency detection submodule 33. It receives continuous analog signals (i.e. test temperature signals and radio frequency signals) from the two submodules and transmits these signals to the control module 10 for further analysis and processing. Since the signals generated by the temperature detection submodule 32 and the radio frequency detection submodule 33 are usually continuous analog signals, they need to reflect the fine features of temperature changes and radio frequency signals.

[0065] In addition, the expansion module 20 can also be implemented through the second expansion submodule 22 and the third expansion submodule 23. Among them, the connection relationship of the second expansion submodule 22 is unchanged, and the function is consistent with the above content. The third expansion submodule 23 replaces the first expansion submodule 21 in the above content, and the connection relationship is consistent with that of the first expansion submodule 21, mainly responsible for realizing the digital expansion between the control module 10 and the on-off detection submodule 31.

[0066] It can be understood that digital expansion is mainly used to expand digital input or output signals to digital control systems or data acquisition systems. It supports multiple functions such as analog input, switch input (i.e. digital input), pulse input, analog output, switch output (i.e. digital output), etc., and can receive and send various digital signals to realize communication and control with various devices. Since on-off detection is mainly binary switch state (i.e. on or off) detection, digital expansion reduces the detection cost while realizing on-off detection compared to IO (input / output) expansion.

[0067] In this embodiment, by subdividing the extension module 20 into two sub-modules, the system can more flexibly handle different types of signals. The first extension sub-module 21 or the third extension sub-module 23 focuses on the transmission of digital signals, while the second extension sub-module 22 focuses on the transmission of analog signals. This design ensures the integrity and accuracy of different types of signals during transmission. Digital signals and analog signals are transmitted through different paths, avoiding interference and confusion between signals.

[0068] In this embodiment, the treatment head circuit board detection device comprises an interaction module 40; the interaction module 40 is connected to the control module 10.

[0069] It should be noted that the control module 10 is configured to control the interaction module 40 to display the treatment head circuit board in the disconnected state and report an error when the cutoff signal is received. The control module 10 is also configured to control the interaction module 40 to display the treatment head circuit board whose radio frequency signal is outside the preset radio frequency signal range and report an error when the radio frequency signal is outside the preset radio frequency signal range.

[0070] It can be understood that when the control module 10 receives the cutoff signal forwarded by the first extension sub-module 21 and collected by the on-off detection sub-module 31, it immediately identifies that the circuit on the treatment head circuit board is in a non-connected (i.e., disconnected) state. Subsequently, the control module 10 activates the interaction module 40 (which can be a display screen, a set of indicator lights, or other user interface devices) to clearly display which treatment head circuit board or specific circuit portion has a disconnection problem and simultaneously triggers an error report.

[0071] It can be understood that the control module 10 also monitors the radio frequency signal forwarded by the second extension sub-module 22 and originating from the radio frequency detection sub-module 33 in real time. The system has a preset normal range of radio frequency signals. Once the radio frequency signal exceeds this preset range, the control module 10 quickly determines that the radio frequency signal is abnormal. Subsequently, the control module 10 instructs the interaction module 40 to clearly mark the treatment head circuit board with an abnormal radio frequency signal and generates a corresponding error report.

[0072] It should be noted that the control module 10 is also configured to generate a temperature error based on the temperature signal and the ambient temperature after receiving the temperature signal, and control the interaction module 40 to display the temperature error. The control module 10 is also configured to control the interaction module 40 to display the treatment head circuit board whose temperature error exceeds the preset temperature error and report an error when the temperature error exceeds the preset temperature error.

[0073] It can be understood that when the control module 10 receives the temperature signal forwarded by the second expansion submodule 22 and collected by the temperature detection submodule 32, it will simultaneously obtain the current ambient temperature information, which can be obtained by the internal ambient temperature sensor of the system or received from an external device. Subsequently, the control module 10 will calculate the temperature error according to the difference between the temperature signal and the ambient temperature. This error reflects the deviation between the actual temperature of the treatment head circuit board and the expected (or ideal) temperature. The control module 10 will control the interactive module 40 (such as the display screen, indicator light, etc.) to display the calculated temperature error. This helps the operator to understand whether the temperature state of the treatment head circuit board deviates from the normal range.

[0074] It can be understood that the system has a preset acceptable temperature error range, usually within 4°C. If the calculated temperature error exceeds this preset range, the control module 10 will determine that the temperature error is abnormal. Once the temperature error is abnormal, the control module 10 will immediately activate the interactive module 40 to clearly indicate which treatment head circuit board has a problem of excessive temperature error.

[0075] It should be noted that the significant difference between the temperature signal and the ambient temperature is due to poor connection caused by virtual soldering. At the virtual soldering point, due to poor contact, the heat conduction path is blocked or weakened. When the treatment head electrode plate is working, the heat generated cannot be effectively transmitted to the tooling or the environment through the virtual soldering point, resulting in a significant difference between the temperature value of this channel and the ambient temperature value. In some cases, the virtual soldering point may have increased local resistance due to poor contact, which generates additional Joule heat at that point when current passes through, causing the local temperature to rise.

[0076] In particular, please refer to Figure 3 , Figure 3 The equipment selection schematic diagram provided for the second embodiment of the treatment head circuit board detection device of the present application.

[0077] In the specific embodiment, the interactive module 40 includes a display and a buzzer; the display and the buzzer are respectively connected to the control module; the display is used to display the working state and temperature error of multiple treatment head circuit boards; the buzzer is used to report errors for treatment head circuit boards in the disconnected state, and is also used to report errors for treatment head circuit boards whose temperature error exceeds the preset temperature error, and is also used to report errors for treatment head circuit boards whose radio frequency signal is outside the preset radio frequency signal range. The detection module 30 is connected to multiple treatment head circuit boards through multiple FPC connectors. The control module 10 includes an MCU chip, a CPLD chip, an FPGA chip, a DSP chip, or a SOC chip.

[0078] It can be understood that the display is responsible for displaying the working status of the plurality of treatment head circuit boards (such as whether online, whether normal, etc.) and temperature error information. The LCD or LED display screen with high resolution, good color performance and stable performance can be selected. These display screens can clearly present the various state information of the treatment head circuit boards, which is convenient for the operator to monitor. When it is detected that the treatment head circuit board is in the off state, the temperature error exceeds the preset range, or the radio frequency signal is abnormal, the buzzer will emit an alarm sound to remind the operator to pay attention.

[0079] Specifically, whether the treatment head circuit board is a defective product and accurate positioning can be indicated by color, and the error cause can be numbered by digit. Green indicates that the treatment head circuit board is in a normal working state, all temperature acquisition modules and radio frequency modules are operating normally, and the temperature error and radio frequency signal are within the preset range. Yellow indicates that the treatment head circuit board has slight abnormalities, which may be a slight decline in the performance of a certain temperature acquisition module or radio frequency module, but has not yet reached the alarm threshold. At this time, the system can provide warning information through the display of the interactive module, prompting the operator to pay attention and further check. Red indicates that the treatment head circuit board is a defective product and has a serious fault. It may be that the temperature acquisition module is invalid, the radio frequency module cannot work normally, the temperature error exceeds the preset range, or the radio frequency signal is abnormal. At this time, the system will display detailed error information through the display and emit an alarm sound through the buzzer, and at the same time, the corresponding circuit board position on the display is highlighted in red to achieve accurate positioning.

[0080] Specifically, in order to more specifically indicate the error cause, the system can assign a unique digital number to each possible error. These numbers can be explained in detail in the user manual or online help document of the system, for example, the temperature acquisition module fault of the treatment head circuit board can be set to 001, and the on or off indicates the on-off.

[0081] It can be understood that the plurality of FPC connectors are connected with the plurality of treatment head circuit boards, which are responsible for collecting the connection state, temperature signal and radio frequency signal of the circuit board. This is because the FPC connector should have good conductivity, stability and durability, which can ensure accurate transmission of signals and long-term stable operation of the system.

[0082] It can be understood that the most suitable chip is selected as the control module according to the specific needs of the detection device such as computing performance, cost, development cycle, etc. For example, if the detection device needs to process a large amount of data and implement complex control logic, the FPGA chip or SOC chip is a better choice; and if the detection device has low requirements on computing performance and needs an economical and practical solution, the MCU chip is selected.

[0083] It should be noted that the above examples are only used for understanding the present application and do not constitute a limitation on the treatment head circuit board detection device of the present application, and more forms of simple changes based on this technical concept are within the protection scope of the present application.

[0084] The present application also provides a treatment head circuit board detection system, please refer to Figure 4 , Figure 4 The equipment selection schematic diagram provided for the embodiment of the treatment head circuit board detection system of the present application.

[0085] In the present embodiment, the treatment head circuit board detection system comprises the treatment head circuit board detection device as described above and a plurality of treatment head circuit boards.

[0086] Among them, the treatment head circuit board comprises four temperature acquisition modules and four radio frequency modules, the temperature acquisition module is used to collect the working temperature of the treatment head circuit board, and the radio frequency module is used to excite the treatment head to generate energy.

[0087] It can be understood that the treatment head circuit board detection system provided by the present application realizes high integration of functions and effective use of resources by integrating key components such as control modules, interaction modules and detection modules in the same detection system. The treatment head circuit board adopts modular design, so that each component is easy to replace and upgrade, reducing the maintenance cost and complexity of the system. By collecting and analyzing the working data of the treatment head circuit board in real time, the system can timely discover and warn potential faults, so as to effectively avoid the occurrence of safety accidents. At the same time, the system supports parallel detection of multiple treatment head circuit boards and is easy to expand to adapt to larger scale detection requirements.

[0088] The treatment head circuit board detection system provided by the present application adopts the treatment head circuit board detection device in the above embodiment, which can solve the technical problem that it is difficult to realize large-scale detection of the quality of the treatment head circuit board at present. Compared with the prior art, the beneficial effects of the treatment head circuit board detection system provided by the present application are the same as those of the treatment head circuit board detection device provided by the above embodiment, and other technical features in the treatment head circuit board detection system are the same as those disclosed in the above embodiment, which will not be repeated here.

Claims

1. A device for detecting circuit boards of a treatment head, characterized in that, The treatment head circuit board detection device includes: a control module, an expansion module, and a detection module; The control module is connected to the detection module via the expansion module; The detection module is also connected to multiple treatment head circuit boards; The detection module is used to detect the working status of multiple treatment head circuit boards, and generate multiple working signals based on each working status and transmit them to the expansion module. The expansion module is used to transmit multiple working signals to the control module respectively; The control module is used to report an error when the working signal is outside the preset working signal range on the treatment head circuit board.

2. The treatment head circuit board detection device as described in claim 1, characterized in that, The detection module includes: a continuity detection submodule, a temperature detection submodule, and / or a radio frequency detection submodule; The continuity detection submodule is connected to multiple treatment head circuit boards and the expansion module, respectively. The temperature detection submodule is connected to multiple treatment head circuit boards and the expansion module, respectively. The radio frequency detection submodule is connected to multiple treatment head circuit boards and the expansion module, respectively; The continuity detection submodule is used to detect the continuity status of multiple treatment head circuit boards, and generate a conduction signal or cutoff signal based on the continuity status of each circuit and transmit it to the expansion module. The temperature detection submodule is used to detect the test temperature of multiple treatment head circuit boards, and generate a test temperature signal based on each test temperature and transmit it to the expansion module. The radio frequency detection submodule is used to detect radio frequency signals of multiple treatment head circuit boards and transmit the radio frequency signals to the expansion module.

3. The treatment head circuit board detection device as described in claim 2, characterized in that, The expansion module includes: a first expansion submodule and a second expansion submodule; The first extended submodule is connected to the control module and the continuity detection submodule, respectively; The second expansion submodule is connected to the control module, the temperature detection submodule, and the radio frequency detection submodule, respectively. The first extended submodule is used to implement IO extension between the control module and the on / off detection submodule, and to transmit the received on signal or off signal to the control module; The second extension submodule is used to implement the analog extension between the control module and the temperature detection submodule, and to transmit the received test temperature signal to the control module; The second extension submodule is also used to implement analog extension between the control module and the radio frequency detection submodule, and to transmit the received radio frequency signal to the control module.

4. The treatment head circuit board detection device as described in claim 2, characterized in that, The extension module includes: a second extension submodule and a third extension submodule; The second expansion submodule is connected to the control module, the temperature detection submodule, and the radio frequency detection submodule, respectively. The third extended submodule is connected to the control module and the continuity detection submodule, respectively. The second extension submodule is used to implement the analog extension between the control module and the temperature detection submodule, and to transmit the received test temperature signal to the control module; The second extension submodule is also used to implement analog extension between the control module and the radio frequency detection submodule, and to transmit the received radio frequency signal to the control module; The third extended submodule is used to realize digital extension between the control module and the on / off detection submodule, and to transmit the received on signal or off signal to the control module.

5. The treatment head circuit board detection device as described in claim 3 or 4, characterized in that, The treatment head circuit board detection device includes: an interaction module; The interaction module is connected to the control module; The control module is used to control the interaction module to display the treatment head circuit board in a disconnected state and report an error when the cutoff signal is received. The control module is further configured to, upon receiving the temperature signal, generate a temperature error based on the temperature signal and the ambient temperature, and control the interaction module to display the temperature error; The control module is also used to control the interaction module to display the treatment head circuit board with the temperature error exceeding the preset temperature error and report an error when the temperature error exceeds the preset temperature error. The control module is also configured to control the interaction module to display the treatment head circuit board and report an error when the radio frequency signal is outside the preset radio frequency signal range.

6. The treatment head circuit board detection device as described in claim 5, characterized in that, The interactive module includes a display and a buzzer; The display and the buzzer are respectively connected to the control module; The display is used to show the operating status and temperature error of multiple treatment head circuit boards; The buzzer is used to report an error when the treatment head circuit board is in an open state, to report an error when the temperature error of the treatment head circuit board exceeds a preset temperature error, and to report an error when the radio frequency signal is outside a preset radio frequency signal range.

7. The treatment head circuit board detection device as described in claim 1, characterized in that, The detection module is connected to multiple treatment head circuit boards via multiple FPC connectors.

8. The treatment head circuit board detection device as described in claim 1, characterized in that, The control module includes at least one of the following: MCU chip, CPLD chip, FPGA chip, DSP chip, or SOC chip.

9. A treatment head circuit board detection system, characterized in that, The treatment head circuit board detection system includes a treatment head circuit board detection device as described in any one of claims 1 to 8 and a plurality of treatment head circuit boards; The treatment head circuit board includes four temperature acquisition modules and four radio frequency modules. The temperature acquisition modules are used to acquire the operating temperature of the treatment head circuit board, and the radio frequency modules are used to excite the treatment head to generate energy.

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