Gluing and developing equipment and wafer processing system

Abstract

The utility model provides gluing and developing equipment which is characterized by comprising a gluing unit, a film covering unit, a developing unit and a film removing unit, the gluing unit is used for carrying out photoresist coating process treatment on the wafer; the film coating unit is used for coating a smooth film layer on the back surface of the wafer so as to increase the smoothness of the back surface of the wafer; the developing unit is used for carrying out developing process treatment on the exposed wafer; the film removing unit is used for removing the smooth film layer on the back surface of the wafer; the gluing and developing equipment further comprises an interface tower, a cleaning unit, a wafer carrying table and a manipulator; the cleaning unit is arranged in the interface tower and used for cleaning the wafer carrying table and the mechanical arm. The film coating unit is arranged in the gluing and developing system, so that the back surface of the wafer can be coated with a smooth film layer. The smooth film layer can effectively reduce the friction force when the bearing table of the photoetching machine adsorbs the wafer; the cleaning unit is arranged in the interface tower, so that pollutant particles on the wafer carrier and the manipulator can be effectively removed.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a coating and developing equipment and a wafer processing system. Background Technology

[0002] In wafer manufacturing, photoresist coating and developing equipment is a key processing device in the integrated circuit chip manufacturing process. It often works in conjunction with a photolithography machine to complete processes such as photoresist coating, curing, post-exposure baking, developing, and hardening of the wafer. The quality of its architecture design directly affects the equipment's capacity, stability, ease of operation and maintenance, and cost control.

[0003] Maintaining a clean backside of the wafer is crucial for photolithography in chip manufacturing. Contamination of the wafer backside with particles can wear down the lithography machine's stage, increasing maintenance costs and time, and potentially reducing chip yield. Therefore, improving the cleanliness of the wafer backside before photolithography is an important step. Currently, the common method is to install a back-washing unit inside the coating and developing equipment before photolithography. The cleaning tools typically use diamond abrasion combined with physical cleaning, which can remove particles generated by previous processes in the coating and developing equipment, as well as particles left behind by the previous equipment. However, diamond abrasion can cause surface problems on the wafer backside, such as localized scratches and changes in flatness, which can also damage the wafer and reduce chip yield. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a coating and developing equipment and a wafer processing system to solve the technical problem of how to reduce the friction force when the lithography machine stage picks up the wafer, thereby reducing the wear of the lithography machine stage.

[0005] To achieve the above objectives, the first aspect of this utility model provides a coating and developing apparatus, comprising: a coating and developing apparatus, comprising:

[0006] The photoresist coating unit is used to perform photoresist coating processes on wafers.

[0007] A coating unit is used to coat a smooth film layer on the back side of a wafer to increase the smoothness of the back side of the wafer.

[0008] The developing unit is used to perform developing processes on the exposed wafer.

[0009] A film removal unit is used to remove the smooth film layer on the back side of the wafer.

[0010] Preferably, the coating and developing equipment further includes an interface tower, a cleaning unit, a wafer stage, and a robotic arm.

[0011] The cleaning unit is located in the interface tower and is used to clean the wafer stage and the robotic arm.

[0012] Preferably, the cleaning unit includes:

[0013] A cleaning component has an adhesive layer coated on its surface, the adhesive layer being used to adhere contaminants attached to the wafer stage or the robotic arm when it comes into contact with the wafer stage or the robotic arm.

[0014] A tray is used to store the cleaning components.

[0015] Preferably, the side of the carrier disk that contacts the cleaning component is provided with a plurality of support columns, which are used to support the wafer.

[0016] Preferably, the coating and developing equipment includes a film cassette module, a liquid treatment module, a heat treatment module, and the interface module arranged sequentially in a horizontal direction.

[0017] The interface towers include a first interface tower, a second interface tower, and a third interface tower.

[0018] The first interface tower is disposed in the cassette module, the second interface tower is disposed between the liquid treatment module and the heat treatment module, and the third interface tower is disposed in the interface module.

[0019] Preferably, both the liquid treatment module and the heat treatment module are provided with corresponding process units and corresponding robotic arms, and each process unit is provided with a corresponding wafer stage.

[0020] In the liquid treatment module, the corresponding robotic arm is used to pick up the wafer or the cleaning component from the first interface tower, place the wafer or the cleaning component on the corresponding wafer stage in the liquid treatment module, and put the cleaning component on the corresponding wafer stage back into the corresponding carrier tray, and to take the wafer from the corresponding wafer stage and send it into the second interface tower.

[0021] In the heat treatment module, the corresponding robotic arm is used to pick up the wafer or the cleaning component from the second interface tower, place the wafer or the cleaning component on the corresponding wafer stage in the heat treatment module, and put the cleaning component on the corresponding wafer stage back into the corresponding carrier tray, and to take the wafer from the corresponding wafer stage and send it into the third interface tower.

[0022] Preferably, the interface module further includes:

[0023] A cache unit is used to receive and store the wafer from the coating unit.

[0024] A cooling unit for cooling the wafer from the cache unit.

[0025] Preferably, the robotic arm includes a first robotic arm, a second robotic arm, and a third robotic arm, and the first robotic arm, the second robotic arm, the third robotic arm, and the coating unit are all disposed in the interface module.

[0026] The coating unit includes the corresponding wafer stage.

[0027] The first robotic arm is used to remove the wafer or the cleaning component from the third interface tower and send it into the corresponding wafer stage in the coating unit, and to remove the cleaning component from the wafer stage and put it back into the corresponding carrier tray, and to remove the wafer from the coating unit and place it in the cache unit.

[0028] The second robotic arm is used to transfer the wafer stored in the cache unit into the cooling unit.

[0029] The third robotic arm is used to remove the wafer from the cooling unit.

[0030] Preferably, the coating unit and the developing unit are disposed in the liquid treatment module. The film removal unit is disposed in the heat treatment module.

[0031] The second aspect of this utility model provides a wafer processing system, comprising: a wafer cleaning device, a photolithography device, and a coating and developing device as described above.

[0032] The wafer cleaning equipment is used to clean the wafer before it is fed into the coating and developing equipment.

[0033] The coating and developing equipment is used to perform coating, lamination and developing processes on the cleaned wafer.

[0034] The photolithography equipment is used to perform photolithography on the wafer after it has undergone a photoresist coating process.

[0035] The beneficial effects of this utility model are as follows: Through the above technical solution, the achieved effect is that by setting the coating unit in the coating and developing equipment, a smooth film layer can be coated on the back side of the wafer. This smooth film layer effectively reduces the frictional force when the lithography machine stage picks up the wafer, allowing the wafer to expand smoothly during the flattening process, ultimately achieving minimal overlay error. Furthermore, by effectively reducing the frictional force when the lithography machine stage picks up the wafer, wear on the lithography machine stage can be reduced, thereby significantly reducing the maintenance cost of the lithography machine. Furthermore, the smooth film layer can also effectively eliminate static electricity on the back side of the wafer, preventing static electricity from corroding the lithography machine stage, thus effectively extending the lifespan of the lithography machine stage and improving the overall lifespan of the lithography machine.

[0036] Furthermore, by setting the film removal unit in the coating and developing equipment, the smooth film layer attached to the back of the wafer can be effectively removed, avoiding the smooth film layer from affecting subsequent processes.

[0037] Furthermore, by setting the cleaning unit in the interface tower, contaminant particles on the wafer stage and the robotic arm can be effectively removed, thereby avoiding contamination of the wafer product when the robotic arm and the wafer stage come into contact with the wafer. Attached Figure Description

[0038] Figure 1 This is a top view of the coating and developing equipment in Embodiment 1 of this utility model;

[0039] Figure 2 This is a top view of the cross-sectional structure of the coating and developing equipment in Embodiment 1 of this utility model. Figure 1 ;

[0040] Figure 3 This is a top view of the cross-sectional structure of the coating and developing equipment of Embodiment 1 of this utility model. Figure 2 ;

[0041] Figure 4 This is a schematic diagram of the cleaning unit in Embodiment 1 of this utility model;

[0042] Figure label:

[0043] 1-Slice box module; 11-Interlayer robot; 12-First interface tower;

[0044] 2-Liquid handling module; 21-Liquid handling robot;

[0045] 3-Heat treatment module; 31-Heat treatment robotic arm;

[0046] 4-Interface module; 41-Third interface tower; 42-First robotic arm; 43-Second robotic arm; 44-Third robotic arm;

[0047] 45-Coated unit;

[0048] 5-Second interface tower;

[0049] 6-Cleaning unit; 61-Cleaning component; 62-Carrier plate; 63-Support column;

[0050] 7-Lithography machine; Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0052] Please see Figures 1-4 This utility model provides a coating and developing device, comprising a wafer cassette module 1, a liquid treatment module 2, a heat treatment module 3, and an interface module 4 arranged sequentially in a horizontal direction. Each of the wafer cassette module 1, liquid treatment module 2, heat treatment module 3, and interface module 4 is equipped with a corresponding robotic arm, which is used to pick up and place the wafers.

[0053] Please see Figure 1 , Figure 2 and Figure 3 The wafer cassette module 1 is used to store wafers. The wafer cassette module 1 includes an interlayer robot 11 and a first interface tower 12. The interlayer robot 11 is used to pick up cleaned wafers and transfer them to the first interface tower 12. The wafer cassette module 1 also includes a pre-processing unit (ADB) for coating the front side of the wafer with hexamethyldisilazane (HMDS) to enhance the adhesion between the wafer surface and the photoresist, preparing for photoresist coating.

[0054] Both the liquid treatment module 2 and the heat treatment module 3 are provided with a number of corresponding process units and corresponding robotic arms, and each process unit is provided with a corresponding wafer stage.

[0055] Please see Figure 3In the liquid treatment module 2, the process unit includes:

[0056] The photoresist coating unit (PR) is used to perform a photoresist coating process on the wafer.

[0057] The developing unit (SDC) is used to perform a developing process on the exposed wafer.

[0058] In the heat treatment module 3, the process unit includes:

[0059] The soft bake unit is used to heat the wafer to remove the solvent from the photoresist, enhance the adhesion of the photoresist, and release the stress in the photoresist film.

[0060] Edge Exposure (WEE) units are used to expose the edges of the silicon wafer, thereby determining the precise location of the chip pattern on the silicon wafer.

[0061] The post-bake unit (PEB) is used to bake and heat the exposed wafers.

[0062] The hard bake unit is used to bake and heat the wafers that have undergone the developing process;

[0063] A film removal unit (BRS) is used to remove the smooth film layer on the back side of the wafer;

[0064] An optical defect detection unit (AOI) is used to inspect the developed wafer.

[0065] Please see Figure 1 , Figure 2 and Figure 3 A second interface tower 5 is provided between the liquid treatment module 2 and the heat treatment module 3. The liquid treatment module 2 is equipped with a liquid treatment robot 21, used to transfer wafers from the first interface tower 12 to the corresponding process unit (e.g., a coating unit) within the liquid treatment module 2, and also to transfer wafers from the process unit (e.g., the coating unit) to the second interface tower 5. The heat treatment module 3 is equipped with a heat treatment robot 31, used to transfer the wafers from the second interface tower 5 to the corresponding process unit (e.g., an edge exposure unit) within the heat treatment module 3, and also to remove wafers from the process unit (e.g., the edge exposure unit) and transfer them to the interface module 4.

[0066] The interface module 4 includes: a third interface tower 41, a coating unit 45 (BACS), a buffer unit (BF), and a cooling unit (CPC).

[0067] After the thermal processing robot 31 removes the wafer from the corresponding process unit (such as the edge exposure unit) of the thermal processing module 3, it transfers it to the third interface tower 41.

[0068] The coating unit 45 is used to coat a smooth film layer on the back side of the wafer to increase the smoothness of the back side of the wafer. The smooth film layer can effectively reduce the friction force when the lithography machine 7 carrier stage picks up the wafer, thereby enabling the wafer to expand smoothly during the flattening process and ultimately achieving minimal overlay error. Furthermore, by effectively reducing the friction force when the lithography machine 7 carrier stage picks up the wafer, the wear of the lithography machine 7 carrier stage can be reduced, thereby greatly reducing the maintenance cost of the lithography machine 7. Furthermore, the smooth film layer can also effectively eliminate static electricity on the back side of the wafer, preventing static electricity from corroding the lithography machine 7 carrier stage, thereby effectively extending the life of the lithography machine 7 carrier stage and improving the overall life of the lithography machine 7.

[0069] The buffer unit is used to receive and store the wafers from the coating unit 45; the buffer unit acts like a "reservoir" to regulate the operational differences between different units. This prevents the entire production line from stopping due to a brief delay or failure of a single unit, ensuring the continuity and stability of the production process.

[0070] The cooling unit is used to cool the wafer from the cache unit.

[0071] Furthermore, the interface module 4 also includes a first robotic arm 42, a second robotic arm 43, and a third robotic arm 44.

[0072] The first robotic arm 42 is used to transfer the wafer in the third interface tower 41 to the coating unit 45, and to transfer the wafer in the coating unit 45 to the cache unit;

[0073] The second robotic arm 43 is used to transfer the wafer in the cache unit to the cooling unit for cooling.

[0074] The third robotic arm 44 is used to transfer the wafer in the cooling unit to the lithography machine 7 for exposure processing.

[0075] Please refer to Figure 2 , Figure 3 In this embodiment, cleaning units 6 are provided in the first interface tower 12, the second interface tower 5, and the third interface tower 41. The cleaning units 6 are used to clean the wafer stage and the robotic arm. By providing the cleaning units 6 in the interface towers, contaminant particles on the wafer stage and the robotic arm can be effectively removed, thereby avoiding cross-contamination of the wafer by the robotic arm and the wafer stage.

[0076] For further details, please refer to... Figure 4 The cleaning unit 6 includes a cleaning component 61 and a carrier tray 62. The surface of the cleaning component 61 is coated with an adhesive layer, which is used to adhere contaminants attached to the wafer stage or the robotic arm when it comes into contact with the wafer stage or the robotic arm. The carrier tray 62 is used to store the cleaning component 61. By coating the surface of the cleaning component 61 with the adhesive layer, when the robotic arm picks up the cleaning component 61 and places it on the wafer stage, the cleaning component 61 can effectively adhere to contaminants attached to the wafer stage or the robotic arm, thereby achieving the purpose of cleaning the wafer stage or the robotic arm.

[0077] Furthermore, the side of the carrier tray 62 that contacts the cleaning component 61 is provided with multiple support pillars 63, which are used to support the wafer. By providing multiple support pillars 63 on the side of the carrier tray 62 that contacts the cleaning component 61, the wafer is easily supported. At the same time, when the cleaning component 61 is placed on the carrier tray 62, the support of the support pillars 63 creates a space between the wafer and the carrier tray 62 that is convenient for the robotic arm's fingers to insert, thereby facilitating the robotic arm to pick up and place the cleaning component 61 on the carrier tray 62.

[0078] The liquid handling robot 21, the heat treatment robot 31, and the first robot 42 located in the interface unit will periodically clean the wafer stage in their respective modules.

[0079] For example, in the liquid treatment module 2, the liquid treatment robot 21 retrieves the cleaning component 61 from the first interface tower 12 and places it on the corresponding wafer stage in the liquid treatment module 2. Then, it returns the cleaning component 61 from the wafer stage to the corresponding carrier tray 62. During this process, when the cleaning component 61 comes into contact with the wafer stage or the liquid treatment robot 21, contaminants on the wafer stage or the liquid treatment robot 21 are adhered to the adhesive layer of the cleaning component 61, thereby achieving the purpose of cleaning the wafer stage and the liquid treatment robot 21.

[0080] For example, in the heat treatment module 3, the heat treatment robot 31 retrieves the cleaning component 61 from the second interface tower 5 and places it on the corresponding wafer stage in the heat treatment module 3. Then, it returns the cleaning component 61 from the wafer stage to the corresponding carrier tray 62. During this process, when the cleaning component 61 comes into contact with the corresponding wafer stage or the heat treatment robot 31 in the heat treatment module 3, contaminants on the corresponding wafer stage or the liquid treatment robot 21 will adhere to the adhesive layer of the cleaning component 61. This achieves the purpose of cleaning the wafer stage and the heat treatment robot 31.

[0081] The coating unit 45 includes a corresponding wafer stage; when cleaning the wafer stage and the first robot 42 in the coating unit 45, the first robot 42 is used to take out the cleaning component 61 from the third interface tower 41 and send it into the corresponding wafer stage in the coating unit 45, and then take the cleaning component 61 from the wafer stage and put it back into the corresponding carrier tray 62.

[0082] The second embodiment of this utility model provides a coating and developing system, including a cleaning device (not shown) and a coating and developing device as described in Embodiment 1.

[0083] The cleaning equipment is used to clean the wafers; the cleaned wafers are then transferred to the wafer cassette module 1 of the coating and developing equipment. In this embodiment, the cleaning equipment is a dedicated wafer cleaning device, which is common in the wafer processing field and well-known to those skilled in the art, and will not be described in detail here. By setting up the cleaning equipment to clean the wafers before they enter the coating and developing equipment, contaminant particles left on the back side of the wafer by previous deposition and etching can be effectively removed. Furthermore, it also avoids the contaminant particles being encapsulated in the smooth film layer applied to the back side of the wafer.

[0084] When processing the wafer:

[0085] First, the wafer is transferred to a cleaning device for surface cleaning. Then, it is transferred to the pre-processing unit where hexamethyldisilazane (HMDS) is coated on the front side to enhance adhesion between the wafer surface and the photoresist. Next, the wafer is transferred to a coating unit where a photoresist layer is coated on the front side. After coating, the wafer is transferred to a soft baking unit for baking. Then, the wafer is transferred to an edge exposure unit for edge exposure. Finally, the wafer is transferred to a BACS (Boiler Acrylic Coating System) unit where a smooth film layer is coated on the back side.

[0086] The wafer is transferred to the lithography machine 7 for lithography processing (exposure).

[0087] After exposure, the wafer, now exposed by the lithography machine 7, is transferred to the post-baking unit for baking and heating. Next, it is transferred to the developing unit for developing; then, the developed wafer is transferred to the hard baking unit for baking and heating. Next, the wafer is transferred to the stripping unit to remove the smooth film layer coated on the back side of the wafer. Finally, the wafer is transferred to the optical defect detection unit for inspection after development.

[0088] In the above wafer processing method, the wafer is first transferred to a cleaning device to clean the wafer surface, which can effectively remove contaminant particles left on the back of the wafer by previous deposition and etching. In addition, it also avoids the contaminant particles being encapsulated in the smooth film layer when coating the back of the wafer. Before exposing the wafer, the wafer is transferred to the coating unit 45 to coat the back of the wafer with a smooth film layer, which can effectively reduce the friction when the lithography machine 7 carrier stage adsorbs the wafer, thereby enabling the wafer to expand smoothly during the flattening process and ultimately achieving minimal overlay error.

[0089] In summary, by setting up the cleaning equipment, the present invention cleans the wafer before it enters the coating and developing equipment, effectively removing contaminant particles left on the back side of the wafer by previous deposition and etching. Furthermore, it avoids encapsulating these contaminant particles when coating a smooth film layer on the back side of the wafer. Moreover, by setting up the coating unit 45 in the coating and developing system, a smooth film layer can be coated on the back side of the wafer. This smooth film layer effectively reduces the frictional force when the lithography machine 7's stage picks up the wafer, allowing the wafer to expand smoothly during the flattening process, ultimately achieving minimal overlay errors. Furthermore, by effectively reducing the frictional force when the lithography machine 7's stage picks up the wafer, wear on the lithography machine 7's stage can be reduced, significantly reducing the maintenance cost of the lithography machine 7. Furthermore, the smooth film layer can effectively eliminate static electricity on the back side of the wafer, preventing static electricity from corroding the lithography machine 7's stage, thus effectively extending the lifespan of the lithography machine 7's stage and improving the overall lifespan of the lithography machine 7. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0090] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A coating and developing device, characterized in that, include: The photoresist coating unit is used to perform photoresist coating processes on wafers. A coating unit is used to coat a smooth film layer on the back side of a wafer to increase the smoothness of the back side of the wafer; The developing unit is used to perform a developing process on the exposed wafer. A film removal unit is used to remove the smooth film layer on the back side of the wafer.

2. The coating and developing equipment according to claim 1, characterized in that: The coating and developing equipment also includes an interface tower, a cleaning unit, a wafer stage, and a robotic arm; The cleaning unit is located in the interface tower and is used to clean the wafer stage and the robotic arm.

3. The coating and developing equipment according to claim 2, characterized in that: The cleaning unit includes: A cleaning component has an adhesive layer coated on its surface, the adhesive layer being used to adhere contaminants attached to the wafer stage or the robotic arm when it comes into contact with the wafer stage or the robotic arm; A tray is used to store the cleaning components.

4. The coating and developing equipment according to claim 3, characterized in that: The side of the carrier disk that contacts the cleaning component is provided with multiple support columns, which are used to support the wafer.

5. The coating and developing equipment according to claim 4, characterized in that: The coating and developing equipment includes a film cassette module, a liquid treatment module, a heat treatment module, and an interface module arranged sequentially. The interface tower includes a first interface tower, a second interface tower, and a third interface tower; The first interface tower is disposed in the cassette module, the second interface tower is disposed between the liquid treatment module and the heat treatment module, and the third interface tower is disposed in the interface module.

6. The coating and developing equipment according to claim 5, characterized in that: Both the liquid treatment module and the heat treatment module are equipped with corresponding process units and corresponding robotic arms, and each process unit is equipped with a corresponding wafer stage; In the liquid treatment module, the corresponding robotic arm is used to pick up the wafer or the cleaning component from the first interface tower, place the wafer or the cleaning component on the corresponding wafer stage in the liquid treatment module, and put the cleaning component on the corresponding wafer stage back into the corresponding carrier tray, and to take the wafer from the corresponding wafer stage and send it into the second interface tower. In the heat treatment module, the corresponding robotic arm is used to pick up the wafer or the cleaning component from the second interface tower, place the wafer or the cleaning component on the corresponding wafer stage in the heat treatment module, and put the cleaning component on the corresponding wafer stage back into the corresponding carrier tray, and to take the wafer from the corresponding wafer stage and send it into the third interface tower.

7. The coating and developing equipment according to claim 6, characterized in that: The interface module also includes: A cache unit is used to receive and store the wafer from the coating unit; A cooling unit for cooling the wafer from the cache unit.

8. The coating and developing equipment according to claim 7, characterized in that: The robotic arm includes a first robotic arm, a second robotic arm, and a third robotic arm, and the first robotic arm, the second robotic arm, the third robotic arm, and the coating unit are all disposed in the interface module; The coating unit includes the corresponding wafer stage; The first robotic arm is used to remove the wafer or the cleaning component from the third interface tower and send it into the corresponding wafer stage in the coating unit, and to remove the cleaning component from the wafer stage and put it back into the corresponding carrier tray, and to remove the wafer from the coating unit and place it in the cache unit. The second robotic arm is used to transfer the wafer stored in the cache unit into the cooling unit; The third robotic arm is used to remove the wafer from the cooling unit.

9. The coating and developing equipment according to claim 5, characterized in that: The coating unit and the developing unit are located in the liquid treatment module; the film removal unit is located in the heat treatment module.

10. A wafer processing system, characterized by: include: Wafer cleaning equipment, photolithography equipment, and coating and developing equipment as described in any one of claims 1-9; The wafer cleaning equipment is used to clean the wafer before it is fed into the coating and developing equipment; The coating and developing equipment is used to perform coating, lamination and developing processes on the cleaned wafer. The photolithography equipment is used to perform photolithography on the wafer after it has undergone a photoresist coating process.

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