Optical module

Abstract

The utility model discloses an optical module, which comprises a circuit board, a first photoelectric chip electrically connected with the circuit board, and a first heat sink, the first heat sink comprises a first supporting leg, a second supporting leg and a heat dissipation part which are mutually connected together, the circuit board is provided with an open slot, and the first supporting leg and the second supporting leg are connected on the circuit board at two sides of the open slot. The heat dissipation part is connected between the first supporting leg and the second supporting leg; the first photoelectric chip is connected to the heat dissipation part in a heat conduction mode and located between the heat dissipation part and the open groove. The first heat sink not only forms a space for accommodating the first photoelectric chip, protects the first photoelectric chip and dissipates heat for the first photoelectric chip, but also forms an integrated structure with the circuit board, the first heat sink compensates the strength loss of the circuit board at the slotting position, and the optical module effectively enhances the overall rigidity and bending resistance of the circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical communication technical field especially relates to a kind of optical modules. BACKGROUND

[0002] Optical module is widely used in high-speed optical communication system, to meet the needs of structure, some circuit board of optical module needs to be designed with slot, slot is used to place optical transmitter, optical receiver, chip or some support structure.However, slot although meets the functional requirement, but inevitably weakens the overall structural strength of circuit board, especially when slot is larger, due to lack of support, circuit board is prone to bending, deformation even fracture condition in slot place.In addition, this insufficient strength can lead to the positioning of optoelectronic device or optical path instability, thereby affecting the performance and long-term reliability of module.Moreover, optical module internal space is nervous, and no more space is set to new reinforcing structure, therefore, how to effectively enhance the strength of circuit board under the premise of meeting the slot function, and not occupy more volume, become an important technical challenge in optical module design. SUMMARY

[0003] To solve the problem of insufficient strength of circuit board caused by slot in common technology, the purpose of the utility model is to provide a kind of optical module which strengthens the structural strength of circuit board while avoiding volume increase.

[0004] To realize the above-mentioned utility model purpose, an embodiment of the utility model provides a kind of optical module, it includes circuit board and the first optoelectronic chip electrically connected with the circuit board, the optical module further includes first heat sink, and the first heat sink includes first support leg, second support leg and heat dissipation part connected together;

[0005] The circuit board is provided with slot, the first support leg and the second support leg are connected to the circuit board on the two sides of the slot, and the heat dissipation part is connected between the first support leg and the second support leg.

[0006] The first optoelectronic chip is thermally connected to the heat dissipation part and located between the heat dissipation part and the slot.

[0007] As a further improvement of the utility model, the length of the circuit board in length direction is greater than the width in width direction, and the heat dissipation part is across on the slot along the width direction.

[0008] As a further improvement of the utility model, the length of the first support leg and the second support leg in length direction is longer than the length of the slot, and the projection of the first heat sink in the thickness direction perpendicular to the circuit board completely covers the slot.

[0009] As a further improvement of the utility model, a plurality of positioning holes are arranged on the circuit board, positioning columns matched with the positioning holes are arranged on the first supporting leg and / or the second supporting leg, and the circuit board and the first supporting leg and / or the second supporting leg are connected and fixed through the positioning columns and the positioning holes.

[0010] As a further improvement of the utility model, the slot is a through slot penetrating through the circuit board.

[0011] As a further improvement of the utility model, a filling layer is filled between the first optoelectronic chip and the heat dissipation part, and the filling layer fixedly connects the first optoelectronic chip and the heat dissipation part.

[0012] As a further improvement of the utility model, the first supporting leg and / or the second supporting leg and the circuit board are connected together through a welding layer.

[0013] A plurality of glue overflow grooves are arranged on the side of the first supporting leg and / or the second supporting leg facing the circuit board, and the plurality of glue overflow grooves accommodate at least part of the overflowed welding layer.

[0014] As a further improvement of the utility model, the optical module further comprises a second optoelectronic chip, a projection of the second optoelectronic chip in the thickness direction of the circuit board overlaps with the slot, and the second optoelectronic chip is fixedly connected with the first heat sink.

[0015] As a further improvement of the utility model, the optical module further comprises a second heat sink, the second heat sink is arranged on the other side of the circuit board away from the first heat sink, and the second heat sink is connected to the circuit board on both sides of the slot.

[0016] As a further improvement of the utility model, the first heat sink is made of tungsten copper.

[0017] Compared with the common technology, the optical module has the following beneficial effects: the optical module makes full use of the rigid structure of the heat sink to significantly improve the mechanical strength of the circuit board, the first heat sink not only forms a space for accommodating the first optoelectronic chip, protects the first optoelectronic chip and dissipates heat for the first optoelectronic chip, but also spans the slot through the first supporting leg and the second supporting leg, and forms an integrated structure with the circuit board, the first heat sink compensates for the strength loss of the circuit board at the slot, and effectively enhances the overall rigidity and bending resistance of the circuit board. That is, the heat sink organically combines the heat dissipation function and the reinforcing function, solves the problem of weakening the strength of the circuit board caused by the slot, and does not increase new supporting structures and does not occupy too much space in the optical module. The optical module improves the stability of the overall structure of the circuit board on the basis of the existing structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1is a structural schematic view of the optical module of one embodiment of the utility model;

[0019] Figure 2 is a partial structural schematic view of the inside of the first shell and the second shell of the optical module of one embodiment of the utility model;

[0020] Figure 3 is Figure 2 the exploded view of the structure;

[0021] Figure 4 is a structural schematic view of the first heat sink of one embodiment of the utility model;

[0022] Figure 5 is Figure 2 the sectional view of one perspective of the structure;

[0023] Figure 6 is Figure 2 the sectional view of another perspective of the structure;

[0024] Wherein, 100, optical module;10, circuit board;11, slot;12, positioning hole;20, first heat sink;21, first supporting leg;22, second supporting leg;23, heat dissipation part;24, positioning column;25, glue overflow groove;31, first optoelectronic chip;32, second optoelectronic chip;40, second heat sink;50, shell;51, first shell;52, second shell. DETAILED DESCRIPTION

[0025] The utility model will be described in detail below in combination with the specific implementation manners shown in the drawings. But these implementation manners do not limit the utility model, and the conversion of structure, method or function made by the ordinary skill in the art according to these implementation manners is included in the protection scope of the utility model.

[0026] It should be understood that the terms for indicating spatial relative position, such as "upper", "above", "lower" and "below", used herein are for the purpose of convenient description to describe the relationship of one unit or feature relative to another unit or feature as shown in the drawings. The terms for indicating spatial relative position can be intended to include different positions of the device in use or work other than the position shown in the drawings.

[0027] One embodiment of the utility model provides a kind of optical module 100 that avoids the volume of reinforcing circuit board 10 structural strength simultaneously increasing, which realizes the organic combination of heat sink heat dissipation function and mechanical reinforcement function, and realizes the comprehensive promotion of optical module 100 in performance and structure by a series of detail optimization such as positioning, heat conduction, welding.

[0028] As Figure 1 And 2As shown in the figure, the optical module 100 of the embodiment comprises a housing 50, a circuit board 10 and a first heat sink 20. The first heat sink 20 is in thermal contact with the housing 50. The first heat sink 20 is fixedly connected with the circuit board 10. The circuit board 10 and the first heat sink 20 are fixed in the housing 50.

[0029] Please refer to Figure 3 The optical module 100 further comprises a first optoelectronic chip 31 electrically connected with the circuit board 10. The first heat sink 20 is in thermal contact with the first optoelectronic chip 31. The heat generated by the first optoelectronic chip 31 is dissipated through the first heat sink 20 to the housing 50.

[0030] The circuit board 10 of the embodiment is provided with a slot 11. As Figure 4 shown, the first heat sink 20 comprises a first leg 21, a second leg 22 and a heat dissipation part 23 connected with each other. The heat dissipation part 23 is connected between the first leg 21 and the second leg 22.

[0031] As Figure 2 shown, the first leg 21 and the second leg 22 are connected on the circuit board on both sides of the slot 11, the heat dissipation part 23 is connected between the first leg 21 and the second leg 22, the first optoelectronic chip 31 is in thermal contact with the heat dissipation part 23 and is located between the heat dissipation part 23 and the slot 11.

[0032] The first leg 21 and the second leg 22 are used to support the heat dissipation part 23 so that the heat dissipation part 23 forms a space capable of accommodating the first optoelectronic chip 31. The heat dissipation part 23 spans above the slot 11. That is, the first leg 21, the second leg 22, the heat dissipation part 23 and the circuit board 10 enclose a space, the first optoelectronic chip 31 is located in the space, and the first heat sink 20 provides protection for the first optoelectronic chip 31 outside. In combination with the thermal contact of the first optoelectronic chip 31 and the heat dissipation part 23, that is, the first heat sink 20 protects the first optoelectronic chip 31 while dissipating heat for it.

[0033] In addition to dissipating heat for the first optoelectronic chip 31, the first heat sink 20 is integrated with the circuit board 10 in the form of welding. The first leg 21 and the second leg 22 are both welded to the circuit board 10. Such a structure effectively enhances the overall rigidity and bending resistance of the circuit board 10, especially solving the problem of structural strength reduction caused by the existence of the slot 11.

[0034] Especially in the repeated plug, high power application scenarios, the optical module in the common technology needs to bear the vibration from the outside frequently, and the large amount of heat generated inside the optical module 100 can cause the circuit board 10 to deform, and the optical module 100 of the embodiment can be supported by welding the first supporting leg 21 and the second supporting leg 22 to the two sides of the circuit board 10 of the slot 11. The first heat sink 20 is no longer an independent heat dissipation element, but becomes part of the board structure of the circuit board 10, and the support effect on the slot 11 is particularly significant.

[0035] In addition, the distance between the first supporting leg 21 and the second supporting leg 22 can be determined according to the size of the slot 11 and the position of the first optoelectronic chip 31. That is, the length and position of the two supporting legs can be adjusted according to the layout of the circuit board 10, thereby providing flexibility and scalability for the design of the first heat sink 20.

[0036] The circuit board 10 in the embodiment is in the shape of a long strip, and the length of the circuit board 10 in the length direction is greater than the width in the width direction, and the thickness is the thinnest. In order to clearly express the positions and directions described in the embodiment, the thickness direction is defined as one side up and the other side down, the length direction is defined as one side left and the other side right, and the width direction is defined as one side front and the other side back. The definitions of the directions can be referred to Figure 2 as shown.

[0037] As shown in Figure 3 , 5 , 6, the slot 11 of the embodiment is a through slot that penetrates the circuit board 10. Since some chips cannot be placed on the circuit board in the design of the optical module, such as lasers, a through slot that penetrates the circuit board 10 is provided on the circuit board 10, and the slot 11 can be used to accommodate these chips. Because the slot 11 is a through slot structure that reduces the strength of the circuit board 10, the structural design of the first heat sink 20 of the embodiment can compensate for the reduced structural strength due to the through slot structure.

[0038] In addition, although the first optoelectronic chip 31 is electrically connected to the circuit board 10, it does not necessarily lie in the projection plane of the circuit board 10 in the up-down direction, for example, some chips need to be partially suspended outside the circuit board 10 for the need to interface with other structures or to ensure the performance of use. As shown in Figure 5 , Figure 6 , the first optoelectronic chip 31 of the embodiment partially exposes outside the circuit board 10, such as extending to the slot 11. The first heat sink 20 can dissipate heat for the first optoelectronic chip 31 above the slot 11 while spanning the slot 11, and can also provide protection for such first optoelectronic chip 31.

[0039] The embodiment can design the slot 11 and the first heat sink 20 to be symmetrically distributed front and back, as shown in Figure 2 and Figure 4As shown, the slot 11 and the first heat sink 20 are both substantially symmetrical along the central axis of the left-right direction. In the left-right direction, the first support leg 21 and the second support leg 22 are flush and have substantially the same shape. This design not only optimizes the heat dissipation path, but also balances the stress distribution of the circuit board 10 and reduces stress concentration caused by the slot 11.

[0040] Further, as shown in the drawings, Figure 2 The heat dissipation part 23 spans the slot 11 in the width direction. Since the circuit board 10 on both sides of the slot 11 in the width direction is relatively narrow, and the circuit board 10 on both sides of the slot 11 in the length direction is relatively long, the structural strength on both sides of the slot 11 in the width direction is relatively weak. In this embodiment, the support mode of the heat dissipation part 23 is limited to support in the width direction, which is similar to the effect of adding a bridge in the weak area, optimizes the mechanical distribution, reduces the stress concentration on both sides of the slot 11, and can more evenly distribute the load to the first heat sink 20, optimizing the heat dissipation efficiency and mechanical support effect.

[0041] As shown in the drawings, Figure 6 The length of the first support leg 21 and the second support leg 22 in the length direction is longer than the length of the slot 11. The projection of the first heat sink 20 in the thickness direction perpendicular to the circuit board 10 completely covers the slot 11. That is, the left end of the first support leg 21 and the second support leg 22 is located to the left of the left edge of the slot 11. The right end of the first support leg 21 and the second support leg 22 is located to the right of the right edge of the slot 11. The first support leg 21 and the second support leg 22 also connect and support the left and right sides of the slot 11, maximizing the coverage and support effect of the first support leg 21 and the second support leg 22 on the slot 11 area, avoiding stress concentration on the edge of the slot 11 causing fatigue failure, and improving the stability of the connection.

[0042] Further, as shown in the drawings, Figure 3 A plurality of positioning holes 12 are provided on the circuit board 10. As shown in the drawings, Figure 4 A positioning column 24 is provided on the first support leg 21 and / or the second support leg 22 to cooperate with the positioning hole 12. The circuit board 10 and the first support leg 21 and / or the second support leg 22 are connected and fixed by the positioning column 24 and the positioning hole 12. In this embodiment, the positioning column 24 is inserted into the positioning hole 12. The introduction of the positioning column 24 provides accurate alignment function for the assembly process of the heat sink, and also reduces the possibility of welding deviation during assembly. The pre-fixing effect formed after the positioning column 24 is inserted into the positioning hole 12 can significantly improve the assembly efficiency and show higher consistency in mass production.

[0043] In this embodiment, multiple positioning holes 12, for example, three positioning holes 12, are symmetrically arranged on both the front and rear sides of the slot 11. Metal rings can be placed inside the positioning holes 12 to increase strength. Three positioning posts 24 are symmetrically arranged on the first support leg 21 and the second support leg 22. The positioning posts 24 are inserted into the positioning holes 12, ensuring uniform force distribution on both the front and rear sides of the slot 11. Furthermore, anti-loosening designs can be added to the positioning posts 24, such as by providing raised textures on the surface, to further enhance stability after assembly.

[0044] In this embodiment, the positioning post 24 and the positioning hole 12 are interference-fitted, which strengthens the mechanical bonding performance between the heat sink and the circuit board 10 through physical locking. During long-term use of the optical module 100, repeated insertion and removal, as well as thermal expansion and deformation, make it difficult for the first heat sink 20 to loosen or separate from the circuit board 10.

[0045] Furthermore, a filler layer is filled between the first optoelectronic chip 31 and the heat sink 23, and the filler layer fixes the first optoelectronic chip 31 and the heat sink 23 together. The filler material of the filler layer can be an adhesive with good adhesion and a relatively thin adhesive layer.

[0046] On the one hand, the first heat sink 20 has a higher strength than the circuit board 10. By fixing the first optoelectronic chip 31 to the heat sink 23 through the filler layer, it can provide higher support for the first optoelectronic chip 31, preventing the first optoelectronic chip 31 from deforming, shifting, or even being damaged when the circuit board 10 is subjected to deformation force. In other words, the filler layer protects the first optoelectronic chip 31 and prevents optical path deflection caused by its displacement or misalignment, thereby further improving the reliability of the optical module 100.

[0047] On the other hand, the filler layer can also be a thermally conductive adhesive, thermally conductive paste, or graphite sheet with high thermal conductivity. The filler layer forms an efficient heat transfer path between the first heat sink 20 and the first optoelectronic chip 31.

[0048] In this embodiment, the first support leg 21 and / or the second support leg 22 are connected to the circuit board 10 by a solder layer. The solder layer can be solder paste, and preferably low-temperature solder paste. Low-temperature solder paste can avoid excessively high soldering temperatures from affecting the components or circuit board 10.

[0049] In addition, surface treatment of the surface to be soldered is performed to provide more reliable soldering contact. For example, electroplating is used to deposit metal ions onto the surface to be soldered through an electrochemical reaction to form a metal coating. The aforementioned low-temperature solder paste can prevent high-temperature solder from damaging the metal coating.

[0050] like Figure 4 As shown, a plurality of solder paste overflow channels 25 are provided on the side of the first support leg 21 and / or the second support leg 22 facing the circuit board 10. The solder paste overflow channels 25 can provide a preset overflow channel for excess solder paste.

[0051] Figure 4 The plurality of glue overflow grooves 25 in the first glue overflow groove 23 are arranged in a wave shape between the adjacent positioning columns 24.

[0052] Further, as shown in FIG. 6, in addition to the first optoelectronic chip 31 partially exposed outside the circuit board 10, the optical module 100 also includes a second optoelectronic chip 32. The projection of the second optoelectronic chip 32 in the thickness direction of the circuit board 10 overlaps the slot 11. The second optoelectronic chip 32 of the present embodiment is a chip that needs to be arranged at the slot 11. The second optoelectronic chip 32 is, for example, a light receiving chip and a light emitting chip. The arrangement of the second optoelectronic chip 32 improves the integration of the optical module 100. Figure 3 、 5

[0053] The first optoelectronic chip 31 and the second optoelectronic chip 32 of the present embodiment can include a microcontroller unit (MCU), a laser drive chip, a transimpedance amplifier (TIA), a limiting amplifier, a clock and data recovery chip (CDR), a power management chip, a digital signal processing (DSP), a light receiving chip, and a light emitting chip, etc.

[0054] The second optoelectronic chip 32 can be fixedly connected with the first heat sink 20, and the first heat sink 20 provides support for the second optoelectronic chip 32 and dissipates heat for the second optoelectronic chip 32. The second optoelectronic chip 32 can be welded or glued to the first heat sink 20.

[0055] As shown in FIG. 6, the optical module 100 also includes a second heat sink 40. The second heat sink 40 is arranged on the side of the circuit board 10 away from the first heat sink 20. The first heat sink 20 is arranged above the circuit board 10, and the second heat sink 40 is arranged below the circuit board 10. The second heat sink can be connected to the circuit board on both sides of the slot by means of bonding or welding. The second heat sink 40 makes the mechanical structure of the entire circuit board 10 more balanced, and improves the overall anti-distortion performance of the circuit board 10. Figure 3 、 5

[0056] In an embodiment, the second heat sink 40 can also not be in contact with the second optoelectronic chip 32, but is only arranged below the second optoelectronic chip 32. The second optoelectronic chip 32 is only fixedly connected with the first heat sink 20 above. Such a second heat sink 40 can not need to be designed to have heat dissipation capability in the design process.

[0057] ​​In another embodiment, at least a portion of the second optoelectronic chip 32 can be thermally connected to the second heat sink 40. The second heat sink 40 is disposed below to provide support and heat dissipation for the second optoelectronic chip 32. The second heat sink 40 further improves the heat dissipation capacity inside the optical module 100.

[0058] Furthermore, such as Figure 1 As shown, the housing 50 also includes a first housing 51 and a second housing 52. The first housing 51 is located above the first heat sink 20, and the second housing 52 is located below the second heat sink 40. A first thermally conductive layer is filled between the first housing 51 and the first heat sink 20, and a second thermally conductive layer is filled between the second housing 52 and the second heat sink 40. By filling each heat sink and each housing with a thermally conductive layer, the overall thermal management performance of the optical module 100 is optimized, and heat is effectively conducted from the chip and heat sink to the housing. The first and second thermally conductive layers can also be made of thermally conductive materials such as thermally conductive adhesive, thermally conductive paste, graphite sheets, graphene thermally conductive films, and carbon nanotube composite materials.

[0059] The material of the first heat sink 20 in this embodiment can be selected from a metal material with high thermal conductivity according to application requirements. For example, the first heat sink can be made of tungsten copper. Alternatively, the first heat sink can also be made of copper, aluminum alloy, or nickel-plated copper alloy, etc.

[0060] Compared with the prior art, this embodiment has the following beneficial effects:

[0061] The optical module 100 significantly enhances the mechanical strength of the circuit board 10 by fully utilizing the rigid structure of the heat sink. The first heat sink 20 not only forms a space to accommodate the first optoelectronic chip 31, protecting it while dissipating heat, but also spans across both sides of the slot 11 via the first support 21 and the second support 22, forming an integrated structure with the circuit board 10. The first heat sink compensates for the strength loss of the circuit board at the slot, effectively enhancing the overall rigidity and bending resistance of the circuit board 10. In short, the heat sink organically combines heat dissipation and reinforcement functions, solving the problem of the slot 11 weakening the strength of the circuit board 10 without adding new support structures or excessively occupying space within the optical module 100. This optical module improves the overall structural stability of the circuit board based on existing structures.

[0062] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0063] The series of detailed descriptions listed above are only specific descriptions for the feasible implementation manners of the present application, and are not used to limit the protection scope of the present application. Any equivalent implementation manners or changes made without departing from the spirit of the present application should be included in the protection scope of the present application.

Claims

1. An optical module comprising a circuit board and a first optoelectronic chip electrically connected to the circuit board, characterized in that, The optical module also includes a first heat sink, which includes a first support leg, a second support leg, and a heat dissipation part connected together. The circuit board has a slot, the first support leg and the second support leg are connected to the circuit board on both sides of the slot, and the heat dissipation part is connected between the first support leg and the second support leg; The first photoelectric chip is thermally connected to the heat dissipation part and is located between the heat dissipation part and the slot.

2. The optical module according to claim 1, characterized in that, The circuit board is longer in the longitudinal direction than it is wide in the width direction, and the heat dissipation part extends across the slot in the width direction.

3. The optical module according to claim 2, characterized in that, The lengths of the first support leg and the second support leg along the length direction are both longer than the length of the slot, and the projection of the first heat sink in the direction perpendicular to the thickness of the circuit board completely covers the slot.

4. The optical module according to claim 1, characterized in that, The circuit board has a plurality of positioning holes, and the first support leg and / or the second support leg has positioning posts that cooperate with the positioning holes. The circuit board and the first support leg and / or the second support leg are connected and fixed through the positioning posts and the positioning holes.

5. The optical module according to claim 4, characterized in that, The slot is a through slot that penetrates the circuit board.

6. The optical module according to claim 1, characterized in that, A filler layer is filled between the first optoelectronic chip and the heat dissipation part, and the filler layer fixes the first optoelectronic chip and the heat dissipation part together.

7. The optical module according to claim 6, characterized in that, The first support leg and / or the second support leg are connected to the circuit board via a solder layer; The first support leg and / or the second support leg are provided with a plurality of glue overflow grooves on the side facing the circuit board, the plurality of glue overflow grooves accommodating at least a portion of the overflowing solder layer.

8. The optical module according to claim 1, characterized in that, The optical module also includes a second optoelectronic chip, the projection of the second optoelectronic chip in the thickness direction of the circuit board overlaps with the slot, and the second optoelectronic chip is fixedly connected to the first heat sink.

9. The optical module according to claim 1, characterized in that, The optical module also includes a second heat sink, which is disposed on the side of the circuit board away from the first heat sink, and the second heat sink is connected to the circuit boards on both sides of the slot.

10. The optical module according to claim 1, characterized in that, The first heat sink is a tungsten-copper component.

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